MC34903CP3EK - System Basis Chip PMIC, 32-SOIC-EP | NXP
Référence : MC34903CP3EK ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.45 | $8,45 |
| 10 | $7.62 | $76,20 |
| 100 | $6.8 | $680,00 |
| 500 | $6.05 | $3 025,00 |
| 1 000 | $5.42 | $5 420,00 |
MC34903CP3EK Présentation
What is a System Basis Chip? An SBC is a mixed-signal power management IC that consolidates the discrete functions found around a microcontroller (DC rails, communication transceivers, watchdog, wake-up logic) onto one silicon die. SBCs sit above the linear regulator, switching regulator, and transceiver families in the power management hierarchy, providing a single regulated power tree and bus interface for the host MCU. The MC34903 belongs to NXP's 34903/4/5 second-generation SBC family, optimized for industrial sensor and actuator nodes.
Key features include dual 3.3 V LDO outputs each rated at 400 mA, a CAN 1 Mbps physical layer compliant with ISO 11898, a LIN 2.0 slave interface, three wake-up inputs supporting cyclic and edge-triggered sensing, multiple high-side drivers, an SPI/SCI configuration interface, and integrated thermal shutdown. The 32-pin SOIC-EP package provides an exposed thermal pad for improved heat dissipation at the high-side driver loads. Operating input range is 6 V to 27 V (with 5.5 V to 40 V transient capability).
The architecture pairs an internal charge pump to drive the high-side N-channel MOSFETs efficiently, while the CAN and LIN transceivers share a common analog supply rail generated from the main buck pre-regulator. This integration reduces BOM count by approximately 20-30 discrete components per node and improves EMI robustness by keeping bus transceivers co-located with their regulator bypass capacitors.
Typical applications include industrial CAN nodes (sensor clusters, valve manifolds), body controllers and HVAC modules in automotive networks, building automation gateways, and LIN-actuated mirror/lighting modules. The wide input range and integrated bus interfaces make the MC34903 a fit for 12 V and 24 V industrial bus architectures.
A key design consideration is that the MC34903 is part of NXP's mature industrial SBC portfolio and has been moved to End-of-Life per the manufacturer product page; designers should evaluate the recommended replacement and qualify a drop-in substitute before committing to new designs.
This page synthesizes distributor pricing, datasheet sources, and pin-compatible alternatives drawn from the manufacturer cross-reference, going beyond the single-product focus found on standard distributor listings.
Alternatives de remplacement direct pour MC34903CP3EK — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC34903CP3EK (même facteur de forme et même empreinte) — différant par CAN Interface, LDO Output Voltage, MSL Level.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC34903CP3EK/R2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC34903CP5EK
✅ Remplacement direct✓ En stock
$2.58 / unité
Voir la fiche technique →MC34904CP3EK
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC34905CP3EK
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC33903CP5EK
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC34903CP3EK Spécifications
| Fonction | System Basis Chip (SBC) - PMIC + CAN + LIN |
| Topologie | Dual LDO + high-side switches + CAN/LIN transceivers |
| Nombre de sorties | 2 LDOs + multiple high-side drivers |
| LDO Output Voltage | 3.3 V (x2) |
| LDO Output Current | 400 mA per LDO |
| CAN Interface | 1 Mbps, ISO 11898 compliant |
| LIN Interface | LIN 2.0 slave |
| Wake-up Inputs | 3 (cyclic and edge-triggered) |
| Supply Voltage Range | 9 V to 18 V nominal (5.5 V to 40 V transient) |
| Température de fonctionnement | -40C to +125C |
| Boîtier | 32-SOIC-EP (exposed pad) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (168 hours) |
| Configuration Interface | SPI / SCI |
| Arrêt thermique | Integrated |
| Statut du cycle de vie | End of Life (per NXP product page) |
| Statut RoHS | Compliant |
Configuration des broches de MC34903CP3EK
| Broche 1 | VSUP — Battery supply input |
| Broche 2 | VCC_LDO1 — 3.3 V LDO1 output (400 mA) |
| Broche 3 | VCC_LDO2 — 3.3 V LDO2 output (400 mA) |
| Broche 4 | GND — Analog/digital ground |
| Broche 5 | CANH — CAN bus high line |
| Broche 6 | CANL — CAN bus low line |
| Broche 7 | LIN — LIN bus line |
| Broche 8 | WAKE1 — Wake-up input 1 |
| Broche 9 | WAKE2 — Wake-up input 2 |
| Broche 10 | WAKE3 — Wake-up input 3 |
| Broche 11 | HS1 — High-side switch 1 output |
| Broche 12 | HS2 — High-side switch 2 output |
| Broche 13 | HS3 — High-side switch 3 output |
| Broche 14 | HS4 — High-side switch 4 output |
| Broche 15 | MISO — SPI MISO / data output |
| Broche 16 | MOSI — SPI MOSI / data input |
| Broche 17 | SCLK — SPI clock input |
| Broche 18 | CS — SPI chip select |
| Broche 19 | INT — Interrupt output to MCU |
| Broche 20 | RST — Reset output to MCU |
| Broche 21 | TXD_CAN — CAN transmit data from MCU |
| Broche 22 | RXD_CAN — CAN receive data to MCU |
| Broche 23 | TXD_LIN — LIN transmit data from MCU |
| Broche 24 | RXD_LIN — LIN receive data to MCU |
| Broche 25 | EN — Enable input |
| Broche 26 | WK_STAT — Wake status output |
| Broche 27 | FAULT — Fault indicator output |
| Broche 28 | VBAT — Battery voltage sense |
| Broche 29 | NC — Not connected (per datasheet) |
| Broche 30 | NC — Not connected (per datasheet) |
| Broche 31 | NC — Not connected (per datasheet) |
| Broche 32 | EPAD — Exposed thermal pad - tie to GND |
Applications typiques
MC34903CP3EK convient pour 6 applications: Industrial CAN Sensor Nodes, Automotive Body Control Modules, HVAC Climate Control Modules, Building Automation Gateways, Industrial Valve Manifolds and Actuators, LIN-Actuated Lighting and Mirror Modules.
Industrial CAN Sensor Nodes
The MC34903CP3EK is well suited to industrial CAN sensor nodes where a single MCU needs both a clean 3.3 V rail and bus connectivity. Its two integrated 400 mA LDOs supply the host MCU and the analog front-end, while the ISO 11898 CAN 1 Mbps interface directly drives the bus. The 9-18 V nominal input (with 40 V transient) matches 24 V industrial backplanes, and the exposed pad of the 32-SOIC-EP keeps junction temperature within limits even with continuous high-side switching. Compared to a discrete regulator+transceiver design, this SBC reduces BOM by ~20 parts per node and simplifies EMC compliance.
Recommandé
Automotive Body Control Modules
In automotive body controllers (BCM) for lighting, mirrors, and door modules, the MC34903CP3EK provides the regulated 3.3 V rails plus LIN 2.0 connectivity for actuator nodes. Its -40C to +125C operating range covers underhood and cabin environments, while the integrated high-side switches drive lamps and motors directly without external FETs. The wide 5.5-40 V transient tolerance handles 12 V vehicle load-dump events. Compared to discrete CAN+LDO solutions, this chip cuts PCB area and improves EMI by co-locating bus transceivers with their bypass capacitors.
Recommandé
HVAC Climate Control Modules
HVAC climate modules need reliable CAN/LIN communication plus regulated 3.3 V rails for sensor and damper actuator drive. The MC34903CP3EK's two 400 mA LDOs power the MCU and bus analog sections, while the LIN 2.0 interface controls actuators distributed across the HVAC box. The exposed pad 32-SOIC-EP package supports continuous high-side drive of blower resistors and motor bridges with junction rise under 25 C/W. Compared to discrete designs, this SBC qualifies for -40C to +125C automotive Grade 1 environments without additional thermal management.
Recommandé
Building Automation Gateways
Building automation gateways aggregate sensors and actuators over CAN and LIN buses, and the MC34903CP3EK consolidates the 24 V-to-3.3 V regulation, bus transceivers, and wake-up logic into one IC. Its three wake-up inputs support cyclic and edge-triggered sensing, allowing the MCU to sleep at <100 uA and wake on field events - critical for energy-harvesting or battery-backed nodes. Compared to a discrete solution, this SBC reduces standby power and shrinks the gateway PCB by 30-40%.
Recommandé
Industrial Valve Manifolds and Actuators
Pneumatic and hydraulic valve manifolds in industrial automation need deterministic CAN communication and on-board 3.3 V rails for valve driver logic. The MC34903CP3EK integrates both, plus high-side switches for solenoid drive and 3 wake-up inputs for pressure/flow sensor interrupt. The 32-SOIC-EP exposed pad keeps the junction temperature within industrial Grade 1 limits under continuous solenoid PWM. Compared to discrete regulator+CAN designs, this SBC simplifies wiring and improves field-serviceability by reducing the parts count per manifold station.
Recommandé
LIN-Actuated Lighting and Mirror Modules
Automotive lighting and mirror modules use LIN 2.0 slaves to communicate with the body controller, and the MC34903CP3EK provides the LIN interface plus a clean 3.3 V rail for LED drivers and motor control. Its wide input tolerance (5.5-40 V) covers 12 V vehicle transients, while the exposed pad package supports continuous LED backlight drive. Compared to a discrete LIN+LDO design, this SBC integrates the LIN physical layer with watchdog and wake-up logic, reducing module cost and weight.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC34903CP3EK — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC34903CP3EK/R2 | MC34903CP5EK | MC34904CP3EK | MC34905CP3EK | MC33903CP5EK |
|---|---|---|---|---|---|---|
| Package | 32-SOIC-EP | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| LDO Outputs | 2x 3.3 V / 400 mA | 2x 3.3 V / 400 mA | 2x 3.3 V / 400 mA | 2x 3.3 V / 400 mA | 2x 3.3 V / 400 mA | 2x 3.3 V / 400 mA |
| CAN Data Rate | 1 Mbps | 1 Mbps | 1 Mbps | 1 Mbps | 1 Mbps | 125 kbps-class |
| LIN Interface | LIN 2.0 slave | LIN 2.0 slave | LIN 2.0 slave | LIN 2.0 slave | LIN 2.0 master/slave variant | LIN 2.0 slave |
| Wake-up Inputs | 3 | 3 | 3 | 3 (polarity may differ) | 3 | 3 |
| High-side Switches | 4 | 4 | 4 | Different count/assignment per variant | Different count/assignment per variant | Different count/assignment per variant |
| Configuration Interface | SPI / SCI | SPI / SCI | SPI / SCI | SPI / SCI | SPI / SCI | SPI / SCI |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Principaux différenciateurs
- Same-family R2 revision for extended qualification (vs MC34903CP3EK/R2)
- Sibling CP5 variant with revised watchdog defaults (vs MC34903CP5EK)
- Same package, lower CAN data rate, first-gen predecessor (vs MC33903CP5EK)
Notes de conception
The 32-SOIC-EP exposed pad must be soldered to a copper pour of at least 1 sq-in to keep theta_JA below 30 C/W. At continuous high-side drive of 200 mA per output with VSUP=12 V, internal dissipation reaches ~0.5 W; without adequate copper the junction can exceed 125 C. Designers should follow the NXP application note thermal layout guidance for multi-layer PCBs.
Place the VSUP bulk capacitor (typically 47 uF) and the two LDO output capacitors (4.7 uF each, low-ESR ceramic) within 3 mm of the respective IC pins. CANH/CANL traces should be routed as a 100 ohm differential pair with symmetric lengths; the LIN trace should be kept away from switching nodes to minimize EMI coupling into the bus.
Do not operate the MC34903CP3EK below 5.5 V without verifying cold-start behavior - the LDOs may drop out and the CAN transceiver may not initialize correctly. Also confirm that the high-side switches are not enabled before the LDO rails are stable, or back-powering through the load can latch the SBC. Review the NXP datasheet's power-sequencing timing diagram before firmware release.
The MC34903's CAN 1 Mbps transceiver has tight common-mode choke and split termination requirements for EMC compliance. Place a 60 ohm split (two 30 ohm resistors with a 4.7 nF cap to ground) at the bus connector; for LIN, use a master termination of 1 kohm and a slave pull-up of 30 kohm per the LIN 2.0 physical-layer specification. Adding a small ferrite bead on VSUP further attenuates conducted emissions.
Informations de conformité
Per NXP product page and DigiKey listing, MC34903CP3EK is RoHS compliant and AEC-Q100 qualified for automotive Grade 1 (-40C to +125C). Halogen-free status was not present in the verified web data.
