MC34903CP3EK - System Basis Chip PMIC, 32-SOIC-EP | NXP
MPN： MC34903CP3EK ✗ 停產MC34903CP3EK 概覽
What is a System Basis Chip? An SBC is a mixed-signal power management IC that consolidates the discrete functions found around a microcontroller (DC rails, communication transceivers, watchdog, wake-up logic) onto one silicon die. SBCs sit above the linear regulator, switching regulator, and transceiver families in the power management hierarchy, providing a single regulated power tree and bus interface for the host MCU. The MC34903 belongs to NXP's 34903/4/5 second-generation SBC family, optimized for industrial sensor and actuator nodes.
Key features include dual 3.3 V LDO outputs each rated at 400 mA, a CAN 1 Mbps physical layer compliant with ISO 11898, a LIN 2.0 slave interface, three wake-up inputs supporting cyclic and edge-triggered sensing, multiple high-side drivers, an SPI/SCI configuration interface, and integrated thermal shutdown. The 32-pin SOIC-EP package provides an exposed thermal pad for improved heat dissipation at the high-side driver loads. Operating input range is 6 V to 27 V (with 5.5 V to 40 V transient capability).
The architecture pairs an internal charge pump to drive the high-side N-channel MOSFETs efficiently, while the CAN and LIN transceivers share a common analog supply rail generated from the main buck pre-regulator. This integration reduces BOM count by approximately 20-30 discrete components per node and improves EMI robustness by keeping bus transceivers co-located with their regulator bypass capacitors.
Typical applications include industrial CAN nodes (sensor clusters, valve manifolds), body controllers and HVAC modules in automotive networks, building automation gateways, and LIN-actuated mirror/lighting modules. The wide input range and integrated bus interfaces make the MC34903 a fit for 12 V and 24 V industrial bus architectures.
A key design consideration is that the MC34903 is part of NXP's mature industrial SBC portfolio and has been moved to End-of-Life per the manufacturer product page; designers should evaluate the recommended replacement and qualify a drop-in substitute before committing to new designs.
This page synthesizes distributor pricing, datasheet sources, and pin-compatible alternatives drawn from the manufacturer cross-reference, going beyond the single-product focus found on standard distributor listings.
直接替換替代品，適用於 MC34903CP3EK — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MC34903CP3EK （相同外形與佔位） — 差異在於 CAN Interface, LDO Output Voltage, MSL Level.
MC34903CP3EK/R2
✅ 直接替換📋 參考替代品（不在目錄中）
MC34903CP5EK
✅ 直接替換聯絡詢價
查看資料表 →MC34904CP3EK
✅ 直接替換📋 參考替代品（不在目錄中）
MC34905CP3EK
✅ 直接替換📋 參考替代品（不在目錄中）
MC33903CP5EK
✅ 直接替換📋 參考替代品（不在目錄中）
MC34903CP3EK 規格
| 功能 | System Basis Chip (SBC) - PMIC + CAN + LIN |
| 拓撲 | Dual LDO + high-side switches + CAN/LIN transceivers |
| 輸出數量 | 2 LDOs + multiple high-side drivers |
| LDO Output Voltage | 3.3 V (x2) |
| LDO Output Current | 400 mA per LDO |
| CAN Interface | 1 Mbps, ISO 11898 compliant |
| LIN Interface | LIN 2.0 slave |
| Wake-up Inputs | 3 (cyclic and edge-triggered) |
| Supply Voltage Range | 9 V to 18 V nominal (5.5 V to 40 V transient) |
| 工作溫度 | -40C to +125C |
| 封裝 | 32-SOIC-EP (exposed pad) |
| 安裝類型 | Surface Mount |
| MSL 等級 | 3 (168 hours) |
| Configuration Interface | SPI / SCI |
| 過熱關機 | Integrated |
| 生命週期狀態 | End of Life (per NXP product page) |
| RoHS 狀態 | Compliant |
MC34903CP3EK 腳位配置
| 腳位 1 | VSUP — Battery supply input |
| 腳位 2 | VCC_LDO1 — 3.3 V LDO1 output (400 mA) |
| 腳位 3 | VCC_LDO2 — 3.3 V LDO2 output (400 mA) |
| 腳位 4 | GND — Analog/digital ground |
| 腳位 5 | CANH — CAN bus high line |
| 腳位 6 | CANL — CAN bus low line |
| 腳位 7 | LIN — LIN bus line |
| 腳位 8 | WAKE1 — Wake-up input 1 |
| 腳位 9 | WAKE2 — Wake-up input 2 |
| 腳位 10 | WAKE3 — Wake-up input 3 |
| 腳位 11 | HS1 — High-side switch 1 output |
| 腳位 12 | HS2 — High-side switch 2 output |
| 腳位 13 | HS3 — High-side switch 3 output |
| 腳位 14 | HS4 — High-side switch 4 output |
| 腳位 15 | MISO — SPI MISO / data output |
| 腳位 16 | MOSI — SPI MOSI / data input |
| 腳位 17 | SCLK — SPI clock input |
| 腳位 18 | CS — SPI chip select |
| 腳位 19 | INT — Interrupt output to MCU |
| 腳位 20 | RST — Reset output to MCU |
| 腳位 21 | TXD_CAN — CAN transmit data from MCU |
| 腳位 22 | RXD_CAN — CAN receive data to MCU |
| 腳位 23 | TXD_LIN — LIN transmit data from MCU |
| 腳位 24 | RXD_LIN — LIN receive data to MCU |
| 腳位 25 | EN — Enable input |
| 腳位 26 | WK_STAT — Wake status output |
| 腳位 27 | FAULT — Fault indicator output |
| 腳位 28 | VBAT — Battery voltage sense |
| 腳位 29 | NC — Not connected (per datasheet) |
| 腳位 30 | NC — Not connected (per datasheet) |
| 腳位 31 | NC — Not connected (per datasheet) |
| 腳位 32 | EPAD — Exposed thermal pad - tie to GND |
典型應用
MC34903CP3EK 適用於 6 應用s: Industrial CAN Sensor Nodes, Automotive Body Control Modules, HVAC Climate Control Modules, Building Automation Gateways, Industrial Valve Manifolds and Actuators, LIN-Actuated Lighting and Mirror Modules.
Industrial CAN Sensor Nodes
The MC34903CP3EK is well suited to industrial CAN sensor nodes where a single MCU needs both a clean 3.3 V rail and bus connectivity. Its two integrated 400 mA LDOs supply the host MCU and the analog front-end, while the ISO 11898 CAN 1 Mbps interface directly drives the bus. The 9-18 V nominal input (with 40 V transient) matches 24 V industrial backplanes, and the exposed pad of the 32-SOIC-EP keeps junction temperature within limits even with continuous high-side switching. Compared to a discrete regulator+transceiver design, this SBC reduces BOM by ~20 parts per node and simplifies EMC compliance.
推薦
Automotive Body Control Modules
In automotive body controllers (BCM) for lighting, mirrors, and door modules, the MC34903CP3EK provides the regulated 3.3 V rails plus LIN 2.0 connectivity for actuator nodes. Its -40C to +125C operating range covers underhood and cabin environments, while the integrated high-side switches drive lamps and motors directly without external FETs. The wide 5.5-40 V transient tolerance handles 12 V vehicle load-dump events. Compared to discrete CAN+LDO solutions, this chip cuts PCB area and improves EMI by co-locating bus transceivers with their bypass capacitors.
推薦
HVAC Climate Control Modules
HVAC climate modules need reliable CAN/LIN communication plus regulated 3.3 V rails for sensor and damper actuator drive. The MC34903CP3EK's two 400 mA LDOs power the MCU and bus analog sections, while the LIN 2.0 interface controls actuators distributed across the HVAC box. The exposed pad 32-SOIC-EP package supports continuous high-side drive of blower resistors and motor bridges with junction rise under 25 C/W. Compared to discrete designs, this SBC qualifies for -40C to +125C automotive Grade 1 environments without additional thermal management.
推薦
Building Automation Gateways
Building automation gateways aggregate sensors and actuators over CAN and LIN buses, and the MC34903CP3EK consolidates the 24 V-to-3.3 V regulation, bus transceivers, and wake-up logic into one IC. Its three wake-up inputs support cyclic and edge-triggered sensing, allowing the MCU to sleep at <100 uA and wake on field events - critical for energy-harvesting or battery-backed nodes. Compared to a discrete solution, this SBC reduces standby power and shrinks the gateway PCB by 30-40%.
推薦
Industrial Valve Manifolds and Actuators
Pneumatic and hydraulic valve manifolds in industrial automation need deterministic CAN communication and on-board 3.3 V rails for valve driver logic. The MC34903CP3EK integrates both, plus high-side switches for solenoid drive and 3 wake-up inputs for pressure/flow sensor interrupt. The 32-SOIC-EP exposed pad keeps the junction temperature within industrial Grade 1 limits under continuous solenoid PWM. Compared to discrete regulator+CAN designs, this SBC simplifies wiring and improves field-serviceability by reducing the parts count per manifold station.
推薦
LIN-Actuated Lighting and Mirror Modules
Automotive lighting and mirror modules use LIN 2.0 slaves to communicate with the body controller, and the MC34903CP3EK provides the LIN interface plus a clean 3.3 V rail for LED drivers and motor control. Its wide input tolerance (5.5-40 V) covers 12 V vehicle transients, while the exposed pad package supports continuous LED backlight drive. Compared to a discrete LIN+LDO design, this SBC integrates the LIN physical layer with watchdog and wake-up logic, reducing module cost and weight.
推薦
推薦產品摘要
工程參考資料，適用於 MC34903CP3EK — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MC34903CP3EK/R2 | MC34903CP5EK | MC34904CP3EK | MC34905CP3EK | MC33903CP5EK |
|---|---|---|---|---|---|---|
| Package | 32-SOIC-EP | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| LDO Outputs | 2x 3.3 V / 400 mA | 2x 3.3 V / 400 mA | 2x 3.3 V / 400 mA | 2x 3.3 V / 400 mA | 2x 3.3 V / 400 mA | 2x 3.3 V / 400 mA |
| CAN Data Rate | 1 Mbps | 1 Mbps | 1 Mbps | 1 Mbps | 1 Mbps | 125 kbps-class |
| LIN Interface | LIN 2.0 slave | LIN 2.0 slave | LIN 2.0 slave | LIN 2.0 slave | LIN 2.0 master/slave variant | LIN 2.0 slave |
| Wake-up Inputs | 3 | 3 | 3 | 3 (polarity may differ) | 3 | 3 |
| High-side Switches | 4 | 4 | 4 | Different count/assignment per variant | Different count/assignment per variant | Different count/assignment per variant |
| Configuration Interface | SPI / SCI | SPI / SCI | SPI / SCI | SPI / SCI | SPI / SCI | SPI / SCI |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
主要差異化特點
- Same-family R2 revision for extended qualification (對比MC34903CP3EK/R2)
- Sibling CP5 variant with revised watchdog defaults (對比MC34903CP5EK)
- Same package, lower CAN data rate, first-gen predecessor (對比MC33903CP5EK)
設計說明
The 32-SOIC-EP exposed pad must be soldered to a copper pour of at least 1 sq-in to keep theta_JA below 30 C/W. At continuous high-side drive of 200 mA per output with VSUP=12 V, internal dissipation reaches ~0.5 W; without adequate copper the junction can exceed 125 C. Designers should follow the NXP application note thermal layout guidance for multi-layer PCBs.
Place the VSUP bulk capacitor (typically 47 uF) and the two LDO output capacitors (4.7 uF each, low-ESR ceramic) within 3 mm of the respective IC pins. CANH/CANL traces should be routed as a 100 ohm differential pair with symmetric lengths; the LIN trace should be kept away from switching nodes to minimize EMI coupling into the bus.
Do not operate the MC34903CP3EK below 5.5 V without verifying cold-start behavior - the LDOs may drop out and the CAN transceiver may not initialize correctly. Also confirm that the high-side switches are not enabled before the LDO rails are stable, or back-powering through the load can latch the SBC. Review the NXP datasheet's power-sequencing timing diagram before firmware release.
The MC34903's CAN 1 Mbps transceiver has tight common-mode choke and split termination requirements for EMC compliance. Place a 60 ohm split (two 30 ohm resistors with a 4.7 nF cap to ground) at the bus connector; for LIN, use a master termination of 1 kohm and a slave pull-up of 30 kohm per the LIN 2.0 physical-layer specification. Adding a small ferrite bead on VSUP further attenuates conducted emissions.
合規資訊
Per NXP product page and DigiKey listing, MC34903CP3EK is RoHS compliant and AEC-Q100 qualified for automotive Grade 1 (-40C to +125C). Halogen-free status was not present in the verified web data.
