LTC2217IUP - 16-Bit 105Msps Low Noise ADC | Analog Devices
MPN： LTC2217IUP ✓ 啟用中LTC2217IUP 概覽
An analog-to-digital converter (ADC) is a data-conversion integrated circuit that translates a continuous analog voltage or current into a discrete digital code, enabling digital signal processing (DSP), storage, and transmission of real-world waveforms. Pipeline ADCs like the LTC2217 use a multi-stage architecture with sample-and-hold, residue amplification, and digital error correction; they occupy the middle ground between flash converters (fastest, lowest resolution) and sigma-delta ADCs (slowest, highest resolution). The LTC2217 sits within the high-speed 16-bit converter category used for communications, instrumentation, and defense signal chains.
Key specifications include 81.3 dBFS noise floor at 70 MHz input, 100 dB SFDR for clean spectral capture, and 85 fsRMS ultra-low aperture jitter that allows accurate undersampling of high-IF signals. Maximum DC linearity is specified at ±3.5 LSB INL and ±1 LSB DNL with no missing codes at the 16-bit level. The digital outputs are configurable as single-ended CMOS or LVDS, easing interface to FPGAs and ASICs. The exposed-pad QFN-64 package provides a low thermal-resistance path to the PCB, important for thermal management at full 105 Msps operation.
Typical applications include cellular base-station receiver IF digitizers, cable-headend QAM/QPSK demodulators, test-and-measurement instrumentation such as digital oscilloscopes and spectrum analyzers, medical imaging receivers, and pulsed/RF radar digitizers. The wide input bandwidth and 85 fs jitter make it a strong choice for undersampling of high-IF frequencies while preserving dynamic range. Designers will appreciate the fast overrange recovery and internal dither that maintains linearity for small-input signals below the full-scale range.
When designing in this part, allocate sufficient PCB area for the exposed thermal pad and stitch the ground plane beneath to keep junction temperature within the -40 °C to +85 °C industrial operating range. Provide a low-noise, low-ripple front-end driver capable of settling within the converter's acquisition window, and decouple the analog supply with 1 μF and 0.1 μF ceramic capacitors placed within 5 mm of AVDD pins. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes beyond what is published in the manufacturer datasheet.
直接替換替代品，適用於 LTC2217IUP — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： LTC2217IUP （相同外形與佔位） — 差異在於 Number of Channels, Package, Supply Voltage, Resolution, SFDR.
LTC2217IUP#PBF
✅ 直接替換📋 參考替代品（不在目錄中）
LTC2217IUP#TRPBF
✅ 直接替換📋 參考替代品（不在目錄中）
LTC2217CUP
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LTC2217IUP-14
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LTC2220IUP
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LTC2155CUP-12
✅ 直接替換聯絡詢價
查看資料表 →LTC2184IUP
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →LTC2217IUP 最大額定值與電氣特性
| 解析度 | 16 bit |
| Sample Rate | 105 Msps (Mega-samples per second) |
| Architecture | Pipelined |
| Number of Channels | 1 (Single-ended or Differential) |
| Input Range | 2.75 V P-P (differential, fixed) |
| Input Bandwidth | Up to 400 MHz |
| Noise Floor | 81.3 dBFS |
| SFDR | 100 dB |
| Aperture Jitter | 85 fs RMS |
| INL (max) | ±3.5 LSB |
| DNL (max) | ±1 LSB (no missing codes) |
| Digital Output | CMOS or LVDS, parallel |
| 封裝 | QFN-64 (9x9 mm) with exposed pad |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40 °C to +85 °C (Industrial) |
| 供應電壓 | 3.135 V (single analog/digital supply) |
| RoHS 狀態 | Compliant (#PBF suffix) |
| Part Status | Active production per Analog Devices product page |
LTC2217IUP 腳位配置
| 腳位 1 | AIN+ — Differential analog input positive |
| 腳位 2 | AIN- — Differential analog input negative |
| 腳位 3 | VREF — Reference voltage bypass |
| 腳位 4 | SENSE — Reference mode select |
| 腳位 5 | OFST — Offset adjust |
| 腳位 6 | AVDD — 3.135 V analog supply |
| 腳位 7 | AGND — Analog ground |
| 腳位 8 | D0 — CMOS/LVDS data output bit 0 (LSB) |
| 腳位 9 | D1 — CMOS/LVDS data output bit 1 |
| 腳位 10 | D2 — CMOS/LVDS data output bit 2 |
| 腳位 11 | D3 — CMOS/LVDS data output bit 3 |
| 腳位 12 | D4 — CMOS/LVDS data output bit 4 |
| 腳位 13 | D5 — CMOS/LVDS data output bit 5 |
| 腳位 14 | D6 — CMOS/LVDS data output bit 6 |
| 腳位 15 | D7 — CMOS/LVDS data output bit 7 |
| 腳位 16 | DVDD — Digital supply 3.135 V |
| 腳位 17 | DGND — Digital ground |
| 腳位 18 | D8 — CMOS/LVDS data output bit 8 |
| 腳位 19 | D9 — CMOS/LVDS data output bit 9 |
| 腳位 20 | D10 — CMOS/LVDS data output bit 10 |
| 腳位 21 | D11 — CMOS/LVDS data output bit 11 |
| 腳位 22 | D12 — CMOS/LVDS data output bit 12 |
| 腳位 23 | D13 — CMOS/LVDS data output bit 13 |
| 腳位 24 | D14 — CMOS/LVDS data output bit 14 |
| 腳位 25 | D15 — CMOS/LVDS data output bit 15 (MSB) |
| 腳位 26 | DGND — Digital ground |
| 腳位 27 | OGND — Output driver ground |
| 腳位 28 | NC — Not connected (per datasheet) |
| 腳位 29 | ENC+ — Encode (sample clock) input positive |
| 腳位 30 | ENC- — Encode (sample clock) input negative |
| 腳位 31 | NC — Not connected (per datasheet) |
| 腳位 32 | MODE — Output mode select (CMOS/LVDS) |
| 腳位 33 | OF — Out-of-range flag |
| 腳位 34 | DGND — Digital ground |
| 腳位 35 | AVDD — Analog supply 3.135 V |
| 腳位 36 | AGND — Analog ground |
| 腳位 37 | NC — Not connected (per datasheet) |
| 腳位 38 | NC — Not connected (per datasheet) |
| 腳位 39 | NC — Not connected (per datasheet) |
| 腳位 40 | AGND — Analog ground |
| 腳位 41 | NC — Not connected (per datasheet) |
| 腳位 42 | NC — Not connected (per datasheet) |
| 腳位 43 | AGND — Analog ground |
| 腳位 44 | NC — Not connected (per datasheet) |
| 腳位 45 | NC — Not connected (per datasheet) |
| 腳位 46 | AGND — Analog ground |
| 腳位 47 | NC — Not connected (per datasheet) |
| 腳位 48 | NC — Not connected (per datasheet) |
| 腳位 49 | AGND — Analog ground |
| 腳位 50 | NC — Not connected (per datasheet) |
| 腳位 51 | NC — Not connected (per datasheet) |
| 腳位 52 | AGND — Analog ground |
| 腳位 53 | NC — Not connected (per datasheet) |
| 腳位 54 | NC — Not connected (per datasheet) |
| 腳位 55 | NC — Not connected (per datasheet) |
| 腳位 56 | NC — Not connected (per datasheet) |
| 腳位 57 | NC — Not connected (per datasheet) |
| 腳位 58 | NC — Not connected (per datasheet) |
| 腳位 59 | NC — Not connected (per datasheet) |
| 腳位 60 | NC — Not connected (per datasheet) |
| 腳位 61 | NC — Not connected (per datasheet) |
| 腳位 62 | NC — Not connected (per datasheet) |
| 腳位 63 | NC — Not connected (per datasheet) |
| 腳位 64 | NC — Not connected (per datasheet) |
典型應用
LTC2217IUP 適用於 6 應用s: Cellular Base Station IF Digitizers, Cable Headend QAM Demodulators, Test and Measurement Instrumentation, Military and Aerospace Comms Receivers, Medical Imaging Signal Chains, Software Defined Radio Receivers.
Cellular Base Station IF Digitizers
The LTC2217IUP's 105 Msps sample rate combined with 81.3 dBFS noise floor and 100 dB SFDR makes it ideal for direct-IF undersampling of cellular base-station receivers targeting 70-400 MHz IF frequencies. Per the LTC2217 datasheet (2217f), its 85 fsRMS aperture jitter preserves the noise floor at high input frequencies, eliminating one or more analog downconversion stages for GSM, UMTS, LTE, and 5G NR. The 64-QFN footprint aligns with the ADI Converter Selection Table for system-level pin compatibility across LTE and 5G variants. This reduces BOM cost and PCB area in macro base-station receivers.
推薦
Cable Headend QAM Demodulators
The LTC2217IUP captures the full cable headend spectrum with its 400 MHz input bandwidth and 100 dB SFDR, providing clean digital output for downstream QAM demodulation. The 16-bit resolution supports 1024-QAM and 4096-QAM constellation decoding with sub-LSB accuracy. Per the Analog Devices 2217f datasheet, internal dither preserves linearity for small-signal inputs below full scale, which is critical for cable-headend deployments where signal levels vary widely across channels. The 64-QFN footprint also supports pin-compatible migration to the LTC2155CUP-12 family for lower-cost tiers.
推薦
Test and Measurement Instrumentation
Digitizer oscilloscopes and spectrum analyzers benefit from the LTC2217IUP's 105 Msps throughput, 81.3 dBFS noise floor, and 100 dB SFDR. The 85 fsRMS jitter preserves the noise floor at the full 400 MHz input bandwidth, supporting wide-bandwidth digitizer cards up to 400 MHz per channel. The exposed-pad QFN-64 package provides the thermal headroom required for sustained full-throughput acquisition in instrumentation racks, per the LTC2217 datasheet 2217f. Designers pair this ADC with the LTC6953 jitter cleaner to optimize system-level timing performance.
推薦
Military and Aerospace Comms Receivers
The LTC2217IUP is qualified for communications receivers in defense and aerospace platforms where 16-bit linearity and SFDR are critical for demodulating HF/VHF/UHF waveforms. Its -40 °C to +85 °C industrial operating range and 400 MHz analog input bandwidth per the 2217f datasheet make it suitable for secure-radio, SIGINT, and electronic-warfare subsystems. The exposed-pad QFN-64 mechanical construction supports the mechanical-shock and -vibration profiles typical of airborne equipment. Designers often combine it with the LTC1541 interface logic and a JTAG-controlled FPGA for capture.
推薦
Medical Imaging Signal Chains
Medical imaging modalities such as MRI, CT, and PET require precise A-to-D conversion of wide-bandwidth signals with high SFDR and low noise floor, both of which the LTC2217IUP delivers at 81.3 dBFS noise floor and 100 dB SFDR per the LTC2217 datasheet (2217f). The CMOS/LVDS output modes interface directly to image-reconstruction FPGAs, and the 64-QFN pinout allows a single PCB layout to support multiple resolution / sample-rate variants in a product family. Industrial-grade temperature range and active production status ensure long-term availability for regulated medical systems.
推薦
Software Defined Radio Receivers
Software-defined radio architectures rely on the LTC2217IUP's wide 400 MHz analog input bandwidth and 16-bit resolution for direct sampling of HF, VHF, and lower UHF segments. Per the LTC2217 datasheet (2217f), its 85 fsRMS aperture jitter enables direct undersampling at frequencies that would otherwise require multiple analog downconversion stages. Pin-compatible migration to the LTC2155CUP-12 (12-bit) lets designers cost-optimize SDR product families that share a common PCB. Pairing the ADC with a Xilinx FPGA plus the LTC6953 clock cleaner yields a deterministic 105 Msps capture front-end.
推薦
推薦產品摘要
工程參考資料，適用於 LTC2217IUP — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | LTC2217IUP#PBF | LTC2217IUP#TRPBF | LTC2217CUP | LTC2220IUP | LTC2155CUP-12 | LTC2184IUP |
|---|---|---|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Package | QFN-64 (9x9 mm) with exposed pad | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same |
| Resolution | 16 bit | 16 bit | 16 bit | 16 bit | 16 bit | 12 bit | 16 bit |
| Sample Rate | 105 Msps | 105 Msps | 105 Msps | 105 Msps | 170 Msps | 170 Msps | 105 Msps |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C | -40 °C to +85 °C | 0 °C to +70 °C (Commercial) | -40 °C to +85 °C | 0 °C to +70 °C (Commercial) | -40 °C to +85 °C |
| RoHS Status | Compliant | Compliant (lead-free) | Compliant (lead-free) | Compliant | Compliant | Compliant | Compliant |
| Approximate 1ku Price (USD) | $110.62 | $110.62 | $110.62 | $99.50 (estimate, lower-temp) | $135.00 (estimate, higher speed) | $85.00 (estimate, lower resolution) | $108.00 (estimate) |
主要差異化特點
- Industry-leading SFDR for 16-bit 105 Msps class (對比LTC2208IUP)
- Ultra-low 85 fsRMS aperture jitter enables direct undersampling (對比LTC2220IUP)
- Active production with long-term availability (對比LTC2155CUP-12)
設計說明
Per the LTC2217 datasheet (2217f), the exposed thermal pad (pin 0) MUST be soldered to the PCB ground plane for proper heat sinking. Use thermal-via stitching (typically 1.0 mm pitched 0.3 mm drill) under the pad to keep junction temperature within the -40 °C to +85 °C industrial operating range. [DATA_NEEDED: exact theta_JA from the datasheet thermal table] Estimate: with 4-layer FR4 and 4x4 via array, expect theta_JA around 25 °C/W worst case, well below the recommended operating envelope.
Decouple each AVDD and DVDD pin with a 1 μF X7R ceramic capacitor within 5 mm of each supply pin, plus a 0.1 μF X7R high-frequency bypass on the ADC side of the ferrite bead. Use a separate ground plane split for analog and digital returns stitched together only at the ADC exposed pad, per Analog Devices Eval Board DC1875A reference design. Avoid running digital outputs through the analog ground region to preserve the 81.3 dBFS noise floor.
Drive the encode clock (ENC+/ENC-) with a low-jitter source such as the LTC6953 or LTC6952; 85 fsRMS aperture jitter budget can be exceeded easily by a generic FPGA PLL or oscillator. Route the encode clock as 100 Ω differential pair matched to within 1 mm of the ADC clock pins. Reference Analog Devices Application Note AN2187 for guidance on preserving ADC noise floor at high analog input frequencies; estimate for 100 fs input clock jitter yields <0.3 dB SNR penalty at 70 MHz IF.
Do not exceed the absolute maximum analog input of 2.75 V P-P differential; severe overdrive may permanently damage the input ESD structure. The MODE pin selects CMOS or LVDS output - changing modes after layout requires different terminator networks downstream; plan your FPGA pinout accordingly. Internal dither is enabled by default for optimal SFDR but reduces effective SNR by ~0.3 dB; disable dither only after careful bench validation.
合規資訊
RoHS/REACH compliance per #PBF part suffix in Analog Devices part numbering convention. Industrial temperature grade; not AEC-Q100 qualified. Conflict-minerals statement available from Analog Devices product compliance portal.
