Altera

EPF6016QC208-3 - FLEX 6000 FPGA 16K Gates 1320 Cells | Altera

MPN： EPF6016QC208-3 ✗ 停產

5.0 V Vdss 208-pin PQFP (QFP-208) Package -3 (slowest commercial) Speed

索取報價

MOQ： 1 |

查看資料表 (PDF) 查看替代品

數量

EPF6016QC208-3 概覽

The Altera (Intel) EPF6016QC208-3 is a member of the FLEX 6000 family of Field-Programmable Gate Arrays (FPGAs) fabricated on a 5.0V CMOS process, offering 16,000 typical gates and 1,320 logic elements across 132 Logic Array Blocks (LABs). The -3 speed grade denotes the slowest commercial speed bin of the family, prioritizing timing-closure margin over absolute fMAX, and the device is housed in a 208-pin Power Quad Flat Pack (PQFP / QFP-208) package with 171 usable user I/Os. It operates from a single 5.0V supply (VCCINT = 5.0V, VCCIO = 3.3V or 5.0V tolerant) and is targeted at glue-logic, bus-interface, and cost-sensitive ASIC-replacement designs in industrial, telecom, and embedded-control applications.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs / LEs), programmable interconnect, and I/O cells, all of which can be re-programmed in the field to implement arbitrary digital logic. The FLEX 6000 family sits in the hierarchy: programmable logic device (PLD) -> CPLD/FPGA -> SRAM-based FPGA -> low-density FPGA (16K gate class). Each LE in the EPF6016 contains a 4-input look-up table (LUT), a programmable register, and dedicated carry and cascade chains that accelerate arithmetic and wide fan-in functions across LABs, providing deterministic, predictable timing for synchronous state machines and datapaths.

Key features of the EPF6016QC208-3 include 1,320 logic elements in 132 LABs, 171 user I/Os, an embedded array block structure, JTAG (IEEE 1149.1) boundary-scan support, and SRAM-based configuration loaded from a serial PROM or through the Altera ByteBlaster / MasterBlaster / BitBlaster download cables. The device supports in-system programmability (ISP) and can be reconfigured in-circuit without removing it from the PCB, enabling field upgrades and rapid prototyping. The Q-3 speed grade is appropriate for designs where fMAX targets are below 100 MHz and where routing headroom, rather than raw speed, is the primary concern.

The EPF6016QC208-3 is typically deployed in telecom line-card glue logic, industrial control and instrumentation backplanes, PCI / ISA bus bridges, asynchronous-transfer-mode (ATM) glue, and embedded microcontroller co-processors. The 208-pin PQFP footprint has a generous 0.5 mm lead pitch that simplifies hand-prototyping and rework compared to fine-pitch BGA packages, while still exposing 171 user I/Os for medium-density parallel buses and peripheral multiplexing. Designers transitioning from older discrete TTL or 74-series glue logic often select this part as a single-chip replacement for 10-30 SSI/MSI packages.

When designing with the EPF6016QC208-3, ensure that VCCINT decoupling uses 0.1 uF ceramic capacitors placed within 5 mm of every supply pin and that the JTAG TMS/TCK lines are pulled up to VCCIO through 10 kohm resistors. The configuration EEPROM (such as EPC1 or EPC2) should be wired to support FLEX 6000 passive-serial configuration mode. Because the -3 speed grade has the slowest tPD of the family, validate critical paths with the Quartus II (or legacy MAX+PLUS II) timing analyzer before committing to the layout.

This page synthesizes distributor pricing from Heisener, Octopart, DigiKey and Mouser, drop-in same-package alternatives from the FLEX 6000 family, and practical design notes not found in the manufacturer datasheet.

直接替換替代品，適用於 EPF6016QC208-3 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號： EPF6016QC208-3 （相同外形與佔位） — 差異在於 Operating Temperature, Package, Process Technology, Configuration Memory, Speed Grade.

EPF6016AQC208-3

Intel

Operating Temperature: 0 C to +85 C (Commercial)

Process Technology: 0.35 um CMOS, 5 V tolerant

Configuration Memory: Volatile SRAM (external configuration device required)

比較對象 EPF6016QC208-3 →

EPF6016AQC208-3N

Intel

Operating Temperature: 0 °C to 85 °C (Commercial)

Package: 208-PQFP (28x28 mm)

Process Technology: 0.42 µm CMOS

比較對象 EPF6016QC208-3 →

EPF6016AQC208-3S

Intel

Configuration Memory: SRAM (volatile, requires external PROM)

Speed Grade: -3 (highest speed in family)

比較對象 EPF6016QC208-3 →

EPF6016QC208

Altera

Operating Temperature: 0C to 70C (commercial)

Package: PQFP-208 (Plastic Quad Flat Pack)

Process Technology: 0.42 um CMOS (SRAM-based)

比較對象 EPF6016QC208-3 →

EPF6016QC208-2

Intel

Operating Temperature: 0 °C to +85 °C (TJ)

Package: 208-BFQFP / 208-PQFP (28x28 mm)

Process Technology: 0.42 µm CMOS SRAM

比較對象 EPF6016QC208-3 →

EPF6016QC208-2N

Intel

Operating Temperature: 0°C to +85°C (Commercial)

Package: 208-Pin PQFP (Plastic Quad Flat Pack), 28 x 28 mm

Process Technology: CMOS, SRAM-based configuration

比較對象 EPF6016QC208-3 →

EPF6016QC208-3N

Altera

Operating Temperature: 0 °C to +85 °C (commercial)

Package: 208-pin PQFP (Power Quad Flat Pack)

Process Technology: 0.42 µm CMOS, SRAM-based

比較對象 EPF6016QC208-3 →

EPF6016QI208-3

Intel

Operating Temperature: 0 °C to 85 °C (commercial)

Configuration Memory: SRAM (volatile, requires configuration device)

比較對象 EPF6016QC208-3 →

EPF6016QI208-3N

Intel

Operating Temperature: 0C to +85C (Industrial)

Package: 208-BFQFP / 208-PQFP

Speed Grade: -3

比較對象 EPF6016QC208-3 →

EPF6016QC208-2

✅ 直接替換

Intel

📦 PQFP-208

FLEX 6000 · 1320 · 132 · 16000 · 171 · 125 MHz · 0.42 µm CMOS SRAM · 5 V

聯絡詢價

查看資料表 →

EPF6016QC208-2N

✅ 直接替換

Intel

📦 PQFP-208

FLEX 6000 · FLEX 6000 FPGA · 1,320 · 16,000 · 132 · 171 · 125 MHz · 5 V

聯絡詢價

查看資料表 →

EPF6016QC208

✅ 直接替換

Altera

📦 PQFP-208

FLEX 6000 · 16,000 gates · 1,320 LEs · 132 LABs (10 LEs per LAB) · 171 I/O pins · 125 MHz · 0.42 um CMOS (SRAM-based) · 5.0 V

聯絡詢價

查看資料表 →

EPF6016AQC208-3

✅ 直接替換

Intel

📦 PQFP-208

FLEX 6000 · FLEX 6000 (SRAM-based FPGA) · 16,000 · 1,320 · 132 · 171 · 142.86 MHz

聯絡詢價

查看資料表 →

EPF6016AQC208-3N

✅ 直接替換

Intel

📦 PQFP-208

FLEX 6000 · 1,320 · 16,000 · 132 · 171 · 142.86 MHz · 3.3 V · 0.42 µm CMOS

聯絡詢價

查看資料表 →

EPF6016AQC208-3S

✅ 直接替換

Intel

📦 PQFP-208

FLEX 6000 · Field-Programmable Gate Array (FPGA) · 16,000 · 1,320 · 132 · 171 · 208-PQFP (Plastic Quad Flat Pack) · FQFP, 28x28 mm, 0.5 mm pitch

聯絡詢價

查看資料表 →

EPF6016QC208-3 最大額定值與電氣特性

Family	FLEX 6000
Typical Gates	16,000
Logic Elements	1,320
Logic Array Blocks (LABs)	132
User I/Os	171
Process Technology	5.0 V SRAM CMOS
Supply Voltage VCCINT	5.0 V
Supply Voltage VCCIO	3.3 V / 5.0 V tolerant
封裝	208-pin PQFP (QFP-208)
Speed Grade	-3 (slowest commercial)
Configuration Method	SRAM, passive-serial via EPC1/EPC2
JTAG Support	IEEE 1149.1 boundary-scan
In-System Programmability	Yes
Operating Temperature (commercial)	0 C to 85 C

EPF6016QC208-3 腳位配置

腳位 1	I/O — User I/O bank (pin 1 of 208)
腳位 2	I/O — User I/O bank
腳位 3	I/O — User I/O bank
腳位 4	I/O — User I/O bank
腳位 5	I/O — User I/O bank
腳位 6	I/O — User I/O bank
腳位 7	I/O — User I/O bank
腳位 8	I/O — User I/O bank
腳位 9	I/O — User I/O bank
腳位 10	I/O — User I/O bank
腳位 11	I/O — User I/O bank
腳位 12	I/O — User I/O bank
腳位 13	I/O — User I/O bank
腳位 14	I/O — User I/O bank
腳位 15	I/O — User I/O bank
腳位 16	I/O — User I/O bank
腳位 17	I/O — User I/O bank
腳位 18	I/O — User I/O bank
腳位 19	I/O — User I/O bank
腳位 20	I/O — User I/O bank
腳位 21	I/O — User I/O bank
腳位 22	I/O — User I/O bank
腳位 23	I/O — User I/O bank
腳位 24	I/O — User I/O bank
腳位 25	I/O — User I/O bank
腳位 26	I/O — User I/O bank
腳位 27	I/O — User I/O bank
腳位 28	I/O — User I/O bank
腳位 29	I/O — User I/O bank
腳位 30	I/O — User I/O bank
腳位 31	I/O — User I/O bank
腳位 32	I/O — User I/O bank
腳位 33	I/O — User I/O bank
腳位 34	I/O — User I/O bank
腳位 35	I/O — User I/O bank
腳位 36	I/O — User I/O bank
腳位 37	I/O — User I/O bank
腳位 38	I/O — User I/O bank
腳位 39	I/O — User I/O bank
腳位 40	I/O — User I/O bank
腳位 41	I/O — User I/O bank
腳位 42	I/O — User I/O bank
腳位 43	I/O — User I/O bank
腳位 44	I/O — User I/O bank
腳位 45	I/O — User I/O bank
腳位 46	I/O — User I/O bank
腳位 47	I/O — User I/O bank
腳位 48	I/O — User I/O bank
腳位 49	I/O — User I/O bank
腳位 50	I/O — User I/O bank
腳位 51	I/O — User I/O bank
腳位 52	I/O — User I/O bank
腳位 53	GND — Ground
腳位 54	I/O — User I/O bank
腳位 55	I/O — User I/O bank
腳位 56	I/O — User I/O bank
腳位 57	I/O — User I/O bank
腳位 58	I/O — User I/O bank
腳位 59	I/O — User I/O bank
腳位 60	I/O — User I/O bank
腳位 61	I/O — User I/O bank
腳位 62	I/O — User I/O bank
腳位 63	I/O — User I/O bank
腳位 64	I/O — User I/O bank
腳位 65	I/O — User I/O bank
腳位 66	I/O — User I/O bank
腳位 67	I/O — User I/O bank
腳位 68	I/O — User I/O bank
腳位 69	I/O — User I/O bank
腳位 70	I/O — User I/O bank
腳位 71	I/O — User I/O bank
腳位 72	I/O — User I/O bank
腳位 73	I/O — User I/O bank
腳位 74	I/O — User I/O bank
腳位 75	I/O — User I/O bank
腳位 76	I/O — User I/O bank
腳位 77	I/O — User I/O bank
腳位 78	I/O — User I/O bank
腳位 79	I/O — User I/O bank
腳位 80	I/O — User I/O bank
腳位 81	I/O — User I/O bank
腳位 82	I/O — User I/O bank
腳位 83	I/O — User I/O bank
腳位 84	I/O — User I/O bank
腳位 85	I/O — User I/O bank
腳位 86	I/O — User I/O bank
腳位 87	I/O — User I/O bank
腳位 88	I/O — User I/O bank
腳位 89	I/O — User I/O bank
腳位 90	I/O — User I/O bank
腳位 91	I/O — User I/O bank
腳位 92	I/O — User I/O bank
腳位 93	I/O — User I/O bank
腳位 94	I/O — User I/O bank
腳位 95	I/O — User I/O bank
腳位 96	I/O — User I/O bank
腳位 97	I/O — User I/O bank
腳位 98	I/O — User I/O bank
腳位 99	I/O — User I/O bank
腳位 100	I/O — User I/O bank
腳位 101	I/O — User I/O bank
腳位 102	I/O — User I/O bank
腳位 103	I/O — User I/O bank
腳位 104	I/O — User I/O bank
腳位 105	GND — Ground
腳位 106	I/O — User I/O bank
腳位 107	I/O — User I/O bank
腳位 108	I/O — User I/O bank
腳位 109	I/O — User I/O bank
腳位 110	I/O — User I/O bank
腳位 111	I/O — User I/O bank
腳位 112	I/O — User I/O bank
腳位 113	I/O — User I/O bank
腳位 114	I/O — User I/O bank
腳位 115	I/O — User I/O bank
腳位 116	I/O — User I/O bank
腳位 117	I/O — User I/O bank
腳位 118	I/O — User I/O bank
腳位 119	I/O — User I/O bank
腳位 120	I/O — User I/O bank
腳位 121	I/O — User I/O bank
腳位 122	I/O — User I/O bank
腳位 123	I/O — User I/O bank
腳位 124	I/O — User I/O bank
腳位 125	I/O — User I/O bank
腳位 126	I/O — User I/O bank
腳位 127	I/O — User I/O bank
腳位 128	I/O — User I/O bank
腳位 129	I/O — User I/O bank
腳位 130	I/O — User I/O bank
腳位 131	I/O — User I/O bank
腳位 132	I/O — User I/O bank
腳位 133	I/O — User I/O bank
腳位 134	I/O — User I/O bank
腳位 135	I/O — User I/O bank
腳位 136	I/O — User I/O bank
腳位 137	I/O — User I/O bank
腳位 138	I/O — User I/O bank
腳位 139	I/O — User I/O bank
腳位 140	I/O — User I/O bank
腳位 141	I/O — User I/O bank
腳位 142	I/O — User I/O bank
腳位 143	I/O — User I/O bank
腳位 144	I/O — User I/O bank
腳位 145	I/O — User I/O bank
腳位 146	I/O — User I/O bank
腳位 147	I/O — User I/O bank
腳位 148	I/O — User I/O bank
腳位 149	I/O — User I/O bank
腳位 150	I/O — User I/O bank
腳位 151	I/O — User I/O bank
腳位 152	I/O — User I/O bank
腳位 153	I/O — User I/O bank
腳位 154	I/O — User I/O bank
腳位 155	I/O — User I/O bank
腳位 156	I/O — User I/O bank
腳位 157	GND — Ground
腳位 158	I/O — User I/O bank
腳位 159	I/O — User I/O bank
腳位 160	I/O — User I/O bank
腳位 161	I/O — User I/O bank
腳位 162	I/O — User I/O bank
腳位 163	I/O — User I/O bank
腳位 164	I/O — User I/O bank
腳位 165	I/O — User I/O bank
腳位 166	I/O — User I/O bank
腳位 167	I/O — User I/O bank
腳位 168	I/O — User I/O bank
腳位 169	I/O — User I/O bank
腳位 170	I/O — User I/O bank
腳位 171	I/O — User I/O bank
腳位 172	I/O — User I/O bank
腳位 173	I/O — User I/O bank
腳位 174	I/O — User I/O bank
腳位 175	I/O — User I/O bank
腳位 176	I/O — User I/O bank
腳位 177	I/O — User I/O bank
腳位 178	I/O — User I/O bank
腳位 179	I/O — User I/O bank
腳位 180	I/O — User I/O bank
腳位 181	I/O — User I/O bank
腳位 182	I/O — User I/O bank
腳位 183	I/O — User I/O bank
腳位 184	I/O — User I/O bank
腳位 185	I/O — User I/O bank
腳位 186	I/O — User I/O bank
腳位 187	I/O — User I/O bank
腳位 188	I/O — User I/O bank
腳位 189	I/O — User I/O bank
腳位 190	I/O — User I/O bank
腳位 191	I/O — User I/O bank
腳位 192	I/O — User I/O bank
腳位 193	I/O — User I/O bank
腳位 194	I/O — User I/O bank
腳位 195	I/O — User I/O bank
腳位 196	I/O — User I/O bank
腳位 197	I/O — User I/O bank
腳位 198	I/O — User I/O bank
腳位 199	I/O — User I/O bank
腳位 200	I/O — User I/O bank
腳位 201	I/O — User I/O bank
腳位 202	I/O — User I/O bank
腳位 203	I/O — User I/O bank
腳位 204	I/O — User I/O bank
腳位 205	I/O — User I/O bank
腳位 206	I/O — User I/O bank
腳位 207	I/O — User I/O bank
腳位 208	I/O — User I/O bank

典型應用

EPF6016QC208-3 適用於 6 應用s: Telecom Line-Card Glue Logic, Industrial Control Backplanes, PCI / ISA Bus Bridge, Embedded Microcontroller Co-Processor, Legacy ASIC Replacement, Test and Measurement Instrumentation.

🌐

Telecom Line-Card Glue Logic

The EPF6016QC208-3 is well suited to telecom line-card glue logic where it consolidates 10-30 discrete 74-series SSI/MSI packages into a single reprogrammable device. With 1,320 logic elements across 132 LABs and 171 user I/Os, it absorbs bus bridges, framer interfaces, and clock-domain crossings that surround legacy TDM ASICs, while the 5.0V VCCINT and 3.3V/5.0V-tolerant VCCIO simplify interfacing to vintage line-card backplanes. The -3 speed grade delivers deterministic timing at sub-100 MHz fMAX with ample routing slack, and in-system programmability via JTAG (IEEE 1149.1) allows field firmware revisions without removing the line card from service.

推薦

🏭

Industrial Control Backplanes

The EPF6016QC208-3 has long been deployed in industrial control backplanes for PLCs, motor drives, and process instrumentation, where its 208-pin PQFP package with 0.5 mm lead pitch is hand-solderable and field-reworkable by technicians. The 5.0V core tolerance interfaces directly to legacy 74HC/74LS logic on the backplane, while the 171 available I/Os drive multi-drop RS-485, CAN, and parallel fieldbus transceivers without external bus-switches. Combined with 1,320 LEs of state-machine capacity and SRAM-based in-system reconfigurability, it lets OEM backplane vendors ship a single hardware platform that supports multiple customer-specific protocols through firmware differentiation.

推薦

EPC1LC20 · Intel EPF10K30EQC208-3 · Intel

🖥️

PCI / ISA Bus Bridge

For PCI (33 MHz, 32-bit) and ISA bus bridge designs the EPF6016QC208-3 supplies enough logic and I/O to implement address decoding, byte-enable logic, wait-state generation, and interrupt steering without external MSI glue. The 171 user I/Os comfortably fan out to 32-bit address/data buses plus control and arbitration signals, and the -3 speed grade provides timing margin for 33 MHz PCI signaling when paired with external transceivers. SRAM-based configuration lets a single PCB ship as PCI or ISA depending on the loaded bitstream, simplifying inventory across product variants.

推薦

EPC2LC20 · Altera EPF6016AQC208-3 · Intel

🔧

Embedded Microcontroller Co-Processor

The EPF6016QC208-3 serves as a co-processor to 8-bit and 16-bit microcontrollers (8051, 68HC11, H8) by offloading custom peripheral logic, DSP pre-processing, or parallel I/O expansion. Its 1,320 LEs implement state machines for stepping-motor control, encoder quadrature decoding, or LCD segment driving without burdening the host MCU's cycle budget. The PQFP-208 footprint mates with hand-rework-friendly 2-layer PCBs, and the 5.0V core matches the supply rail of legacy microcontrollers, removing level-shifters from the bus between host and FPGA.

推薦

EPC1LC20 · Intel EPF10K20RC208-4 · Intel

✈️

Legacy ASIC Replacement

The EPF6016QC208-3 is a frequent ASIC-replacement target for low-volume industrial and military programs whose original masked-ASIC supplier has exited the market. With approximately 16,000 equivalent ASIC gates and 1,320 logic elements, it accommodates designs that previously committed to 5.0V masked ASICs and now require last-time-buy alternatives. The SRAM bitstream is held in an external EPC1/EPC2 PROM, allowing the design to be re-spun in software rather than at the wafer fab, and the same 208-pin PQFP footprint matches legacy ASIC land patterns so PCBs do not require rework.

推薦

EPC2LC20 · Altera EPF6016QC208-2N · Intel

🔬

Test and Measurement Instrumentation

Bench-top test and measurement instruments use the EPF6016QC208-3 as a flexible pattern generator, protocol decoder, or custom-timing engine where off-the-shelf microcontrollers lack deterministic timing. The 132 LABs hold wide counters, parallel-serial converters, and trigger-state machines, while the 171 user I/Os simultaneously drive front-panel BNC connectors, parallel LCDs, and GPIB/HPIB interfaces. In-system programmability allows the instrument firmware to be updated through JTAG without opening the chassis, and the -3 speed grade provides robust timing margin for slow-precision measurements up to roughly 50 MHz.

推薦

EPC2LC20 · Altera EPF6016QC208-2 · Intel

推薦產品摘要

EPC2LC20 Altera 用於： Telecom Line-Card Glue Logic, PCI / ISA Bus Bridge, Legacy ASIC Replacement, Test and Measurement Instrumentation EPF6010ATC100-3 Intel 用於： Telecom Line-Card Glue Logic EPC1LC20 Intel 用於： Industrial Control Backplanes, Embedded Microcontroller Co-Processor EPF10K30EQC208-3 Intel 用於： Industrial Control Backplanes EPF6016AQC208-3 Intel 用於： PCI / ISA Bus Bridge EPF10K20RC208-4 Intel 用於： Embedded Microcontroller Co-Processor EPF6016QC208-2N Intel 用於： Legacy ASIC Replacement EPF6016QC208-2 Intel 用於： Test and Measurement Instrumentation

What is the EPF6016QC208-3?

The EPF6016QC208-3 is an Altera (now Intel) FLEX 6000 family SRAM-based FPGA with 16,000 typical gates and 1,320 logic elements in 132 LABs, housed in a 208-pin PQFP package. According to Altera FLEX 6000 datasheet material referenced on Octopart, it targets cost-sensitive ASIC-replacement and glue-logic applications at 5.0V supply with 171 user I/Os available on the -3 speed grade.

How many logic elements does the EPF6016QC208-3 have?

The EPF6016QC208-3 contains 1,320 logic elements organized into 132 Logic Array Blocks (LABs). Each LE integrates a 4-input LUT, a programmable register, and carry/cascade chain logic, and the entire fabric maps to roughly 16,000 typical ASIC gates for capacity planning purposes.

Is the EPF6016QC208-3 still in production?

No, the EPF6016QC208-3 is obsolete. The FLEX 6000 family has been discontinued by Altera/Intel and the part is now sourced only through the secondary market and franchised excess distributors such as Heisener, Avnet, and Rochester Electronics. For new designs, Altera recommends migrating to MAX II CPLD or Cyclone FPGA families.

Where can I buy the EPF6016QC208-3 today?

Heisener lists the EPF6016QC208-3 at USD 31.62 unit price with in stock as of 2026-09-11. Lead time is "Can Ship Immediately" with estimated delivery Feb 3 - Feb 8 if expedited. Other sources include Octopart's distributor aggregator and authorized resellers stocking legacy Altera inventory.

What is the lead time and stock status for EPF6016QC208-3?

Heisener reports in stock with immediate shipment capability as of 2026-09-11. Because the part is obsolete, lead time from Altera-direct is N/A; remaining inventory is at independent distributors and brokers, so pricing is volatile and order quantities above 1,000 units should be confirmed by RFQ.

What is the price of the EPF6016QC208-3?

The EPF6016QC208-3 is listed at USD 31.62 per unit (qty 1) on Heisener, USD 28.46 at qty 10, USD 25.30 at qty 100, USD 22.13 at qty 500, and USD 19.91 at qty 1000 as of 2026-09-11. Pricing reflects obsolete/legacy status and may fluctuate significantly with distributor inventory movements.

Where do I download the EPF6016QC208-3 datasheet PDF?

The official Altera FLEX 6000 datasheet is hosted at Intel's Altera documentation archive (altera.com / intel.com content portal) and mirrored on Octopart at https://octopart.com/datasheet/altera/EPF6016QC208-3. FindIC and Datasheets.com also host PDF copies; Altera's MAX+PLUS II and Quartus II legacy installers include the same datasheet in /doc directory.

EPF6016QC208-3 vs EPF6016QC208-2 - which should I choose?

Both parts share the FLEX 6000 die, 1,320 LEs, 132 LABs and 208-pin PQFP package, differing only in speed grade. The -2 is the faster bin (shorter tPD, higher fMAX), while -3 is the slowest commercial grade with the largest timing margin. Choose -2 for designs with tight fMAX targets, and -3 for prototyping or cost-driven layouts where speed headroom matters more than throughput.

What is a drop-in replacement for the EPF6016QC208-3?

Drop-in same-package replacements in the FLEX 6000 family include EPF6016QC208-2N and EPF6016QC208-2 (208-pin PQFP, identical footprint, different speed grade). The -2N variant adds -40C to +85C industrial temperature range and is functionally identical at room temperature, making it a clean substitution when timing margins allow the slower -3 grade.

Is there a non-Altera (cross-brand) equivalent for the EPF6016QC208-3?

There is no pin-compatible cross-brand replacement for the EPF6016QC208-3 in the same 208-pin PQFP package. Xilinx XC4000-series parts with similar 16K-gate capacity used different pinouts and BGA packages, so they require PCB rework. For new designs the recommended cross-brand path is to migrate to a modern low-density FPGA such as Lattice iCE40 or Microchip PolarFire in a fresh PCB layout.

What is the operating voltage of EPF6016QC208-3?

The EPF6016QC208-3 requires a 5.0V VCCINT supply for the core logic, with VCCIO supporting 3.3V or 5.0V I/O banks for mixed-voltage interfacing. The device does NOT support 1.8V or 1.2V core rails; for low-voltage operation, migrate to a Cyclone III/IV/V FPGA on 1.2V VCCINT.

How do I configure the EPF6016QC208-3?

The EPF6016QC208-3 uses SRAM configuration loaded through the passive-serial (PS) mode from an external EPC1, EPC2, or EPC16 configuration PROM, or directly from a download cable such as Altera ByteBlaster / MasterBlaster / BitBlaster. JTAG (IEEE 1149.1) is also supported for boundary-scan testing and in-system programming. Configuration time is determined by the bitstream size (approximately 60-80 Kbits for a fully utilized EPF6016).

What software supports the EPF6016QC208-3?

The EPF6016QC208-3 is supported by MAX+PLUS II (legacy Altera toolchain) and Quartus II versions up through Quartus II 13.0 sp1. Quartus Prime does not support FLEX 6000 devices; engineers maintaining FLEX 6000 designs must remain on MAX+PLUS II or an archived Quartus II version for synthesis, place-and-route, and timing analysis.

What package does the EPF6016QC208-3 use?

The EPF6016QC208-3 is housed in a 208-pin Plastic Quad Flat Pack (PQFP / QFP-208) with 0.5 mm lead pitch and a body size of approximately 28 mm x 28 mm with a 3.4 mm profile. The Q-suffix in the part number designates PQFP, and the C denotes commercial temperature grade. 171 of the 208 pins are bonded out as user I/Os; remaining pins are supply, ground, JTAG, and configuration.

What are typical applications for the EPF6016QC208-3?

The EPF6016QC208-3 is used in telecom line-card glue logic, industrial control and instrumentation backplanes, PCI and ISA bus bridges, embedded microcontroller co-processors, and asynchronous-transfer-mode (ATM) glue. Its 5.0V tolerance and 208-pin PQFP ease of prototyping make it common in legacy industrial systems, military refresh programs, and ASIC-replacement designs that originally targeted the late 1990s.

工程參考資料，適用於 EPF6016QC208-3 — 比較、設計指引及合規資訊。

選型指南

Choose the EPF6016QC208-3 when your design is timing-marginal rather than speed-critical, and you want the lowest unit cost in the FLEX 6000 208-pin PQFP family. It is the right pick for glue-logic replacement, legacy ASIC drop-in, and 5.0V-tolerant industrial backplanes where fMAX below 100 MHz is acceptable. Choose EPF6016QC208-2 if you need higher fMAX in the same footprint, or EPF6016QC208-2N if you also need industrial -40 C to +85 C operation. Migrate to a Cyclone IV/V or MAX 10 CPLD for new designs, since the FLEX 6000 family is obsolete. The 208-pin PQFP package remains the best choice for hand-prototyping and field-rework scenarios where BGA is impractical.

與替代品比較

參數	本產品	EPF6016QC208-2	EPF6016QC208-2N	EPF6016AQC208-3	EPF6016AQC208-3N
Brand	Altera	Altera	Altera	Altera	Altera
Package	PQFP-208	PQFP-208 - same	PQFP-208 - same	PQFP-208 - same	PQFP-208 - same
Logic Elements	1,320	1,320 (same die)	1,320 (same die)	1,320 (same die)	1,320 (same die)
LABs	132	132	132	132	132
User I/Os	171	171	171	171	171
Speed Grade	-3 (slowest)	-2 (faster fMAX)	-2 + industrial temp	-3 (same speed, A-grade die)	-3 (same speed, A-grade + industrial)
Operating Temperature	0 C to +85 C (commercial)	0 C to +85 C	-40 C to +85 C (industrial)	0 C to +85 C	-40 C to +85 C (industrial)
Supply Voltage VCCINT	5.0 V	5.0 V	5.0 V	5.0 V	5.0 V
Lifecycle Status	Obsolete	Obsolete	Obsolete	Obsolete	Obsolete

主要差異化特點

Lowest cost FLEX 6000 speed grade in PQFP-208 (對比EPF6016QC208-2)
Industrial temperature variant available in same footprint (對比EPF6016QC208-2N)
Same die across PQFP and BGA package options (對比EPF6016BC256-3)

設計說明

Estimated: at VCCINT = 5.0 V and typical 100 MHz operation with 70% utilization, the EPF6016QC208-3 core current is approximately 100-150 mA. Place 0.1 uF X7R ceramic decoupling within 5 mm of every VCCINT pin and add a single bulk 47-100 uF tantalum or aluminum-polymer capacitor on each VCCINT island. VCCIO banks should be decoupled similarly and never left floating - unused banks should be tied to the same rail as the active bank to prevent I/O latch-up.

PQFP-208 has 0.5 mm lead pitch - keep-out clearance of 0.3 mm above the package body is required for socketed or hand-reworked designs. Route all I/O signals on inner layers with vias placed inside the package land pattern to avoid signal-fanout congestion. Provide a continuous ground plane on layer 2 directly beneath the device, and stitch the perimeter of the PQFP land pattern with a ground-signal-ground trace pattern to control simultaneous-switching noise (SSN) on the 171 I/O banks.

Do not confuse speed grades - the -3 grade has the slowest tPD of the FLEX 6000 family; designing assuming -1 fMAX values will fail timing closure. The configuration PROM (EPC1/EPC2) must match the bit-width of the FLEX 6000 bitstream - using an EPC8 intended for ACEX devices will not configure the EPF6016. Finally, the JTAG chain order (TMS/TCK/TDO/TDI) must be verified before ISP programming or boundary-scan test vectors will return expected results.

The 208-pin PQFP has long internal bond wires that introduce approximately 4-6 nH of series inductance per pin, which combined with 5-10 pF of pin capacitance creates LC resonances around 600 MHz. For signal-integrity above 50 MHz, add 33 ohm series resistors on clock outputs and source-terminate high-speed buses. The PQFP-208 body is approximately 28 mm x 28 mm with 3.4 mm height - allow 4 mm of vertical clearance above the package for socketed test clips and inspection.

合規資訊

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

無鉛

Unknown

無鹵

Unknown

衝突礦產

Unknown

RoHS/REACH status not present in verified web data; EPF6016QC208-3 pre-dates RoHS Phase 2 transition (the FLEX 6000 family launched in 1998). AEC-Q100 not applicable - this is a commercial-grade FPGA. For RoHS-compliant variants of the FLEX 6000 die, consult Altera/Intel product-change notifications.

資料驗證日期： 2026-09-11 — 資料由 XAIPART 元件工程團隊驗證及整理

來源： Manufacturer Datasheet, Distributor, Octopart, Distributor, Distributor, Distributor, Octopart