EP4CE75F29I7 - Cyclone IV E FPGA, 75K LE, 780-BGA | Intel
Référence : EP4CE75F29I7 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $168.5 | $168,50 |
| 10 | $152.4 | $1 524,00 |
| 100 | $137.2 | $13 720,00 |
| 250 | $128.75 | $32 187,50 |
| 500 | $121.3 | $60 650,00 |
EP4CE75F29I7 Présentation
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that the designer can configure post-fabrication using an HDL (Hardware Description Language) such as Verilog or VHDL. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers, offering hardware-level parallelism, deterministic timing, and rapid design iteration. Within the wider taxonomy, the EP4CE75F29I7 belongs to the low-cost, low-power segment of the FPGA market, sitting below high-end Stratix-class devices but above CPLDs in both capacity and capability.
Key features of the EP4CE75F29I7 include 75,408 logic elements (LEs), 274 M9K memory blocks, 200 embedded 18×18 multipliers (suitable for DSP inference and signal processing), 4 general-purpose PLLs, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports configuration via JTAG, Active Serial (AS), and Passive Serial (PS) modes, and provides 426 user I/O pins to interface with DDR/DDR2 SDRAM, QDRII SRAM, and common parallel peripherals.
From an architectural perspective, the Cyclone IV E family delivers up to 30% lower dynamic power than the preceding Cyclone III generation by combining the 60 nm process with optimized clock-tree gating, selectable I/O bank pre-emphasis, and optional 1.0 V core operation. Hard IP blocks for memory controllers and PCIe (in higher-density variants) reduce logic utilization, leaving more LE budget for the user's custom datapath. Configuration bitstream encryption and a robust CRC-based readback path protect IP in deployed systems.
Typical applications include industrial motor control and PLCs, video bridging and display controllers, automotive infotainment prototypes, low-cost software-defined radio front-ends, factory automation line cards, and educational logic-analyzer or prototyping boards. The wide industrial temperature grade makes it especially attractive for outdoor or harsh-environment installations.
When designing with the EP4CE75F29I7, carefully manage the eight I/O bank supply voltages (VCCIO), keep decoupling within 5 mm of every VCCINT/VCCIO pin, and use the Altera/Intel Quartus Prime Lite Edition for synthesis. Because the part is in active production, a stable, multi-year supply roadmap is available through Intel's FPGA product longevity program.
Alternatives de remplacement direct pour EP4CE75F29I7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CE75F29I7 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Embedded Memory Bits, Family, MSL Level.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CE75F29I7N
✅ Remplacement direct✓ En stock
$540 / unité
Voir la fiche technique →EP4CE75F29C7N
✅ Remplacement direct✓ En stock
$152.7 / unité
Voir la fiche technique →EP4CE55F29I7
✅ Remplacement direct✓ En stock
$139.95 / unité
Voir la fiche technique →EP4CE40F29I7
✅ Remplacement direct✓ En stock
$96.2 / unité
Voir la fiche technique →EP4CE115F23I7N
✅ Remplacement direct✓ En stock
$87.95 / unité
Voir la fiche technique →EP4CE75F23I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$118 / unité
Voir la fiche technique →EP4CE75F29I7 Valeurs maximales et caractéristiques électriques
| Series | Cyclone IV E |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LEs) | 75,408 |
| Embedded Memory (bits) | 2,810,880 |
| Embedded Memory Blocks | 274 (M9K) |
| Embedded 18×18 Multipliers | 200 |
| PLLs | 4 |
| User I/O Count | 426 |
| Boîtier | 780-ball FBGA (FineLine BGA) |
| Température de fonctionnement | -40 °C to +100 °C (Industrial) |
| Process Node | 60 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.0 V / 1.2 V selectable |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| External Memory Interfaces | DDR/DDR2 SDRAM, QDRII SRAM |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours) |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du EP4CE75F29I7 780-ball fbga (fineline bga)
Configuration des broches du EP4CE75F29I7 (boîtier 780-ball fbga (fineline bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4CE75F29I7.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4CE75F29I7 convient pour 6 applications: Industrial Motor Control & PLC, Video Bridging & Display Controllers, Automotive Infotainment Prototypes, Software-Defined Radio Front-End, Factory Automation Line Cards, Logic Analyzer & Educational Prototyping Boards.
Industrial Motor Control & PLC
The EP4CE75F29I7 is well suited for industrial motor-control and PLC designs because its 75,408 logic elements plus 200 18×18 hardware multipliers can implement multi-axis field-oriented-control (FOC) loops in parallel. The 274 M9K blocks store reference trajectories and encoder capture buffers, while 4 PLLs synthesize jitter-clean PWM carrier clocks up to several hundred kHz. The 426 user I/O accommodate multi-encoder inputs, opto-isolated digital I/O, and isolated SPI links to gate-driver ICs. Industrial temperature grade (-40 to +100 °C) and long-term Cyclone IV E supply make it ideal for factory-floor deployments requiring 10+ year product life.
Recommandé
Video Bridging & Display Controllers
For video bridging (HDMI to LVDS, MIPI to RGB, dual-camera aggregation), the EP4CE75F29I7 offers sufficient logic and DSP resources to implement pixel-clock domain crossing, color-space conversion, and frame-rate conversion. The 426 user I/O support multi-lane LVDS links needed for high-resolution display panels, and the 2.8 Mbit embedded memory buffers full video lines without external SRAM. Industrial temperature grade supports outdoor signage and kiosk applications. Quartus Prime video IP cores accelerate HDMI 1.4, DisplayPort, and 7:1 LVDS interfaces.
Recommandé
Automotive Infotainment Prototypes
In automotive infotainment development, the EP4CE75F29I7 enables rapid prototyping of head-unit, instrument-cluster, and rear-seat-display signal paths. Its 200 18×18 multipliers handle H.264 decode assist and audio DSP (EQ, crossover, active noise cancellation), and the 4 PLLs generate independent clocks for camera, display, and audio buses. The industrial temperature range covers in-cabin conditions. For production, design teams typically migrate prototypes to Cyclone V or Cyclone 10 LP while preserving the Quartus Prime HDL source. The wide 426-I/O count simplifies interfacing with MOST, CAN, and Ethernet PHYs.
Recommandé
Software-Defined Radio Front-End
The EP4CE75F29I7 fits entry-level SDR designs where its 75K LEs and 200 18×18 multipliers implement digital down-conversion, channelization, and baseband processing at IF sample rates up to ~80 MSPS. The 4 PLLs synthesize tunable sampling clocks synchronized to ADC sample edges. External DDR2 SDRAM interfaces via dedicated hard controllers ease large-FFT buffer implementation. Industrial temperature grade enables deployable outdoor or vehicular SDR nodes. Quartus Prime DSP Builder accelerates FIR and FFT IP integration.
Recommandé
Factory Automation Line Cards
For factory-automation line cards (IO-Link masters, servo controllers, vision inspection nodes), the EP4CE75F29I7 provides deterministic parallel I/O handling and real-time EtherCAT / PROFINET cycle times under 1 ms. Its 274 M9K blocks buffer process data and diagnostic logs, while 200 hardware multipliers accelerate vibration-analysis and image-preprocessing DSP. Industrial temperature rating and Intel's FPGA longevity program ensure multi-decade factory-floor availability. Quartus Prime Qsys tool-chain simplifies integration of industrial Ethernet IP cores.
Recommandé
Logic Analyzer & Educational Prototyping Boards
The EP4CE75F29I7's combination of 75K LEs, 426 user I/O, and 2.8 Mbit embedded memory makes it a strong choice for desktop logic-analyzer, oscilloscope, and FPGA-education platforms. Multiple acquisition channels with on-chip buffering reduce external memory BOM, while 4 PLLs supply independent sampling rates per channel. Industrial temperature grade supports classroom and lab abuse. The wide I/O count and Quartus Prime Lite tool support keep the bill of materials low for student-grade boards. Companion SRAM/DRAM controllers are part of the free Cyclone IV IP catalog.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CE75F29I7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CE75F29I7N | EP4CE75F29C7N | EP4CE55F29I7 | EP4CE40F29I7 | EP4CE115F23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (F29) | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F23 family) - verify pinout |
| Logic Elements | 75,408 | 75,408 | 75,408 | 55,856 | 39,600 | 114,480 |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 | 2,810,880 | 2,396,160 | 1,161,216 | 3,981,312 |
| 18x18 Multipliers | 200 | 200 | 200 | 156 | 116 | 266 |
| User I/O | 426 | 426 | 426 | 374 | 532 | 528 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Temperature Grade | Industrial -40 to +100 °C | Industrial -40 to +100 °C | Commercial 0 to +85 °C | Industrial -40 to +100 °C | Industrial -40 to +100 °C | Industrial -40 to +100 °C |
| Approx. Price @ qty-1 | USD 168.50 | USD 165.20 | USD 142.00 | USD 132.50 | USD 102.30 | USD 245.00 |
Principaux différenciateurs
- Pin-compatible lead-free variant (vs EP4CE75F29I7N)
- Lower temperature rating for indoor cost savings (vs EP4CE75F29C7N)
- Higher-density option in same FBGA family (vs EP4CE115F23I7N)
Notes de conception
BGA escape routing for the 780-ball FBGA demands 0.8 mm or 1.0 mm pitch fan-out. Use Intel's Cyclone IV E PCB design guidelines and a 6-8 layer stack-up with dedicated VCCINT, VCCIO, and GND planes. Place 0.1 µF decoupling capacitors within 5 mm of every VCCIO/VCCINT ball pair and 10 µF bulk capacitors on each supply rail. Match differential pair lengths to within 150 mil for LVDS links to maintain skew budget.
Estimated: VCCINT current for a typical 75 %LE utilization design is approximately 1.5-2.0 A at 1.2 V. Use a switching regulator with ±3 % accuracy and sequence VCCINT before VCCIO to avoid POR glitches. Enable VCCPD ramp within 100 ms of VCCINT and hold nCONFIG low until all rails are stable. Inrush current during configuration can reach 2 A peak - size bulk capacitance accordingly.
Do not exceed 8 banks of independent VCCIO - the EP4CE75F29I7 supports up to 8 I/O bank voltages. Mixing SSTL and LVCMOS in the same bank without proper reference-voltage (VREF) pins will cause link errors. Ensure JTAG TCK has a 1 kΩ pull-down and TMS has a 10 kΩ pull-up to keep the TAP controller in known state during power-up. Configuration failures are most often traced to inadequate MSL handling - the part is MSL3.
Route all clock inputs to dedicated CLK pins with controlled impedance and length matching to within 50 mil for matched-frequency banks. Use the Quartus Prime fitter report to verify the chosen pin assignments meet timing constraints. For DDR/DDR2 SDRAM interfaces, follow Intel's External Memory Interface (EMIF) Kit routing guidelines and enforce tIS/tIH margins.
Informations de conformité
RoHS and REACH compliant per Intel Cyclone IV E product page. Not AEC-Q100 qualified; for automotive, validate against AEC-Q100 requirements. Lead-free (Pb-free) and halogen-free per Intel FPGA material declaration. Conflict-minerals compliance per Intel supplier program.