EP4SGX360NF45C4 - Stratix IV GX FPGA, 353K LE, 1932-FCBGA | Intel
MPN： EP4SGX360NF45C4 ✓ 啟用中EP4SGX360NF45C4 概覽
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric, routing, and I/O can be customized by the user after manufacture. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy: programmable logic -> reconfigurable logic -> FPGA -> programmable logic device (PLD) -> standard logic IC. The Stratix IV family specifically combines general-purpose fabric with embedded transceivers, hard memory blocks (M20K), and DSP blocks optimized for high-bandwidth signal chains.
Key features of the EP4SGX360NF45C4 include 8.9 Mbits of distributed RAM, 8 transceivers supporting multi-gigabit serial links, dedicated DSP blocks for fixed- and floating-point arithmetic, and SelectRAM+ memory architecture. The 'C4' speed grade indicates a commercial-temperature operating range, while the NF45 package designation identifies the 45 mm body 1932-ball FC-FBGA. Designers typically pair this device with DDR3/DDR2 memory controllers, multi-lane PCI Express hard IP, and SERDES reference clock networks.
Typical applications include high-end test and measurement instrumentation, radar and electronic-warfare baseband processing, high-definition video broadcasting equipment, high-speed packet inspection, and 40G/100G line-card prototyping. Its high logic density makes it suitable for designs that would otherwise require multiple smaller FPGAs, simplifying board layout and BOM. When designing with this part, ensure a 12-layer or thicker PCB with controlled-impedance routing for SERDES lanes; also verify thermal dissipation since a 1932-ball FCBGA package concentrates significant heat flux and benefits from a heatsink or high-airflow chassis.
直接替換替代品，適用於 EP4SGX360NF45C4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4SGX360NF45C4 （相同外形與佔位） — 差異在於 Speed Grade, Operating Temperature, Package, Transceivers, Process Technology.
EP4SGX360NF45C3N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360NF45C3
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360NF45C2N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360NF45C2
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX290NF45I4N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX360NF45C4 最大額定值與電氣特性
| Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Adaptive Logic Modules (LABs) | 14,144 |
| User I/Os | 920 |
| Total Embedded Memory (bits) | 23,105,536 |
| Distributed RAM (Mbits) | 8.9 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| 封裝 | 1932-ball FC-FBGA (NF45) |
| 工作溫度 | Commercial (0C to +85C) |
| Speed Grade | C4 |
| 安裝類型 | Surface Mount |
| Lead Free / RoHS | Compliant |
| AEC-Q100 | Not applicable (commercial grade) |
EP4SGX360NF45C4 1932-ball fc-fbga (nf45) 腳位配置指南
EP4SGX360NF45C4（1932-ball fc-fbga (nf45) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4SGX360NF45C4.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4SGX360NF45C4 適用於 6 應用s: High-Bandwidth Wired Communications Line Card, Radar and Electronic Warfare Baseband Processing, Test and Measurement Instrumentation, High-Definition Video Broadcasting Equipment, Network Packet Inspection and DPI, Medical Imaging Back-End Processing.
High-Bandwidth Wired Communications Line Card
The EP4SGX360NF45C4's integrated multi-gigabit transceivers and 353,600 logic elements make it well suited for 10G/40G Ethernet line cards. Its 8 transceivers aggregate backplane lanes, while the 920 user I/Os provide parallel interconnect to external DDR3 and QSFP cages. The 0.9V core voltage and 40nm process deliver a power-efficient fabric for sustained packet-processing workloads. Designers typically pair this FPGA with Intel's hard PCIe Gen2 IP and external PHY for switch-fabric prototyping. Compared to mid-density alternatives, the 360 NF45 variant absorbs full L2/L3 forwarding tables and queueing logic without external memory, simplifying the BOM.
推薦
Radar and Electronic Warfare Baseband Processing
For radar and EW baseband designs, the EP4SGX360NF45C4 provides the DSP block density and external memory bandwidth required for pulse compression, FFT processing, and beamforming. Its 14,144 LABs and embedded 23 Mbit memory array support real-time sample-rate conversion. The NF45 package's 1932 balls deliver wide external memory interfaces to DDR3, essential for capturing high-bandwidth ADC data streams. Designers use the device's hard transceivers to fan out raw IF data to downstream DSP clusters. Compared to ASIC implementations, the Stratix IV GX offers design flexibility for evolving EW algorithms while still meeting latency targets.
推薦
Test and Measurement Instrumentation
The EP4SGX360NF45C4 fits high-end oscilloscope and protocol analyzer designs because its high logic count enables deep capture memory, complex trigger engines, and protocol decoding on-chip. The 920 user I/Os support direct parallel interfaces to high-speed ADCs and DACs, while the embedded 23 Mbit memory block enables long real-time waveform captures. The 40nm process keeps channel-count scaling manageable for multi-channel digitizers. Designers choose this part for its combination of logic density, transceiver capability, and the mature Quartus toolchain that accelerates verification. The C4 commercial speed grade provides deterministic timing margins needed for measurement accuracy.
推薦
High-Definition Video Broadcasting Equipment
In HD/4K video broadcast gear, the EP4SGX360NF45C4 handles multi-stream SDI encoding/decoding, color-space conversion, and on-screen graphics overlay. Its 920 user I/Os interface to HDMI, SDI, and DisplayPort PHYs, while the high logic count supports multiple parallel video pipelines without frame drops. The embedded transceivers route SDI signals with low jitter, critical for broadcast compliance. The 0.9V core and 40nm process balance performance and power for rack-mounted broadcast chassis. Designers favor this FPGA for its ability to consolidate what would otherwise require multiple FPGAs into a single device, reducing PCB complexity.
推薦
Network Packet Inspection and DPI
Deep packet inspection platforms benefit from the EP4SGX360NF45C4's 353K logic elements and multi-gigabit transceivers for line-rate pattern matching. The device's on-chip memory (23 Mbits) buffers regex state machines and rule tables, while the 920 I/Os connect to TCAMs and DDR3 for lookup. Its transceiver-based fabric supports 10G/40G aggregation without external PHYs. The NF45 package's high ball count enables wide memory buses, critical for sustained packet throughput. Designers appreciate that Stratix IV GX retains long-term Intel support, making it viable for carrier-grade networking products with multi-year lifecycles.
推薦
Medical Imaging Back-End Processing
The EP4SGX360NF45C4's logic density suits CT, MRI, and ultrasound back-end image reconstruction pipelines where large matrix operations must execute in real time. Its DSP blocks accelerate convolution and back-projection kernels, while the 920 user I/Os connect to multi-channel analog front ends. The C4 commercial speed grade provides the deterministic timing necessary for medical safety certifications. Designers leverage the embedded memory for line buffers and tile caching, avoiding external memory bottlenecks. Compared to GPU-based systems, the FPGA delivers lower latency and deterministic throughput required for clinical imaging workloads.
推薦
推薦產品摘要
工程參考資料，適用於 EP4SGX360NF45C4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4SGX360NF45C3N | EP4SGX360NF45C3 | EP4SGX360NF45C2N | EP4SGX360NF45C2 | EP4SGX290NF45I4N |
|---|---|---|---|---|---|---|
| Package | 1932-ball FC-FBGA (NF45) | 1932-ball FC-FBGA (NF45) - same | 1932-ball FC-FBGA (NF45) - same | 1932-ball FC-FBGA (NF45) - same | 1932-ball FC-FBGA (NF45) - same | 1932-ball FC-FBGA (NF45) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 290,000 |
| Speed Grade | C4 (fastest commercial) | C3 | C3 | C2 | C2 | I4 |
| User I/Os | 920 | 920 | 920 | 920 | 920 | 920 |
| Operating Temperature | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| Process / Core Voltage | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V |
主要差異化特點
- Highest available speed grade in this die/package (對比EP4SGX360NF45C3N)
- Full logic density maintained across speed grades (對比EP4SGX290NF45I4N)
- Integrated multi-gigabit transceivers eliminate external PHY (對比EP4SGX230KF40C4N)
設計說明
Estimated: A 40nm Stratix IV GX device at full utilization in the 1932-ball FC-FBGA package typically dissipates 10-15 W. Without a heatsink or sufficient airflow, junction temperatures can exceed the 85C commercial limit during sustained DSP operation. Recommend a heatsink with thermal interface material plus 200 LFM minimum airflow in chassis-level designs. Use the Quartus Prime PowerPlay analyzer to model expected dissipation before finalizing the thermal solution.
Designers must use a 12-layer or thicker PCB with controlled-impedance routing for transceiver lanes (100-ohm differential). Reference Intel's Stratix IV GX board design guidelines for stack-up recommendations. Decoupling requires low-ESL ceramic capacitors placed as close as possible to power balls. Use microvia technology to escape the dense BGA; full through-via fanout is impractical with a 1932-ball 1.0 mm pitch package.
Transceiver reference clock routing requires strict length matching (typically +/- 25 mil) and isolation from noisy signals. Keep SERDES lanes away from switching power supply edges; place guard ground vias alongside high-speed differential pairs. Use Intel's pin-out file editor to optimize bank assignments and minimize routing congestion. Pin 1 orientation and the thermal pad footprint must match the package land pattern exactly to avoid solder joint failures.
Do not assume all 920 user I/Os are simultaneously available; many balls are dedicated to power, ground, configuration, and SERDES channels, leaving fewer general-purpose I/Os than the headline count. Verify I/O bank voltage compatibility when interfacing with DDR3 (1.5V) and LVDS (2.5V) peripherals - banks cannot mix voltages freely. Confirm MSL handling per JEDEC J-STD-033 before reflow to avoid package cracking.
合規資訊
RoHS compliant per Intel product page. AEC-Q100 not applicable (commercial grade C4). For industrial applications choose I-grade variants such as EP4SGX360NF45I4N. Halogen-free status not explicitly confirmed in retrieved data - set to unknown.
