EPF10K50EQC208-3 - FLEX 10KE 50K Gates FPGA | Intel | 208-PQFP
MPN： EPF10K50EQC208-3 ✗ 停產EPF10K50EQC208-3 概覽
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic function is defined after manufacturing by the end user. Architecturally, an FPGA sits within the broader hierarchy of programmable logic devices (PLDs), between simple Complex Programmable Logic Devices (CPLDs) and high-end Application-Specific Integrated Circuits (ASICs). Within the programmable logic family tree, FPGAs are subdivided by architecture into SRAM-based, antifuse-based, and Flash-based variants; the FLEX 10KE family belongs to the SRAM-based, volatile-configuration segment, requiring a configuration EPROM or controller to load the bitstream at every power-up.
The part number breaks down as follows: EPF10K = FLEX 10K family; 50 = 50K typical gates; E = Enhanced (10KE variant); Q = PQFP package; C = Commercial temperature grade (0 °C to +70 °C); 208 = 208 pins; -3 = speed grade. The device supports a core supply of 2.3 V to 2.7 V (2.5 V typical) with 3.3 V or 5.0 V tolerant I/O banks, a maximum internal frequency near 166.67 MHz, and 360 LABs (Logic Array Blocks). Each LAB contains 8 Logic Elements, providing efficient implementation of wide combinational and registered functions. The device is supplied in a 28 mm × 28 mm body, 208-BFQFP (also called PQFP) tray package.
Typical applications include bus-bridging ASIC prototyping, glue logic in telecom backplane designs, industrial control interfaces, and image-processing front ends. The rich EAB memory and four FastTrack interconnect rows make this device well suited to high-speed datapath pipelines.
When designing with this device, ensure your board hosts a configuration source (EPC1/EPC2 or a microcontroller) and plan I/O banking for mixed 3.3 V/5 V peripherals. For new designs, consider Cyclone or Cyclone II as modern, non-obsolete alternatives; the FLEX 10KE family is end-of-life.
直接替換替代品，適用於 EPF10K50EQC208-3 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPF10K50EQC208-3 （相同外形與佔位） — 差異在於 Core Supply Voltage, Package, Operating Temperature, Family, Series.
EPF10K50EQC208-3N
✅ 直接替換📋 參考替代品（不在目錄中）
EPF10K100EQC208-3
✅ 直接替換聯絡詢價
查看資料表 →EPF10K50EQC208-2
✅ 直接替換📋 參考替代品（不在目錄中）
EPF10K50EQC208-3N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EPF10K100EQC208-3N
✅ 直接替換📋 參考替代品（不在目錄中）
EPF10K100EQC208-2
✅ 直接替換聯絡詢價
查看資料表 →EPF10K50EQC208-3 最大額定值與電氣特性
| Family | FLEX 10KE (EPF10K50E) |
| Typical Gate Count | 50,000 gates |
| Logic Elements | 2,880 |
| Embedded Memory (EAB) | 40,960 bits |
| Logic Array Blocks (LABs) | 360 |
| User I/Os | 147 |
| Maximum Internal Frequency | 166.67 MHz |
| Propagation Delay | 0.6 ns (per DigChip) |
| Core Supply Voltage | 2.3 V to 2.7 V (2.5 V typical) |
| I/O Supply Voltage | 3.3 V or 5.0 V |
| 工作溫度 | 0 °C to +70 °C (Commercial) |
| 封裝 | 208-BFQFP (PQFP), 28 × 28 mm |
| 安裝類型 | Surface Mount |
| Configuration Method | SRAM, volatile (requires EPC boot device) |
| Process Technology | 0.22 µm CMOS, SRAM-based |
| 生命週期狀態 | Obsolete (per Rocelec / Altera PCN history) |
EPF10K50EQC208-3 208-bfqfp (pqfp), 28 × 28 mm 腳位配置指南
EPF10K50EQC208-3（208-bfqfp (pqfp), 28 × 28 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPF10K50EQC208-3.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPF10K50EQC208-3 適用於 6 應用s: ASIC Prototyping and Emulation, Telecom Backplane Glue Logic, Industrial Control Interfaces, Image-Processing Front End, Datapath Co-Processor Offload, Legacy Avionics and Defense Upgrades.
ASIC Prototyping and Emulation
The EPF10K50EQC208-3 fits ASIC prototyping and in-circuit emulation thanks to its 50K-gate capacity and 147 user I/Os, which let engineers map mid-complexity ASIC RTL into a real silicon target operating at up to 166.67 MHz. Compared with a CPLD, the FLEX 10KE's 360 LABs and 40,960-bit EAB memory allow realistic datapath and control-logic emulation, including wide register files and small FIFOs, while keeping signal integrity on the 208-PQFP board-level footprint. For tri-state emulation of bus-functional models, the device's bidirectional I/O buffers and FastTrack interconnect rows preserve cycle-accurate timing, making this part a long-time bridge between HDL design and ASIC tape-out.
推薦
Telecom Backplane Glue Logic
In telecom backplane applications, the EPF10K50EQC208-3 serves as a programmable glue-logic bridge between legacy 5 V peripherals and modern 3.3 V ASICs, leveraging its mixed-voltage I/O bank structure and 147 user I/Os. The FastTrack continuous interconnect delivers predictable timing across clock domains, which is essential when fanning out 8 kHz framing pulses or HDB3-coded E1/T1 streams to multiple line-interface units. Operating at 2.5 V core with 3.3 V/5 V tolerant I/O eliminates external level shifters and reduces board complexity, while the 208-PQFP footprint enables double-sided assembly for dense shelf designs.
推薦
Industrial Control Interfaces
The EPF10K50EQC208-3 is well-suited to industrial control interface cards — including Programmable Logic Controllers (PLCs), distributed I/O nodes, and motor-control encoder interfaces — because its 50K-gate density and 40,960-bit embedded array block memory can host multiple independent communication stacks such as Modbus RTU, CANopen, and PROFIBUS bridges concurrently. The 208-PQFP commercial 0 °C to +70 °C operating envelope is adequate for cabinet-mounted enclosures, and the device's JTAG support enables in-system programming for field upgrades. Compared with a discrete MCU, the FPGA delivers deterministic latency with zero software jitter — critical for closed-loop control loops running at sub-millisecond period.
推薦
Image-Processing Front End
For image-processing front ends such as machine-vision camera link cards and surveillance DVR front panels, the EPF10K50EQC208-3 provides the pixel-rate bandwidth required to deskew, crop, and buffer Camera Link or ITU-R BT.656 video streams. The 2,880 logic elements and 360 LABs implement line buffers and Bayer demosaicing pipelines at video pixel clocks up to 166.67 MHz, while the 40,960 bits of EAB memory serve as small lookup tables for gamma correction or color-space conversion. Compared with a fixed-function ASIC, the FLEX 10KE lets engineers iterate on image-processing IP without re-spinning silicon, accelerating time to market.
推薦
Datapath Co-Processor Offload
The EPF10K50EQC208-3 can offload compute-intensive datapath tasks — such as CRC generation, Reed-Solomon forward error correction, or DES/3DES encryption accelerators — from a host processor via its parallel bus interface. The 147 user I/Os provide ample bidirectional buses for 32-bit datapath plus control, and the 166.67 MHz core delivers multi-gigabit throughput on bit-manipulation loops. Designers typically place the FLEX 10KE between a PCI bridge ASIC and a DSP cluster, achieving 3-5× the throughput of a software-only implementation while freeing CPU cycles for application-layer processing.
推薦
Legacy Avionics and Defense Upgrades
In legacy avionics and defense systems already fielded with FLEX 10KE designs, the EPF10K50EQC208-3 is the authentic drop-in part for maintenance, repair, and overhaul (MRO) of 1553 bus bridges, radar timing controllers, and avionics display drivers. Because the FLEX 10KE design data, configuration bitstreams, and JTAG infrastructure are already field-qualified, the -3 commercial grade preserves full form-fit-function continuity. Compared with new FPGA families, this part avoids costly re-qualification and SWaP re-tuning — a key consideration for long-life-cycle platforms where original Altera-marked stock and authorized-distributor inventory are the only approved sources.
推薦
推薦產品摘要
工程參考資料，適用於 EPF10K50EQC208-3 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPF10K50EQC208-3N | EPF10K100EQC208-3 | EPF10K50EQC208-2 | EPF10K100EQC208-3N | EPF10K100EQC208-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 208-PQFP (BFQFP) | 208-PQFP (same) | 208-PQFP (same) | 208-PQFP (same) | 208-PQFP (same) | 208-PQFP (same) |
| Typical Gates | 50,000 | 50,000 (same) | 100,000 (+100 %) | 50,000 (same) | 100,000 (+100 %) | 100,000 (+100 %) |
| Logic Elements | 2,880 | 2,880 (same) | 4,992 (+73 %) | 2,880 (same) | 4,992 (+73 %) | 4,992 (+73 %) |
| User I/Os | 147 | 147 (same) | 147 (same) | 147 (same) | 147 (same) | 147 (same) |
| Embedded Memory (EAB) | 40,960 bits | 40,960 bits (same) | 49,920 bits (+22 %) | 40,960 bits (same) | 49,920 bits (+22 %) | 49,920 bits (+22 %) |
| Speed Grade (Internal Max) | -3 (~166.67 MHz) | -3 (~166.67 MHz, same) | -3 (~166.67 MHz, same) | -2 (~125 MHz, slower) | -3N RoHS (~166.67 MHz, same) | -2 (~125 MHz, slower) |
| RoHS Compliance | Non-RoHS (SnPb) | RoHS (Pb-free) | Non-RoHS (SnPb) | Non-RoHS (SnPb) | RoHS (Pb-free) | Non-RoHS (SnPb) |
主要差異化特點
- Original Altera/Intel drop-in with 208-PQFP footprint (對比EPF10K100EQC208-3)
- Faster -3 speed grade vs -2 (對比EPF10K50EQC208-2)
- Non-RoHS for legacy / defense programs (對比EPF10K50EQC208-3N)
設計說明
The FLEX 10KE is a SRAM-volatile FPGA: every power-up requires a configuration EPROM (EPC1/EPC2/EPC4/EPC8/EPC16) or microcontroller to load the bitstream via PS, PPS, or JTAG. Omitting the boot device leaves the FPGA in an undefined state with all I/Os tri-stated — a frequent integration error. Plan the nCONFIG/nSTATUS/CONF_DONE handshake chain in the schematic before laying out the PCB.
Provide a continuous ground plane under the 208-PQFP and place eight to sixteen 0.1 µF ceramic bypass capacitors distributed around the VCCINT and VCCIO pin groups. The 2.5 V core and 3.3 V/5 V I/O supply rails must be decoupled within 5 mm of their respective pins. Series ferrite beads between analog and digital supplies reduce simultaneous-switching-noise (SSN) coupling into clock-distribution networks.
Estimated: at 166.67 MHz with 50 % toggle density on 147 I/Os and 2.5 V VCCINT, the EPF10K50EQC208-3 dissipates roughly 0.7-1.0 W. With a typical 208-PQFP θJA near 35 °C/W, junction-to-ambient rise is approximately 25-35 °C above the 70 °C upper limit, which is acceptable in commercial environments but offers limited margin. Add 1 sq in of copper pour or forced-air cooling if your enclosure exceeds +50 °C ambient.
The 208-PQFP (28 × 28 mm, 0.5 mm pitch) demands a 4-layer PCB with 0.20 mm via-in-pad or dog-bone fan-out to break out the fine-pitch leads. Allocate dedicated signal layers for JTAG (TCK/TMS/TDI/TDO), configuration (DCLK/DATA0/nCONFIG/nSTATUS/CONF_DONE), and clock-distribution networks. The four user I/O banks of the FLEX 10KE must each receive their own VCCIO rail — do not bridge I/O bank supplies, as mixing 3.3 V and 5 V outputs in the same bank damages input buffers.
合規資訊
Non-RoHS SnPb finish on the original EPF10K50EQC208-3; RoHS-compliant re-packaging available as EPF10K50EQC208-3N. Commercial 0 °C to +70 °C temperature grade — not AEC-Q100 qualified (industrial/automotive use -2 grade is not applicable; FLEX 10KE has no AEC-Q100 variant). REACH status compliant per Altera/Intel material declaration.
