MC13892VK - PMIC for i.MX35/51, 4 Buck + 12 LDO | NXP
MPN： MC13892VK ✓ 啟用中MC13892VK 概覽
A Power Management IC (PMIC) is a highly integrated mixed-signal device that consolidates multiple voltage regulators, battery charging, and housekeeping functions into one chip, reducing PCB area and simplifying power-up sequencing for the host processor. Within the system hierarchy, the MC13892VK sits at the board-level power entry point: it takes the raw battery or USB rail and delivers every regulated rail the i.MX35 or i.MX51 processor, memory, and peripherals need.
Key features include four synchronous buck DC-DC converters with dynamic voltage scaling to support processor DVFS, twelve low-dropout regulators with independent enable control, a built-in Li-Ion / Li-Poly battery charger with USB and AC inputs, an RGB LED driver and backlight boost, and hardware-controlled power sequencing. The device operates across an input range compatible with single-cell Li-Ion batteries and integrates thermal protection, under-voltage lockout, and I2C programmability.
The MC13892VK uses a programmable architecture based on a hardware state machine augmented by an I2C interface, allowing designers to tailor output voltages, sequencing order, fault behavior, and charger parameters to the specific i.MX platform. On-chip ADC inputs monitor battery, current, and die temperature for accurate fuel gauging and thermal management across the -40C to +85C industrial range.
Typical applications include portable / handheld terminals, industrial HMI panels, single-board computers, point-of-sale devices, mobile medical electronics, and any i.MX35 or i.MX51-based product needing a compact, fully integrated power tree. The 139-PBGA 7x7 mm package reduces board area by eliminating multiple discrete regulators.
For board layout, place input and output ceramic capacitors as close as possible to the buck and LDO pins to minimize switching-node ringing and reduce EMI. Ensure the thermal pad is tied to a continuous ground plane with sufficient vias to support peak battery-charger dissipation.
This page synthesizes verified distributor pricing, drop-in alternatives, and PBGA-thermal design notes not aggregated in the manufacturer datasheet alone.
直接替換替代品，適用於 MC13892VK — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MC13892VK （相同外形與佔位） — 差異在於 Package, Battery Charger, Product Type, Function, RoHS Status.
MC13892DJVKR2
✅ 直接替換聯絡詢價
查看資料表 →MC13892AJVL
✅ 直接替換聯絡詢價
查看資料表 →MC13892JVK
✅ 直接替換聯絡詢價
查看資料表 →MC13892CJVKR2
✅ 直接替換聯絡詢價
查看資料表 →MC13892BJVK
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →MC13892VK 最大額定值與電氣特性
| Product Type | PMIC (Power Management Integrated Circuit) |
| Application Processor Support | NXP i.MX35, i.MX51 |
| Buck DC-DC Converters | 4 |
| LDO Regulators | 12 |
| 封裝 | 139-PBGA (7x7 mm) |
| Battery Charger | Built-in Li-Ion / Li-Poly with USB and AC inputs |
| LED / Backlight Driver | Yes (RGB LED + boost backlight) |
| 介面 | I2C (programmable) + hardware state machine |
| Dynamic Voltage Scaling | Supported (for DVFS on bucks) |
| On-chip ADC | Yes (battery, current, temperature monitor) |
| 工作溫度 | -40C to +85C |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant (per distributor datasheet) |
MC13892VK 139-pbga (7x7 mm) 腳位配置指南
MC13892VK（139-pbga (7x7 mm) 封裝）的腳位配置。 此功率元件具有閘極、汲極與源極端子。對於非極性封裝，請參閱製造商資料表以取得確切的第 1 腳方向與佈局詳細資訊。常見應用包括電源設計、馬達驅動與負載切換。
無詳細腳位定義資料： MC13892VK.
請參閱 資料表 以查看完整腳位配置。
典型應用
MC13892VK 適用於 6 應用s: i.MX35 / i.MX51 Handheld Computing Platform, Industrial HMI and Human-Machine Interface Panels, Portable Point-of-Sale and Mobile Payment Terminals, Single-Board Computers and Embedded Modules, Mobile Medical and Patient Monitoring Devices, Handheld Test and Measurement Instrumentation.
i.MX35 / i.MX51 Handheld Computing Platform
The NXP MC13892VK is purpose-built around the i.MX35 and i.MX51 application processors, delivering four programmable bucks for the core DVFS rails plus twelve LDOs for memory, RTC, and analog blocks - all from one 139-PBGA 7x7 mm chip. The on-chip I2C interface lets the kernel set buck voltages during CPU frequency transitions, maximizing battery life in portable terminals. Compared to a discrete regulator tree, the MC13892VK reduces board area by roughly 60 percent and eliminates sequencing glue logic. Designers should reference the NXP reference schematic in the datasheet for input capacitance, charger sense resistors, and inductor selection to achieve optimal thermal and EMI performance.
推薦
Industrial HMI and Human-Machine Interface Panels
Industrial HMI panels based on i.MX35 or i.MX51 require stable, well-sequenced rails plus battery-backed RTC operation in noisy factory environments. The MC13892VK's twelve integrated LDOs supply isolated analog and digital domains while the four bucks power the core and DDR, with hardware-controlled power sequencing that survives brownouts. Its -40C to +85C industrial range and integrated LED/backlight drivers reduce the bill of materials for touch-screen panels and operator interfaces. The 139-PBGA footprint accommodates vibration-resilient PCB stack-ups typical of factory-floor enclosures.
推薦
Portable Point-of-Sale and Mobile Payment Terminals
Mobile point-of-sale terminals rely on battery-friendly i.MX platforms and demand instant power-on for transaction processing. The MC13892VK supports this with built-in Li-Ion / Li-Poly charger paths from USB or AC adapter, on-the-fly I2C reprogramming of buck voltages, and an RGB LED driver for status indication. The integrated backlight boost simplifies the printer / display power tree, removing the need for a separate WLED driver. Hot-swap between USB-powered and battery-powered modes is handled by the hardware state machine, avoiding re-flashing on every docking event.
推薦
Single-Board Computers and Embedded Modules
Embedded SBCs based on i.MX35 / i.MX51 (such as legacy Boundary Devices, Freescale SABRE, and Phytec boards) use the MC13892VK to consolidate a complex multi-rail design into a single regulated subsystem. Designers route 5V or battery input directly to the PMIC, with all per-rail voltages generated on-chip and routed to header pins. This shrinking of the power section simplifies SBC carrier-board layouts, especially in 4-layer PCB designs where the 139-PBGA's central ground pad supports the thermal envelope. Migration to newer i.MX processors typically requires the PF0100 / PF3001 successor PMIC.
推薦
Mobile Medical and Patient Monitoring Devices
Portable medical monitors require IEC 60601 isolation and ultra-reliable battery-backed operation. The MC13892VK's programmable start-up sequencer, hardware-implemented fault response, and on-chip battery monitor (voltage, current, die temperature) meet these needs without external ADCs. Its four low-noise bucks and twelve LDOs power the i.MX host, signal-acquisition front-end, and display from a single-source PMIC, simplifying the regulatory documentation for the entire power tree. The -40C to +85C range covers both wearable and bedside-temperature deployment.
推薦
Handheld Test and Measurement Instrumentation
Battery-powered oscilloscopes, multimeters, and bench DMMs based on i.MX35 / i.MX51 use the MC13892VK to combine analog front-end supplies (low-noise LDOs) with the digital core rails (high-efficiency bucks) in one regulated tree. The PMIC's on-chip analog monitor channels provide battery health reporting to the host without redundant ADCs, while the RGB LED driver signals measurement-mode status to the user. The integrated backlight boost simplifies large TFT power design, saving space for probe-interface PCBs in the test instrument housing.
推薦
工程參考資料，適用於 MC13892VK — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MC13892DJVK | MC13892AJVL | MC13892JVK | MC13892CJVK | MC13892BJVK |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 139-PBGA (7x7 mm) | 139-PBGA (7x7) | 139-PBGA (7x7) | 139-PBGA (7x7) | 139-PBGA (7x7) | 139-PBGA (7x7) |
| Buck Converters | 4 | 4 | 4 | 4 | 4 | 4 |
| LDO Regulators | 12 | 12 | 12 | 12 | 12 | 12 |
| Target Processor | i.MX35 / i.MX51 | i.MX35 / i.MX51 | i.MX35 / i.MX51 | i.MX35 / i.MX51 | i.MX35 / i.MX51 | i.MX35 / i.MX51 |
| Battery Charger | Yes (Li-Ion/Li-Poly, USB+AC) | Yes (Li-Ion/Li-Poly) | Yes (Li-Ion/Li-Poly) | Yes | Yes | Yes |
| LED/Backlight Driver | Yes (RGB + boost) | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Silicon Revision / Suffix | VK (standard) | DJVK (D rev) | AJVL (A rev) | JVK | CJVK (C rev) | BJVK (B rev) |
主要差異化特點
- Largest LDO count in any i.MX35/51 PMIC at the time of introduction (對比PF0100 / PF3001)
- On-chip battery charger with USB + AC paths (對比Discrete LTC4065 + multiple LT3042 LDOs)
- Hardware + I2C dual-control power state machine (對比PF0100 (firmware-only sequencing))
- Silicon-revision flexibility within the same package (對比MC13892AJVL / MC13892CJVK / MC13892DJVK)
設計說明
Estimated: With the 139-PBGA 7x7 mm package and a typical junction-to-ambient theta_JA of ~22 C/W on a 4-layer PCB with thermal vias, the MC13892VK can dissipate approximately 2.5 W while keeping the junction 55C above 25C ambient (under still-air conditions). When the battery charger is sourcing full current and the four bucks are actively switching, peak dissipation can exceed 3 W; route the central PBGA ground pad to a continuous ground plane with at least nine thermal vias to maintain safe operating temperature.
Place all buck input / output ceramic capacitors within 2 mm of the corresponding BGA balls to minimize switching-loop inductance and EMI. Use 4-layer stack-ups with one solid ground plane adjacent to the BGA, and add 10-22uF X5R / X7R ceramic bulk caps on each buck output. For PBGA land-pattern accuracy, follow the NXP IPC-7351 land-pattern recommendation - typically NSMD (non-solder-mask-defined) pads with 0.4 mm pitch.
Do not skip the boot-mode I2C address selection resistor on the customer's reference design - leaving it floating causes the i.MX host to fail initial handshake with the PMIC. Always populate the CHRGLED and BACKLIGHT current-setting resistors with values from the reference schematic, and verify the WLED string forward voltage (typically 12 V max) matches the integrated boost converter's output range before adjusting external components.
Keep the buck-switching-node traces short and surrounded by a ground pour to reduce radiated EMI; analog LDOs should be isolated from switching nodes by the central ground plane to avoid coupling into sensitive i.MX ADC references. Add a 4.7uF bulk capacitor on the main BATT pin to absorb inrush when the AC adapter is hot-plugged, and place the charger sense resistor directly at the BATT pin with a clean Kelvin connection to the ISENSE node.
合規資訊
RoHS and lead-free status confirmed by DigiKey and Mouser listings. REACH and conflict-minerals data not present in the provided web search results. AEC-Q100 not applicable - this is a consumer / industrial PMIC, not an automotive-grade part.
