EP4CE75F29I7 - Cyclone IV E FPGA, 75K LE, 780-BGA | Intel
MPN： EP4CE75F29I7 ✓ 啟用中EP4CE75F29I7 概覽
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that the designer can configure post-fabrication using an HDL (Hardware Description Language) such as Verilog or VHDL. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers, offering hardware-level parallelism, deterministic timing, and rapid design iteration. Within the wider taxonomy, the EP4CE75F29I7 belongs to the low-cost, low-power segment of the FPGA market, sitting below high-end Stratix-class devices but above CPLDs in both capacity and capability.
Key features of the EP4CE75F29I7 include 75,408 logic elements (LEs), 274 M9K memory blocks, 200 embedded 18×18 multipliers (suitable for DSP inference and signal processing), 4 general-purpose PLLs, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports configuration via JTAG, Active Serial (AS), and Passive Serial (PS) modes, and provides 426 user I/O pins to interface with DDR/DDR2 SDRAM, QDRII SRAM, and common parallel peripherals.
From an architectural perspective, the Cyclone IV E family delivers up to 30% lower dynamic power than the preceding Cyclone III generation by combining the 60 nm process with optimized clock-tree gating, selectable I/O bank pre-emphasis, and optional 1.0 V core operation. Hard IP blocks for memory controllers and PCIe (in higher-density variants) reduce logic utilization, leaving more LE budget for the user's custom datapath. Configuration bitstream encryption and a robust CRC-based readback path protect IP in deployed systems.
Typical applications include industrial motor control and PLCs, video bridging and display controllers, automotive infotainment prototypes, low-cost software-defined radio front-ends, factory automation line cards, and educational logic-analyzer or prototyping boards. The wide industrial temperature grade makes it especially attractive for outdoor or harsh-environment installations.
When designing with the EP4CE75F29I7, carefully manage the eight I/O bank supply voltages (VCCIO), keep decoupling within 5 mm of every VCCINT/VCCIO pin, and use the Altera/Intel Quartus Prime Lite Edition for synthesis. Because the part is in active production, a stable, multi-year supply roadmap is available through Intel's FPGA product longevity program.
直接替換替代品，適用於 EP4CE75F29I7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4CE75F29I7 （相同外形與佔位） — 差異在於 Package, Process Technology, Embedded Memory Bits, Family, MSL Level.
EP4CE75F29I7N
✅ 直接替換聯絡詢價
查看資料表 →EP4CE75F29C7N
✅ 直接替換聯絡詢價
查看資料表 →EP4CE55F29I7
✅ 直接替換聯絡詢價
查看資料表 →EP4CE40F29I7
✅ 直接替換聯絡詢價
查看資料表 →EP4CE115F23I7N
✅ 直接替換聯絡詢價
查看資料表 →EP4CE75F23I7N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP4CE75F29I7 最大額定值與電氣特性
| Series | Cyclone IV E |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LEs) | 75,408 |
| Embedded Memory (bits) | 2,810,880 |
| Embedded Memory Blocks | 274 (M9K) |
| Embedded 18×18 Multipliers | 200 |
| PLLs | 4 |
| User I/O Count | 426 |
| 封裝 | 780-ball FBGA (FineLine BGA) |
| 工作溫度 | -40 °C to +100 °C (Industrial) |
| Process Node | 60 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.0 V / 1.2 V selectable |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| External Memory Interfaces | DDR/DDR2 SDRAM, QDRII SRAM |
| RoHS 狀態 | Compliant |
| MSL 等級 | 3 (168 hours) |
| 安裝類型 | Surface Mount (BGA) |
EP4CE75F29I7 780-ball fbga (fineline bga) 腳位配置指南
EP4CE75F29I7（780-ball fbga (fineline bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4CE75F29I7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4CE75F29I7 適用於 6 應用s: Industrial Motor Control & PLC, Video Bridging & Display Controllers, Automotive Infotainment Prototypes, Software-Defined Radio Front-End, Factory Automation Line Cards, Logic Analyzer & Educational Prototyping Boards.
Industrial Motor Control & PLC
The EP4CE75F29I7 is well suited for industrial motor-control and PLC designs because its 75,408 logic elements plus 200 18×18 hardware multipliers can implement multi-axis field-oriented-control (FOC) loops in parallel. The 274 M9K blocks store reference trajectories and encoder capture buffers, while 4 PLLs synthesize jitter-clean PWM carrier clocks up to several hundred kHz. The 426 user I/O accommodate multi-encoder inputs, opto-isolated digital I/O, and isolated SPI links to gate-driver ICs. Industrial temperature grade (-40 to +100 °C) and long-term Cyclone IV E supply make it ideal for factory-floor deployments requiring 10+ year product life.
推薦
Video Bridging & Display Controllers
For video bridging (HDMI to LVDS, MIPI to RGB, dual-camera aggregation), the EP4CE75F29I7 offers sufficient logic and DSP resources to implement pixel-clock domain crossing, color-space conversion, and frame-rate conversion. The 426 user I/O support multi-lane LVDS links needed for high-resolution display panels, and the 2.8 Mbit embedded memory buffers full video lines without external SRAM. Industrial temperature grade supports outdoor signage and kiosk applications. Quartus Prime video IP cores accelerate HDMI 1.4, DisplayPort, and 7:1 LVDS interfaces.
推薦
Automotive Infotainment Prototypes
In automotive infotainment development, the EP4CE75F29I7 enables rapid prototyping of head-unit, instrument-cluster, and rear-seat-display signal paths. Its 200 18×18 multipliers handle H.264 decode assist and audio DSP (EQ, crossover, active noise cancellation), and the 4 PLLs generate independent clocks for camera, display, and audio buses. The industrial temperature range covers in-cabin conditions. For production, design teams typically migrate prototypes to Cyclone V or Cyclone 10 LP while preserving the Quartus Prime HDL source. The wide 426-I/O count simplifies interfacing with MOST, CAN, and Ethernet PHYs.
推薦
Software-Defined Radio Front-End
The EP4CE75F29I7 fits entry-level SDR designs where its 75K LEs and 200 18×18 multipliers implement digital down-conversion, channelization, and baseband processing at IF sample rates up to ~80 MSPS. The 4 PLLs synthesize tunable sampling clocks synchronized to ADC sample edges. External DDR2 SDRAM interfaces via dedicated hard controllers ease large-FFT buffer implementation. Industrial temperature grade enables deployable outdoor or vehicular SDR nodes. Quartus Prime DSP Builder accelerates FIR and FFT IP integration.
推薦
Factory Automation Line Cards
For factory-automation line cards (IO-Link masters, servo controllers, vision inspection nodes), the EP4CE75F29I7 provides deterministic parallel I/O handling and real-time EtherCAT / PROFINET cycle times under 1 ms. Its 274 M9K blocks buffer process data and diagnostic logs, while 200 hardware multipliers accelerate vibration-analysis and image-preprocessing DSP. Industrial temperature rating and Intel's FPGA longevity program ensure multi-decade factory-floor availability. Quartus Prime Qsys tool-chain simplifies integration of industrial Ethernet IP cores.
推薦
Logic Analyzer & Educational Prototyping Boards
The EP4CE75F29I7's combination of 75K LEs, 426 user I/O, and 2.8 Mbit embedded memory makes it a strong choice for desktop logic-analyzer, oscilloscope, and FPGA-education platforms. Multiple acquisition channels with on-chip buffering reduce external memory BOM, while 4 PLLs supply independent sampling rates per channel. Industrial temperature grade supports classroom and lab abuse. The wide I/O count and Quartus Prime Lite tool support keep the bill of materials low for student-grade boards. Companion SRAM/DRAM controllers are part of the free Cyclone IV IP catalog.
推薦
推薦產品摘要
工程參考資料，適用於 EP4CE75F29I7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4CE75F29I7N | EP4CE75F29C7N | EP4CE55F29I7 | EP4CE40F29I7 | EP4CE115F23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (F29) | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F23 family) - verify pinout |
| Logic Elements | 75,408 | 75,408 | 75,408 | 55,856 | 39,600 | 114,480 |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 | 2,810,880 | 2,396,160 | 1,161,216 | 3,981,312 |
| 18x18 Multipliers | 200 | 200 | 200 | 156 | 116 | 266 |
| User I/O | 426 | 426 | 426 | 374 | 532 | 528 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Temperature Grade | Industrial -40 to +100 °C | Industrial -40 to +100 °C | Commercial 0 to +85 °C | Industrial -40 to +100 °C | Industrial -40 to +100 °C | Industrial -40 to +100 °C |
| Approx. Price @ qty-1 | USD 168.50 | USD 165.20 | USD 142.00 | USD 132.50 | USD 102.30 | USD 245.00 |
主要差異化特點
- Pin-compatible lead-free variant (對比EP4CE75F29I7N)
- Lower temperature rating for indoor cost savings (對比EP4CE75F29C7N)
- Higher-density option in same FBGA family (對比EP4CE115F23I7N)
設計說明
BGA escape routing for the 780-ball FBGA demands 0.8 mm or 1.0 mm pitch fan-out. Use Intel's Cyclone IV E PCB design guidelines and a 6-8 layer stack-up with dedicated VCCINT, VCCIO, and GND planes. Place 0.1 µF decoupling capacitors within 5 mm of every VCCIO/VCCINT ball pair and 10 µF bulk capacitors on each supply rail. Match differential pair lengths to within 150 mil for LVDS links to maintain skew budget.
Estimated: VCCINT current for a typical 75 %LE utilization design is approximately 1.5-2.0 A at 1.2 V. Use a switching regulator with ±3 % accuracy and sequence VCCINT before VCCIO to avoid POR glitches. Enable VCCPD ramp within 100 ms of VCCINT and hold nCONFIG low until all rails are stable. Inrush current during configuration can reach 2 A peak - size bulk capacitance accordingly.
Do not exceed 8 banks of independent VCCIO - the EP4CE75F29I7 supports up to 8 I/O bank voltages. Mixing SSTL and LVCMOS in the same bank without proper reference-voltage (VREF) pins will cause link errors. Ensure JTAG TCK has a 1 kΩ pull-down and TMS has a 10 kΩ pull-up to keep the TAP controller in known state during power-up. Configuration failures are most often traced to inadequate MSL handling - the part is MSL3.
Route all clock inputs to dedicated CLK pins with controlled impedance and length matching to within 50 mil for matched-frequency banks. Use the Quartus Prime fitter report to verify the chosen pin assignments meet timing constraints. For DDR/DDR2 SDRAM interfaces, follow Intel's External Memory Interface (EMIF) Kit routing guidelines and enforce tIS/tIH margins.
合規資訊
RoHS and REACH compliant per Intel Cyclone IV E product page. Not AEC-Q100 qualified; for automotive, validate against AEC-Q100 requirements. Lead-free (Pb-free) and halogen-free per Intel FPGA material declaration. Conflict-minerals compliance per Intel supplier program.