EP4SGX360NF45I3 - 360K LE Stratix IV GX FPGA, 1932-BGA | Intel
MPN： EP4SGX360NF45I3 ✓ 啟用中EP4SGX360NF45I3 概覽
What is an FPGA? A field-programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit within the integrated-circuit hierarchy as logic ICs specialized for parallel, high-throughput digital computation. The Stratix IV GX family specifically adds multi-gigabit transceivers, positioning the device between general-purpose FPGAs and ASIC/ASSP solutions for serial connectivity.
Key features include 920 user I/Os, integrated transceivers supporting backplane and chip-to-chip serial links, dedicated DSP blocks for high-speed multiply-accumulate operations, and on-chip RAM distributed across M9K and M144K blocks. The device is offered in the I3 industrial speed grade and supports operation across an extended industrial temperature range suitable for baseband and digital-signal-processing cards.
From an architectural perspective, the EP4SGX360NF45I3 uses a logic-structure of adaptive logic modules (ALMs) combined with embedded transceivers hardened for protocols such as PCIe, Serial RapidIO, Gbps Ethernet, and CPRI. The 40 nm low-power process and dedicated PLL/clock networks enable deterministic timing closure for multi-gigabit interfaces, which is critical when the FPGA drives or receives data from analog front-ends, ADCs/DACs, or backplane SERDES.
Typical applications include high-end wireless baseband processing, software-defined radio (SDR) platforms, video broadcast and imaging pipelines, ASIC prototyping, and high-throughput test and measurement equipment. The combination of logic density and embedded transceivers makes it well suited for designs that previously required an ASIC plus a companion FPGA.
When designing with this device, plan the PCB escape pattern for the 1932-ball FCBGA carefully, as signal-integrity routing below the package typically requires a high-layer-count board with microvias and a controlled-impedance stackup. Designers must also budget for configuration memory (EPCS) and a thermal solution capable of dissipating the worst-case transceiver-driven power.
This page synthesizes Intel/Altera datasheet parameters, distributor pricing, same-brand same-package drop-in alternatives, and practical design notes for the EP4SGX360NF45I3, complementing the manufacturer handbook with structured engineering context.
直接替換替代品，適用於 EP4SGX360NF45I3 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4SGX360NF45I3 （相同外形與佔位） — 差異在於 Speed Grade, Package, Operating Temperature, Process Technology, Mounting Type.
EP4SGX360NF45C2N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP4SGX360NF45C3
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360NF45C4N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360NF45I4N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360NF45C2
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360NF45C4
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360NF45I3 最大額定值與電氣特性
| Series | Stratix IV GX |
| Family | Stratix IV GX |
| Logic Elements (LE) | 353,600 |
| Logic Array Blocks (LABs) | 14,144 |
| Embedded Memory Bits | 23,105,536 |
| User I/Os | 920 |
| Number of Logic Cells | 353,600 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Package Type | FC-FBGA |
| Pin/Ball Count | 1932 |
| Speed Grade | I3 (industrial) |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40C to +100C (industrial) |
| RoHS 狀態 | Compliant |
EP4SGX360NF45I3 fc-fbga 腳位配置指南
EP4SGX360NF45I3（fc-fbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4SGX360NF45I3.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4SGX360NF45I3 適用於 7 應用s: Wireless Baseband Processing, Software Defined Radio (SDR) Platforms, Broadcast Video Processing, ASIC Prototyping and Emulation, Industrial Test and Measurement Equipment, Medical Imaging Systems, High-Speed Networking Backplanes.
Wireless Baseband Processing
The EP4SGX360NF45I3 is well suited for wireless baseband cards where 353,600 logic elements and 23,105,536 embedded memory bits enable multi-antenna MIMO signal chains in a single device. Its integrated multi-gigabit transceivers support CPRI and OBSAI fronthaul links to remote radio heads, eliminating external PHY chips and reducing board area. The I3 industrial speed grade supports base-station outdoor enclosures operating from -40C to +100C, while 920 user I/Os accommodate parallel LVDS connections to ADC/DAC front-ends. Compared to ASIC solutions, the FPGA's reconfigurability allows late-stage algorithm updates for evolving 4G/5G standards. Designers should pair the device with a temperature-stable VCXO and DDR3 memory for sample buffering, budgeting thermal dissipation from the transceiver channels into the FC-FBGA's exposed-die bottom.
推薦
Software Defined Radio (SDR) Platforms
For software-defined radio platforms, the EP4SGX360NF45I3 offers the DSP block density required for wideband digital down-conversion, channelization, and modulation/demodulation pipelines. The 23,105,536 bits of embedded SRAM act as sample-rate buffers between ADC stages, while 14,144 LABs implement parallel FIR filter banks with deterministic latency. Multi-gigabit transceivers aggregate multiple ADC lanes into a single high-speed serial link to a host processor, supporting JESD204B/C interfaces. The 1932-ball FC-FBGA package exposes dedicated transceiver pins on the periphery for clean RF routing, but engineers must maintain 100-ohm differential impedance and length-matching within the FPGA's transceiver skew budget. Compared with smaller Cyclone devices, this FPGA delivers the headroom needed for multi-channel wideband capture up to 500 MHz instantaneous bandwidth.
推薦
Broadcast Video Processing
The EP4SGX360NF45I3 powers broadcast video infrastructure including contribution encoders, multiviewers, and video routers. Its 920 user I/Os interface directly to SDI serializers/deserializers operating at 3G-SDI, 6G-SDI, and 12G-SDI rates, while the high LE count handles 4K/UHD real-time processing pipelines without external frame buffers. Embedded memory provides line-store buffering for deinterlacing and scaling operations, eliminating external SRAM. Industrial temperature operation from -40C to +100C ensures reliability in 24/7 broadcast racks and outdoor transmitter sites. Multi-gigabit transceivers additionally support SMPTE 2022 IP-based video transport, enabling hybrid SDI/IP facilities. Designers should follow Intel's high-speed serial layout guidelines and use matched-length serpentine routing for the SDI clock tree.
推薦
ASIC Prototyping and Emulation
ASIC prototyping and hardware emulation benefit from the EP4SGX360NF45I3's combination of 353,600 logic elements and high I/O count, enabling engineers to partition large ASIC RTL into multi-FPGA boxes. The 920 user I/Os map to high-density connector pinout for backplane-based interconnect between multiple FPGAs emulating a single ASIC. Multi-gigabit transceivers model chip-to-chip SERDES in the target ASIC at real line rates, validating the design before tape-out. The I3 speed grade preserves timing fidelity when the prototype runs at -40C to +100C to emulate corner cases. Compared to using multiple smaller FPGAs, a single Stratix IV GX device reduces inter-FPGA partition overhead and accelerates bring-up. Designers should run Intel's TimeQuest timing analysis with realistic SDF back-annotation for accurate timing closure.
推薦
Industrial Test and Measurement Equipment
High-end test and measurement equipment such as oscilloscopes, protocol analyzers, and BERT testers leverage the EP4SGX360NF45I3 for real-time signal processing of acquired waveforms. The device's 23,105,536 embedded memory bits provide deep acquisition memory, while 14,144 LABs implement parallel decimation and triggering logic in firmware. Industrial temperature operation allows deployment in factory-floor test cells, and 920 user I/Os interface to high-speed ADC front-ends up to 14-bit resolution at GSPS rates. Multi-gigabit transceivers backhaul processed data to a host PC over PCIe Gen2 or 10 Gigabit Ethernet. Compared to DSP-based test instruments, the FPGA-based architecture offers deterministic latency and reprogrammability for emerging standards like USB4 and 100 Gigabit Ethernet.
推薦
Medical Imaging Systems
Medical imaging modalities including ultrasound, CT, and MRI use the EP4SGX360NF45I3 to perform beamforming and image reconstruction in real time. The device's 353,600 logic elements implement parallel beamforming pipelines for phased-array ultrasound probes, while embedded memory provides line-store buffers for back-projection in CT reconstruction. Multi-gigabit transceivers aggregate data from distributed transducer modules, reducing cable count in cart-based ultrasound systems. The industrial temperature range supports reliable operation in operating-room and mobile-clinic environments. Compared to fixed-function ASIC beamformers, the FPGA enables algorithm upgrades as imaging techniques evolve, extending product lifespan. Designers should follow IEC 60601-1 isolation and EMI requirements when integrating the FPGA into patient-adjacent medical equipment.
推薦
High-Speed Networking Backplanes
In networking backplane applications, the EP4SGX360NF45I3 implements custom packet-processing logic between 10 Gigabit Ethernet, 40 Gigabit Ethernet, and 100 Gigabit Ethernet ports. Its multi-gigabit transceivers directly interface to SFP+, QSFP+, and CFP modules without external PHY chips, simplifying BOM and reducing PCB layers. Embedded memory serves as packet buffer and queue management storage, while 920 user I/Os connect to external TCAM or RLDRAM for lookup tables. Industrial temperature rating allows deployment in carrier-grade equipment located in uncontrolled-environment remote cabinets. Compared to merchant switching ASICs, the FPGA offers faster time-to-market for custom protocols and proprietary features like deep packet inspection. Designers should follow IEEE 802.3 signal-integrity guidelines and use pre-emphasis/equalization settings tuned to the board channel.
推薦
推薦產品摘要
工程參考資料，適用於 EP4SGX360NF45I3 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4SGX360NF45C2N | EP4SGX360NF45C3 | EP4SGX360NF45C4N | EP4SGX360NF45I4N | EP4SGX360NF45C2 | EP4SGX360NF45C4 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FC-FBGA-1932 (NF45) | FC-FBGA-1932 (NF45) - same | FC-FBGA-1932 (NF45) - same | FC-FBGA-1932 (NF45) - same | FC-FBGA-1932 (NF45) - same | FC-FBGA-1932 (NF45) - same | FC-FBGA-1932 (NF45) - same |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| User I/Os | 920 | 920 | 920 | 920 | 920 | 920 | 920 |
| Speed Grade | I3 (industrial) | C2 (commercial) | C3 (commercial) | C4 (commercial) | I4 (industrial) | C2 (commercial) | C4 (commercial) |
| Operating Temperature | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
| Lead-Free Finish | Per ordering code | Yes (N suffix) | Per ordering code | Yes (N suffix) | Yes (N suffix) | Per ordering code | Per ordering code |
主要差異化特點
- Industrial temperature rating in the I3 speed grade (對比EP4SGX360NF45C2N)
- Higher speed grade option available in pin-compatible package (對比EP4SGX360NF45C2)
- Same-family design reuse with drop-in industrial/commercial variants (對比EP4SGX360NF45C4)
設計說明
The 1932-ball FC-FBGA package requires a high-density-interconnect PCB stackup with microvias and buried capacitance. Intel recommends a 1.0 mm pitch escape with at least 16 layers to fan out all user I/Os and dedicated transceiver pins while maintaining 100-ohm differential impedance for SERDES channels. Decoupling capacitors should be placed within 100 mils of each supply ball, with a mix of 100 nF, 10 nF, and 1 uF values to cover the wide frequency range of the integrated transceivers.
Estimated: at full transceiver utilization (24 channels at 6.5 Gbps) and 80% logic utilization, total power dissipation can approach 25-30 W. The FC-FBGA package's exposed-die bottom requires a heatsink with thermal interface material, plus thermal vias in the PCB under the device to spread heat into internal copper planes. Design airflow at the card level to maintain junction temperature below 100C in the I3 industrial temperature grade.
Do not assume that Stratix IV GX transceiver pins share pinout with later Stratix V/10 families - migrating to a newer FPGA family requires a complete re-pinout study. The I3 speed grade does not mean 'highest performance'; it indicates industrial temperature rating at moderate speed. When designing, configure unused transceiver channels to power-down state to avoid unnecessary power consumption, and use the Quartus II fitter settings to balance timing closure across the 14,144 LABs.
合規資訊
RoHS and REACH compliant per Intel/Altera product declaration. Not AEC-Q100 qualified - FPGAs of this density are not typically used in automotive safety-critical ECUs. Industrial temperature grade I3 supports -40C to +100C operation.
