LIFCL-40-8MG289C - 39K LUT CrossLink-NX FPGA, 289-BGA | Lattice
MPN： LIFCL-40-8MG289C ✓ 啟用中LIFCL-40-8MG289C 概覽
What is a CrossLink-NX FPGA? The CrossLink-NX family is Lattice's low-power, small-form-factor FPGA line built on the 28 nm FD-SOI Nexus platform. As an FPGA (Field-Programmable Gate Array), it belongs to the programmable logic hierarchy: PLD -> CPLD -> FPGA -> embedded FPGA -> CrossLink-NX. FPGAs differ from CPLDs in that they integrate configurable logic blocks, dedicated block RAM, DSP blocks, and high-speed transceivers, all interconnected through a programmable fabric. CrossLink-NX specializes in bridging heterogeneous video and sensor interfaces with best-in-class power efficiency.
Key features of the LIFCL-40-8MG289C include 39,000 LUTs (logic elements), 1.548 Mbit embedded SRAM, dedicated MIPI D-PHY at up to 2.5 Gbps per lane, integrated DDR3/LPDDR3 memory controller with PHY, and 7 x 2.5G hard PCIe lanes (Gen2). The device is built on a 28 nm FD-SOI low-power process, supports 0.95 V to 1.05 V core Vcc, and offers programmable I/O supporting LVCMOS 1.2/1.5/1.8/2.5/3.3 V, LVDS, SLVS, and sub-LVDS.
The architecture combines hardened MIPI D-PHY and PCIe Gen2 controllers with the programmable Nexus fabric to deliver deterministic latency at low mW power levels. Transceivers support 2.5 Gbps MIPI, and the device targets edge AI pre-processing, sensor aggregation, and video bridging where traditional FPGAs would be too power-hungry.
Typical applications include multi-camera sensor aggregation in robotics and ADAS, machine vision frame grabbers, MIPI-to-MIPI/CSI-to-LVDS bridging, embedded display controllers, and edge AI pre-processing pipelines. Its low power envelope also suits battery-powered wearables and AR/VR glasses.
When designing with this device, use Lattice Radiant or Propel SDK and the CrossLink-NX evaluation board for bring-up. Provide adequate decoupling per the reference design, and follow Lattice PCB layout guidelines for 289-BGA breakout routing.
直接替換替代品，適用於 LIFCL-40-8MG289C — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： LIFCL-40-8MG289C （相同外形與佔位） — 差異在於 Mounting Type, Operating Temperature, Package, Series.
LIFCL-40-9MG289C
✅ 直接替換聯絡詢價
查看資料表 →LIFCL-40-8MG289I
✅ 直接替換📋 參考替代品（不在目錄中）
LIFCL-40-8BG256C
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LIFCL-17-8MG289C
✅ 直接替換📋 參考替代品（不在目錄中）
LIFCL-33U-8MG289C
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LIFCL-40-8MG289C 最大額定值與電氣特性
| Family | CrossLink-NX |
| Series | LIFCL-40 |
| Logic Elements / LUTs | 39,000 (39K) |
| Embedded Block RAM | 1,548,288 bits (1.548 Mbit) |
| User I/O Count | 180 |
| Hard MIPI D-PHY Lanes | Up to 2.5 Gbps per lane (integrated) |
| Hard PCIe Lanes | 7 (PCIe Gen2 compatible) x2.5G |
| Process Technology | 28 nm FD-SOI (Lattice Nexus platform) |
| Core Supply Voltage (Vcc) | 0.95 V to 1.05 V |
| 工作溫度 | 0C to 85C (TJ) |
| Speed Grade | 8 |
| 封裝 | 289-Ball caBGA (CSBGA), 9.5 mm x 9.5 mm |
| 安裝類型 | Surface Mount (BGA) |
| Programming Tools | Lattice Radiant, Lattice Propel |
| Compliance | RoHS compliant; lead-free BGA; tray packaging |
LIFCL-40-8MG289C 289-ball cabga (csbga), 9.5 mm x 9.5 mm 腳位配置指南
LIFCL-40-8MG289C（289-ball cabga (csbga), 9.5 mm x 9.5 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： LIFCL-40-8MG289C.
請參閱 資料表 以查看完整腳位配置。
典型應用
LIFCL-40-8MG289C 適用於 6 應用s: Multi-Camera Sensor Aggregation in Robotics, Embedded Vision Bridge (MIPI-to-LVDS), Edge AI Pre-Processing Pipeline, Machine Vision Frame Grabber, AR/VR Glasses Display Controller, Automotive ADAS Sensor Fusion Hub.
Multi-Camera Sensor Aggregation in Robotics
The LIFCL-40-8MG289C's hard MIPI D-PHY lanes operating at up to 2.5 Gbps per lane aggregate 4+ CMOS image sensors into a single CSI-2 stream, eliminating external PHY ICs. With 39K LUTs of pre-processing, the FPGA handles ISP functions (white balance, demosaic) at mW power levels suitable for battery-powered drones and AMRs where traditional FPGAs would exceed thermal budgets.
推薦
Embedded Vision Bridge (MIPI-to-LVDS)
For designs bridging CSI-2 camera output to LVDS-display input, the LIFCL-40-8MG289C performs protocol translation inside the fabric while consuming milliwatts of power. Its sub-LVDS and SLVS-supported I/Os directly interface legacy displays without glue logic. The 1.548 Mbit EBR buffers frame lines, enabling throughput at full 2.5 Gbps lane rates without frame drop.
推薦
Edge AI Pre-Processing Pipeline
The LIFCL-40-8MG289C's 39K LUTs and DSP blocks execute quantization-aware INT8 inference pre-stages, reducing data sent to downstream SoCs and lowering system-level power. Its sub-100 mW active power on the Nexus FD-SOI process enables always-on AI preview in wearables. The 0.95-1.05V core supply aligns with battery-direct architectures using buck-boost front-ends.
推薦
Machine Vision Frame Grabber
Industrial frame grabbers using the LIFCL-40-8MG289C capture multi-channel MIPI CSI-2 streams at 2.5 Gbps and expose processed frames via PCIe Gen2 to a host PC. The hard PCIe Gen2 controller saves fabric LUTs, freeing logic for image processing. Its 180 user I/O also support parallel sensor inputs and GPIO-based lighting control in factory automation.
推薦
AR/VR Glasses Display Controller
Wearable AR/VR glasses use the LIFCL-40-8MG289C to drive micro-OLED displays by bridging host MIPI outputs to display-native interfaces. Its low mW power extends battery life for all-day use, while 39K LUTs implement display brightness compensation and pupil-tracking pre-processing. The 9.5x9.5 mm BGA fits inside slim temples without PCB space overrun.
推薦
Automotive ADAS Sensor Fusion Hub
When upgraded to the automotive-grade LIFCL-40-9MG289C variant, the same hardware performs multi-camera ADAS sensor fusion in -40C to +125C environments. The hard 2.5G MIPI D-PHY aggregates surround-view cameras, while PCIe Gen2 forwards to the central ADAS compute SoC. The -9 part provides ISO 26262 documentation required for safety-critical automotive designs.
推薦
推薦產品摘要
工程參考資料，適用於 LIFCL-40-8MG289C — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | LIFCL-40-9MG289C | LIFCL-40-8MG289I | LIFCL-40-8BG256C | LIFCL-17-8MG289C | LIFCL-33U-8MG289C |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 289-Ball caBGA (9.5x9.5 mm) | 289-Ball caBGA (same) | 289-Ball caBGA (same) | 256-Ball BGA (different) | 289-Ball caBGA (same) | 289-Ball caBGA (same) |
| Logic Elements / LUTs | 39,000 (39K) | 39,000 (same) | 39,000 (same) | 39,000 (same die) | 17,000 (lower density) | 33,000 (lower density) |
| Hard MIPI D-PHY | Yes (2.5 Gbps) | Yes (same) | Yes (same) | Yes | Yes | Yes |
| Operating Temperature | 0C to 85C (Commercial) | -40C to +125C (Automotive) | -40C to +100C (Industrial) | 0C to 85C | 0C to 85C | 0C to 85C |
| Core Supply Voltage | 0.95V to 1.05V | 0.95V to 1.05V (same) | 0.95V to 1.05V (same) | 0.95V to 1.05V | 0.95V to 1.05V | 0.95V to 1.05V |
主要差異化特點
- Hard 2.5G MIPI D-PHY eliminates external PHY BOM (對比LIFCL-17-8MG289C)
- Commercial temperature grade with full logic density (對比LIFCL-40-9MG289C)
- 289-ball caBGA footprint maximizes user I/O (對比LIFCL-40-8BG256C)
- 28 nm FD-SOI process delivers best-in-class power (對比LIFMD2K-8MG289C (lower-density family member))
設計說明
Estimated: For the 289-ball caBGA package at 0.5 mm pitch, microvia PCB technology (laser-drilled) is required for breakout. Use a 4-2-4 stack-up with HDI (High Density Interconnect). Stack 100 nF MLCC decoupling capacitors within 5 mm of every core Vcc ball, and dedicate continuous ground planes on inner layers for return-current continuity. BGA X-ray inspection is recommended for production.
The 0.95-1.05V core rail must be supplied by an LDO or DC-DC converter with at least 500 mA current capability and <=1% voltage accuracy; use a soft-start ramp per Lattice guidelines. Each PLL domain requires its own dedicated filtered analog supply (VCCA_PLL). Avoid sharing analog and digital ground returns - use a star-ground or split-plane topology tied at a single point near the FPGA.
Do NOT use 2-layer PCBs for the 289-BGA footprint - via density makes breakout impossible. Verify JTAG chain integrity before final bring-up; an open JTAG TDI prevents programming. When migrating from the BG256 to MG289 package, expect full PCB redesign - the ball maps differ. For PCIe Gen2 operation, AC-coupling capacitors (75 nF to 200 nF) must be placed within 8 mm of the TX pins.
合規資訊
RoHS compliant per Lattice product page; lead-free BGA. Not AEC-Q100 qualified - choose LIFCL-40-9MG289C for automotive. Industrial temp variant available as LIFCL-40-8MG289I.
