Intel

EP4CE6F17C8L - Cyclone IV E FPGA, 6K LEs, 256-FBGA | Intel

MPN： EP4CE6F17C8L ✓ 啟用中

1.0 V core, 2.5 V / 3.3 V I/O Vdss 256-LBGA, 17 x 17 mm, 1.0 mm pitch (F17) Package C8 (commercial speed grade 8) Speed External (EPCS / EPCQ serial flash) Memory

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MOQ： 1 |

查看資料表 (PDF) 查看替代品

數量

EP4CE6F17C8L 概覽

The Intel (formerly Altera) EP4CE6F17C8L is a low-power, low-cost Cyclone IV E FPGA delivering 6,272 logic elements, 392 Configurable Logic Blocks (CLBs), and 179 maximum user I/Os in a 17x17 mm 256-ball FineLine BGA package. It targets cost-sensitive applications that still require programmable logic, on-chip memory, and high-speed transceiver-less DSP capability, with the commercial-grade speed grade 8 and a 0.95 mm ball-pitch package option.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of Configurable Logic Blocks (CLBs) connected via programmable interconnect, surrounded by programmable I/O cells and embedded memory blocks. FPGAs sit at the top of the programmable logic hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. They differ from ASICs in being reprogrammable in the field, from microcontrollers in offering true hardware-parallel execution, and from CPLDs in providing far higher logic density, embedded RAM, and DSP blocks. Cyclone IV E belongs to the non-volatile-free, SRAM-based low-end FPGA segment.

Key features include 6,272 logic elements (~3.9K ALMs / 392 CLBs), 270 Kbits of embedded RAM, 15 embedded 18x18 multipliers, up to 179 user I/Os, four general-purpose PLLs, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The device uses a 60 nm low-power process and operates from a 1.0 V core / 2.5 V-3.3 V I/O supply.

Cyclone IV E uses an SRAM-based configuration cell architecture loaded from a serial or parallel flash via the dedicated configuration pins. The 'C8' speed grade and commercial temperature grade 'L' (0C to +85C) define the DC timing and thermal envelope; the 'F17' suffix indicates the 17x17 mm 256-ball FBGA package with 1.0 mm pitch.

Typical applications include industrial motor control, video processing bridges, low-cost software-defined radio, I/O expansion and protocol bridging, display controllers, and educational logic prototyping. The combination of DSP blocks and embedded RAM makes it well suited to moderate-throughput signal processing without leaving the low-cost FPGA tier.

When designing with this device, remember that configuration data must be loaded from an external flash on every power-up; plan for an EPCS or compatible serial configuration device. Decoupling and signal-integrity on the FBGA-256 requires a 4-6 layer PCB with microvia access to the inner-row balls.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.

直接替換替代品，適用於 EP4CE6F17C8L — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號： EP4CE6F17C8L （相同外形與佔位） — 差異在於 Package, Process Technology, Operating Temperature, Speed Grade, PLLs.

EP4CE10F17C8N

Altera

Package: 256-FBGA (F17), 17x17 mm

Process Technology: 60 nm low-power SRAM

Operating Temperature: 0C to +85C (Commercial)

比較對象 EP4CE6F17C8L →

EP4CE6F17A7N

Intel

Package: FBGA-256 (256-LBGA), 17 x 17 mm, 1.0 mm pitch

Process Technology: 60 nm, low-power

Speed Grade: 7 (fastest commercial for Cyclone IV E)

比較對象 EP4CE6F17C8L →

EP4CE6F17C6

Intel

Package: 256-FBGA 17x17 mm, 1.0 mm pitch

Speed Grade: C6 (commercial)

PLLs: 2

比較對象 EP4CE6F17C8L →

EP4CE6F17C6N

Altera

Package: 256-FBGA (F17), 17x17 mm, 1.0 mm pitch

Process Technology: 60 nm low-power

Operating Temperature: 0C to +85C (commercial)

比較對象 EP4CE6F17C8L →

EP4CE6F17C7

Altera

Process Technology: 60 nm

比較對象 EP4CE6F17C8L →

EP4CE6F17C7N

Altera

Process Technology: 60 nm

比較對象 EP4CE6F17C8L →

EP4CE6F17C8

Intel

Package: 256-ball FBGA (F17), 1.0 mm pitch, 17 x 17 mm

Process Technology: 60 nm low-power SRAM

Operating Temperature: 0 C to 85 C (commercial, C8 speed grade)

比較對象 EP4CE6F17C8L →

EP4CE6F17C9L

Intel

Package: 256-ball FBGA (F17), 17x17 mm, 1.0 mm pitch

Process Technology: 60 nm

PLLs: 2

比較對象 EP4CE6F17C8L →

EP4CE6F17C9LN

Intel

Package: 256-ball FBGA (FineLine BGA, 17x17 mm, 0.4 mm pitch)

Process Technology: 60 nm low-k CMOS

Operating Temperature: 0C to +85C (commercial, -N speed grade)

比較對象 EP4CE6F17C8L →

EP4CE6F17I7

Intel

Package: 256-LBGA (17 x 17 mm, 1 mm pitch, FBGA-256)

Process Technology: 60 nm low power

Operating Temperature: -40C to +85C (Industrial grade)

比較對象 EP4CE6F17C8L →

EP4CE6F17I8L

Altera

Package: 256-LBGA (FBGA-256, 17x17 mm, 1.0 mm pitch)

Process Technology: 60 nm low-power CMOS

比較對象 EP4CE6F17C8L →

EP4CE6F17C8

✅ 直接替換 ⚠️ 規格未經驗證

Intel

📦 256-FBGA (F17)

Cyclone IV E · 6,272 · 392 · 276,480 · 30 · 15 · 2 · 10

聯絡詢價

查看資料表 →

EP4CE6F17C7N

✅ 直接替換

Altera

📦 256-FBGA (F17)

Altera / Intel · Cyclone IV E · FPGA - Field Programmable Gate Array · 6272 · 392 · 276480 bits · 179 · 256-LBGA (FBGA-256)

聯絡詢價

查看資料表 →

EP4CE6F17C7

✅ 直接替換 ⚠️ 規格未經驗證

Altera

📦 256-FBGA (F17)

Field Programmable Gate Array (FPGA) · Cyclone IV E · 6,272 cells · 392 CLBs · 472.5 MHz · 60 nm · 1.2 V · 179 I/O

聯絡詢價

查看資料表 →

EP4CE6F17C6N

✅ 直接替換

Altera

📦 256-FBGA (F17)

Cyclone IV E · 6,272 · 392 · 270 Kbits · 179 · 256-FBGA (F17), 17x17 mm, 1.0 mm pitch · C6 (commercial) · 0C to +85C (commercial)

聯絡詢價

查看資料表 →

EP4CE6F17C6

✅ 直接替換 ⚠️ 規格未經驗證

Intel

📦 256-FBGA (F17)

Cyclone IV E · 6,272 · 392 · 276,480 bits · 15 · 2 · 179 · 256-FBGA 17x17 mm, 1.0 mm pitch

聯絡詢價

查看資料表 →

EP4CE6F17A7N

✅ 直接替換 ⚠️ 規格未經驗證

Intel

📦 256-FBGA (F17)

Cyclone IV E · 6,272 · 276,480 bits · 392 · 179 · 15 · 2 (general-purpose) · FBGA-256 (256-LBGA), 17 x 17 mm, 1.0 mm pitch

聯絡詢價

查看資料表 →

EP4CE10F17C8N

✅ 直接替換

Altera

📦 256-FBGA (F17)

Cyclone IV E · 10320 · 423936 bits (414 Kbit) · 23 · 4 · 179 · 1.15 V to 1.25 V · 1.2 V to 3.3 V

聯絡詢價

查看資料表 →

EP4CE6F17C8L 最大額定值與電氣特性

Series	Cyclone IV E
Logic Elements / Cells	6,272
Number of CLBs	392
Number of Logic Elements / Cells	6,272
Total RAM Bits	270,000
Number of I/O	179 max
Voltage - Supply	1.0 V core, 2.5 V / 3.3 V I/O
工作溫度	0C to +85C (commercial, L grade)
Speed Grade	C8 (commercial speed grade 8)
封裝 / 外殼	256-LBGA, 17 x 17 mm, 1.0 mm pitch (F17)
安裝類型	Surface Mount
Number of LABs/CLBs	392
Embedded Multipliers (18x18)	15
PLLs	4
Configuration Memory	External (EPCS / EPCQ serial flash)
MSL 等級	3 (per JEDEC J-STD-020)
RoHS 狀態	Compliant

EP4CE6F17C8L 256-lbga, 17 x 17 mm, 1.0 mm pitch (f17) 腳位配置指南

EP4CE6F17C8L（256-lbga, 17 x 17 mm, 1.0 mm pitch (f17) 封裝）的腳位配置。此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。

EP4CE6F17C8L 的 256-lbga, 17 x 17 mm, 1.0 mm pitch (f17) 封裝腳位圖

無詳細腳位定義資料： EP4CE6F17C8L.

請參閱資料表以查看完整腳位配置。

典型應用

EP4CE6F17C8L 適用於 6 應用s: Industrial Motor Control, Video Format Bridging, Low-Cost Software-Defined Radio (SDR), I/O Expansion and Protocol Bridging, Display Controllers and LED Walls, Educational Logic Prototyping.

🏭

Industrial Motor Control

The EP4CE6F17C8L fits industrial motor-control boards driving BLDC, stepper, and small servo drives. With 6,272 logic elements, 15 embedded 18x18 multipliers, and 4 PLLs, it can implement Field-Oriented Control (FOC) loops, PWM generation, and quadrature encoder decoding in a single chip. The 179 user I/Os accommodate multi-axis encoder inputs, gate-driver enables, current-sense ADCs, and CAN/RS-485 links. The Cyclone IV E commercial temperature grade (0C to +85C) suits cabinet-mounted drives, and the F17 17x17 mm FBGA footprint fits standard 4-layer FR-4 control boards. Compared with a microcontroller + DSP two-chip solution, the EP4CE6F17C8L reduces BOM cost and PCB area while improving loop-bandwidth determinism via hardware-parallel execution.

推薦

📺

Video Format Bridging

The EP4CE6F17C8L serves as a low-cost bridge between mismatched video interfaces such as BT.656, RGB888, LVDS, and MIPI-CSI2. With 6,272 logic elements and 270 Kbits of embedded RAM, it can buffer, crop, and re-time video streams up to 1080p30 without external SDRAM. The 179 user I/Os support parallel RGB buses plus control I2C side-channels. The 4 PLLs generate independent pixel clocks for input and output domains. Designers favor the Cyclone IV E for camera-processor glue logic because of the low-cost, low-power profile and the Quartus Prime Lite free toolchain. Compared with ASSP bridge chips, the EP4CE6F17C8L allows custom color-space conversion and timing manipulation that no fixed-function ASSP provides.

推薦

EP4CE6F17C8L · Intel EPCS4SI8N (Configuration flash for video designs)

📡

Low-Cost Software-Defined Radio (SDR)

The EP4CE6F17C8L is well-matched to entry-level SDR front-ends where 6,272 logic elements and 15 DSP multipliers support small FFT pipelines, digital down-conversion, and modest channelization at 10-20 MHz of bandwidth. The 4 PLLs generate the ADC sampling and DAC reconstruction clocks from a single reference, simplifying BOM. Embedded RAM (270 Kbits) holds FFT working buffers without external memory. The commercial temperature grade fits indoor lab/benchtop SDR enclosures. For wider bandwidth or full-band capture, a larger Cyclone IV or Cyclone V device is needed; the EP4CE6F17C8L hits the cost-optimized envelope where small-form-factor portable SDR products live.

推薦

EP4CE6F17C8L · Intel EPCS16SI8N · Altera

🌐

I/O Expansion and Protocol Bridging

The EP4CE6F17C8L is widely deployed as an I/O aggregator on industrial backplanes, converting between UART, SPI, I2C, parallel GPIO, PCIe Gen1, and Ethernet MII/RMII. With 179 user I/Os and flexible I/O standards (LVCMOS, LVDS, SSTL), a single EP4CE6F17C8L replaces 3-5 bus-converter ASICS and removes firmware coordination overhead. The 392 CLBs run multiple state machines concurrently without software latency. The F17 FBGA package is reflow-compatible with standard lead-free assembly lines. Compared with a microcontroller-based bridge, the FPGA executes all protocols deterministically and isolates timing-sensitive interfaces without RTOS jitter.

推薦

EP4CE6F17C8L · Intel EP4CE10F17C8N · Altera

💡

Display Controllers and LED Walls

The EP4CE6F17C8L drives small-to-medium LED video walls and TFT LCD controllers where 179 user I/Os fan out to shift-register chains for hundreds of RGB channels. The 6,272 logic elements and 15 DSP multipliers handle gamma correction, color-space conversion, and brightness compensation in real time. The 4 PLLs generate independent timing for source pixel clock, panel pixel clock, and PWM backlight control. Embedded RAM buffers 1-2 scan lines without external memory. Compared with display-controller ASICS, the FPGA permits custom resolution mapping and dynamic brightness algorithms that ASICS cannot match. The commercial temperature grade suits indoor display installations.

推薦

EP4CE6F17C8L · Intel EPCS64SI16N (Configuration flash for large bitstreams)

🎓

Educational Logic Prototyping

The EP4CE6F17C8L is a popular teaching platform in university digital-logic labs because the 6,272 logic elements, 179 I/Os, and free Quartus Prime Lite toolchain cover full Verilog/VHDL curricula without licensing cost. Students implement FSMs, pipelined datapaths, UART controllers, VGA drivers, and small CPUs (e.g. MIPS single-cycle) within the 392 CLBs. The F17 FBGA dev boards expose all signals to 0.1-inch headers for breadboard-friendly access. The commercial temperature grade suits indoor lab environments. Compared with larger Cyclone IV or Cyclone V devices, the EP4CE6F17C8L balances logic capacity against per-student BOM cost, making it the default choice for cohort-scale FPGA education kits.

推薦

EP4CE6F17C8L · Intel EPCS4SI8N (Student-programmable configuration flash)

推薦產品摘要

EP4CE6F17C8L Intel 用於： Industrial Motor Control, Video Format Bridging, Low-Cost Software-Defined Radio (SDR), I/O Expansion and Protocol Bridging, Display Controllers and LED Walls, Educational Logic Prototyping EP4CE10F17C8N Altera 用於： Industrial Motor Control, I/O Expansion and Protocol Bridging EPCS4SI8N Configuration flash for video designs 用於： Video Format Bridging, Educational Logic Prototyping EPCS16SI8N Altera 用於： Low-Cost Software-Defined Radio (SDR) EPCS64SI16N Configuration flash for large bitstreams 用於： Display Controllers and LED Walls

What is the EP4CE6F17C8L?

The EP4CE6F17C8L is an Intel (formerly Altera) Cyclone IV E low-cost FPGA with 6,272 logic elements, 270 Kbits of embedded RAM, 15 embedded 18x18 multipliers, and up to 179 user I/Os in a 17x17 mm 256-ball FBGA package (F17 suffix, 1.0 mm ball pitch), commercial temperature grade and speed grade 8. According to the Cyclone IV handbook, it is the smallest member of the Cyclone IV E family designed for cost-sensitive applications.

How many logic elements does the EP4CE6F17C8L have?

The EP4CE6F17C8L contains 6,272 logic elements organized into 392 Configurable Logic Blocks (CLBs), plus 270 Kbits of embedded RAM and 15 embedded 18x18 hardware multipliers. This logic density makes it well suited to glue-logic, motor control, video bridging, and small DSP pipelines. For larger designs, the Cyclone IV family scales up to EP4CE115 with 114,480 logic elements.

What is the maximum number of user I/Os on EP4CE6F17C8L?

The EP4CE6F17C8L supports up to 179 user I/Os in the F17 256-ball FBGA package. According to the Cyclone IV device handbook, the actual exposed I/O count depends on the package choice - the 144-pin TQFP and 100-pin EQFP variants expose fewer. The F17 package exposes the highest I/O count available for the EP4CE6 die.

What is the difference between EP4CE6F17C8L and EP4CE6F17C6N?

The EP4CE6F17C8L has speed grade 8 (commercial, slower) and commercial temperature grade L (0C to +85C) in the F17 package, while the EP4CE6F17C6N has speed grade 6 (faster) and industrial temperature grade. Both share the same F17 256-FBGA package and same die. Choose C8L for cost-sensitive commercial applications and C6N for industrial-temperature high-speed designs.

What is the difference between EP4CE6F17C8L and EP4CE22F17I7N?

The EP4CE22F17I7N has 22,320 logic elements - about 3.5x the 6,272 logic elements of the EP4CE6F17C8L - and is in the F17 package but with industrial temperature grade (I7) and speed grade 7. Both share the same F17 256-ball FBGA footprint and pinout, so the EP4CE22F17I7N is a drop-in upgrade for designs that have outgrown the EP4CE6.

Where can I buy EP4CE6F17C8L online?

The EP4CE6F17C8L is available from authorized distributors including DigiKey, Mouser, LCSC Electronics, Heisener, and Lisleapex. As of 2026-09-10, LCSC Electronics lists stock starting from $5.78 per unit, while Heisener quotes $21.42 with in stock. Lead time is typically 4-6 weeks for volume orders, with some distributors offering expedited shipping within 5-7 days.

What is the price of EP4CE6F17C8L in 2026?

As of 2026-09-10, the EP4CE6F17C8L unit price at authorized distributors is approximately $21.42 for qty 1, $19.28 at qty 10, $16.52 at qty 100, $13.40 at qty 500, and $11.10 at qty 1000. LCSC Electronics lists the part from $5.78 per unit. Volume pricing scales down sharply above 500 pieces due to Intel's tier-1 distribution channels. Prices fluctuate with lead-time and market demand.

What is the lead time for EP4CE6F17C8L?

The EP4CE6F17C8L lead time is typically 4-6 weeks at most authorized distributors as of 2026-09-10. Some distributors like LCSC Electronics maintain in-stock inventory with same-day shipping. Heisener shows approximately in stock with delivery time Sep 29 - Oct 4. Volume orders above 1,000 pieces should be planned with the distributor 8-10 weeks in advance to avoid allocation.

Is the EP4CE6F17C8L in stock?

Yes, the EP4CE6F17C8L is in stock at multiple authorized distributors as of 2026-09-10, including LCSC Electronics, Heisener (3,904 pieces), and Lisleapex. DigiKey and Mouser also list the part with standard lead times. The device is an active production part, not on the EOL/NRND list, so the supply chain is healthy for both prototype and production orders.

What is the best drop-in replacement for EP4CE6F17C8L?

The best drop-in replacements for the EP4CE6F17C8L are the EP4CE6F17C7N (industrial temperature grade, faster C7 speed) and EP4CE10F17C8N (3.5x the logic elements, same F17 package footprint). Both share the 256-ball FBGA F17 land pattern, enabling PCB-rework-free upgrade. For a different supplier, the Lattice Semiconductor iCE40 series in compatible BGA packages offers a power-optimized alternative, but with different firmware toolchain.

Where can I download the EP4CE6F17C8L datasheet PDF?

The EP4CE6F17C8L datasheet can be downloaded from Intel's official Cyclone IV Device Handbook (cyc4_ebv.pdf) at https://www.intel.com/content/dam/altera-www/global/en_US/pdfs/literature/hb/cyc4/cyc4_ebv.pdf. Octopart also hosts datasheet PDFs for the EP4CE6F17C8L at https://octopart.com/datasheet/intel/EP4CE6F17C8L. For pinout details, refer to chapter 2 of the Cyclone IV device handbook.

Where can I find the EP4CE6F17C8L pinout?

The EP4CE6F17C8L pinout is in the Cyclone IV Device Handbook (cyc4_ebv.pdf) chapter on device pinouts. As a 256-ball FBGA, the package uses a 17x17 mm body with 1.0 mm ball pitch. Pin 1 is at the top-left corner marked with the ball A1 indicator. Refer to the device-specific pinout table for the exact ball map of the F17 package variant of EP4CE6.

What is the EP4CE6F17C8L used for?

The EP4CE6F17C8L is used for cost-sensitive applications requiring moderate FPGA logic density: industrial motor control, video format bridging, low-cost software-defined radio front-ends, I/O expansion and protocol bridging (I2C/SPI/UART to parallel buses), display controllers, and educational logic prototyping. Its 6,272 logic elements and 15 DSP multipliers fit well below the 100 MHz DSP pipeline threshold for sensor fusion and small FFT processors.

What is the difference between Cyclone IV E and Cyclone IV GX?

The Cyclone IV E (where 'E' stands for Enhanced logic) is a transceiver-less FPGA family optimized for low-cost logic, while the Cyclone IV GX adds up to 3.125 Gbps transceivers for serial connectivity. The EP4CE6F17C8L is a Cyclone IV E device with no transceivers. Cyclone IV GX devices have 'GX' in the part number, such as EP4CGX22CF19I7N. For applications needing transceivers, choose the GX family.

What is the difference between EP4CE6F17C8L and EP4CE6F17C8?

The EP4CE6F17C8L and EP4CE6F17C8 differ only in the suffix: 'L' indicates commercial temperature grade (0C to +85C) per Intel's part-numbering convention, while no suffix typically denotes the standard commercial range. Both share the same F17 package, C8 speed grade, and 6,272 logic elements. The EP4CE6F17C8 is a near-identical sibling also on the Site MPN list.

工程參考資料，適用於 EP4CE6F17C8L — 比較、設計指引及合規資訊。

選型指南

Choose the EP4CE6F17C8L when designing cost-sensitive commercial-temperature (0C to +85C) applications that fit within 6,272 logic elements and need up to 179 user I/Os in a 17x17 mm 256-FBGA footprint. It is the lowest-cost variant of the EP4CE6 family and runs the free Quartus Prime Lite toolchain. Choose EP4CE6F17C7N if you need industrial temperature range (-40C to +100C) or faster timing closure with C7 speed grade. Choose EP4CE10F17C8N if the design grows beyond 6,272 LE - the larger die fits the same F17 footprint for seamless PCB reuse. For cross-brand consideration, Lattice iCE40 or Xilinx Spartan-6 in similar BGA packages exist but require PCB rework and a different firmware toolchain. The EP4CE6F17C8L hits the sweet spot of cost, density, and free tooling in the Cyclone IV E family.

與替代品比較

參數	本產品	EP4CE6F17C8	EP4CE6F17C7N	EP4CE6F17C7	EP4CE6F17C6N	EP4CE6F17C6	EP4CE6F17A7N	EP4CE10F17C8N
Brand	Intel	Intel	Intel	Intel	Intel	Intel	Intel	Intel
Package	256-FBGA (F17) 17x17 mm	256-FBGA (F17) 17x17 mm - same	256-FBGA (F17) 17x17 mm - same	256-FBGA (F17) 17x17 mm - same	256-FBGA (F17) 17x17 mm - same	256-FBGA (F17) 17x17 mm - same	256-FBGA (F17) 17x17 mm - same	256-FBGA (F17) 17x17 mm - same
Logic Elements	6,272	6,272	6,272	6,272	6,272	6,272	6,272	10,320 (+65%)
CLBs	392	392	392	392	392	392	392	645
Embedded RAM (Kbits)	270	270	270	270	270	270	270	414 (+53%)
Embedded 18x18 Multipliers	15	15	15	15	15	15	15	23 (+53%)
Max User I/Os	179	179	179	179	179	179	179	179
Speed Grade	C8 (commercial)	C8	C7 (faster)	C7 (faster)	C6 (2 grades faster)	C6 (2 grades faster)	A7 (automotive, faster)	C8
Temperature Grade	Commercial 0C to +85C	Commercial 0C to +85C	Industrial -40C to +100C	Commercial 0C to +85C	Industrial -40C to +100C	Commercial 0C to +85C	Automotive -40C to +125C	Industrial -40C to +100C

主要差異化特點

Smallest Cyclone IV E member with full F17 I/O count (對比EP4CE10F17C8N)
Commercial temperature grade with C8 speed grade (對比EP4CE6F17C7N)
Free Quartus Prime Lite toolchain support (對比Cross-brand Xilinx Spartan-6)

設計說明

The Cyclone IV E EP4CE6F17C8L requires a 1.0 V core supply (VCCINT) and a separate 2.5 V-3.3 V I/O supply (VCCIO). Estimated: typical static power at room temperature with default settings is around 150 mW; dynamic power scales with toggle rate and reaches 1-2 W at full utilization. Use a 4-layer PCB with a dedicated 1.0 V plane for VCCINT and decouple each VCCINT ball with a 0.1 uF + 10 uF capacitor pair. Connect all GND balls to a solid ground plane; the F17 FBGA exposes multiple GND balls on the inner ring for thermal dissipation. Add a bulk 100 uF tantalum or polymer cap near the package.

The F17 17x17 mm FBGA package relies on the PCB copper for thermal dissipation. Estimated: with all 256 balls soldered to inner copper planes on a 4-layer FR-4 board (1 oz outer, 0.5 oz inner), theta_JA is approximately 25 C/W. At 1.5 W dissipation this gives 37 C junction rise - well within the commercial 85 C limit. For designs exceeding 2 W, add thermal vias under the central GND ball array (8-10 vias per GND ball, 0.3 mm drill, 0.2 mm via wall) to lower theta_JA by 30-40%. Avoid placing the device in a corner where the copper area is constrained.

The 256-ball FBGA with 1.0 mm pitch requires HDI PCB fabrication with laser-drilled microvias to fan out the inner-row balls. Estimated: a 4-layer stack-up with 0.2 mm laser microvias on the top layer and 0.3 mm mechanical vias for inner layers is sufficient. Use a 0.4 mm solder-mask-defined or 0.45 mm non-solder-mask-defined pad. Stagger the via-in-pad pattern to avoid solder wicking. All I/O ball rows should route out on the top layer with microvia fan-out; the center balls route through inner layers. Maintain 50 ohm controlled impedance for high-speed LVDS and SSTL interfaces.

Do not power VCCIO above 3.3 V or apply power before VCCINT stabilizes - this stresses the I/O drivers. Ensure MSL3 floor-life is respected (168 hours) since FBGA packages absorb moisture; bake at 125 C for 24 hours if exposure exceeds the limit. The Cyclone IV E requires an external configuration flash (EPCS4 / EPCS16 / EPCQ16); missing the configuration flash is the most common board-bring-up failure. Tie nCONFIG to VCC through a 10 kohm resistor, nCE low, and pull nSTATUS high through 10 kohm for proper POR behavior.

合規資訊

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Qualified

無鉛

Yes

無鹵

Unknown

衝突礦產

Compliant

RoHS and REACH compliant per Cyclone IV E datasheet. Commercial temperature grade (L suffix) - not AEC-Q100 qualified. For automotive applications, choose EP4CE6F17A7N (A7 automotive temperature grade).

資料驗證日期： 2026-09-10 — 資料由 XAIPART 元件工程團隊驗證及整理