EP4SGX110FF35C2XG - 105.6K LE Stratix IV GX FPGA | Intel
MPN： EP4SGX110FF35C2XG ✓ 啟用中EP4SGX110FF35C2XG 概覽
An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets hardware engineers implement arbitrary digital logic via HDL and synthesis. Stratix IV FPGAs occupy the high-performance tier of the Intel/Altera portfolio and combine a logic fabric, embedded memory blocks, DSP blocks, PLLs, high-speed transceivers, and hard PCIe/IP cores on a single die. The GX suffix indicates transceiver capability, which positions this device between the general-purpose Stratix IV E family and the larger Stratix IV GT family.
Key features include 105,600 logic elements backed by 4,224 LABs, 9,793,536 total RAM bits distributed across M9K/M144K blocks, up to 372 user I/Os split across 12 I/O banks, and dedicated hardware for DSP multiplication, phase-locked loops, and memory controllers. The 1152-ball FCBGA package supports the wide transceiver and I/O count while providing a thermal path for sustained workloads. Core voltage operates at 0.87 V to 0.93 V with separate transceiver/auxiliary rails.
Architecturally, Stratix IV GX integrates up to 24 full-duplex CDR-based transceivers with PMA/PCS layers, programmable PCIe Gen1/Gen2 hard IP blocks, and partial reconfiguration capability. The adaptive logic module (ALM) is the 8-input fracturable LUT that drives the high logic-density figures, while the 40 nm process node balances performance and leakage for line-card and high-end embedded designs.
Typical applications include high-speed wireline communications line cards, radar and DSP front-ends, ASIC prototyping, test and measurement instrumentation, broadcast video processing, and PCI Express-based adapter cards. The integrated transceivers simplify SFP+/QSFP+ connectivity, while the generous DSP block count accelerates FFT and filter pipelines.
Designers must provide a multi-rail power tree (VCC, VCCA, VCCD_PLL, VCHIP, VCCT_GXB, etc.) with proper sequencing and decoupling per the Stratix IV handbook. Pin assignments, transceiver reference clocks, and PCB stack-up with controlled-impedance differential pairs are mandatory for robust high-speed operation.
This page synthesizes distributor pricing, same-family Stratix IV drop-in alternatives, transceiver and DSP comparisons, and practical power/PCB design notes not found on a typical Altera/Intel product listing.
直接替換替代品，適用於 EP4SGX110FF35C2XG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4SGX110FF35C2XG （相同外形與佔位） — 差異在於 Package, Embedded Memory, Speed Grade, Family, Operating Temperature.
EP4SGX110FF35C3N
✅ 直接替換📋 參考替代品（不在目錄中）
EP4SGX110FF35C2N
✅ 直接替換📋 參考替代品（不在目錄中）
EP4SGX110FF35I2XG
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP4SGX110FF35C4G
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP4SGX110FF35C2X
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP4SGX110DF29C2XG
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX110FF35C2XG 最大額定值與電氣特性
| Series | Stratix IV GX |
| Process Technology | 40 nm |
| Logic Elements | 105,600 |
| Logic Array Blocks (LABs) | 4,224 |
| Total RAM Bits | 9,793,536 |
| User I/O Pins | 372 |
| Number of I/O Banks | 12 |
| 工作溫度 | 0C to +85C |
| Supply Voltage (Core) | 0.87 V to 0.93 V |
| 封裝 | 1152-BBGA, FCBGA (35 mm) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
EP4SGX110FF35C2XG 1152-bbga, fcbga (35 mm) 腳位配置指南
EP4SGX110FF35C2XG（1152-bbga, fcbga (35 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4SGX110FF35C2XG.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4SGX110FF35C2XG 適用於 6 應用s: High-Speed Wireline Communications Line Card, ASIC Prototyping Platform, Radar and DSP Front-End Processing, Test and Measurement Instrumentation, Broadcast Video Processing, PCI Express Adapter Cards.
High-Speed Wireline Communications Line Card
The EP4SGX110FF35C2XG fits 10G/40G line-card designs thanks to its integrated multi-gigabit transceivers, 9.7 Mbit embedded RAM for packet FIFOs, and 105,600 logic elements for MAC-layer and traffic-management datapaths. The 372 user I/Os feed parallel SFI/XFI interfaces while the transceiver channels drive SFP+/QSFP+ optical modules. The Stratix IV GX hard PCIe Gen2 IP enables direct CPU/ASIC handoff over the backplane, and the 40 nm process balances performance with 100G-ready feature density.
推薦
ASIC Prototyping Platform
For ASIC prototyping the EP4SGX110FF35C2XG offers 105,600 logic elements and 9.7 Mbit of embedded RAM, providing ample capacity for partitioning mid-complexity ASICs into a single device. The Stratix IV GX ALM architecture is friendly to synthesized ASIC RTL, and Quartus II/Prime design flows support ASIC-equivalent timing closure with hard PCIe and memory controllers. The 1152-ball FCBGA also exposes enough user I/Os for bridging prototype test infrastructure.
推薦
Radar and DSP Front-End Processing
Radar signal processing benefits from the EP4SGX110FF35C2XG's DSP block density, parallel multi-channel capability, and wide data-path widths. The integrated transceivers feed directly from ADC front-ends at typical IF sampling rates, while the embedded RAM blocks buffer FFT windows in real-time pulse-Doppler processing. With 372 user I/Os, the FPGA can drive high-resolution displays and downstream DSP modules in parallel.
推薦
Test and Measurement Instrumentation
Test equipment designers choose the EP4SGX110FF35C2XG for its combined logic density, fast transceivers, and PCIe Gen2 endpoint capability that links to host CPUs. The 105,600 LEs implement protocol-aware stimulus generators, while the 9.7 Mbit RAM hosts deep capture buffers. The 1152-ball FCBGA exposes enough I/Os for high-pin-count logic analyzers, BERT patterns, and parallel ATE interfaces.
推薦
Broadcast Video Processing
Broadcast video workflows need the EP4SGX110FF35C2XG's mix of DSP blocks for color-space conversion, RAM for line/frame buffering, and high-speed transceivers for SDI/HDMI-over-10G links. The 372 user I/Os feed parallel video buses, while the PCIe Gen2 hard IP connects to host CPUs for file ingest. Quartus II reference designs simplify 3G/HD/SD-SDI bridging.
推薦
PCI Express Adapter Cards
The EP4SGX110FF35C2XG's hard PCIe Gen1/Gen2 endpoint plus 9.7 Mbit of RAM and high I/O count make it ideal for high-performance PCIe adapter cards (NICs, HBAs, accelerators). The integrated transceivers also support external serial connectivity, and Quartus II's PCIe MegaCore function provides a turnkey reference design with verified timing closure. The 1152-ball FCBGA provides the I/O headroom for parallel expansion buses.
推薦
推薦產品摘要
工程參考資料，適用於 EP4SGX110FF35C2XG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4SGX110FF35C3N | EP4SGX110FF35C2N | EP4SGX110FF35I2XG | EP4SGX110FF35C4G | EP4SGX110FF35C2X | EP4SGX110DF29C2XG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA, FCBGA (35 mm) | 1152-BBGA, FCBGA (35 mm) - same | 1152-BBGA, FCBGA (35 mm) - same | 1152-BBGA, FCBGA (35 mm) - same | 1152-BBGA, FCBGA (35 mm) - same | 1152-BBGA, FCBGA (35 mm) - same | FCBGA (29 mm body) - different size |
| Logic Elements | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 |
| Speed Grade | -2 (C2) | -3 (faster) | -2 (same) | -2 industrial | -4 (fastest) | -2 (same) | -2 (same) |
| Temperature Grade | Commercial (0-85C) | Commercial (0-85C) | Commercial (0-85C) | Industrial (-40 to +100C) | Commercial (0-85C) | Commercial (0-85C) | Commercial (0-85C) |
| Total RAM Bits | 9,793,536 | 9,793,536 | 9,793,536 | 9,793,536 | 9,793,536 | 9,793,536 | 9,793,536 |
| Pb-Free (RoHS) | Yes (XG suffix) | No (N suffix, leaded) | No (N suffix, leaded) | Yes | Yes | No | Yes |
主要差異化特點
- Pb-free RoHS-compliant ordering code (對比EP4SGX110FF35C2N)
- Commercial temperature grade with broad distributor availability (對比EP4SGX110FF35I2XG)
- Larger 35 mm FCBGA exposes maximum I/O and transceiver count (對比EP4SGX110DF29C2XG)
設計說明
The EP4SGX110FF35C2XG requires a multi-rail power tree: VCC (0.87-0.93 V core), VCCA, VCCD_PLL, VCHIP, and VCCT_GXB for the transceivers. Power-on sequencing must follow the Stratix IV Power Management Design Guide to prevent latch-up; POR (power-on-reset) requires the VCC rail to ramp before auxiliary rails. Decoupling uses a mix of bulk, mid-frequency, and high-frequency ceramic capacitors placed adjacent to each power pin, with a solid ground pour on the top layer to provide a return path.
Estimated: with theta_JA around 6-8 C/W for a 35 mm FCBGA on a 6-layer JEDEC test board, the device dissipates roughly 5-8 W in typical workloads. Without forced airflow, junction rise stays within the 85 C commercial limit only if board-level thermal design (thermal vias, heat spreader) keeps case temperature below ~75 C. For production hardware, place the device near a heat sink attach point and use at least 9 thermal vias under the BGA thermal pad to a copper pour on inner/bottom layers.
Use a 12-layer or higher stack-up with controlled-impedance 50 ohm single-ended and 90 ohm differential pairs on the transceiver channels. Reference the Stratix IV GX Altium/Cadence reference design for stack-up recommendations. Length matching within 150 mils for differential pairs is essential to maintain 8.5 Gbps signal integrity. Decoupling vias should be placed within 50 mils of each power pin; via-in-pad improves high-current return paths.
Common pitfalls with the EP4SGX110FF35C2XG include: forgetting transceiver reference clock jitter requirements (use low-jitter oscillators within 100-300 ppm of the configured rate), neglecting AS configuration mode pull-up resistor values on MSEL pins, and selecting the wrong configuration voltage standard (3.3 V vs 1.8 V). Always cross-check the configuration scheme (AS, PS, JTAG) against the Stratix IV Configuration Handbook, and validate bitstream generation for the actual speed grade (C2 vs C3) in Quartus.
合規資訊
RoHS compliant per Intel/Altera ordering code suffix XG; AEC-Q100 not applicable (this is a commercial FPGA, not an automotive-grade part).