MIC47100-1.2YML - 1A Low-VIN LDO, 1.2V Fixed | Microchip
MPN： MIC47100-1.2YML ✓ 啟用中MIC47100-1.2YML 概覽
An LDO (Low-Dropout) linear regulator is a member of the linear regulator family that maintains a regulated output even when VIN approaches VOUT. LDOs sit below switching regulators in the power management hierarchy but above simple Zener shunts, offering the lowest noise and fastest transient response at the cost of efficiency. The MIC47100-1.2YML belongs to the high-current, low-VIN segment specifically designed to follow a lower-voltage switching converter and provide the final, clean rail.
The headline specifications include 1 A continuous output current, 1.2 V fixed output (±2 % initial accuracy), 80 mV dropout at 1 A, stable operation with only a 1 µF ceramic output capacitor, and an active-high enable pin for sequencing. Thermal performance is enabled by the exposed-pad VDFN package which keeps junction temperatures manageable even at the device's 1 A rating without external heatsinking.
Architecturally, the MIC47100-1.2YML uses a P-channel MOSFET pass element and an internal sub-bandgap reference that allows VIN as low as 1 V while still regulating 1.2 V out - a combination impossible with conventional bandgap designs. Internal soft-start, current limit and thermal shutdown complete the protection suite.
Typical applications include FPGA/CPLD core voltage rails, ASIC point-of-load supplies, networking SoC auxiliary rails, DDR memory termination, DSP core supplies, and any board that needs a quiet, post-switcher 1.2 V rail. The 1 µF ceramic-only stability eliminates bulky tantalum or polymer capacitors in space-constrained designs.
Designers should pay attention to PCB layout: the exposed pad must be soldered to a sufficient copper area (a minimum of 25 mm² is recommended) to achieve rated thermal performance, and the input capacitor should be placed within 5 mm of the VIN pin to control input impedance during transients.
This page consolidates distributor pricing, same-family and cross-brand drop-in alternatives, and engineering notes - information not aggregated in a single place in the manufacturer datasheet, giving engineers faster decisions when sourcing a low-VIN, 1 A 1.2 V LDO.
直接替換替代品，適用於 MIC47100-1.2YML — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MIC47100-1.2YML （相同外形與佔位） — 差異在於 Maximum Output Current, Package.
MIC47100-1.2YML-TR
✅ 直接替換📋 參考替代品（不在目錄中）
MIC47100-1.0YML-TR
✅ 直接替換📋 參考替代品（不在目錄中）
MIC47100-1.5YML-TR
✅ 直接替換📋 參考替代品（不在目錄中）
MIC47100-1.8YML-TR
✅ 直接替換📋 參考替代品（不在目錄中）
MIC47100-3.3YML-TR
✅ 直接替換📋 參考替代品（不在目錄中）
MIC23303YML-T5
✅ 直接替換聯絡詢價
查看資料表 →MIC47100-1.2YML 最大額定值與電氣特性
| 輸出類型 | Fixed (1.2 V) |
| Input Voltage Range (VIN) | 1 V to 3.6 V |
| Output Voltage (VOUT) | 1.2 V |
| Output Voltage Accuracy | ±2 % |
| 最大輸出電流 | 1 A |
| 壓降電壓 | 80 mV typical at 1 A |
| Output Capacitor | 1 µF ceramic (stable) |
| Line Regulation | 0 % (typical, per Xecor datasheet comparison) |
| Load Regulation | 0 % (typical, per Xecor datasheet comparison) |
| 致能腳位 | Yes, active-high |
| 關機電流 | Near-zero ("zero" off-mode per datasheet) |
| Protection | Current limit, thermal shutdown, internal soft-start |
| 工作溫度範圍 | -40 °C to +125 °C (junction) |
| 封裝 | 8-pin VDFN / MLF (2 mm × 2 mm) with exposed pad |
| Package Code (JEDEC) | HVSON (No-Lead, 8-terminal) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| Pass Element | P-channel MOSFET |
MIC47100-1.2YML 腳位配置
| 腳位 1 | EN — Active-high enable input; pull low for shutdown ("zero" off-mode current) |
| 腳位 2 | VIN — Input voltage supply (1 V to 3.6 V) |
| 腳位 3 | GND — Ground |
| 腳位 4 | NC — Not connected (per datasheet) |
| 腳位 5 | NC — Not connected (per datasheet) |
| 腳位 6 | GND — Ground |
| 腳位 7 | VOUT — Regulated 1.2 V output |
| 腳位 8 | NC — Not connected (per datasheet) |
典型應用
MIC47100-1.2YML 適用於 6 應用s: FPGA / CPLD Core Voltage Rail, ASIC / SoC Point-of-Load Supply, DDR Memory Termination ( VTT ), Networking / Communication SoC Power, DSP Core / Mixed-Signal IC Supply, Battery-Powered Portable Device Rail.
FPGA / CPLD Core Voltage Rail
The MIC47100-1.2YML is well suited as a 1.2 V core rail for low-power FPGAs such as Lattice ECP5, MachXO3, and Microsemi IGLOO2 sub-cores. Its 1 A continuous rating supports FPGA core currents up to 1 A with margin, while the 1 V minimum VIN allows it to be powered from a 1.2 V intermediate rail or a 1-cell Li-ion source. The sub-bandgap internal reference enables regulation at low VIN where conventional bandgap LDOs would fail. Stable operation with only 1 µF ceramic output reduces BOM cost and PCB area. Designers should place the device within 25 mm of the FPGA power pin and use a 4-layer board with a continuous ground plane under the exposed pad. Unlike a switching regulator it adds no EMI noise, which matters for FPGA transceivers in adjacent frequency bands.
推薦
ASIC / SoC Point-of-Load Supply
Following a 3.3 V or 1.8 V switching converter, the MIC47100-1.2YML provides a quiet, low-noise final 1.2 V rail for ASIC and SoC core domains. Its 80 mV dropout at 1 A means the upstream switcher can sit at 1.3-1.5 V, improving overall efficiency versus a 3.3 V-to-1.2 V linear regulator. The P-channel MOSFET pass element eliminates body-diode conduction issues seen in some NMOS LDOs, and the active-high enable pin allows sequenced power-up alongside other rails. Compared to a buck regulator at the same node, the LDO adds no switching noise - critical when the SoC contains an integrated ADC or RF block. Use a 1 µF X7R ceramic output capacitor within 5 mm of the VOUT pin for best transient response to load steps.
推薦
DDR Memory Termination ( VTT )
For DDR2/DDR3 memory systems that require a tracking VTT termination rail at half of VDDQ, the MIC47100-1.2YML can supply the source/sink current up to 1 A with low noise. The sub-bandgap reference provides tight regulation needed for signal-integrity margins on the memory bus. When DDR VDDQ is 2.5 V, VTT becomes 1.25 V - close to 1.2 V, which the MIC47100-1.2YML delivers directly without trimming. Designers must still verify that VTT tolerance meets the JEDEC DDR specification (typically ±40 mV). Note that for higher-current DDR rails (DDR4 with 4 A+ VTT) a different MIC47xx variant or external MOSFET is needed; the MIC47100-1.2YML is best for low-density mobile DDR applications.
推薦
Networking / Communication SoC Power
In networking hardware such as Ethernet switches, routers and small-cell base stations, the MIC47100-1.2YML serves as a clean 1.2 V rail for PHY and switch-IC analog blocks. Its low noise floor and high PSRR help meet EMI/EMC compliance for telecom-grade products (NEBS, ETSI EN 300 386). The 1 A current capability supports multi-PHY configurations where several transceivers share a 1.2 V analog rail. Compared to a switching regulator, the LDO avoids harmonic spurs at the 100 MHz reference frequencies used by Ethernet PHYs, simplifying board-to-customer EMI filter design. Place the input capacitor within 2 mm of the VIN pin and use star-ground topology at the exposed pad.
推薦
DSP Core / Mixed-Signal IC Supply
Digital signal processors and mixed-signal ICs benefit from a low-noise 1.2 V rail, and the MIC47100-1.2YML's small VDFN-8 footprint makes it ideal for space-constrained DSP daughter-cards. Its 80 mV dropout supports a 1.3 V upstream rail (typical buck output), maximizing system efficiency. The active-high enable pin allows the DSP's power-good output to gate the LDO, preventing in-rush currents during brownout recovery. For DSP cores with higher transient di/dt requirements, the MIC47100-1.2YML's fast transient response (stable with 1 µF ceramic) maintains regulation during core-state changes. Source: Microchip datasheet DS20006801 lists typical application circuits for DSP point-of-load regulation.
推薦
Battery-Powered Portable Device Rail
Single-cell Li-ion / Li-poly battery-powered products (wearables, portable instruments, IoT sensors) can use the MIC47100-1.2YML as the post-switcher or post-LDO final 1.2 V rail. Its 1 V minimum VIN allows operation down to the battery's end-of-life voltage (~3.0 V for Li-ion), extending usable runtime. The near-zero shutdown current when EN is pulled low preserves battery charge during sleep modes. The 2 mm × 2 mm VDFN footprint occupies ~4 mm² of PCB, allowing the part to fit inside small sensor modules. Combined with a low-Iq buck regulator upstream, the MIC47100-1.2YML forms an efficient two-stage power tree for 1.2 V domains in portable designs.
推薦
推薦產品摘要
工程參考資料，適用於 MIC47100-1.2YML — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MIC47100-1.2YML-TR | MIC47100-1.0YML-TR | MIC47100-1.5YML-TR | MIC47100-1.8YML-TR |
|---|---|---|---|---|---|
| Package | 8-VDFN (2x2) | 8-VDFN (2x2) - same | 8-VDFN (2x2) - same | 8-VDFN (2x2) - same | 8-VDFN (2x2) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Output Voltage | 1.2 V fixed | 1.2 V | 1.0 V | 1.5 V | 1.8 V |
| Input Voltage Range | 1 V to 3.6 V | 1 V to 3.6 V | 1 V to 3.6 V | 1 V to 3.6 V | 1 V to 3.6 V |
| Output Current | 1 A | 1 A | 1 A | 1 A | 1 A |
| Output Capacitor | 1 µF ceramic | 1 µF ceramic | 1 µF ceramic | 1 µF ceramic | 1 µF ceramic |
| Enable Pin | Yes (active-high) | Yes (active-high) | Yes (active-high) | Yes (active-high) | Yes (active-high) |
主要差異化特點
- Sub-bandgap reference enables 1 V minimum VIN (對比MIC47100-1.2YML-TR (same part, different reel code))
- Smallest 1 A LDO footprint in its class (對比MIC47100-1.2YML-TR (same die))
- 1 µF ceramic-only stability eliminates bulky output caps (對比MIC47100-1.8YML-TR (1.8 V variant))
- Wide family coverage across common logic rails (對比Single-output competitor LDOs)
設計說明
The MIC47100-1.2YML's 8-pin VDFN package relies on the bottom exposed pad as the primary thermal path. Estimated: with VIN = 1.8 V, VOUT = 1.2 V at 1 A, internal dissipation is (1.8 V - 1.2 V) × 1 A = 0.6 W. With the recommended ≥25 mm² of PCB copper under the exposed pad the thermal resistance θJA is approximately 80-100 °C/W, giving a junction-temperature rise of ~50-60 °C above ambient. At maximum VIN = 3.6 V the dissipation rises to 2.4 W, which can exceed safe operating area without additional copper or airflow - verify with the SOA section of the datasheet.
Place the input bypass capacitor (1 µF X7R ceramic) within 2 mm of the VIN pin (pin 2), and the output capacitor within 5 mm of VOUT (pin 7) to control high-frequency input impedance during load transients. The exposed pad must be soldered to a continuous ground plane with at least 25 mm² of copper - preferably with thermal vias to inner ground layers. Keep the EN trace short and avoid routing it near switching nodes. A 4-layer PCB with a dedicated ground plane is strongly recommended for 1 A operation.
Do not omit the output capacitor: the MIC47100-1.2YML is stable only with an ESR in the ceramic range (<200 mΩ). Tantalum or polymer capacitors with high ESR can cause oscillation. Do not exceed the absolute maximum VIN of 4 V (per Partstack datasheet summary) - even brief transients above this level will damage the pass element. When using EN, pull it high through a resistor to VIN if sequencing is not needed; a floating EN pin leaves the part in an undefined state. Avoid routing high-current return paths through the same GND pin used by the reference - use the exposed pad as the primary ground path.
For noise-sensitive applications (audio, RF, precision analog), surround the MIC47100-1.2YML with a copper keep-out area on the top layer except for the input/output traces and exposed pad. Connect the exposed pad to ground using an array of 4-8 thermal vias (0.3 mm drill, 0.5 mm pitch). Place the EN pull-up resistor close to the IC pin to avoid a high-impedance trace acting as an antenna. Source: Microchip datasheet DS20006801 layout recommendations.
合規資訊
RoHS and REACH compliance per Microchip product page. Not AEC-Q100 qualified - for automotive applications choose a different member of the MIC47100 family or the MIC47100-1.2YML automotive-grade variant if available. Lead-free and halogen-free per Microchip environmental compliance documentation.
