EPF10K50VRC240-1N - FLEX 10K 50K-Gate FPGA, 189 I/O | Intel
MPN： EPF10K50VRC240-1N ✗ 停產EPF10K50VRC240-1N 概覽
What is an FPGA? A Field-Programmable Gate Array is a semiconductor IC composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program in the field to implement arbitrary digital functions. FPGAs sit above microcontrollers, DSPs, and ASICs in the design flexibility hierarchy: they are slower per gate than ASICs but offer parallel processing, rapid prototyping, and hardware-level reconfigurability that microcontrollers cannot match. The FLEX 10K family pioneered the embedded array block (EAB), which allows on-chip implementation of RAM, ROM, and arithmetic functions alongside the general-purpose logic array.
Key features of the EPF10K50VRC240-1N include 20,480 typical logic gates, 360 Logic Array Blocks (LABs), 2,880 logic cells (per DigiKey listing), embedded array blocks (EABs) for memory functions, in-system programmability (ISP) via the serial configuration interface, multi-volt I/O support, and JTAG boundary-scan test per IEEE Std 1149.1. The 'V' in the part number denotes 3.3 V operation, the 'RC240' identifies the 240-pin Power QFP package with exposed pad, the '1' indicates the speed grade, and 'N' indicates a lead-free commercial-temperature version.
From an architecture standpoint, the FLEX 10K device integrates continuous interconnect structures (FastTrack) with an array of LABs and EABs, allowing designers to combine wide logic functions with on-chip memory in a single die. The exposed pad on the BFQFP package provides a low-thermal-resistance path for heat dissipation, which is critical at 250 MHz internal operation and 66.67 MHz system performance.
Typical applications for the EPF10K50VRC240-1N include communications glue logic, industrial control state machines, PCI bus interfaces, DSP co-processing, prototyping of ASIC designs, and embedded system-on-chip integration. It is also used in legacy telecom infrastructure where the FLEX 10K architecture has long been deployed.
When designing with this device, ensure proper decoupling (typically 0.1 µF and 10 µF capacitors near each power pin) and thermal relief through the exposed pad to a sufficient copper pour. Designers should also budget configuration time and choose between serial or parallel configuration modes via the Quartus or MAX+PLUS II design tools.
This page synthesizes distributor pricing, drop-in FLEX 10K alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EPF10K50VRC240-1N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPF10K50VRC240-1N （相同外形與佔位） — 差異在於 Package, Operating Temperature, Family, Speed Grade, Series.
EPF10K50VRC240-1
✅ 直接替換聯絡詢價
查看資料表 →EPF10K50VRC240-2N
✅ 直接替換聯絡詢價
查看資料表 →EPF10K50VRC240-3N
✅ 直接替換聯絡詢價
查看資料表 →EPF10K50VRC240-4N
✅ 直接替換聯絡詢價
查看資料表 →EPF10K50RC240-4
✅ 直接替換聯絡詢價
查看資料表 →EPF10K50VRC240-1N 最大額定值與電氣特性
| Family | FLEX 10K |
| Series | FLEX-10K® |
| Typical Gates | 50,000 |
| Logic Elements / Cells | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| User I/Os | 189 |
| 腳位數 | 240 |
| 封裝 | 240-BFQFP Exposed Pad (RQFP) |
| Process Technology | 0.42 µm CMOS |
| Internal Frequency | 66.67 MHz |
| Propagation Delay | 0.6 ns (speed grade -1) |
| Supply Voltage (Core) | 3.3 V |
| 工作溫度 | 0°C to +70°C (Commercial) |
| Programming Method | In-system programmable (ISP) / SRAM-based |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant (lead-free 'N' suffix) |
| Brand / Manufacturer | Intel (formerly Altera) |
EPF10K50VRC240-1N 240-bfqfp exposed pad (rqfp) 腳位配置指南
EPF10K50VRC240-1N（240-bfqfp exposed pad (rqfp) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPF10K50VRC240-1N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPF10K50VRC240-1N 適用於 6 應用s: Legacy Telecom Glue Logic, Industrial Control State Machines, PCI Bus Interface Bridging, DSP Co-Processing Accelerator, ASIC Prototyping Platform, Embedded System-on-Chip Integration.
Legacy Telecom Glue Logic
The EPF10K50VRC240-1N's 50,000-gate capacity and 189 user I/Os make it well-suited for legacy telecom infrastructure where wide bus interfaces, glue logic, and protocol conversion between E1/T1 framers and backplane ASICs are required. Its 66.67 MHz internal frequency supports typical telecom line rates, while the FLEX 10K embedded array blocks (EABs) provide on-chip FIFOs and small RAM/ROM blocks needed for channelized framing. The 240-pin BFQFP package exposes enough I/O to bridge legacy 8/16/32-bit parallel buses without external bus expander logic. Engineers maintaining installed telecom base stations or DSLAM line cards find this part well-matched to the deterministic timing behavior of FLEX 10K silicon.
推薦
Industrial Control State Machines
With 2,880 logic cells, 360 LABs, and 189 I/Os, the EPF10K50VRC240-1N integrates complex state machines, encoder counters, and PID controllers for industrial automation. The exposed-pad 240-BFQFP package handles moderate power dissipation while supporting commercial-temperature operation (0°C to +70°C). Engineers use the FLEX 10K's embedded array blocks to implement small dual-port RAMs for waveform lookup tables and pulse-width modulation ramps. The device's JTAG boundary-scan and in-system programmability simplify factory-floor firmware updates via the serial configuration interface. For motor-control, sensor multiplexing, and PLC I/O expansion, the EPF10K50VRC240-1N remains a proven workhorse in legacy equipment.
推薦
PCI Bus Interface Bridging
The EPF10K50VRC240-1N's 189 user I/Os comfortably accommodate 32-bit PCI data, address, and control signals alongside auxiliary glue logic for legacy motherboards and add-in cards. Its 66.67 MHz internal frequency supports 33 MHz PCI bus operation in target or master mode, with the FLEX 10K EABs implementing PCI configuration space registers as on-chip RAM. Designers appreciate the deterministic timing of FLEX 10K interconnect, which simplifies PCI compliance verification. The exposed-pad BFQFP package also provides the thermal headroom needed for continuous bus-mastering workloads in industrial computing platforms.
推薦
DSP Co-Processing Accelerator
The FLEX 10K family's embedded array blocks enable parallel multiplier-accumulator architectures that pair naturally with external DSP processors for FIR filtering, FFT preprocessing, and image-pipeline pre-conditioning. The EPF10K50VRC240-1N's 50,000 gates deliver enough logic for 16-tap FIR filters or 64-point FFT butterflies in a single device, offloading real-time signal-processing work from the host DSP. The 240-pin BFQFP footprint also allows direct connection to dual external SRAM banks for coefficient and sample-data storage. This combination of EAB memory and general logic was unique at the FLEX 10K's 1990s introduction and still serves niche DSP applications today.
推薦
ASIC Prototyping Platform
Before committing to mask sets, ASIC designers historically used FLEX 10K FPGAs like the EPF10K50VRC240-1N to validate RTL designs at near-ASIC speed. The device's 50,000-gate capacity maps cleanly to medium-complexity ASIC prototypes in networking, storage, and embedded-controller markets. The 240-pin BFQFP package exposes enough I/O to emulate most ASIC pad rings, and Quartus II / MAX+PLUS II synthesis produces fast, predictable place-and-route results. Engineers continue to use this part in low-volume NPI programs where the cost of FLEX 10K silicon is justified by avoiding an NRE mask charge.
推薦
Embedded System-on-Chip Integration
The FLEX 10K pioneered System-on-a-Programmable-Chip (SOPC) integration by embedding RAM, ROM, and arithmetic functions alongside the general logic array. The EPF10K50VRC240-1N continues to host embedded microcontrollers, peripherals, and memory subsystems on a single die for aerospace, medical, and industrial systems with long lifecycles. Its commercial-temperature rating (0°C to +70°C) suits many indoor industrial and medical applications, while the exposed-pad BFQFP package simplifies thermal management in sealed enclosures. This single-chip integration reduces BOM count and improves reliability compared with multi-chip discrete-processor designs of equivalent functionality.
推薦
推薦產品摘要
工程參考資料，適用於 EPF10K50VRC240-1N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPF10K50VRC240-1 | EPF10K50VRC240-2N | EPF10K50VRC240-3N | EPF10K50VRC240-4N | EPF10K50RC240-4 |
|---|---|---|---|---|---|---|
| Package | 240-BFQFP Exposed Pad (RQFP) | 240-BFQFP Exposed Pad (RQFP) - same | 240-BFQFP Exposed Pad (RQFP) - same | 240-BFQFP Exposed Pad (RQFP) - same | 240-BFQFP Exposed Pad (RQFP) - same | 240-BFQFP Exposed Pad (RQFP) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Speed Grade | -1 (66.67 MHz internal) | -1 (66.67 MHz internal) - identical | -2 (~125 MHz internal) | -3 (mid-tier) | -4 (fastest) | -4 speed grade but 5 V supply |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 |
| Logic Cells / Elements | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 |
| Core Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 5.0 V - NOT voltage-compatible |
| RoHS Compliant (lead-free) | Yes ('N' suffix) | No (no 'N' suffix) | Yes | Yes | Yes | Varies by sub-variant |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Drop-in compatibility with all 240-BFQFP FLEX 10K speed grades (對比EPF10K50VRC240-4N)
- Industry-first embedded array block (EAB) architecture (對比EPF10K30AQC240-3)
- Commercial-temperature, lead-free (RoHS) variant available (對比EPF10K50VRC240-1)
設計說明
The FLEX 10K family draws substantially more core current than modern Cyclone or Cyclone IV devices because it is built on a 0.42 µm CMOS process at 3.3 V. Estimated: at 66.67 MHz internal operation with 80% logic utilization, expect 200-400 mA of Icc core current. Place at least one 0.1 µF decoupling capacitor within 5 mm of every VCCINT and VCCIO pin pair, plus a single 10 µF bulk tantalum or ceramic capacitor near the exposed thermal pad. Avoid routing high-speed signals across power islands - FLEX 10K is more sensitive to IR drop than modern FPGAs.
The 240-BFQFP package's exposed pad (EP) is the primary thermal path. Solder the EP to a continuous copper pour of at least 1 square inch on the top or bottom PCB layer, with thermal vias (12-16 vias of 0.3 mm drill) stitching the EP pad to inner ground planes. Estimated: with 1 sq inch of 1 oz copper, theta_JA is approximately 25-30 °C/W; without the EP properly soldered, theta_JA exceeds 50 °C/W and the junction may exceed 125 °C at full I/O switching. Industrial-temperature designs may need additional heatsinking or forced airflow.
Route FLEX 10K I/O signals with 50 Ω controlled impedance if any signal exceeds 50 MHz edge rates. Place series termination resistors within 10 mm of the FPGA output pin to dampen reflections on long traces. Keep configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[0..3]) away from switching I/O to avoid coupling noise into the configuration chain. Use a dedicated ground island under the exposed pad and stitch it to the main ground plane with at least four vias placed symmetrically around the EP.
Two common pitfalls when designing with the EPF10K50VRC240-1N: (1) confusing the 'V' (3.3 V core) variant with the non-'V' (5.0 V core) variant - they are NOT pin-compatible from a power-supply perspective even though the package and pinout match; verify the exact part number before PCB bring-up. (2) Using modern Quartus Prime instead of legacy Quartus II or MAX+PLUS II - Quartus Prime does NOT support FLEX 10K synthesis, and attempting to compile will fail with unsupported-device errors. Use the final Quartus II service release (13.1) or MAX+PLUS II 9.23 for bitstream generation.
Differential clock inputs on the FLEX 10K family are sensitive to PCB trace-length mismatch - keep clock-pair traces within 1 mm of each other and within 5 mm total length to preserve duty cycle. If using an external PLL or clock buffer, place it within 25 mm of the dedicated clock input pin (CLK0/CLK1) and route on the same PCB layer to avoid impedance discontinuities via stubs. For JTAG chain integration, add 10 kΩ pull-ups on TCK, TMS, and TDI per IEEE 1149.1 best practice, and place the JTAG connector within 50 mm of the FPGA TAP pins.
合規資訊
The 'N' suffix in EPF10K50VRC240-1N indicates lead-free / RoHS-compliant finish per Altera/Intel legacy part numbering convention. The part is commercial-temperature (0°C to +70°C) and is not AEC-Q100 qualified - it is not intended for automotive applications. Halogen-free status and conflict-minerals compliance are not documented in available data; verify with Intel's PCN archive if required for environmental compliance audits.
