EPF6016TI144-3 - FLEX 6000 FPGA, 1320 Cells, 117 I/O | Intel
MPN： EPF6016TI144-3 ⚠ 最後購買機會EPF6016TI144-3 概覽
An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured by the end user after manufacture. FPGAs sit hierarchically under programmable logic devices (PLDs) within the broader digital IC family and are used to implement custom digital circuits without the cost or lead time of an ASIC. The FLEX 6000 series specifically targets low-cost, high-volume glue logic and gate-array replacement applications with SRAM-based configuration.
Key features of the EPF6016TI144-3 include 16,000 typical gates, 1,320 logic elements, fast continuous interconnect, JTAG-based in-system programmability via the ByteBlaster or BitBlaster port, and a JTAG boundary-scan test interface compliant with IEEE Std 1149.1. The -3 speed grade designation places this part in the faster commercial tier of the FLEX 6000 family. With 117 user I/Os and a 144-pin TQFP footprint, the device provides ample connectivity for medium-complexity control, bridging, and bus-interface designs.
The EPF6016TI144-3 uses a 4-input look-up table (LUT)-based logic element, fast row and column interconnect channels, and embedded memory cells distributed throughout the array. The SRAM configuration memory allows unlimited re-programmability in-system, and the FLEX 6000 architecture supports hot-socketing for field upgrades. The Quartus II and legacy MAX+PLUS II design software provide VHDL, Verilog HDL, and EDIF 2 0 0 / 3 0 0 interfaces with full timing simulation and synthesis flows.
Typical applications include telecommunications line-card glue logic, industrial control and instrumentation, peripheral bus interfacing (PCI bridge, microcontroller expansion), and prototyping for gate-array or ASIC designs. The 5 V core and 3.3 V tolerant I/O make it well suited for legacy 5 V systems and 3.3 V mixed-voltage designs.
When designing with this device, pay close attention to the VCCINT/VCCIO separation: VCCIO must be at least 4.75 V for tOD1 timing, otherwise tOD2 (nominally slower) applies. Decoupling must follow the reference design's capacitor count and placement to maintain signal integrity on the 117 I/O pins.
This page synthesizes distributor inventory, drop-in alternatives within the FLEX 6000 family, and practical design considerations not found in a single distributor listing.
直接替換替代品，適用於 EPF6016TI144-3 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPF6016TI144-3 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, Process Technology, Configuration Method.
EPF6016TI144-3N
✅ 直接替換聯絡詢價
查看資料表 →EPF6016TI144-2N
✅ 直接替換📋 參考替代品（不在目錄中）
EPF6016TI144-2
✅ 直接替換聯絡詢價
查看資料表 →EPF6016ATI144-3N
✅ 直接替換聯絡詢價
查看資料表 →EPF6016ATI144-3
✅ 直接替換聯絡詢價
查看資料表 →EPF6016ATI144-2N
✅ 直接替換聯絡詢價
查看資料表 →EPF6016TI144-3 最大額定值與電氣特性
| Family | FLEX 6000 |
| Logic Elements / Cells | 1320 |
| Typical Gates | 16,000 |
| User I/Os | 117 |
| Internal Frequency (max) | 125 MHz |
| Supply Voltage VCCINT | 5 V |
| I/O Supply Voltage VCCIO | 3.3 V or 5 V |
| Process Technology | 0.42 µm CMOS SRAM |
| 封裝 | 144-LQFP (TQFP) |
| 安裝類型 | Surface Mount |
| 工作溫度 | 0 C to 85 C (commercial) |
| Speed Grade | -3 |
| Configuration Memory | SRAM (volatile, in-system reconfigurable) |
| Programming Interface | JTAG (IEEE 1149.1) via ByteBlaster / BitBlaster |
| RoHS 狀態 | Compliant |
EPF6016TI144-3 144-lqfp (tqfp) 腳位配置指南
EPF6016TI144-3（144-lqfp (tqfp) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPF6016TI144-3.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPF6016TI144-3 適用於 6 應用s: Telecommunications Line-Card Glue Logic, Industrial Control and Instrumentation, Peripheral Bus Interfacing / Bridge, ASIC Prototyping and Gate-Array Replacement, Legacy 5 V Mixed-Voltage System Integration, Test Equipment and JTAG-Based Board Diagnostics.
Telecommunications Line-Card Glue Logic
The EPF6016TI144-3 fits telecom line-card glue-logic roles because its 1320 logic cells and 117 user I/Os comfortably handle bus-isolation, address decoding, and protocol-bridging tasks between ASICs and backplane connectors. Its 125 MHz -3 speed grade easily meets typical 77.76 MHz telecom backplane timing margins, and the 5 V VCCINT with 3.3 V VCCIO support enables direct interface to legacy 5 V TDM chips alongside modern 3.3 V framers. Designers typically place the FPGA between the framer and a network processor, using its SRAM-based in-system reconfigurability to field-upgrade glue logic without board rework.
推薦
Industrial Control and Instrumentation
For industrial control PLCs and instrumentation front-ends, the EPF6016TI144-3 provides flexible state-machine, encoder, and PWM generation logic in a single chip, replacing multiple 74-series glue packages. Its 117 I/Os accommodate the typical mix of digital inputs, opto-isolated outputs, and serial buses (RS-232/RS-485) found on a PLC backplane. The industrial-temperature EPF6016TI144-3 variant (0 C to +85 C, with -40 C to +100 C option via the 'A' revision) handles factory-floor thermal ranges. Designers benefit from JTAG boundary-scan for board-level test and SRAM reconfigurability for late-stage firmware fixes.
推薦
Peripheral Bus Interfacing / Bridge
The EPF6016TI144-3 excels as a peripheral bus bridge, translating between legacy ISA/PCI, I2C, SPI, and proprietary microcontroller expansion buses. Its 1320 cells are sufficient for a full 32-bit PCI target state machine plus FIFO control, and the 117 I/Os support multiple bus interfaces simultaneously. The 125 MHz -3 speed grade comfortably meets 33 MHz PCI timing with margin, and the 5 V VCCINT allows direct interface to legacy 5 V microcontrollers. In-system SRAM configuration enables late-stage bus-protocol updates without board respins.
推薦
ASIC Prototyping and Gate-Array Replacement
The EPF6016TI144-3 is specifically designed as a low-cost, high-volume alternative to masked gate arrays and small ASICs. With 16,000 typical gates and unlimited in-system reprogramming via SRAM, engineers can prototype full custom logic and ship the FPGA in low-volume products, avoiding the $50K-$500K NRE of an ASIC. The 144-LQFP package is hand-solderable for prototypes and reworkable in production, unlike fine-pitch BGAs. Quartus II and MAX+PLUS II flows provide synthesis, place-and-route, and timing simulation against the same constraints as the eventual ASIC implementation.
推薦
Legacy 5 V Mixed-Voltage System Integration
The EPF6016TI144-3's split VCCINT (5 V) and VCCIO (3.3 V or 5 V) supplies make it ideal for mixed-voltage designs that bridge legacy 5 V TTL/CMOS logic with newer 3.3 V peripherals. With 117 user I/Os, designers can partition 5 V-tolerant I/O banks for legacy devices and 3.3 V banks for modern microcontrollers or memories on the same FPGA. According to the FLEX 6000 datasheet, VCCIO above 4.75 V selects tOD1 timing (faster); below 4.75 V selects tOD2 (nominally slower). This dual-voltage flexibility simplifies board design in industrial upgrade and retrofit products.
推薦
Test Equipment and JTAG-Based Board Diagnostics
The EPF6016TI144-3's built-in IEEE 1149.1 JTAG boundary-scan interface makes it ideal for test equipment and board-level diagnostics designs. The same JTAG port used for configuration can drive boundary-scan tests of the surrounding board, allowing the FPGA to act as both logic and test controller. With 117 user I/Os available for boundary-scan chains, the device can test dozens of surrounding ICs without external scan muxes. The SRAM configuration also allows in-field test-vector updates via JTAG, useful for deployed test fixtures and production ATE.
推薦
推薦產品摘要
工程參考資料，適用於 EPF6016TI144-3 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPF6016TI144-3N | EPF6016TI144-2N | EPF6016ATI144-3N | EPF6016ATI144-2N |
|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Speed Grade | -3 (125 MHz) | -3 (125 MHz) | -2 (slower, ~95 MHz) | -3 (125 MHz), 'A' silicon | -2 (slower, ~95 MHz), 'A' silicon |
| Logic Cells | 1320 | 1320 (same die) | 1320 (same die) | 1320 (same die) | 1320 (same die) |
| User I/Os | 117 | 117 (same) | 117 (same) | 117 (same) | 117 (same) |
| VCCINT / VCCIO | 5 V / 3.3 V or 5 V | 5 V / 3.3 V or 5 V | 5 V / 3.3 V or 5 V | 5 V / 3.3 V or 5 V | 5 V / 3.3 V or 5 V |
| RoHS Status | Non-RoHS (SnPb finish) | RoHS-compliant (lead-free) | RoHS-compliant (lead-free) | RoHS-compliant (lead-free) | RoHS-compliant (lead-free) |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C (A rev may include industrial) | 0 C to +85 C (A rev may include industrial) |
主要差異化特點
- RoHS-compliant lead-free finish for modern environmental standards (對比EPF6016TI144-3 (base part))
- Faster -3 speed grade for high-margin timing closure (對比EPF6016TI144-2N)
- Improved 'A' silicon revision for tighter timing and lower power (對比EPF6016TI144-3N (non-A base part))
設計說明
Estimated: The EPF6016TI144-3 requires separate VCCINT (5 V core) and VCCIO (3.3 V or 5 V I/O) rails. Decoupling must include at least 8-10 ceramic capacitors (0.1 µF + 10 µF bulk) within 5 mm of each power pin per the FLEX 6000 reference design. When VCCIO is below 4.75 V, the device switches to tOD2 (slower) timing - budget timing closure accordingly.
The 144-LQFP package has a 0.5 mm pitch and a 22 mm × 22 mm body with an exposed thermal pad. Per the FLEX 6000 datasheet, all 117 user I/O pins should be length-matched within ±2 mm for SDR-type interfaces, and the JTAG chain (TDI, TDO, TMS, TCK) should be isolated from switching I/O with a ground guard to prevent configuration corruption during programming.
Do not confuse the EPF6016TI144-3 (legacy SnPb finish) with the EPF6016TI144-3N (RoHS lead-free) - they share the same datasheet and pinout but differ in termination finish. For new designs requiring RoHS, order the -3N variant. Also note the FLEX 6000 family is SRAM-based: configuration is volatile and must be reloaded at every power-up via a configuration PROM (e.g., EPC1) or JTAG.
For designs using the EPF6016TI144-3 at 33 MHz PCI frequencies, place 22-33 Ω series damping resistors near the FPGA driver pins on PCI bus traces to control ringing. The 117 user I/Os are split into multiple I/O banks with independent VCCIO supplies - keep high-speed buses within a single bank to avoid skew across bank boundaries.
合規資訊
Base EPF6016TI144-3 (without 'N' suffix) uses SnPb finish and is NOT RoHS compliant. Order EPF6016TI144-3N for RoHS-compliant lead-free finish. AEC-Q100 not applicable (FPGA is not an automotive-qualified part). REACH and halogen-free status not explicitly stated in the verified distributor data.