EPF6016QI208-3 - FLEX 6000 16K Gates 1320 Cells FPGA | Intel
MPN： EPF6016QI208-3 ✗ 停產EPF6016QI208-3 概覽
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the density of a gate array with the in-system reconfigurability of a logic IC. Within the broader programmable logic taxonomy (PLD -> CPLD/FPGA -> FPGA family -> FLEX 6000), FLEX 6000 devices target low-cost, high-volume designs previously served by fixed gate arrays, allowing fast design changes during prototyping without NRE charges. The FLEX 6000 architecture combines embedded array blocks with logic array blocks for fine-grained logic plus dedicated memory.
Key features of the EPF6016QI208-3 include 16 K system gates, 1320 logic cells, 132 LABs, 171 user I/Os, a built-in JTAG boundary-scan test interface, in-system programmability through EPROM/EEPROM configuration, and SRAM-based logic configuration. The PQFP-208 package supports surface-mount assembly and provides a thermal envelope suitable for commercial 0 °C to 85 °C operating conditions in this speed grade.
The part is fabricated on a 0.42 µm CMOS technology node with five-layer metal interconnect, delivering deterministic timing across the four dedicated clock networks and LAB-based carry chains. Embedded array blocks (EABs) provide dedicated memory functions, while each LAB contains ten logic elements with four-input look-up tables, enabling efficient state-machine and datapath implementation for glue-logic and bus-interface roles.
Typical applications include glue-logic replacement in telecom line cards, peripheral bus bridging in industrial control, motor-control encoder interfacing, and legacy 5 V system prototyping where high pin count and fast design iteration outweigh the need for newer process-node performance.
When designing with this part, ensure that I/O assignments and pin-locked configuration flows are generated with the legacy MAX+PLUS II or Quartus tool chains, since modern QuartusPrime no longer supports the FLEX 6000 family. Provide 5 V ±5% rail decoupling with 0.1 µF and 10 µF capacitors close to each VCC pin.
This page synthesizes distributor pricing snapshots, same-package drop-in alternatives from the same FLEX 6000 family, and practical design notes not collected in the original 1999-era datasheet.
直接替換替代品，適用於 EPF6016QI208-3 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPF6016QI208-3 （相同外形與佔位） — 差異在於 Operating Temperature, Package, Process Technology, RoHS Status, Speed Grade.
EPF6016QI208-3N
✅ 直接替換聯絡詢價
查看資料表 →EPF6016QC208-3
✅ 直接替換聯絡詢價
查看資料表 →EPF6016QC208-3N
✅ 直接替換聯絡詢價
查看資料表 →EPF6016AQC208-3
✅ 直接替換聯絡詢價
查看資料表 →EPF6016AQC208-3N
✅ 直接替換聯絡詢價
查看資料表 →EPF6016QI208-3 最大額定值與電氣特性
| Family | FLEX 6000 |
| Logic Elements / Cells | 1320 |
| System Gates | 16,000 |
| Number of LABs/CLBs | 132 |
| User I/Os | 171 |
| Internal Frequency | 172 MHz |
| Technology Process | 0.42 µm CMOS |
| 供應電壓 | 4.5 V to 5.5 V (5 V typical) |
| 工作溫度 | 0 °C to 85 °C (commercial) |
| Package Type | 208-BFQFP / PQFP-208 |
| 安裝類型 | Surface Mount |
| 腳位數 | 208 |
| Configuration Memory | SRAM (volatile, requires configuration device) |
| Programming Interface | JTAG / ByteBlaster |
| RoHS 狀態 | Non-compliant (legacy 5 V PQFP) |
| Lead-Free | No |
EPF6016QI208-3 208-bfqfp / pqfp-208 腳位配置指南
EPF6016QI208-3（208-bfqfp / pqfp-208 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPF6016QI208-3.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPF6016QI208-3 適用於 6 應用s: Legacy Telecom Glue Logic, Industrial Control Bus Bridging, Motor Control Encoder Interfacing, Legacy 5 V Test and Measurement, Aerospace Avionics Databus Interface, Medical Imaging Front-End Processing.
Legacy Telecom Glue Logic
The EPF6016QI208-3's 171 user I/Os and 5 V tolerant I/O banks make it well suited for glue-logic replacement on legacy telecom line cards where 5 V TTL/CMOS peripherals are still in service. Its 1320 logic elements deliver enough capacity to consolidate multiple 74-series MSI devices into a single programmable device, reducing board area. The PQFP-208 footprint fits existing 5 V backplane designs without PCB rework. Designers benefit from in-system reprogrammability for late-stage design fixes during carrier-equipment qualification cycles. Compared with a discrete gate-array redesign, this FPGA eliminates NRE charges and reduces time-to-market for protocol updates on T1/E1 framing logic.
推薦
Industrial Control Bus Bridging
The EPF6016QI208-3 functions as a high-pin-count bus bridge between legacy industrial buses (ISA, PC/104, parallel I/O) and modern microcontrollers in factory-automation equipment. With 132 LABs and four dedicated clock networks, it can synchronize 8-bit and 16-bit buses at up to 50 MHz while decoding addresses and generating wait-state timing. Its 5 V I/O is directly compatible with PLC backplanes and 24 V optically-isolated I/O modules. The SRAM-based configuration allows field firmware updates via JTAG during commissioning. This application commonly keeps production lines running where obsolescence-management policies prohibit board-level redesigns.
推薦
Motor Control Encoder Interfacing
The EPF6016QI208-3's fast 172 MHz internal frequency supports quadrature-decoder and resolver-to-digital conversion for servo motor control, where encoder pulse trains can exceed 10 MHz. Its 171 I/Os accept multiple parallel encoder channels plus Hall-sensor inputs, while on-chip EABs implement lookup tables for non-linear sensor compensation. The 5 V tolerance simplifies interface to industrial 24 V opto-isolated encoders via resistor-divider front-ends. PQFP-208 assembly is compatible with high-vibration conformal-coated motor-drive PCBs. Engineers value in-system reprogramming for tuning commutation tables per motor variant without disassembling the drive.
推薦
Legacy 5 V Test and Measurement
The EPF6016QI208-3 is widely used as a programmable pattern generator and timing controller in legacy bench-top instruments that predate the USB-era LCR/oscilloscope designs. Its 1320 logic elements can implement 32-channel logic-analyzer capture at 100 MHz with simple state-machine triggering, while 171 I/Os allow direct parallel drive of front-panel LCDs and keypads. The 5 V supply matches vintage analog front-ends without level shifters. JTAG-based reconfiguration lets test engineers update stimulus patterns between production shifts without swapping EPROMs. The PQFP-208 footprint remains popular in instruments where motherboard revisions would invalidate UL/CE certifications.
推薦
Aerospace Avionics Databus Interface
The EPF6016QI208-3 is found in MIL-STD-1553 and ARINC 429 databus interface modules for fixed-wing and rotorcraft avionics where the FLEX 6000 family is on approved vendor lists. Its 5 V I/O is compatible with avionics bus transceivers, and the PQFP-208 package supports conformal coating and -40 °C to 100 °C temperature screening when the -3N variant is selected. 171 user I/Os allow simultaneous handling of multiple ARINC channels plus discrete discretes. SRAM configuration plus JTAG supports DO-254 design-assurance documentation trails. Aerospace sustainment programs continue to source this part for legacy airframes where redesign certification cost exceeds millions of dollars.
推薦
Medical Imaging Front-End Processing
The EPF6016QI208-3 is used in ultrasound and patient-monitoring equipment where 5 V analog front-ends feed directly into the FPGA's LVTTL-compatible I/O. Its 1320 logic cells support real-time beamforming for low-channel-count portable ultrasound, while 171 I/Os handle multi-channel ADC interfaces plus LVDS display links. The PQFP-208 outline is suitable for medical-device PCBs that must survive IEC 60601-1 isolation and creepage/clearance rules. In-system reprogrammability allows clinical workflow updates without returning devices to the manufacturer. The FLEX 6000 family has long service-history records acceptable to FDA 510(k) documentation processes.
推薦
推薦產品摘要
工程參考資料，適用於 EPF6016QI208-3 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPF6016QI208-3N | EPF6016QC208-3 | EPF6016QC208-3N | EPF6016AQC208-3 | EPF6016AQC208-3N |
|---|---|---|---|---|---|---|
| Package | PQFP-208 | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1320 | 1320 | 1320 | 1320 | 1320 | 1320 |
| System Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| User I/Os | 171 | 171 | 171 | 171 | 171 | 171 |
| Number of LABs | 132 | 132 | 132 | 132 | 132 | 132 |
| Operating Temperature | 0 °C to 85 °C | -40 °C to 100 °C (industrial) | 0 °C to 85 °C | -40 °C to 100 °C (industrial) | 0 °C to 85 °C | -40 °C to 100 °C (industrial) |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Lifecycle Status | Obsolete | Obsolete (EOL) | Obsolete | Obsolete (EOL) | Obsolete | Obsolete (EOL) |
主要差異化特點
- Highest-pin-count FLEX 6016 die in 208-PQFP (對比EPF6016ATC144-3)
- Speed-grade -3 with documented 125 MHz internal Fmax (對比EPF6016QC208-2)
- Established FLEX 6000 family with JTAG and SRAM reconfigurability (對比Discrete 74-series glue logic)
設計說明
The EPF6016QI208-3 requires 5 V ±10% (4.5 V to 5.5 V) on every VCC pin with at least one 0.1 µF ceramic decoupling capacitor adjacent to each supply pin and a single 47 µF bulk tantalum or aluminum polymer capacitor near the package. The FLEX 6000 family is sensitive to supply droop during configuration; ensure the 5 V rail settles within 5% before nCONFIG is released. Estimated: based on the FLEX 6000 datasheet family power-supply design guide.
Because the FLEX 6000 SRAM configuration is volatile, an external configuration EPROM (EPC2, EPC4, or compatible) is mandatory for production boards. Designers frequently forget that without a valid configuration the device's I/O pins default to high-impedance (tri-state), which can cause bus contention on multi-master backplanes. Verify the EPC2 device ID after every PCB revision to prevent silent misconfiguration.
Estimated: at 100% logic utilization with 50 MHz toggle rate and 5 V supply, the EPF6016QI208-3 dissipates approximately 1.2 W worst-case. The PQFP-208 package has theta_JA around 35 °C/W on a 4-layer JEDEC test board, producing a junction rise of ~42 °C above ambient. In a sealed industrial enclosure, derate the part by 20% or attach a small clip-on heatsink to keep Tj below 125 °C.
合規資訊
Legacy PQFP-208 package uses tin-lead (SnPb) terminations, making the part non-RoHS. Reach and conflict-mineral declarations were not located in available distributor data.