EPF10K50VBC356-4 - FLEX 10K FPGA, 50K Gates, 356-BGA | Intel
MPN： EPF10K50VBC356-4 ✗ 停產EPF10K50VBC356-4 概覽
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnects, and I/O cells that engineers can program after manufacture to implement arbitrary digital logic. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), which also includes simple PLDs (SPLDs), complex PLDs (CPLDs), and modern heterogeneous SoC FPGAs that embed hard processor cores. Within Intel's portfolio, FPGAs occupy the programmable-logic tier alongside CPLDs (MAX series) and high-end SoC FPGAs (Stratix, Cyclone, Agilex). The FLEX 10K family was historically the industry's first embedded PLD family to provide true SOPC integration, enabling designers to mix soft logic with embedded array blocks for memory and arithmetic functions.
The EPF10K50VBC356-4 features a 0.6 ns propagation delay, 16 embedded array blocks, and 3,152 logic elements, supporting designs that demand moderate-density logic with embedded memory and arithmetic blocks. The 356-ball BGA package provides high I/O density suitable for complex glue-logic, bus-interface, and signal-processing tasks. Configuration is performed via in-system programming through the IEEE 1149.1 JTAG interface or with an external serial/configuration EPROM.
Typical applications span telecommunications infrastructure, industrial control, military and aerospace systems, ASIC prototyping, and DSP preprocessing. Engineers select the FLEX 10K family when they require deterministic timing, embedded array blocks, and JTAG-based in-system reprogrammability within a moderate-density logic budget.
When designing with the EPF10K50VBC356-4, observe the 3.3 V supply rail tolerance, ensure adequate decoupling across the BGA balls, and follow the JTAG configuration procedure in the manufacturer datasheet. The commercial temperature grade (0 C to 70 C) limits deployment to non-automotive environments - use the -N suffix variant for industrial extended-temperature designs.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the original manufacturer datasheet.
直接替換替代品，適用於 EPF10K50VBC356-4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPF10K50VBC356-4 （相同外形與佔位） — 差異在於 Speed Grade, Package, Operating Temperature, Process Technology, Mounting Type.
EPF10K50VBC356-3
✅ 直接替換聯絡詢價
查看資料表 →EPF10K50VBC356-2
✅ 直接替換聯絡詢價
查看資料表 →EPF10K50VBC356-1N
✅ 直接替換聯絡詢價
查看資料表 →EPF10K50VBC356-2N
✅ 直接替換聯絡詢價
查看資料表 →EPF10K50VBC356-3N
✅ 直接替換聯絡詢價
查看資料表 →EPF10K50VBC356-4 最大額定值與電氣特性
| Series | FLEX 10K |
| Family | FLEX-10K Embedded Programmable Logic Device |
| Typical Gates | 50,000 |
| Logic Cells / Elements | 2,880 (3,152 logic elements) |
| User I/Os | 274 |
| Internal Frequency (max) | 125 MHz |
| Propagation Delay | 0.6 ns |
| 供應電壓 | 3.3 V |
| Logic Family | CMOS |
| Package Type | BGA-356 |
| 腳位數 | 356 |
| 安裝類型 | Surface Mount (BGA) |
| 工作溫度 | 0 C to 70 C (Commercial) |
| Programming Interface | JTAG (IEEE 1149.1) / Serial configuration EPROM |
| Embedded Array Blocks | 16 EABs |
| Lifecycle | Obsolete / Discontinued |
EPF10K50VBC356-4 bga-356 腳位配置指南
EPF10K50VBC356-4（bga-356 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPF10K50VBC356-4.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPF10K50VBC356-4 適用於 6 應用s: Telecommunications Infrastructure, Industrial Control and Factory Automation, ASIC Prototyping and Emulation, Military and Aerospace Avionics (Legacy), DSP Pre-Processing and Co-Processing, Embedded System Glue Logic and Bus Bridging.
Telecommunications Infrastructure
The EPF10K50VBC356-4's 274 user I/Os and 50K-gate logic capacity make it suitable for telecom line-card glue logic, bus-bridging between legacy microprocessors and modern ASICs, and protocol-conversion interfaces. Its 16 embedded array blocks provide local memory for small packet buffers and lookup tables, while the 125 MHz FastTrack interconnect supports standard telecom backplane rates. In typical SONET/SDH or ATM line-interface designs, the FPGA sits between a framer ASIC and the host CPU, performing parity generation, address decoding, and interrupt multiplexing. The commercial temperature grade (0 C to 70 C) is adequate for centrally cooled central-office equipment, and the JTAG-based in-system programming enables field upgrades as protocols evolve.
推薦
Industrial Control and Factory Automation
With 274 I/Os and deterministic 0.6 ns propagation delay, the EPF10K50VBC356-4 fits motion-control, PLC backplane, and process-control designs that demand predictable timing and dense parallel interfacing. The embedded array blocks implement small dual-port RAMs and FIFO buffers used for sensor data aggregation before forwarding to a host CPU or DSP. In a typical PLC design the device absorbs encoder quadrature decoding, PWM generation, and high-speed serial-protocol multiplexing. The 3.3 V supply simplifies power architecture in 24 V industrial systems with intermediate regulation. Designers should observe industrial EMI practices - guard traces, BGA via-in-pad design, and bulk decoupling - to ensure robust operation.
推薦
ASIC Prototyping and Emulation
The EPF10K50VBC356-4's 50K-gate logic density and JTAG-based reconfiguration make it a popular vehicle for ASIC prototyping in the late 1990s and early 2000s. Engineers partition a multi-hundred-thousand-gate ASIC into several FLEX 10K devices and run near-real-time verification before committing to silicon. The 356-ball BGA supports the wide buses typical of ASIC verification, while the 125 MHz internal frequency matches many CPU peripheral interfaces. The device also serves as a low-cost platform for educational FPGA laboratories where students learn RTL design with Verilog or VHDL. Modern prototyping uses Cyclone IV/V or larger Stratix parts, but the FLEX 10K remains in legacy emulation racks worldwide.
推薦
Military and Aerospace Avionics (Legacy)
Although not automotive-qualified (AEC-Q100), the EPF10K50VBC356-4 has been used in legacy military and aerospace systems where its commercial temperature range was acceptable for environmentally controlled enclosures. Avionics-bus interfaces (MIL-STD-1553 bridges, ARINC 429 converters), radar signal pre-processing, and flight-control test equipment have all been implemented on FLEX 10K logic. The 356-ball BGA's high I/O density accommodates the multiple redundant buses common to avionics architectures. For new military programs, designers should consider radiation-hardened or Rad-tolerant FPGAs from Microsemi/Microchip (RTG4) or Xilinx (Virtex-5QV) instead.
推薦
DSP Pre-Processing and Co-Processing
The FLEX 10K's embedded array blocks provide 2 Kbit memory blocks that engineers configure as small FIR filter coefficients, delay lines, or sample buffers for DSP pre-processing tasks. In a typical audio or video pipeline, the EPF10K50VBC356-4 sits upstream of a dedicated DSP, performing sample-rate conversion, gain control, or 2D filter pre-conditioning. The 125 MHz internal frequency handles audio at standard professional sample rates and modest video resolutions. Its 50K-gate budget is sufficient for moderate-complexity DSP glue logic but not for full-rate video processing; modern designs would migrate to Cyclone IV/V or Spartan-6/7 families.
推薦
Embedded System Glue Logic and Bus Bridging
Engineers use the EPF10K50VBC356-4 as a programmable glue-logic device that bridges between microprocessors, memory, and peripherals that lack natural compatibility. Typical applications include address-latch and bank-switch generation, wait-state insertion, interrupt prioritization, and custom peripheral expansion. The 274 I/Os comfortably support wide data buses (32-bit data plus address and control) common in 1990s embedded designs. The embedded array blocks also implement small register files and dual-port FIFOs needed for inter-processor mailboxes. Although Intel's modern SoC FPGAs (Cyclone V SoC, MAX 10) integrate ARM cores that absorb much of this glue logic, the FLEX 10K remains in long-lifecycle industrial and medical equipment.
推薦
推薦產品摘要
工程參考資料，適用於 EPF10K50VBC356-4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPF10K50VBC356-3 | EPF10K50VBC356-2 | EPF10K50VBC356-1 | EPF10K50VBC356-2N | EPF10K50VBC356-3N |
|---|---|---|---|---|---|---|
| Package | BGA-356 | BGA-356 (same) | BGA-356 (same) | BGA-356 (same) | BGA-356 (same) | BGA-356 (same) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Speed Grade | -4 (fastest) | -3 | -2 | -1 (slowest) | -2 industrial | -3 industrial |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 |
| Logic Cells / Elements | 2,880 (3,152 LE) | 2,880 (3,152 LE) | 2,880 (3,152 LE) | 2,880 (3,152 LE) | 2,880 (3,152 LE) | 2,880 (3,152 LE) |
| User I/Os | 274 | 274 | 274 | 274 | 274 | 274 |
| Internal Frequency (max) | 125 MHz | ~100 MHz | ~85 MHz | ~70 MHz | ~85 MHz | ~100 MHz |
| Operating Temperature | 0 C to 70 C (Commercial) | 0 C to 70 C | 0 C to 70 C | 0 C to 70 C | -40 C to 85 C (Industrial) | -40 C to 85 C (Industrial) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle | Obsolete / Discontinued | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Highest speed grade in the 356-BGA EPF10K50 family (對比EPF10K50VBC356-3)
- Commercial temperature range for cost-sensitive designs (對比EPF10K50VBC356-3N)
- Drop-in compatible with other 356-BGA EPF10K50 speed grades (對比EPF10K50VBC356-2)
設計說明
Estimated: With a 3.3 V supply and a fully populated design running at 125 MHz, the EPF10K50VBC356-4 can draw 300-500 mA from the core rail plus additional I/O current proportional to switching I/Os (use 20-30 uA per MHz per toggling LVTTL output as a first-order estimate). Provide a minimum of 4 bulk-decoupling 10 uF tantalum or ceramic capacitors distributed around the BGA footprint plus 0.1 uF and 1 nF high-frequency decoupling on every supply pin. A linear LDO such as LT1117-3.3 or a switching regulator with adequate output filtering must supply the VCCINT rail; do NOT share the core supply with high-current 5 V peripherals without proper isolation.
The 356-ball BGA package demands a multi-layer PCB with microvia or via-in-pad construction to reach the inner-ball ground and power planes. Follow the Altera package guidelines for ball-pitch (1.27 mm typical) and escape routing; use the manufacturer's reference PCB layout if available. Maintain a continuous ground plane directly beneath the BGA to provide both thermal spreading and a low-impedance return path for high-speed signals. Allow for BGA inspection and rework by exposing all balls on the top side and using no-clean flux compatible with lead-free reflow profiles.
Do not confuse the EPF10K50VBC356-4 (commercial temperature grade, speed grade -4) with the -4N industrial-temp variant: the N-suffix parts are tested over -40 C to 85 C and command a higher price. When sourcing from distributors, verify the full MPN string including suffix. Also avoid mixing FLEX 10K (5 V tolerant I/O in older revisions) with FLEX 10KE logic - the architecture differs slightly in EAB configuration. Finally, ensure the configuration EPROM or JTAG programmer supports the specific device ID (0x0204 for EPF10K50VBC356 family) before committing to a programming flow.
Estimated: Without forced-air cooling, the EPF10K50VBC356-4 dissipating 1.5 W will see a junction-temperature rise of approximately 25-35 C above ambient in a typical JEDEC EIA/JESD51 still-air environment, given a theta-JA of roughly 15-20 C/W for the 356-BGA package. For continuous operation near 70 C ambient, provide at minimum 100 LFPM of airflow across the package. A thermal copper pad stitched to an internal ground plane further improves dissipation.
合規資訊
RoHS compliance not confirmed for EPF10K50VBC356-4 in the verified web data; the device is obsolete and predates modern RoHS documentation standards. Not AEC-Q100 qualified; do not use in automotive applications. Verify compliance with the original Altera datasheet for any production deployment.
