10AX090R2F40E2LG - Arria 10 GX 900K LE FPGA, 1517-FCBGA | Intel
MPN： 10AX090R2F40E2LG ✓ 啟用中10AX090R2F40E2LG 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing programmable logic blocks, configurable interconnect, and dedicated hardened IP such as transceivers, DSP blocks, and memory controllers. FPGAs sit within the broader category of programmable logic devices (PLDs) and occupy the high-performance tier above CPLDs. The Arria 10 family is Intel's mid-range 20nm lineup, positioned between the lower-power Cyclone series and the high-end Stratix series, and is widely deployed in communications infrastructure, broadcast video, and military/aerospace signal-processing applications.
Key features of the 10AX090R2F40E2LG include 66 transceivers with data rates up to 12.5 Gbps (GX variant), 4,520 18x19 multipliers for DSP, 25 Mbits of embedded memory (MLAB + block RAM combined), and hard PCIe Gen3 and Gen2 IP cores. The -E2 speed grade places it in the mid-tier of Arria 10 speed binning, balancing Fmax and power consumption. Hardware debugging is supported via SignalTap II and Transceiver Toolkit, while configuration is handled through JTAG, passive serial, fast passive parallel, or Avalon-ST interfaces.
Typical applications include 100G/400G optical transport line cards, software-defined radio baseband processing, radar and EW front-end processing, 4K/UHD broadcast video encoding, ASIC prototyping, and high-performance DSP accelerators. The -2 speed grade and 1517-FCBGA package combination is a popular choice for production deployments requiring both performance and a thermally robust flip-chip BGA footprint. The 1517-FCBGA package is a fine-pitch flip-chip BGA optimized for signal-integrity performance of multi-gigabit serial links.
When designing with the 10AX090R2F40E2LG, engineers should pay close attention to PCB layer stack-up and decoupling, since the device draws significant transient current during logic and transceiver switching. Quartus Prime design software from Intel is required for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer's standalone datasheet, giving procurement and engineering teams a single source for sourcing decisions.
直接替換替代品，適用於 10AX090R2F40E2LG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AX090R2F40E2LG （相同外形與佔位） — 差異在於 Package, DSP Blocks, Mounting Type, Speed Grade, Transceivers.
10AX090R2F40E1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090R1F40E1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090R1F40I1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX090N4F40I3LG
✅ 直接替換聯絡詢價
查看資料表 →10AX090N3F40E2LG
✅ 直接替換聯絡詢價
查看資料表 →10AX090N2F40E2SG
✅ 直接替換📋 參考替代品（不在目錄中）
10AX090R2F40E2LG 最大額定值與電氣特性
| Series | Arria 10 GX |
| Family | 10AX090 |
| Logic Elements (LE) | 900,000 |
| User I/O Count | 342 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Transceivers | 66 channels |
| Transceiver Data Rate | Up to 12.5 Gbps (GX) |
| Embedded Memory | 25 Mbits (MLAB + block RAM, total) |
| DSP Blocks | 18x19 multipliers |
| 封裝 | 1517-ball FCBGA |
| 安裝類型 | Surface Mount (flip-chip BGA) |
| Speed Grade | -E2 (Extended, mid-tier) |
| Operating Temperature Grade | Extended (-E) |
| RoHS 狀態 | Compliant |
| MSL 等級 | 3 |
| Lead-Free | Yes |
10AX090R2F40E2LG 1517-ball fcbga 腳位配置指南
10AX090R2F40E2LG（1517-ball fcbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AX090R2F40E2LG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AX090R2F40E2LG 適用於 6 應用s: 100G/400G Optical Transport Line Card, Software-Defined Radio Baseband, Radar and Electronic Warfare Front-End, 4K/UHD Broadcast Video Processing, ASIC Prototyping and Emulation, High-Performance DSP Accelerator Card.
100G/400G Optical Transport Line Card
The 10AX090R2F40E2LG is well suited for 100G/400G optical transport line cards because its 66 transceivers at up to 12.5 Gbps aggregate enough bandwidth for multiple 10G/25G/40G client-side optical modules. The 1517-FCBGA package provides signal-integrity headroom for high-speed serial routing and the 900K LE fabric absorbs MAC framing, OTN framer, and forward-error-correction (FEC) logic. Designers typically pair this device with OTN framer ASICs or co-process it alongside DSPs for soft-decision FEC.
推薦
Software-Defined Radio Baseband
In software-defined radio (SDR) baseband processing, the 10AX090R2F40E2LG's 4,520 18x19 multipliers and 25 Mbits of embedded memory deliver sufficient DSP throughput for LTE and 5G NR physical-layer (PHY) processing. The 66 transceivers interface directly to RF ADCs and DACs over JESD204B/C, eliminating external SerDes. The 900K LE capacity enables a complete PHY plus MAC implementation on a single device, while the 1517-FCBGA package supports the high pin count required for parallel RF data paths.
推薦
Radar and Electronic Warfare Front-End
The 10AX090R2F40E2LG's high logic density and embedded DSP make it a strong fit for radar and electronic-warfare (EW) front-end processing, where pulse compression, beamforming, and adaptive filtering are implemented in the FPGA fabric. The 66 transceivers handle multiple phased-array digitizer links, while the 0.9V core reduces power dissipation per DSP operation - critical in densely populated array electronics. Extended temperature screening is available via the -E2 grade.
推薦
4K/UHD Broadcast Video Processing
For 4K/UHD broadcast video encoding, decoding, and processing, the 10AX090R2F40E2LG provides the logic and memory bandwidth required for real-time HEVC/H.265 or AVC pipelines. Its 342 user I/Os accept SDI, HDMI, and DisplayPort inputs at full UHD frame rates, while 25 Mbits of embedded memory absorb frame buffer and motion-estimation working sets. The 1517-FCBGA package is a standard form factor for broadcast video reference designs.
推薦
ASIC Prototyping and Emulation
The 10AX090R2F40E2LG's 900K LE fabric is large enough to map substantial ASIC blocks for pre-silicon verification and software development. Combined with 66 transceivers, the device can emulate ASIC-to-ASIC serial links at production rates. Multi-FPGA partitioning tools from vendors such as Synopsys and Cadence support the Arria 10 family, and the 1517-FCBGA package is supported on most commercial prototyping boards. Quartus Prime provides the timing-driven compilation required for high-fidelity emulation.
推薦
High-Performance DSP Accelerator Card
The 10AX090R2F40E2LG is used as a co-processor in high-performance computing (HPC) and DSP accelerator cards, where the FPGA accelerates workloads such as compression, encryption, or financial Monte Carlo simulation. The 4,520 18x19 multipliers deliver multi-TFLOP DSP throughput, while the 66 transceivers support PCIe Gen3 host connectivity and high-bandwidth memory (HBM) side-channels. The 1517-FCBGA package supports the dense power-delivery network required for sustained DSP workloads.
推薦
推薦產品摘要
工程參考資料，適用於 10AX090R2F40E2LG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AX090R2F40E1SG | 10AX090R1F40E1SG | 10AX090R1F40I1SG | 10AX090N4F40I3LG | 10AX090N3F40E2LG | 10AX090N2F40E2SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-FCBGA | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same |
| Transceivers | 66 (GX, up to 12.5 Gbps) | 66 (GX) | 36 (GX) | 36 (GX) | 0 (no transceivers) | 0 (no transceivers) | 0 (no transceivers) |
| Speed Grade | -E2 (Extended) | -E1 (Extended, slower) | -E1 | -I1 (Industrial) | -I3 (Industrial) | -E2 | -E2 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
主要差異化特點
- Highest logic density in the Arria 10 family at the 1517-FCBGA tier (對比10AX090R1F40E1SG)
- Maximum transceiver count (66) within the 1517-FCBGA package (對比10AX090N3F40E2LG)
- Mid-tier -E2 speed grade balances Fmax and power (對比10AX090R2F40E1SG)
設計說明
Estimated: The 10AX090R2F40E2LG is a 900K-LE FPGA in a 1517-FCBGA with up to 66 transceivers operating at 12.5 Gbps. Under typical full-fabric and transceiver utilization, total on-die power dissipation can reach 20-25 W. The flip-chip BGA package relies on the PCB top-side copper pour and a heat sink for cooling; a minimum 8-layer stack-up with thermal vias under the die is recommended. Without adequate cooling, junction temperature may exceed 100 C under sustained workload, degrading long-term reliability.
Designers should use at least an 8-layer PCB stack-up for the 10AX090R2F40E2LG with dedicated ground and power planes between each signal layer. Decoupling must include bulk capacitors on each voltage rail and 0.1 uF / 0.01 uF high-frequency ceramics placed as close as possible to BGA balls. Transceiver channels require matched-length routing and controlled-impedance (100 ohm differential) traces to within 5 mil tolerance per the Arria 10 PCB design guidelines.
A common design pitfall is omitting configuration-mode selection straps on MSEL pins, which can leave the device in an unconfigured state on power-up. The Quartus Prime pin-planner tool will flag these, but if the schematic capture is done outside of Quartus, verify MSEL settings match the intended configuration scheme (AS, PS, FPP, or JTAG). Another frequent issue is insufficient configuration flash memory size: large FPGA designs require 256 Mbit or larger flash for safe AS configuration storage.
合規資訊
RoHS compliant and lead-free per Intel product page. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Extended temperature grade is the -E2 speed grade designation; industrial temperature parts are designated -I1/-I2/-I3.