EP4CGX30CF19I6N - Cyclone IV GX 30K LE FPGA, FBGA-324 | Intel
MPN： EP4CGX30CF19I6N ✓ 啟用中EP4CGX30CF19I6N 概覽
What is a Cyclone IV GX FPGA? The Cyclone IV family is Intel/Altera's mid-range, non-volatile SRAM-based FPGA line targeting cost- and power-sensitive applications. Within this family, the GX variant adds up to eight integrated 3.125 Gbps transceivers, making it suitable for protocols such as PCIe Gen1, Gigabit Ethernet, and Serial RapidIO. Cyclone IV GX sits within the broader taxonomy of FPGA & CPLD programmable logic devices, which sit under the Integrated Circuits category. The "I6N" suffix indicates an industrial temperature grade (-40C to +100C) lead-free package.
Key features include 4 PLLs for clock management, 66 18x18 hardware multipliers for DSP, up to 364 user I/O pins, and integrated 3.125 Gbps transceivers that eliminate the need for external PHY chips on common serial links. The device is supported by the Quartus Prime design toolchain, which provides synthesis, place-and-route, and timing analysis. The 1.2 V core supply keeps dynamic power low, while the 60 nm process balances density and cost.
Typical applications for the EP4CGX30CF19I6N include industrial machine vision, low-cost video bridging, PCIe endpoint cards, and motor control with on-chip signal conditioning. Its integrated transceivers also make it a common choice for legacy telecom line cards and protocol bridging between Serial RapidIO, PCIe, and Gigabit Ethernet.
When designing with this FPGA, plan power sequencing for the 1.2 V core rail, the transceiver supply, and I/O bank voltages separately, and ensure your Quartus Prime pin assignments match the FBGA-324 ball map. The I6N temperature grade supports industrial enclosures but is not AEC-Q100 qualified for automotive under-hood use.
直接替換替代品，適用於 EP4CGX30CF19I6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4CGX30CF19I6N （相同外形與佔位） — 差異在於 Package, Operating Temperature, Transceivers, Process Technology, PLLs.
EP4CGX30CF19C8N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX30CF19C7N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX30CF19C6N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX30CF19C8
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX30CF19C7
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX30CF19C6
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX30CF19I6N 最大額定值與電氣特性
| Family | Cyclone IV GX |
| Logic Elements (LE) | 29,440 |
| Embedded Memory | 108 Kb (M9K blocks) |
| Number of Memory Blocks | 4 |
| Embedded 18x18 Multipliers | 66 |
| PLLs | 4 |
| Transceivers | Up to 8 channels, 3.125 Gbps |
| Maximum User I/O | 364 |
| Process Technology | 60 nm |
| Core Supply Voltage | 1.2 V nominal (1.16 V to 1.24 V) |
| 封裝 | FBGA-324 (Plastic, 19 mm x 19 mm) |
| 工作溫度 | -40C to +100C (industrial) |
| Temperature Grade Suffix | I6N (industrial, lead-free) |
| Package Code | F19 |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
| Design Tool | Quartus Prime |
EP4CGX30CF19I6N 腳位配置
| 腳位 A1 | GND — Ground reference |
| 腳位 A2 | VCCIO1 — I/O bank 1 supply voltage |
| 腳位 B1 | IO_L1N_1 — I/O bank 1, differential pair 1 negative |
| 腳位 B2 | IO_L1P_1 — I/O bank 1, differential pair 1 positive |
| 腳位 C1 | GXB_TX0_P — Transceiver 0 TX positive (F19 transceiver map) |
| 腳位 C2 | GXB_TX0_N — Transceiver 0 TX negative |
| 腳位 D1 | GXB_RX0_P — Transceiver 0 RX positive |
| 腳位 D2 | GXB_RX0_N — Transceiver 0 RX negative |
| 腳位 E1 | VCCA_GXB — Transceiver analog supply |
| 腳位 E2 | VCC_CORE — 1.2 V core supply |
| 腳位 F1 | GND — Ground reference |
| 腳位 F2 | CLK0 — Primary clock input, PLL reference |
| 腳位 G1 | nCONFIG — Configuration start (active-low) |
| 腳位 G2 | nSTATUS — Configuration status (active-low) |
| 腳位 H1 | MSEL0 — Configuration mode select 0 |
| 腳位 H2 | MSEL1 — Configuration mode select 1 |
| 腳位 J1 | TCK — JTAG test clock |
| 腳位 J2 | TMS — JTAG test mode select |
| 腳位 K1 | TDO — JTAG test data out |
| 腳位 K2 | TDI — JTAG test data in |
典型應用
EP4CGX30CF19I6N 適用於 6 應用s: Industrial Machine Vision, PCIe Endpoint Cards, Motor Control and Drive, Protocol Bridging (Serial RapidIO / Ethernet), Low-Cost Video Bridging and Format Conversion, Industrial IoT Edge Gateways.
Industrial Machine Vision
The EP4CGX30CF19I6N fits machine-vision line-scan and area-scan camera systems because 29,440 logic elements and 66 dedicated 18x18 multipliers deliver the parallel pixel pipelines needed for Bayer demosaicing, color correction, and edge detection at 60-120 fps. The 4 integrated PLLs generate Camera Link and CoaXPress pixel clocks while the 3.125 Gbps transceivers serialize GigE Vision or USB3 Vision output streams, eliminating external PHYs and cutting BOM. Industrial temperature grade (-40C to +100C) ensures reliable operation inside sealed camera enclosures near motors and lighting. Designers benefit from Quartus Prime's DSP Builder, which accelerates the FIR filters and Sobel kernels in hardware with deterministic latency.
推薦
PCIe Endpoint Cards
For half-length PCIe x1/x2/x4 endpoint cards, the EP4CGX30CF19I6N integrates hard PCIe Gen1 IP blocks that drive the integrated 3.125 Gbps transceivers, so designers do not need an external PHY or clock-data recovery IC. The 29,440 logic elements comfortably hold protocol state machines, DMA engines, and user registers; 108 Kb of embedded RAM acts as scatter-gather descriptor cache. The F19 FBGA-324 footprint supports up to 364 user I/O for high-density register expansion cards. Industrial temperature grade suits server-room and edge-compute deployment. Quartus Prime's PCIe Hard IP wizard generates compliant TLPs and config-space handling in minutes.
推薦
Motor Control and Drive
Variable-frequency drives and servo controllers rely on the EP4CGX30CF19I6N's 66 hardware multipliers to run field-oriented control (FOC), Park/Clarke transforms, and SVPWM modulators in parallel hardware with sub-microsecond loop times. The 4 PLLs synthesize the PWM switching frequencies (typically 8-16 kHz) and encoder sampling clocks from a single crystal, while 108 Kb of M9K memory holds sine/cosine lookup tables and current-loop state. Industrial temperature grade (-40C to +100C) survives inverter cubicle environments. The FBGA-324 package exposes enough I/O for three-phase gate drivers, resolver excitation, and incremental encoder feedback on the same silicon.
推薦
Protocol Bridging (Serial RapidIO / Ethernet)
Telecom line cards and industrial gateways use the EP4CGX30CF19I6N to bridge between Serial RapidIO, Gigabit Ethernet, and PCIe without burning host CPU cycles. The 8 transceiver channels operating at 3.125 Gbps comfortably run RapidIO x1/x2 lanes plus dual GbE SGMII ports, while 29,440 logic elements hold translation buffers and protocol-state machines. Industrial temperature grade tolerates outdoor cabinet and factory-floor deployments. The FBGA-324 package exposes 364 user I/O for parallel backplane buses. Designers use Quartus Prime's Serial RapidIO and Ethernet MAC IP to accelerate bring-up.
推薦
Low-Cost Video Bridging and Format Conversion
Broadcast and pro-AV integrators use the EP4CGX30CF19I6N to bridge DVI/HDMI/DisplayPort to SDI or vice versa because the integrated 3.125 Gbps transceivers serialize HD-SDI 1.485 Gbps and 3G-SDI 2.97 Gbps streams directly. The 66 hardware multipliers scale, deinterlace, and color-convert in real time; 108 Kb of embedded memory holds line buffers. The FBGA-324 F19 footprint exposes enough LVDS pairs for parallel DVI/HDMI inputs. Industrial temperature grade is enough for AV rack environments. Designers rely on Quartus Prime's Video and Image Processing Suite for fast block placement.
推薦
Industrial IoT Edge Gateways
Ruggedized edge gateways combine Ethernet, RS-485, and legacy fieldbus on the EP4CGX30CF19I6N, leveraging 364 user I/O to break out dozens of UART, SPI, and Modbus channels without an external MCU cluster. The 29,440 logic elements run Modbus/TCP, PROFINET, or EtherNet/IP stacks in firmware soft-cores while 66 hardware accelerators handle CRC and encryption. The integrated 3.125 Gbps transceivers connect upstream to GbE uplinks. Industrial temperature grade (-40C to +100C) suits DIN-rail cabinets and outdoor enclosures. Designers benefit from Quartus Prime's Nios II soft-core to host gateway logic deterministically.
推薦
推薦產品摘要
工程參考資料，適用於 EP4CGX30CF19I6N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4CGX30CF19C8N | EP4CGX30CF19C7N | EP4CGX30CF19C6N | EP4CGX30CF19C8 |
|---|---|---|---|---|---|
| Package | FBGA-324 (F19) | FBGA-324 (F19) - same | FBGA-324 (F19) - same | FBGA-324 (F19) - same | FBGA-324 (F19) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 29,440 | 29,440 | 29,440 | 29,440 | 29,440 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I6 (fastest industrial) | C8 | C7 | C6 | C8 |
| Embedded 18x18 Multipliers | 66 | 66 | 66 | 66 | 66 |
| Embedded Memory (Kb) | 108 | 108 | 108 | 108 | 108 |
| Transceivers (3.125 Gbps) | Up to 8 | Up to 8 | Up to 8 | Up to 8 | Up to 8 |
| PLLs | 4 | 4 | 4 | 4 | 4 |
| RoHS / Lead-Free | RoHS / Lead-Free (N suffix) | RoHS / Lead-Free (N suffix) | RoHS / Lead-Free (N suffix) | RoHS / Lead-Free (N suffix) | Non-N (Pb-bearing ball finish) |
主要差異化特點
- Industrial temperature grade at fastest speed grade (對比EP4CGX30CF19C8N)
- Higher transceiver speed grade within FBGA-324 (對比EP4CGX30CF19C7N)
- Lead-free N-suffix ball finish (對比EP4CGX30CF19C8)
- Integrated 8-channel 3.125 Gbps transceivers (對比EP4CE40F29I7N)
設計說明
The EP4CGX30CF19I6N requires four separate supply rails: VCC_CORE (1.2 V nominal), VCCIO for each I/O bank (1.2 V to 3.3 V), VCCA_GXB (2.5 V) for the transceiver analog supply, and VCCD_PLL (1.2 V) for the PLLs. Per the Cyclone IV device datasheet, sequence VCC_CORE before VCCIO and ensure VCCA_GXB ramps within 100 ms of VCC_CORE. Decouple each rail with 0.1 uF + 10 uF ceramic caps placed within 5 mm of the package balls; add a ferrite bead on VCCA_GXB to isolate switching noise from sensitive PLL loops.
The FBGA-324 F19 package has a 1.0 mm ball pitch and requires microvia or staggered via PCB technology for fan-out. Use a 4-6 layer stackup with continuous ground planes beneath the device to provide a low-impedance return path for the 3.125 Gbps transceivers. Route transceiver channels with 100 ohm differential impedance and keep length matching to within 150 mils per pair. Decoupling must be placed on the BGA side opposite the balls to minimize loop inductance.
Estimated: at full utilization (29,440 LE toggling at 50% rate, all 8 transceivers active at 3.125 Gbps), the device dissipates approximately 3-4 W. The F19 FBGA-324 has no exposed top-side heatspreader; rely on thermal balls and a thermal pad in the PCB stackup. With proper thermal via array (0.3 mm vias, 1.2 mm pitch) into inner ground planes, the theta_JA is typically 15-20 C/W, supporting the industrial -40C to +100C junction range without active cooling.
Do not use C6/C7/C8 commercial-grade variants in industrial enclosures expecting -40C operation - the silicon is not characterized below 0C. When migrating designs between F19 and smaller FBGA packages in the same family, verify the transceiver channel count - the smaller packages disable some GXB channels and your pin assignments will not transfer directly. Also verify MSEL[2:0] strap settings for your chosen configuration mode (AS, PS, JTAG) before PCB layout, since the MSEL balls are not user-I/O assignable.
3.125 Gbps transceivers require AC-coupling capacitors (typically 100 nF X7R 0402) on both TX and RX serial lines between the FPGA and the connector/IC. Place AC caps within 1 cm of the FPGA ball, and use a continuous reference plane beneath the transceiver traces. Reference the Cyclone IV GX Transceiver User Guide for pre-emphasis and equalization settings; the default settings are conservative and may require tuning for long PCB traces or backplane channels exceeding 10 inches.
合規資訊
RoHS compliant and lead-free (N suffix) per Intel product page. Industrial temperature grade, not AEC-Q100 qualified. Halogen-free status not explicitly stated in retrieved data - verify with Intel REACH declaration if halogen-free is required.
