EPF10K40RC2404 - FLEX 10K FPGA 40K Gates 240-RQFP | Intel / Altera
MPN： EPF10K40RC2404 ✗ 停產EPF10K40RC2404 概覽
An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric can be programmed by the end user after PCB assembly. The FLEX 10K family is the second-generation Altera architecture that introduced Embedded Array Blocks (EABs) - dedicated dual-port RAM blocks of 2,048 bits each - allowing efficient on-chip memory for FIFO, ROM, and DSP coefficient storage. FPGAs occupy a hypernym hierarchy of programmable logic device -> programmable logic -> digital integrated circuit -> semiconductor. The EPF10K40RC2404 sits in the mid-density FLEX 10K range, below the EPF10K100 and EPF10K130, and above the EPF10K30 and EPF10K20 devices.
Key features include 288 Logic Array Blocks (LABs) of 8 logic elements each, 4 EABs providing 8,192 bits of embedded RAM, multi-volt I/O support (5.0V PCI-compatible and 3.3V), and in-system programmability through the IEEE 1149.1 JTAG interface. The -4 speed grade delivers a maximum internal toggle frequency of approximately 125 MHz. Each logic element contains a 4-input look-up table (LUT), a programmable register, and a carry chain for fast arithmetic, while the interconnect fabric provides fast row and column channels with predictable routing delays.
Typical applications include PCI bus interfaces, telecommunications glue logic, industrial control and instrumentation front-ends, prototyping of ASIC designs, and replacement of multiple discrete SSI/MSI logic packages. The 240-pin RQFP package offers manageable board-level assembly while exposing sufficient I/O for wide parallel buses. Designers migrating to newer Cyclone or MAX families can reuse FLEX 10K Verilog/VHDL code with minimal modification when the I/O count and logic density are within the new device's range.
When designing with the EPF10K40RC2404, ensure that JTAG chain integrity is verified before programming, that VCCINT (5V) and VCCIO (3.3V or 5V) rails are decoupled with 0.1 µF and 10 µF capacitors placed within 5 mm of each supply pin, and that unused I/O pins are configured as inputs with weak pull-ups to minimize quiescent current. Boundary-scan testing should be exercised on assembled boards prior to conformal coating.
直接替換替代品，適用於 EPF10K40RC2404 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPF10K40RC2404 （相同外形與佔位） — 差異在於 Package, Speed Grade, Logic Elements / Cells, Operating Temperature, Logic Array Blocks (LABs).
EPF10K40RC240-4N
✅ 直接替換聯絡詢價
查看資料表 →EPF10K40RC240-3
✅ 直接替換聯絡詢價
查看資料表 →EPF10K30RC240-4N
✅ 直接替換聯絡詢價
查看資料表 →EPF10K30RC240-4
✅ 直接替換聯絡詢價
查看資料表 →EPF10K30RC240-3N
✅ 直接替換聯絡詢價
查看資料表 →EPF10K40RC2404 最大額定值與電氣特性
| Family | FLEX 10K |
| Process Technology | 0.42 µm CMOS, SRAM-based |
| Typical Gates | 40,000 |
| Logic Elements (Cells) | 2,304 |
| Logic Array Blocks (LABs) | 288 (8 LEs each) |
| Embedded Array Blocks (EABs) | 4 (2,048 bits each = 8,192 RAM bits) |
| Maximum User I/O | 189 |
| Flip-Flops | 18,816 |
| Core Voltage (VCCINT) | 5.0 V |
| I/O Voltage (VCCIO) | 3.3 V or 5.0 V |
| Speed Grade | -4 |
| Maximum Internal Frequency | 125 MHz |
| 封裝 | 240-RQFP (RQFP-240) with exposed pad, 32 x 32 mm |
| Configuration Interface | IEEE 1149.1 JTAG, serial, parallel |
| RoHS 狀態 | Non-compliant (legacy 5V device) |
EPF10K40RC2404 240-rqfp (rqfp-240) with exposed pad, 32 x 32 mm 腳位配置指南
EPF10K40RC2404（240-rqfp (rqfp-240) with exposed pad, 32 x 32 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPF10K40RC2404.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPF10K40RC2404 適用於 6 應用s: PCI Bus Bridge and Interface Logic, Telecommunications Backplane Glue Logic, Industrial PLC and Process Control, ASIC Prototyping and Emulation, Legacy Test and Measurement Equipment, Aerospace and Defense Avionics Datapath.
PCI Bus Bridge and Interface Logic
The EPF10K40RC2404's 189 user I/O pins and 2,304 logic elements make it well-suited for PCI 2.2 bus bridges in legacy industrial PCs and CompactPCI backplanes. The 5V-tolerant I/O interfaces directly with the PCI connector's 5V signaling environment, eliminating external level shifters. With 125 MHz toggle rate, the device can implement state machines for target/initiator cycles, address decoding across 4 GB memory maps, and interrupt handling in a single chip. The 4 EABs provide on-chip FIFO storage for posted-write buffers and DMA descriptors, simplifying board layout compared to discrete FIFO logic.
推薦
Telecommunications Backplane Glue Logic
In telecom systems from the late 1990s, the EPF10K40RC2404 served as the central glue-logic device connecting T1/E1 framers, HDLC controllers, and TDM backplanes. Its 18,816 flip-flops handle serial-to-parallel conversion, clock-domain crossing buffers, and frame-alignment state machines across multiple E1 links. The 0.42 µm CMOS process provides good EMI immunity for sensitive telecom environments, and the 5V I/O is compatible with legacy LIU (line interface unit) chips. Modern telecom designs have migrated to Cyclone IV/10 with embedded transceivers, but many installed FLEX 10K units still operate in field-deployed equipment.
推薦
Industrial PLC and Process Control
The EPF10K40RC2404 fits mid-range PLC controllers that require custom logic for motor control loops, sensor conditioning, and fieldbus protocol decoding. Its embedded array blocks (EABs, 2,048 bits each) store lookup tables for PID controller gains and sine-wave PWM patterns, eliminating external ROM. The 5V core supply tolerates the wider industrial temperature range and noisy 24V-derived rails better than 3.3V-only FPGAs. Industrial-grade screening was historically offered as part number suffixes; check datasheet for -40°C to +85°C operating range versus commercial 0°C to +70°C.
推薦
ASIC Prototyping and Emulation
Engineers used the EPF10K40RC2404 as a prototype platform for ASIC designs in the 30K-40K gate range before committing to silicon fabrication. Quartus II or MAX+PLUS II synthesis tools map RTL Verilog/VHDL directly to the FLEX 10K architecture, allowing functional verification at near-real-time speeds. The 240-RQFP package is convenient for prototype boards where BGA assembly is impractical. Reusability is high: the SRAM-based configuration can be reloaded in seconds via JTAG, accelerating iterative debug cycles during ASIC bring-up.
推薦
Legacy Test and Measurement Equipment
The EPF10K40RC2404 appeared in oscilloscope front-ends, logic analyzer pattern generators, and protocol analyzers of the late 1990s and early 2000s. Its 189 I/O pins drive parallel display buses, control DACs and ADCs, and capture high-speed digital waveforms through LVTTL-compatible inputs. With EABs serving as deep FIFO buffers, the device can stream capture data to external SRAM at full bus rates. Maintenance and repair of these instruments in 2026 relies on sourcing factory-recycled EPF10K40 units or substituting pin-compatible variants like the EPF10K40RC240-4N.
推薦
Aerospace and Defense Avionics Datapath
Some military and aerospace platforms adopted the EPF10K40RC2404 for sensor-fusion datapaths, MIL-STD-1553 bus interfaces, and radar preprocessing. The 5V tolerant I/O is compatible with older avionics busses, and the FPGA's reconfigurability allows in-field logic updates during depot-level maintenance. Embedded array blocks implement waveform lookup tables for radar pulse compression. While modern classified programs have moved to radiation-hardened FPGAs, many non-critical flight systems retain FLEX 10K designs and continue to require spares; drop-in 240-RQFP alternatives like the EPF10K40RC240-4N are valued for this sustainment role.
推薦
推薦產品摘要
工程參考資料，適用於 EPF10K40RC2404 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPF10K40RC240-4N | EPF10K40RC240-3 | EPF10K30RC240-4N | EPF10K40RC208-4 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 240-RQFP | 240-RQFP (same) | 240-RQFP (same) | 240-RQFP (same) | 208-RQFP (different) |
| Logic Elements | 2,304 | 2,304 (identical) | 2,304 (identical) | 1,728 (-25%) | 2,304 (identical, different package) |
| Typical Gates | 40,000 | 40,000 | 40,000 | 30,000 | 40,000 |
| User I/O Pins | 189 | 189 | 189 | 189 | 147 (-22%) |
| Speed Grade | -4 | -4 (identical) | -3 (slower, ~80 MHz) | -4 | -4 |
| Core Voltage | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
| Embedded RAM (EAB) | 8,192 bits (4 EABs) | 8,192 bits | 8,192 bits | 6,144 bits (-25%) | 8,192 bits |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Identical silicon, alternate part label (對比EPF10K40RC240-4N)
- Higher density than the EPF10K30 family (對比EPF10K30RC240-4N)
- Larger package with more I/O (對比EPF10K40RC208-4)
設計說明
The EPF10K40RC2404 requires two supply rails: VCCINT at 5.0V (±5%) for the core logic and SRAM configuration cells, and VCCIO at either 3.3V or 5.0V for the I/O banks. Decouple each supply pin with a 0.1 µF X7R ceramic capacitor placed within 5 mm of the pin, plus one bulk 47 µF tantalum or 100 µF aluminum polymer capacitor per supply plane. Estimated: typical quiescent current at 25°C and -4 speed grade is approximately 30-50 mA for VCCINT and 5-15 mA per I/O bank depending on switching activity.
The 240-RQFP package has a θJA of approximately 25-30 °C/W (estimated) when the exposed pad is soldered to a 4-layer PCB with thermal vias. In a sealed enclosure with no airflow, junction temperature rise at full logic utilization can exceed 20°C; ensure the PCB copper area beneath the exposed pad is at least 1 square inch tied to a ground plane via an array of 0.3 mm thermal vias. For long-term reliability, keep junction temperature below 100°C.
Route all four JTAG signals (TCK, TMS, TDI, TDO) as a daisy-chained bus with 10 kΩ pull-ups on TCK, TMS, and TDI to VCCIO. Place the configuration EPROM/Flash within 50 mm of the FPGA to minimize signal-integrity issues on the DCLK and DATA0 lines during parallel or serial configuration. Use controlled-impedance routing (50 Ω characteristic impedance) for high-speed I/O signals above 50 MHz, and avoid 90° bends.
Do not leave JTAG pins floating - the IEEE 1149.1 boundary-scan logic requires TCK, TMS, and TDI to be held high or driven externally during normal operation. Unused user I/O should be configured as tri-stated inputs with weak pull-ups in the Quartus II or MAX+PLUS II design to minimize quiescent current and prevent oscillation. Always read back the configuration checksum after programming to verify bitstream integrity; corruption can cause intermittent logic errors that are extremely difficult to debug.
合規資訊
Legacy 5V Altera FLEX 10K FPGA, discontinued before RoHS transition. Lead-bearing RQFP package - not RoHS compliant. REACH, halogen, and conflict-mineral status not formally declared in current Intel/Altera product documentation.
