FS35R12W1T4-T7 - 1200V 35A EasyPACK 1B IGBT Module | Infineon
MPN： FS35R12W1T4-T7 ✓ 啟用中FS35R12W1T4-T7 概覽
An IGBT module is a power-semiconductor building block that combines multiple insulated-gate bipolar transistors and freewheeling diodes in a single isolated package, enabling compact three-phase inverter, rectifier, or chopper designs. Within the broader power-electronics taxonomy, the IGBT sits between MOSFETs (faster, lower voltage) and thyristors (higher power, slower), and is the workhorse device for medium-power motor drives, solar inverters, and UPS systems operating from a few kW to over 100 kW.
Key specifications include a collector-emitter voltage rating of 1200 V, a nominal collector current of 35 A (with 65 A pulsed capability per datasheet), a sixpack (three-phase full-bridge) topology, and an integrated brake chopper IGBT/diode pair. The module is part of the EasyPACK 1B family, sharing the same mechanical footprint and pin-out with related EasyPACK devices, which simplifies PCB and heatsink design across product variants.
The TRENCHSTOP IGBT4 chip technology combines a trench gate cell with a field-stop layer, achieving low VCE(sat) and reduced switching losses compared to previous-generation NPT IGBTs. The Emitter Controlled 4 diode co-packaged with each switch reduces reverse-recovery losses and improves EMC. An NTC thermistor embedded in the module substrate allows real-time junction-temperature monitoring for thermal protection.
Typical applications include low-to-medium power industrial motor drives, servo amplifiers, solar string inverters, UPS systems, and welding equipment. The 1200 V class makes it suitable for 400 V / 480 V AC bus systems and 600 V / 800 V DC-link applications. The EasyPACK 1B platform also enables paralleling multiple modules for higher current.
When designing with the FS35R12W1T4-T7, ensure proper thermal management: the module dissipates significant power (over 200 W possible) and requires a thermal interface material, a suitable heatsink, and often forced-air cooling. Gate-driver design must respect the IGBT4 short-circuit ruggedness and provide sufficient negative gate-emitter voltage during turn-off to prevent spurious turn-on caused by the Miller effect.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer datasheet alone, helping engineers evaluate sourcing options and second-source strategies.
直接替換替代品，適用於 FS35R12W1T4-T7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： FS35R12W1T4-T7 （相同外形與佔位） — 差異在於 Integrated NTC, Mounting Type, Topology.
FS35R12W1T4
✅ 直接替換聯絡詢價
查看資料表 →FS35R12W1T7
✅ 直接替換📋 參考替代品（不在目錄中）
FS35R12W1T4B11BOMA1
✅ 直接替換📋 參考替代品（不在目錄中）
FS35R12W1T4_B11
✅ 直接替換📋 參考替代品（不在目錄中）
FS35R12W2T4
✅ 直接替換📋 參考替代品（不在目錄中）
FS35R12W1T4-T7 最大額定值與電氣特性
| 拓撲 | Sixpack (three-phase inverter) + brake chopper |
| Collector-Emitter Voltage (Vces) | 1200 V |
| Nominal Collector Current (Ic nom) | 35 A |
| Pulsed Collector Current | 65 A |
| Total Power Dissipation | 225 W |
| IGBT Generation | TRENCHSTOP IGBT4 |
| Diode Generation | Emitter Controlled 4 (EC4) |
| Integrated NTC | Yes (temperature monitoring) |
| Package Family | EasyPACK 1B |
| Contact Technology | Solder (T7 variant) |
| 安裝類型 | Chassis Mount |
| Module Configuration | 6 IGBTs + 6 diodes + brake chopper + NTC |
| RoHS Compliance | Compliant |
| Application Class | Industrial / Motor Drive / Solar |
| Datasheet Source | Infineon manufacturer datasheet |
FS35R12W1T4-T7 easypack 1b 腳位配置指南
FS35R12W1T4-T7（easypack 1b 封裝）的腳位配置。 此功率元件具有閘極、汲極與源極端子。對於非極性封裝，請參閱製造商資料表以取得確切的第 1 腳方向與佈局詳細資訊。常見應用包括電源設計、馬達驅動與負載切換。
無詳細腳位定義資料： FS35R12W1T4-T7.
請參閱 資料表 以查看完整腳位配置。
Forward Bias 安全工作區 (Vces vs Ic)
典型應用
FS35R12W1T4-T7 適用於 7 應用s: Industrial Motor Drives, Solar String Inverters, Uninterruptible Power Supplies (UPS), Servo Amplifiers, Welding Power Supplies, EV Charging Stations, Induction Heating.
Industrial Motor Drives
The FS35R12W1T4-T7 is purpose-built for 400 V / 480 V three-phase AC motor drives in industrial automation. Its 1200 V Vces rating easily handles 690 V AC rectified bus voltages, while the 35 A nominal current supports motors from 11 kW to 22 kW depending on switching frequency and load profile. The integrated sixpack topology eliminates the need for discrete IGBTs and matching freewheeling diodes, reducing BOM count and assembly time. The on-board NTC thermistor enables real-time thermal monitoring, critical for variable-frequency drives operating near rated current in enclosed cabinets.
推薦
Solar String Inverters
In solar string inverter applications, the FS35R12W1T4-T7 handles the DC-to-AC conversion stage with high efficiency thanks to its TRENCHSTOP IGBT4 low-VCE(sat) characteristics. The 1200 V class accommodates typical 1000 V DC maximum input strings with proper margin. Sixpack topology suits three-phase string inverter outputs feeding 400 V AC grids. The brake chopper IGBT and diode pair are useful for dissipating residual energy from the DC bus during grid fault ride-through events, protecting downstream capacitors.
推薦
Uninterruptible Power Supplies (UPS)
Online UPS systems use IGBT modules like the FS35R12W1T4-T7 for both the rectifier and inverter stages, providing bidirectional power flow between battery banks and the AC load. The 1200 V rating supports 600-800 V DC battery configurations common in modern lithium-ion UPS installations. Fast switching and low losses from the IGBT4 technology translate directly to higher UPS efficiency, which is critical for reducing operating cost in data-center deployments where every percentage point of efficiency matters.
推薦
Servo Amplifiers
High-performance servo drives for CNC machines, robotics, and precision automation rely on IGBT modules like the FS35R12W1T4-T7 to deliver clean, fast current control to brushless servo motors. The module's 35 A rating suits mid-power servo axes (5-15 kW), while the integrated brake chopper handles regenerative braking energy during rapid deceleration of inertial loads. The NTC thermistor feedback enables precise thermal modeling for derating during peak-duty cycles typical in servo applications.
推薦
Welding Power Supplies
Inverter-based welding machines use IGBT modules to switch high currents at high frequency, achieving smaller transformer size and better arc control than legacy 50/60 Hz designs. The FS35R12W1T4-T7's 35 A continuous and 65 A pulsed current ratings suit mid-range MIG/TIG welders. The 1200 V rating tolerates the inductive kickback from the welding transformer secondary, while the EC4 diodes minimize reverse-recovery losses that would otherwise heat the module during arc strikes.
推薦
EV Charging Stations
Level 3 DC fast chargers for electric vehicles use IGBT modules in the AC-DC and DC-DC power stages. The FS35R12W1T4-T7, with its 1200 V class rating, suits three-phase 400 V AC input rectification and the high-voltage DC bus feeding the vehicle's battery. The EasyPACK 1B form factor is widely accepted in charging station designs for its robust thermal performance and proven field reliability. Module-level monitoring via NTC enables predictive maintenance in commercial charging networks.
推薦
Induction Heating
Industrial induction heating systems use IGBT modules at medium switching frequencies (20-100 kHz) to drive resonant tank circuits coupling energy into the work piece. The FS35R12W1T4-T7 supports lower-frequency heating applications such as forging and surface hardening. The integrated brake chopper can dissipate excess tank energy during load impedance changes, while the NTC thermistor provides critical protection against the high thermal stresses inherent to induction heating coils.
推薦
推薦產品摘要
工程參考資料，適用於 FS35R12W1T4-T7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | FS35R12W1T4 | FS35R12W1T7 | FS35R12W1T4B11BOMA1 |
|---|---|---|---|---|
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Package | EasyPACK 1B (solder pins) | EasyPACK 1B - same | EasyPACK 1B - same | EasyPACK 1B (PressFIT) |
| Topology | Sixpack + brake chopper | Sixpack + brake chopper | Sixpack + brake chopper | Sixpack + brake chopper |
| Collector-Emitter Voltage (Vces) | 1200 V | 1200 V | 1200 V | 1200 V |
| Nominal Collector Current | 35 A | 35 A | 35 A | 35 A |
| Pulsed Collector Current | 65 A | 65 A | 65 A | 65 A |
| IGBT Chip Generation | TRENCHSTOP IGBT4 | TRENCHSTOP IGBT4 | TRENCHSTOP IGBT7 (newer) | TRENCHSTOP IGBT4 |
| Contact Technology | Solder pins | Solder pins | Solder pins | PressFIT |
| Integrated NTC | Yes | Yes | Yes | Yes |
主要差異化特點
- Integrated sixpack topology with brake chopper (對比Discrete IGBT + diode approach)
- On-board NTC thermistor for direct junction monitoring (對比Modules without integrated NTC)
- EasyPACK 1B family compatibility (對比Vendor-specific proprietary packages)
- TRENCHSTOP IGBT4 + EC4 diode co-optimization (對比Older NPT IGBT + standard diode modules)
設計說明
Estimated: at full-load operation of 35 A per switch with VCE(sat) of approximately 2.0 V, total conduction loss per switch is ~70 W. With six switches operating simultaneously in a sixpack configuration, total module dissipation approaches 400-500 W during peak loads. Mount the EasyPACK 1B module to a heatsink with thermal compound and ensure forced-air cooling with at least 2 m/s airflow across the baseplate to maintain junction temperature below 125 C. Always design the heatsink for the worst-case continuous operating current, not the nominal rating.
The EasyPACK 1B module is designed for chassis mounting, not direct PCB mounting. The power terminals are screw or solder connections to busbars or PCB power planes. Gate-emitter auxiliary signals should be routed via a small driver PCB or twisted-pair wiring, kept as short as possible to minimize gate-loop inductance. Place the gate-driver IC within 50 mm of the module gate terminals and use a low-impedance Kelvin emitter connection to avoid parasitic turn-on from the Miller effect.
Common pitfalls when designing with the FS35R12W1T4-T7 include: (1) insufficient gate-drive negative voltage during turn-off causing parasitic turn-on at high dV/dt; (2) neglecting DC-link snubber capacitors, leading to overvoltage transients above the 1200 V Vces rating during switching; (3) ignoring the NTC thermistor for thermal protection, which can result in thermal runaway under sustained overload; (4) undersizing the gate resistor, causing excessive ringing and EMI; (5) failing to apply thermal compound properly between module baseplate and heatsink, dramatically reducing heat transfer.
Power loop inductance is critical for IGBT switching performance. Minimize the physical area of the DC-link capacitor-to-module power terminal loop to reduce switching transients. Use laminated busbars with tightly coupled positive and negative conductors rather than discrete cabling. Keep gate-driver and signal wiring orthogonal to power loop current paths to minimize capacitive coupling. Source: Infineon EasyPACK 1B application notes.
合規資訊
RoHS and REACH compliant per Infineon product page. Not AEC-Q100 qualified (industrial-grade power module, not automotive-qualified). Lead-free soldering compatible. Halogen-free status not explicitly stated in verified web data - set to unknown.
