EPF10K30EFC256-1X - FLEX 10KE FPGA, 30K Gates, 256-BGA | Intel / Altera
MPN： EPF10K30EFC256-1X ✗ 停產EPF10K30EFC256-1X 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacture to implement custom digital logic functions. FPGAs sit within the broader programmable logic device (PLD) family, which also includes SPLDs and CPLDs. FPGAs like the FLEX 10KE sit at the top of the PLD hierarchy, providing the highest logic density and the richest interconnect. FPGAs occupy the position of programmable logic in the system hierarchy: ASIC < structured ASIC < FPGA < general-purpose microprocessor/DSP, with FPGAs delivering higher integration than CPLDs at lower NRE cost than full-cell ASICs.
Key features include 24,576 bits of embedded memory distributed across EABs, four phase-locked loops (PLLs) for clock management, MultiVolt I/O supporting 2.5V/3.3V/5V interfaces, and in-system programmability via the IEEE 1149.1 JTAG interface. The 256-pin FBGA package provides a 17 mm x 17 mm body with 1.0 mm ball pitch, optimized for high-density surface-mount designs. Each EAB provides 4 Kbits of RAM, giving the device approximately 6 Kbits of usable RAM per EAB configuration.
The FLEX 10KE architecture combines a fine-grained gate-array fabric (logic elements organized in LABs of 8 LEs each) with coarse-grained embedded array blocks for memory-intensive functions. The interconnect uses a hierarchical FastTrack routing structure with row and column channels, allowing predictable timing closure across typical logic utilization levels. The 0.22 µm CMOS process places the device in the legacy SRAM-FPGA tier that powered Altera's programmable logic roadmap from 1998 onwards.
Typical applications include industrial control logic, telecommunications interface bridges, glue logic replacement, and prototype ASIC verification. The 176 user I/Os support abundant parallel buses, making the device suitable for legacy peripheral interfacing and custom state machines in test equipment. The combination of 30K gates and embedded memory also fits DSP pre/post-processing pipelines and protocol conversion cards in legacy industrial backplanes.
When designing with this device, note that the FLEX 10KE family requires 2.5V core supply and supports 2.5V/3.3V/5V MultiVolt I/O. JTAG programming is mandatory because the SRAM configuration cell is volatile. The 256-BGA FineLine package demands careful PCB design with controlled-impedance routing and matched-length clock traces.
This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10KE family, and practical design notes not found in the original Altera datasheet, providing information gain beyond standard product listings.
直接替換替代品，適用於 EPF10K30EFC256-1X — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPF10K30EFC256-1X （相同外形與佔位） — 差異在於 Speed Grade, Package, Operating Temperature, Process Technology, Logic Elements / Cells.
EPF10K30EFC256-1
✅ 直接替換聯絡詢價
查看資料表 →EPF10K30EFC256-2
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EPF10K30EFC256-3
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EPF10K50EFC256-1
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EPF10K100EFC256-2
✅ 直接替換聯絡詢價
查看資料表 →EPF10K30EFC256-1X 最大額定值與電氣特性
| Family | FLEX 10KE |
| Logic Elements | 1728 |
| Typical Gates | 30,000 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory (EAB RAM) | 24,576 bits (6 EABs of 4 Kbit each) |
| User I/O | 176 |
| Maximum Internal Frequency | 250 MHz |
| Propagation Delay (tpd) | 0.4 ns to 0.6 ns |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| MultiVolt I/O Support | 2.5 V / 3.3 V / 5 V |
| 封裝 | 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA) |
| Speed Grade | -1X (fastest commercial) |
| 工作溫度 | 0 °C to +70 °C (commercial) |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) |
| Phase-Locked Loops | 4 |
| Compliance | RoHS (check distributor for specific lot), Pb-free option available |
EPF10K30EFC256-1X 256-ball fbga, 17 x 17 mm, 1.0 mm pitch (fineline bga) 腳位配置指南
EPF10K30EFC256-1X（256-ball fbga, 17 x 17 mm, 1.0 mm pitch (fineline bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPF10K30EFC256-1X.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPF10K30EFC256-1X 適用於 6 應用s: Industrial Control Logic and Glue Logic Replacement, Telecommunications Interface Bridging, ASIC Prototype Verification, Legacy Test and Measurement Equipment, DSP Pre/Post-Processing Pipelines, Legacy Peripheral Bus Controllers.
Industrial Control Logic and Glue Logic Replacement
The EPF10K30EFC256-1X's 1728 logic elements and 176 user I/Os make it ideal for industrial control cards where multiple discrete logic ICs (74-series, GAL, PAL) are replaced with a single programmable device. Industrial controllers benefit from the 30K-gate density, which fits state machines for PLC front-ends and machine-tool sequencing. The MultiVolt 5V-tolerant I/O preserves compatibility with legacy 5V sensor inputs and actuator drivers still common in factory automation. With 250 MHz internal frequency, the device handles deterministic control loops at sub-microsecond response. The 256-FBGA package is well-suited to compact PLC backplane modules where board area is at a premium and high pin count is essential for parallel field-bus interfacing.
推薦
Telecommunications Interface Bridging
The FLEX 10KE family was widely adopted in telecom infrastructure for bridging between legacy T1/E1 framers and newer packet-based backplanes. The EPF10K30EFC256-1X provides 176 user I/Os to support multiple TDM buses simultaneously while implementing custom framing, elastic buffering, and protocol adaptation in the 1728 logic elements. The 24,576 bits of embedded RAM enable elastic buffers and small lookup tables without external SRAM. The 250 MHz -1X speed grade supports high-speed serializer/deserializer (SERDES) glue at the board level before dedicated transceivers. The 256-FBGA package is well suited for ATCA/AdvancedTCA cards where high-density logic is needed alongside limited external component count.
推薦
ASIC Prototype Verification
ASIC design teams historically used FLEX 10KE FPGAs to prototype complex state machines and datapaths before committing to silicon. The EPF10K30EFC256-1X's 1728 LEs and 250 MHz Fmax allow prototyping of mid-complexity ASIC blocks running at production speeds. Embedded EABs implement register files and small FIFOs that would become compiled SRAM on the ASIC, giving engineers a faithful behavioral model. The 256-FBGA package maps cleanly onto ASIC prototype boards designed for BGA footprints. In-system JTAG programming accelerates design iterations: a designer can recompile and reprogram in minutes, dramatically faster than ASIC respins, making this device valuable for first-silicon bring-up verification.
推薦
Legacy Test and Measurement Equipment
Test equipment manufacturers built ATE (automatic test equipment) platforms around FLEX 10KE FPGAs because the 176 user I/Os handle the parallel pin-electronics interface required for mixed-signal IC testing. The EPF10K30EFC256-1X's 250 MHz timing closure enables pattern generators and timing measurement blocks at sub-nanosecond resolution. Embedded RAM implements pattern memory and result-capture buffers, avoiding external memory access latency. The MultiVolt I/O interfaces directly with 5V DUT (device-under-test) boards without level shifters. Legacy ATE platforms in production lines still rely on this device for board-level maintenance and replacement. The 256-FBGA also fits the dense backplane layout typical of rack-mounted testers.
推薦
DSP Pre/Post-Processing Pipelines
The FLEX 10KE's EABs (embedded array blocks) implement efficient shift registers and small FIR/IIR filters in distributed arithmetic. The EPF10K30EFC256-1X with 30K gates and 24,576 bits of RAM can host a small DSP pre-processing pipeline (decimation, filtering, FFT prep) feeding an external DSP or ASIC. The 250 MHz Fmax supports multi-Megasample-per-second data rates typical in software-defined radio pre-processors. The 176 user I/Os connect to multiple ADC/DAC channels in parallel. The 256-FBGA is appropriate for compact SDR modules where board area and signal integrity matter. Legacy SDR and instrumentation platforms use this exact device for I/Q channelization and sample-rate conversion.
推薦
Legacy Peripheral Bus Controllers
The EPF10K30EFC256-1X implements custom peripheral bus controllers such as ISA-to-PCI bridges, VMEbus interfaces, and proprietary industrial backplane controllers. With 176 user I/Os, the device can simultaneously host one legacy parallel bus and one modern bus interface, including address decoding, wait-state insertion, and interrupt handling, all in the 1728 LEs. The 250 MHz -1X speed grade supports bus speeds up to 66 MHz for PCI-style peripherals. Embedded EABs implement FIFO buffers needed for bus cycle isolation. The 256-FBGA package supports dense backplane cards. This application remains common in legacy industrial PC and military/aerospace systems that have not migrated to modern FPGAs.
推薦
推薦產品摘要
工程參考資料，適用於 EPF10K30EFC256-1X — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPF10K30EFC256-1 | EPF10K30EFC256-2 | EPF10K50EFC256-1 | EPF10K100EFC256-2 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Logic Elements | 1728 | 1728 | 1728 | 2880 | 4992 |
| Typical Gates | 30,000 | 30,000 | 30,000 | 50,000 | 100,000 |
| Maximum Internal Frequency | 250 MHz (-1X) | 180 MHz | 150 MHz | 180 MHz | 150 MHz |
| Embedded Memory (EAB RAM) | 24,576 bits | 24,576 bits | 24,576 bits | 40,960 bits | 49,152 bits |
| User I/O | 176 | 176 | 176 | 176 | 176 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Fastest -1X speed grade in the FLEX 10KE family (對比EPF10K30EFC256-1)
- Higher logic density than same-package -1 alternative (對比EPF10K10EFC256)
- Drop-in footprint compatibility with other FLEX 10KE density options (對比EPF10K50EFC256-1 / EPF10K100EFC256-2)
設計說明
The EPF10K30EFC256-1X requires a clean 2.5V core supply with bulk decoupling of at least 100 µF low-ESR tantalum plus 0.1 µF ceramic at every VCC pin. According to the FLEX 10KE datasheet, VCCIO must be configured before or simultaneously with VCCINT to avoid I/O latch-up. Add a 10 µF bulk cap on each VCCIO rail when using 3.3V or 5V I/O. Power sequencing: assert VCCINT first, then VCCIO, then drive inputs. Estimated: at 250 MHz with 80% logic utilization, ICCINT is approximately 200 mA plus ICCIO dependent on switching I/Os.
The 256-ball FBGA package uses 1.0 mm ball pitch and demands a 4-layer or 6-layer PCB with microvia technology for fan-out. Maintain continuous ground planes on layers 2 and 5, with power planes on layers 3 and 4. Use 0.5 mm via-in-pad if escape routing is constrained. Match clock trace lengths to within 1 mm of each other and within 5 mm of the FPGA. Add 4 thermal vias under the die (0.3 mm drill, 1.0 mm pitch) to a bottom-side thermal land. Estimated junction-to-ambient thermal resistance theta_JA is approximately 18 °C/W with this via pattern.
Do not leave unused user I/O pins floating; configure them as outputs driving low or as inputs with internal pull-ups enabled (where supported). According to the FLEX 10KE datasheet, floating inputs can oscillate and inject noise into the core via I/O supply coupling. JTAG chain integrity is critical: include TDI-to-TDO bypass resistors on unused JTAG devices, and add a 10 kΩ pull-up on TCK. The configuration EPROM (EPC2 or compatible) must be wired with OE-C0 connected to nCONFIG for proper multi-device configuration. Do not use the device without configuring it; unconfigured SRAM FPGAs have non-deterministic I/O behavior at power-on.
合規資訊
The EPF10K30EFC256-1X predates RoHS but Pb-free/RoHS-compliant lots are available from Rochester Electronics (verify specific date/lot code with distributor). Compliance status varies by lot; AEC-Q100 is not applicable for FPGAs of this vintage.
