EP4SGX110FF35I3G - Stratix IV GX FPGA 105.6K LE, 1152-FCBGA | Intel
MPN： EP4SGX110FF35I3G ⚠ 最後購買機會EP4SGX110FF35I3G 概覽
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor that implements custom digital logic through configurable logic blocks, programmable routing, and dedicated hardware blocks such as transceivers and DSP slices. FPGAs belong to the broader category of programmable logic devices (PLDs) within logic semiconductors, sitting alongside ASICs and CPLDs. The Stratix IV family targets high-performance applications by integrating high-speed transceivers, abundant block RAM, and structured DSP pipelines on a 40 nm process node.
Key features of the EP4SGX110FF35I3G include the 105,600 logic elements backed by 5,659 M20K embedded memory blocks totaling 9,793,536 bits, 532 18x18 multipliers for DSP, and a -3 speed grade that delivers a balance of timing margin and power efficiency. The 8.5 Gbps transceiver capability enables protocols such as PCIe Gen2, Serial RapidIO, CPRI, and 10 Gigabit Ethernet XAUI when used with soft IP. The 1152-ball FCBGA package supports the device's high pin count while providing the signal integrity required for multi-gigabit serial links.
Architecture highlights include the Altera Logic Array Block (LAB) with adaptive logic modules, MultiTrack routing for predictable timing closure, and Programmable Power Technology that dynamically reduces power on unused logic. The GX variant integrates hardened PCIe, CPRI, and Serial RapidIO IP, reducing soft-logic overhead and simplifying board bring-up for communications infrastructure designs.
Typical applications include high-speed data acquisition systems, wireless baseband processing, military radar, broadcast video processing, and protocol bridging cards. The combination of 8 transceivers, abundant DSP, and large block RAM is well suited to multi-channel digital receivers and Software Defined Radio platforms.
A key design consideration is the FPGA's configuration scheme: the EP4SGX110FF35I3G supports fast passive parallel (FPP) and active serial (AS) configuration modes. Plan PCB layout to keep configuration flash within trace-length limits and provide decoupling per Intel's Pin Connection Guidelines to avoid power-rail noise during configuration. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP4SGX110FF35I3G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4SGX110FF35I3G （相同外形與佔位） — 差異在於 Package, Speed Grade, Embedded Memory, RoHS Status, Family.
EP4SGX110FF35C4G
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP4SGX110FF35C3G
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP4SGX110FF35C2XG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP4SGX230FF35I3N
✅ 直接替換📋 參考替代品（不在目錄中）
EP4SGX110HF35C3G
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX110FF35I3G 最大額定值與電氣特性
| Series | Stratix IV GX |
| Family | Altera Stratix IV |
| Logic Elements | 105,600 |
| Embedded Memory | 9,793,536 bits (M20K blocks) |
| User I/O Count | 372 |
| Number of Transceivers | 8 |
| Transceiver Data Rate | up to 8.5 Gbps |
| DSP Blocks (18x18 Multipliers) | 532 |
| Speed Grade | -3 |
| 封裝 | 1152-BBGA, FCBGA (Flip-Chip BGA) |
| Process Node | 40 nm |
| 工作溫度 | -40C to +100C (Industrial, I3) |
| Configuration Mode | FPP, AS, PS, JTAG |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| Hardened IP Blocks | PCIe Gen1/Gen2, CPRI, Serial RapidIO |
| Voltage | Core 0.9 V, transceiver and I/O rails per datasheet |
EP4SGX110FF35I3G 1152-bbga, fcbga (flip-chip bga) 腳位配置指南
EP4SGX110FF35I3G（1152-bbga, fcbga (flip-chip bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4SGX110FF35I3G.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4SGX110FF35I3G 適用於 6 應用s: Wireless Baseband Processing, High-Speed Data Acquisition, Military Radar Signal Processing, Broadcast Video Processing, Protocol Bridging and Interface Cards, Software Defined Radio Platforms.
Wireless Baseband Processing
The EP4SGX110FF35I3G fits wireless baseband processing because its 105,600 logic elements and 532 18x18 DSP multipliers can sustain multi-antenna LTE and 5G NR physical-layer compute pipelines, while the 8 transceivers up to 8.5 Gbps handle CPRI links to the radio unit at up to 9.83 Gbps when overspeed is enabled. The 9,793,536 bits of M20K block RAM provide buffering for soft-decision FEC and HARQ retransmission scratch areas. Designers typically instantiate the CPRI hard IP to offload PHY work and reserve soft logic for scrambling, rate matching, and channel decoding.
推薦
High-Speed Data Acquisition
The EP4SGX110FF35I3G is well matched to multi-channel data acquisition systems where ADC data streams must be aggregated, buffered, and pre-processed. The 105,600 logic elements implement channel synchronization, FIR filtering, and decimation, while the 532 DSP blocks accelerate FFT and digital-down-conversion operations. The 8.5 Gbps transceivers accept JESD204B Class 1/2 ADC outputs, removing the need for external deserializer parts. Industrial temperature grade I3 supports outdoor instrumentation and aerospace test rigs.
推薦
Military Radar Signal Processing
The EP4SGX110FF35I3G suits phased-array radar signal processing because the 105,600 logic elements implement beamforming weights and tracking algorithms while 532 DSP blocks sustain pulse-Doppler FFTs across thousands of range bins. The 8.5 Gbps transceivers link to ADCs and DACs over LVDS or JESD204B, and the industrial -40C to +100C temperature range handles avionics and shipboard environments. The hardened PCIe Gen2 endpoint accelerates radar data offload to host processors at 5 Gbps per lane.
推薦
Broadcast Video Processing
The EP4SGX110FF35I3G targets broadcast video processing where 4K/UHD real-time pipelines demand both high logic density and high DSP throughput. The 105,600 logic elements implement color-space conversion, scaling engines, and overlay composition, while the 532 18x18 multipliers accelerate polyphase scaling and motion-adaptive deinterlacing. The 8 transceivers up to 8.5 Gbps accept SDI-over-fiber and HD-SDI streams via external equalizers, simplifying backplane routing. PCI Express hard IP enables plug-in capture cards for studio servers.
推薦
Protocol Bridging and Interface Cards
The EP4SGX110FF35I3G is ideal for protocol bridging cards such as Serial RapidIO to Ethernet or CPRI to PCIe adapters. The 8 hardened Serial RapidIO endpoints and PCIe Gen2 hard IP dramatically reduce soft-logic overhead, freeing the 105,600 logic elements for protocol conversion and packet classification. Industrial temperature rating lets the card sit in outdoor telecom enclosures. The 372 user I/O pins expose LVDS and LVCMOS lanes for backplane connectivity.
推薦
Software Defined Radio Platforms
The EP4SGX110FF35I3G fits Software Defined Radio development platforms where the 105,600 logic elements support wideband waveform processing and the 8.5 Gbps transceivers digitize RF outputs from wideband ADC front ends. The 9,793,536 bits of block RAM store waveform samples and channelization coefficients without external memory pressure. The Quartus II CPRI and 10 Gigabit Ethernet soft IPs accelerate SDR reference designs from prototype to deployment.
推薦
推薦產品摘要
工程參考資料，適用於 EP4SGX110FF35I3G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4SGX110FF35C4G | EP4SGX110FF35C3G | EP4SGX110FF35C2XG | EP4SGX230FF35I3N | EP4SGX110HF35C3G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA, FCBGA (FF35) | 1152-BBGA, FCBGA (FF35) - same | 1152-BBGA, FCBGA (FF35) - same | 1152-BBGA, FCBGA (FF35) - same | 1152-BBGA, FCBGA (FF35) - same | 1152-BBGA, FCBGA (HF35) - same family |
| Logic Elements | 105,600 | 105,600 | 105,600 | 105,600 | 212,800 | 105,600 |
| Speed Grade | -3 | -4 | -3 | -2 | -3 | -3 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| User I/O | 372 | 372 | 372 | 372 | 372 | 372 |
| Transceivers | 8 up to 8.5 Gbps | 8 up to 8.5 Gbps | 8 up to 8.5 Gbps | 8 up to 8.5 Gbps | 16 up to 8.5 Gbps | 8 up to 8.5 Gbps |
| Embedded Memory | 9,793,536 bits | 9,793,536 bits | 9,793,536 bits | 9,793,536 bits | 17,133,056 bits | 9,793,536 bits |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
| Site MPN Available | No | Yes | Yes | Yes | No | No |
主要差異化特點
- Industrial temperature grade at -3 speed grade (對比EP4SGX110FF35C4G)
- Drop-in compatibility across Stratix IV GX FF35 family (對比EP4SGX110FF35C3G)
- High transceiver count at high density (對比EP4SGX230FF35I3N)
設計說明
The EP4SGX110FF35I3G requires four supply rails: VCCINT (0.9 V core), VCCD_PLL (1.0 V), VCCIO (per bank, 1.2/1.5/1.8/2.5/3.0/3.3 V), and VCCHIP/GXB (1.4 V for transceivers). Bulk-decouple each rail with 220 uF polymer plus 10 uF ceramic near the device, and place 0.1 uF and 1 nF ceramics within 1 cm of each power pin. Estimated core current at 105,600 LE and 50% toggle rate is approximately 4 A; use a 6 A DC-DC regulator with 105 C-rated ceramic output capacitors.
Estimated: at -3 industrial speed grade with 105,600 LE at full utilization and 8 transceivers running at 8.5 Gbps, total power dissipation can reach 25-30 W. The FF35 FCBGA package has theta-JA of approximately 8 C/W with a heat spreader, requiring either a heat sink with thermal interface material or a forced-air flow of at least 200 LFM. Always validate the design with Quartus II PowerPlay early in the schematic phase.
The 1152-ball FCBGA at 1.0 mm pitch requires microvia (HDI) stackup with 4-1-4 or 6-1-6 layer count, 0.5 oz copper on outer layers and 1 oz on inner. Route GXB transceiver pairs with controlled impedance of 100 ohm differential, length-matched within 0.127 mm. Reference Intel's Stratix IV GX Board Design Guidelines (AN 528) for breakout, via-in-pad, and decoupling placement specifics.
Do not confuse FF35 (1.0 mm pitch, 35 mm body) with HF35 or DF29 package variants - the FF35 is the highest I/O count Stratix IV GX variant. Always generate Quartus II pin assignments using the FF35 device in the Pin Planner to avoid ball-map errors. Verify configuration mode (FPP/AS) jumpering matches the boot flash part, since mode-pin strapping errors are a common factory bring-up failure.
合規資訊
RoHS and lead-free per Intel product page. AEC-Q100 not applicable (FPGA is not an automotive-qualified IC). Reach SVHC and CMRT declarations available via Intel's Product Compliance portal under Stratix IV GX MDDS documents.