Intel

EP4SGX110DF29C2XG - Stratix IV GX FPGA, 105.6K LEs, 780-FCBGA | Intel

MPN: EP4SGX110DF29C2XG ✓ 啟用中
780-FCBGA (29 mm) Package 9,793,536 Memory
MOQ: 1 |

EP4SGX110DF29C2XG 概覽

The Intel (formerly Altera) EP4SGX110DF29C2XG is a high-density Stratix IV GX FPGA featuring 105,600 logic elements and 9,793,536 bits of embedded memory (3,564 Kbits of M9K plus 1,318 Kbits of MLAB), fabricated on a 40 nm process. It integrates 372 user I/O pins in a 780-ball FCBGA package and is engineered for high-performance signal processing, serial connectivity, and embedded processing applications where deterministic latency and high transceiver bandwidth are required.

An FPGA (Field Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs), dedicated DSP slices, on-chip memory blocks, and routing interconnect. Stratix IV GX extends this baseline by adding multi-gigabit transceivers, hard PCIe IP cores, and external memory controller support, placing it in the high-end programmable logic family that sits between general-purpose FPGAs and ASICs in the programmable device hierarchy: programmable logic device -> FPGA -> high-end FPGA with transceivers -> SoC FPGA.

Key device features include an FPGA fabric with embedded DSP blocks (variable-precision multipliers and accumulators), dedicated memory blocks (M9K and MLAB), and a hard memory controller that interfaces to DDR/DDR2/DDR3 SDRAM, QDR II/II+ SRAM, and RLDRAM II. The GX suffix denotes the integrated multi-gigabit transceiver subsystem supporting standards such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and 1G/10G Ethernet through hard PCS channels.

Typical applications include high-throughput digital signal processing (radar, beamforming, software-defined radio), high-speed serial protocol bridging (PCIe, Serial RapidIO, 10G Ethernet), ASIC prototyping, and high-end test and measurement instrumentation. The 780-FCBGA package provides the signal and power integrity needed for parallel LVDS and multi-gigabit serial interfaces while remaining compatible with high-density PCB stack-ups.

When designing with this device, plan FPGA floorplanning and pin assignment with Quartus II early to close timing on transceiver channels, and verify signal integrity on the multi-gigabit lanes through IBIS-AMI simulation. Power estimation must include the GX transceiver analog supply rails separately from the core FPGA rails, since the transceivers dominate total device power at full line rate.

直接替換替代品,適用於 EP4SGX110DF29C2XG — 相同封裝,腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號: EP4SGX110DF29C2XG (相同外形與佔位) — 差異在於 Package, Operating Temperature, Speed Grade, Mounting Type, Adaptive Logic Modules (ALM).

Intel
Operating Temperature: Commercial (0C to +85C) - per C3 grade suffix
Mounting Type: Surface Mount (Flip-Chip BGA)
比較對象 EP4SGX110DF29C2XG →
Intel
Package: 780-ball FCBGA (DF29)
Operating Temperature: 0C to +85C (commercial)
Speed Grade: C4
比較對象 EP4SGX110DF29C2XG →
Intel
Package: 780-ball FCBGA, 29x29 mm
Operating Temperature: -40C to +100C (Industrial I3 grade)
Speed Grade: 3
比較對象 EP4SGX110DF29C2XG →
Altera
Operating Temperature: -40C to +100C (Industrial)
Adaptive Logic Modules (ALM): 42,240
比較對象 EP4SGX110DF29C2XG →
Intel
Package: 1152-BBGA, FCBGA (35 mm)
Operating Temperature: 0C to +85C
比較對象 EP4SGX110DF29C2XG →
Intel
Package: 780-FBGA (29x29 mm)
比較對象 EP4SGX110DF29C2XG →
Intel
Package: 780-ball FC-FBGA (DF29)
Speed Grade: C2 (lower-power commercial/industrial variant)
Mounting Type: Surface Mount (FCBGA)
比較對象 EP4SGX110DF29C2XG →
Intel
Speed Grade: C4 (commercial)
比較對象 EP4SGX110DF29C2XG →

EP4SGX230DF29C2X

✅ 直接替換 ⚠️ 規格未經驗證
📦 780-FCBGA (DF29)
Same 780-FCBGA DF29 footprint; 230K LEs vs 105.6K LEs (+118%); higher DSP block count; pin-compatible

📋 參考替代品(不在目錄中)

EP4SGX290DF29C2X

✅ 直接替換 ⚠️ 規格未經驗證
📦 780-FCBGA (DF29)
Same 780-FCBGA DF29 footprint; 290K LEs vs 105.6K LEs (+175%); pin-compatible same package option

📋 參考替代品(不在目錄中)

ℹ️ 1 跨封裝零件已隱藏 — 不同封裝需重新加工 PCB,並非真正的直接替換品。 聯絡我們 如果您需要跨封裝建議。

EP4SGX110DF29C2XG 最大額定值與電氣特性

Series Stratix IV GX
Manufacturer Intel (formerly Altera)
Process Technology 40 nm
Logic Elements (LEs) 105,600
Total Memory Bits 9,793,536
User I/O Count 372
封裝 780-FCBGA (29 mm)
安裝類型 Surface Mount
Multi-Gigabit Transceivers Yes (GX series, hard PCS)
Embedded DSP Blocks Yes (variable-precision)
External Memory Interface DDR/DDR2/DDR3, QDR II/II+, RLDRAM II
Hard PCIe IP Yes (PCIe Gen1/Gen2 hard IP)
Configuration Method FPGA configuration flash / JTAG
RoHS 狀態 Compliant

EP4SGX110DF29C2XG 780-fcbga (29 mm) 腳位配置指南

EP4SGX110DF29C2XG(780-fcbga (29 mm) 封裝)的腳位配置。 此數位 IC 包含 GPIO、通訊介面(UART、SPI、I2C)與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。

EP4SGX110DF29C2XG 的 780-fcbga (29 mm) 封裝腳位圖

無詳細腳位定義資料: EP4SGX110DF29C2XG.

請參閱 資料表 以查看完整腳位配置。

典型應用

EP4SGX110DF29C2XG 適用於 7 應用s: Software-Defined Radio (SDR) Baseband, High-Speed Serial Protocol Bridge, ASIC Prototyping and Emulation, High-End Test & Measurement Instrumentation, Radar and Beamforming Signal Processing, Video Broadcast and Image Processing, Industrial High-Speed Control Systems.

🌐

Software-Defined Radio (SDR) Baseband

The EP4SGX110DF29C2XG's multi-gigabit transceivers interface directly to JESD204B/C ADCs and DACs used in wideband SDR baseband cards, while its variable-precision DSP blocks execute channelization, decimation, and digital down-conversion (DDC) chains in hardware. The 105,600 LEs and 9.79 Mbits of embedded memory buffer ADC capture across multiple antennas, and the hard PCIe Gen2 IP links the FPGA to a host CPU for higher-layer baseband processing. With 372 user I/Os the device exposes LVDS pairs for backplane synchronization.

🌐

High-Speed Serial Protocol Bridge

Used as a bridge between PCIe Gen2, Serial RapidIO, 10G Ethernet, and custom backplane protocols, the EP4SGX110DF29C2XG integrates hard PCS channels that close timing at 6.375 Gbps line rates without soft-IP overhead. Its 105,600 LEs handle protocol state machines and DMA, while the 780-FCBGA package preserves signal integrity on multi-gigabit lanes. Engineers use this configuration in telecom base-station line cards and protocol-conversion ASICs.

🖥️

ASIC Prototyping and Emulation

The 105,600 logic elements of the EP4SGX110DF29C2XG combined with 9.79 Mbits of embedded memory make it a viable target for ASIC prototyping of mid-complexity SoCs. Designers partition the ASIC RTL across multiple Stratix IV GX FPGAs using TimeGen or HapsCheck timing closure tools, with the integrated multi-gigabit transceivers modelling chip-to-chip SerDes at near-SoC line rates. The 780-FCBGA package exposes enough user I/Os to bring out ASIC peripherals for real-time verification.

🔧

High-End Test & Measurement Instrumentation

Test instruments such as protocol analyzers, oscilloscopes, and bit-error-rate testers rely on the EP4SGX110DF29C2XG to capture and generate multi-gigabit serial traffic in real time. Its variable-precision DSP blocks perform on-the-fly decoding, error counting, and pattern matching, while 9.79 Mbits of embedded memory buffer acquisition captures. The 780-FCBGA package supports fine BGA fan-out to high-pin-count probe fixtures and high-speed connector backplanes.

✈️

Radar and Beamforming Signal Processing

In phased-array and MIMO radar front-ends the EP4SGX110DF29C2XG implements beamforming weight calculation, pulse compression, and CFAR detection directly in its variable-precision DSP blocks. The 9.79 Mbits of embedded memory store range-Doppler maps across multiple PRIs, and the integrated multi-gigabit transceivers distribute digitized sub-array data across the backplane. The 372 user I/Os expose LVDS synchronization lines between array elements.

📺

Video Broadcast and Image Processing

Broadcast video routers and image-processing pipelines use the EP4SGX110DF29C2XG for real-time 3G-SDI/HD-SDI switching, color-space conversion, and scaling. Its 105,600 LEs handle multi-stream pixel pipelines, the 9.79 Mbits of embedded memory buffer line-rate frame buffers, and the integrated transceers transport SDI and HDMI streams without external PHYs. The 780-FCBGA package supports the high-pin-count parallel video buses used in broadcast routers.

🏭

Industrial High-Speed Control Systems

Industrial motion controllers and machine-vision systems use the EP4SGX110DF29C2XG for sub-microsecond servo-loop processing and real-time image preprocessing. Its variable-precision DSP blocks execute multi-axis PID loops in hardware, the 9.79 Mbits of embedded memory buffer camera frames, and the multi-gigabit transceivers link to GigE Vision cameras over the CoaXPress or 10G Ethernet physical layers. The 780-FCBGA package handles dense encoder and GPIO routing.

推薦產品摘要

AD9680 Analog Devices 用於: Software-Defined Radio (SDR) Baseband AD9144 JESD204B DAC for transmit chain 用於: Software-Defined Radio (SDR) Baseband TLK10034 External 10G Ethernet PHY companion 用於: High-Speed Serial Protocol Bridge PEX8748 PCIe Gen3 switch for host-side connectivity 用於: High-Speed Serial Protocol Bridge EP4SE530H35C4N Intel 用於: ASIC Prototyping and Emulation MT48LC16M16A2 DDR SDRAM model memory for prototyping 用於: ASIC Prototyping and Emulation AD9257 Octal 14-bit ADC for oscilloscope front-end 用於: High-End Test & Measurement Instrumentation CY7C68013A USB 2.0 controller for host-side data offload 用於: High-End Test & Measurement Instrumentation AD9364 Integrated RF agile transceiver for radar front-end 用於: Radar and Beamforming Signal Processing HMCAD1511 Quad 8-bit ADC at 1 Gsps for IF sampling 用於: Radar and Beamforming Signal Processing LMH0341 3G-SDI adaptive cable equalizer 用於: Video Broadcast and Image Processing ADV7511 HDMI transmitter for video output 用於: Video Broadcast and Image Processing MAX14819 Industrial EtherCAT slave controller 用於: Industrial High-Speed Control Systems TDC-GP22 High-precision time-to-digital converter for motion 用於: Industrial High-Speed Control Systems
What is the EP4SGX110DF29C2XG?
The EP4SGX110DF29C2XG is an Intel (formerly Altera) Stratix IV GX FPGA with 105,600 logic elements, 9,793,536 bits of embedded memory, and 372 user I/Os in a 780-ball FCBGA package. According to the Stratix IV device datasheet, the GX series integrates multi-gigabit transceivers and hard PCIe IP cores for high-speed serial applications.
How much logic fabric and memory does the EP4SGX110DF29C2XG have?
The EP4SGX110DF29C2XG provides 105,600 logic elements (per the verified DigiKey listing) and 9,793,536 bits of total embedded memory, distributed across M9K and MLAB blocks. This places it in the mid-to-upper density tier of the Stratix IV family, suitable for multi-channel DSP and protocol-bridging designs.
Where can I buy the EP4SGX110DF29C2XG online?
The EP4SGX110DF29C2XG is in stock at authorized distributors including DigiKey, Mouser, LCSC, Xecor, and Avaq. LCSC lists a unit price of $1,575.89 as of 2026-09-10. For high-reliability sourcing, verify the manufacturer's supply chain on Intel's authorized distributor list.
What is the lead time for the EP4SGX110DF29C2XG?
DigiKey lists the EP4SGX110DF29C2XG as 'ships today' (in stock at time of fetch on 2026-09-10). For production volumes of 100+ units, lead time depends on distributor allocation; on-demand distributors such as Xecor and Avaq also confirm immediate delivery for sample orders.
Is the EP4SGX110DF29C2XG pin-compatible with any other Stratix IV GX device?
Within the Stratix IV GX family, the EP4SGX110DF29C2XG shares its 780-FCBGA package (option 'DF29') with other density points in the same package option, but transceivers and IO count differ. Same-brand drop-in alternatives such as EP4SGX230DF29 and EP4SGX290DF29 in the same 780-FCBGA footprint are common engineering drop-ins where higher logic density is acceptable.
Where do I download the EP4SGX110DF29C2XG datasheet PDF?
The Stratix IV device datasheet is available on Alldatasheet (40-page document) and via the Intel/Altera documentation portal for the Stratix IV GX family. Search 'EP4SGX110DF29C2XG' on Alldatasheet or navigate to the Intel FPGA documentation library to retrieve the family handbook and pin-out file (PDF) for the 780-FCBGA package.
Where is the EP4SGX110DF29C2XG pinout diagram?
The 780-ball FCBGA pinout for the EP4SGX110DF29C2XG is published in the Stratix IV GX pin connection guidelines and the per-package pinout spreadsheet. Both are available in the Intel FPGA documentation library under Stratix IV GX device documentation; download the 'DF29' package pinout file to identify ball assignments.
EP4SGX110DF29C2XG vs EP4SGX230DF29 - which is better for DSP-heavy designs?
The EP4SGX230DF29 in the same 780-FCBGA footprint offers roughly 2x the logic elements and DSP blocks compared to the EP4SGX110DF29C2XG, making it the better choice for DSP-heavy designs requiring more multipliers. Choose the EP4SGX110DF29C2XG only when your design fits within its 105.6K LEs and you benefit from lower unit cost.
EP4SGX110DF29C2XG vs EP4CGX110DF27 - which is better for transceiver applications?
The EP4SGX110DF29C2XG (Stratix IV GX) integrates multi-gigabit transceivers and hard PCIe IP, whereas the EP4CGX110DF27 (Cyclone IV GX, same logic element count class) targets lower-cost, lower-power transceiver applications. Choose the Stratix IV GX for higher transceiver line rates (3+ Gbps) and PCIe Gen2; choose the Cyclone IV GX for cost-sensitive, lower-bandwidth designs.
What is the best drop-in replacement for the EP4SGX110DF29C2XG?
The best same-brand drop-in replacement is the EP4SGX230DF29 (or EP4SGX290DF29) in the identical 780-FCBGA 'DF29' package, sharing pin compatibility with a higher logic-element budget. For newer process-node migration, the Stratix V GX family (5SGXMA7) provides a footprint-compatible migration path but requires board-level re-spin and Quartus tool migration.
Is the EP4SGX110DF29C2XG suitable for software-defined radio (SDR) applications?
Yes, the EP4SGX110DF29C2XG is well suited for software-defined radio designs. Its integrated multi-gigabit transceivers interface directly to ADC/DAC JESD204B links, its variable-precision DSP blocks implement wideband digital down-conversion (DDC) chains, and its 9.79 Mbits of embedded memory buffer ADC capture data for subsequent FFT-based channelization.
Is the EP4SGX110DF29C2XG the same as the EP4SGX110FF35?
No, the EP4SGX110DF29C2XG and EP4SGX110FF35 are different packages of the same 105.6K LE Stratix IV GX die. The DF29 designation indicates the 780-ball FCBGA, while the FF35 indicates a 1152-ball FCBGA with a higher user-IO count. They are NOT pin-compatible and cannot be swapped on the same PCB.
What is the operating temperature range of the EP4SGX110DF29C2XG?
The 'C2' suffix in EP4SGX110DF29C2XG indicates the commercial temperature grade (0C to +85C) per Altera's Stratix IV device nomenclature. For industrial (-40C to +100C) operation, choose the 'I2' suffix variant in the same package. The 'G' suffix denotes RoHS compliance and lead-free assembly.
What are the key specifications of EP4SGX110DF29C2XG that engineers should know?
Engineers designing with the EP4SGX110DF29C2XG should know: 105,600 logic elements, 9,793,536 bits of embedded memory, 372 user I/Os, integrated multi-gigabit transceivers (GX series), hard PCIe Gen1/Gen2 IP cores, DDR3 external memory interface support, and a 780-ball FCBGA package. The 'C2XG' suffix indicates commercial temperature grade and lead-free RoHS-compliant assembly.

工程參考資料,適用於 EP4SGX110DF29C2XG — 比較、設計指引及合規資訊。

選型指南

Choose the EP4SGX110DF29C2XG when your design requires the 105.6K LE class of logic density with integrated multi-gigabit transceivers and hard PCIe IP, and when your PCB layout is fixed to the 780-ball FCBGA DF29 package. For designs that exceed the 105.6K LEs or require more DSP blocks, step up within the same DF29 footprint to the EP4SGX230DF29C2X (228K LEs) or EP4SGX290DF29C2X (290K LEs) - both share the same board layout. For higher transceiver line rates (>6.375 Gbps) and forward-migration to newer silicon, evaluate the Stratix V GX family or Arria 10 GX, accepting that board re-design and Quartus tool migration are required.

與替代品比較

參數 本產品 EP4SGX230DF29C2X EP4SGX290DF29C2X EP4SGX110FF35C2X
Package 780-FCBGA (DF29) 780-FCBGA (DF29) - same 780-FCBGA (DF29) - same 1152-FCBGA (FF35) - different
Brand Intel Intel Intel Intel
Logic Elements 105,600 228,000 290,000 105,600
Embedded Memory 9,793,536 bits 17,133,312 bits 21,041,664 bits 9,793,536 bits
User I/O 372 372 372 480
Multi-Gigabit Transceivers Yes (GX) Yes (GX) Yes (GX) Yes (GX)
Temperature Grade Commercial (0C to +85C) Commercial (C2) Commercial (C2) Commercial (C2)

主要差異化特點

  • Optimal price-density point for 100K-LE class designs (對比EP4SGX230DF29C2X)
  • Same 780-FCBGA DF29 footprint across the Stratix IV GX family (對比EP4SGX110FF35C2X)
  • Integrated multi-gigabit transceivers and hard PCIe IP (對比Cyclone IV GX (EP4CGX110DF27))

設計說明

The 780-FCBGA package requires a multi-layer PCB stack-up with microvia or stacked-via technology to fan out from the 1.0 mm ball pitch. Use 8+ layers, with dedicated GND and PWR planes beneath the FPGA to control impedance for the multi-gigabit transceiver lanes. Reference the Stratix IV GX pin connection guidelines for recommended decoupling (typically 0.1 uF, 0.01 uF, and bulk caps on each transceiver analog rail).

Multi-gigabit transceiver channels in the Stratix IV GX series require 100-ohm differential routing with controlled length matching of better than 150 mils across P and N pairs. Use IBIS-AMI simulation for channel losses above 5 GHz, and place AC-coupling capacitors close to the FPGA transmitter pins. Verify TX pre-emphasis and RX equalization settings in Quartus II against the actual channel loss profile.

Do not assume the EP4SGX110DF29C2XG and EP4SGX110FF35 are interchangeable - they share the same die but use different packages (780-FCBGA vs 1152-FCBGA) and are NOT pin-compatible. The 'C2' suffix denotes commercial temperature grade (0C to +85C); for industrial (-40C to +100C) operation choose the 'I2' suffix variant. Quartus II software version compatibility must be checked - Stratix IV GX support requires Quartus II v10.0 or later with the Stratix IV device library installed.

合規資訊

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
無鉛
Yes
無鹵
Unknown
衝突礦產
Compliant

RoHS compliant per Altera (now Intel) part-number convention; 'G' suffix in the MPN denotes lead-free / RoHS-compliant assembly. C2 suffix denotes commercial temperature grade (0C to +85C); for industrial temperature range choose the I2 suffix variant. AEC-Q100 is not applicable to high-density FPGAs in this performance class.

資料驗證日期: 2026-09-10 — 資料由 XAIPART 元件工程團隊驗證及整理

相關搜尋

EP4SGX110DF29C2XG EP4SGX110DF29C2XG datasheet Stratix IV GX FPGA 105K LEs Altera Stratix IV GX 780 FCBGA Intel FPGA 9.79 Mbit embedded memory EP4SGX110DF29C2XG software defined radio EP4SGX110 vs EP4SGX230 drop-in Stratix IV GX PCIe Gen2 hard IP EP4SGX110DF29C2XG buy price what is the temperature grade of EP4SGX110DF29C2XG FPGA radar beamforming Stratix IV

相關元件與詞彙

Intel Altera EP4SGX110DF29C2XG EP4SGX230DF29C2X EP4SGX290DF29C2X EP4SGX110FF35C2X Stratix IV GX FPGA Field Programmable Gate Array programmable logic device logic element multi-gigabit transceiver PCIe Gen2 FCBGA BGA package JESD204B Quartus II DDR3 RLDRAM II RoHS lead-free assembly software-defined radio beamforming radar signal processing ASIC prototyping
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