MPC8545PXATGD557 - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP
MPN: MPC8545PXATGD557 ✗ 停產MPC8545PXATGD557 概覽
直接替換替代品,適用於 MPC8545PXATGD557 — 相同封裝,腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
MPC8545PXANGD557
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品(不在目錄中)
MPC8555PXATGD557
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品(不在目錄中)
MPC8545EVTATGD557
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品(不在目錄中)
MPC8545PXATGD557 最大額定值與電氣特性
| Core Architecture | PowerPC e500 |
| Core Count | 1 |
| 資料匯流排寬度 | 32-bit |
| 最大時脈頻率 | 1.2 GHz |
| L1 Cache (Instruction) | 32 KB |
| L1 Cache (Data) | 32 KB |
| L2 Cache | 256 KB unified |
| 工作溫度範圍 | -40C to +105C (extended) |
| Package Type | 783-FCPBGA (29x29 mm) |
| 安裝類型 | Surface Mount |
| Memory Controller | 64-bit DDR / DDR2 |
| Ethernet MACs | 4 x Gigabit (10/100/1000) |
| PCI / PCI-X Controllers | 2 |
| Local Bus Controller | Yes (8/16/32-bit) |
| MSL 等級 | 3 (168 hours) |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
MPC8545PXATGD557 783-fcpbga (29x29 mm) 腳位配置指南
MPC8545PXATGD557(783-fcpbga (29x29 mm) 封裝)的腳位配置。 此數位 IC 包含 GPIO、通訊介面(UART、SPI、I2C)與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料: MPC8545PXATGD557.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC8545PXATGD557 適用於 6 應用s: Enterprise Networking Line Cards, Storage Area Network (SAN) Controllers, Industrial Routers and Gateways, Secure Communications Gateways, Single-Board Computers (SBCs) for Embedded Computing, Wireless Base Station Controllers.
Enterprise Networking Line Cards
The MPC8545PXATGD557's 1.2 GHz e500 core, four integrated tri-speed Gigabit Ethernet MACs, two PCI/PCI-X controllers, and 64-bit DDR controller make it well suited for enterprise routing and switching line cards. The integrated SerDes lanes eliminate external PHYs in many designs, reducing BOM cost. PowerQUICC III is a well-known architecture with mature firmware support in VxWorks and Linux, simplifying carrier-grade deployment.
推薦
Storage Area Network (SAN) Controllers
The MPC8545PXATGD557's PCI-X and local bus interfaces enable high-throughput connectivity to Fibre Channel or SAS controllers in iSCSI and FC-SAN storage designs. The 64-bit DDR controller with ECC support delivers the memory bandwidth required for RAID parity calculations and on-chip DMA engines offload copy operations. PowerQUICC III integration reduces component count for compact RAID controller cards.
推薦
Industrial Routers and Gateways
The MPC8545PXATGD557's extended -40C to +105C operating temperature range makes it suitable for industrial routers deployed in factory floors, outdoor cabinets, and utility substations. Its hardware cryptography engines (in the MPC8545E variant) accelerate IPsec and TLS tunnels, while the dual PCI/PCI-X buses accommodate multiple WAN interface cards. The PowerPC e500 core runs deterministic real-time firmware for SCADA protocols.
推薦
Secure Communications Gateways
For VPN gateways, the MPC8545E variant of the MPC8545PXATGD557 integrates SEC 2.0 and crypto engines that offload AES, 3DES, SHA, and RSA operations. This allows the 1.2 GHz e500 core to focus on packet forwarding while the security block sustains multi-gigabit tunnel throughput. The 783-FCPBGA package fits standard telecom SOM designs.
推薦
Single-Board Computers (SBCs) for Embedded Computing
The MPC8545PXATGD557's rich peripheral integration (Gigabit Ethernet, PCI-X, local bus, DDR controller, I2C, DUART) makes it a complete SoC for VME/CompactPCI single-board computers in defense and aerospace applications. VxWorks and LynxOS BSPs are widely available, and the Book-E architecture provides deterministic interrupt response for safety-critical control loops.
推薦
Wireless Base Station Controllers
The MPC8545PXATGD557's combination of high-throughput DDR memory, fast Ethernet MACs, and PCI-X enables it to function as a baseband controller or base station controller in 3G/4G small cell designs. Its deterministic e500 core executes real-time protocol stacks, while the integrated peripherals streamline the radio card interface. The wide operating temperature range suits outdoor radio units.
推薦
推薦產品摘要
工程參考資料,適用於 MPC8545PXATGD557 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8545PXANGD557 | MPC8555PXATGD557 | MPC8545EVTATGD557 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Core Frequency | 1.2 GHz | 1.0 GHz | 1.2 GHz | 1.2 GHz |
| L2 Cache | 256 KB | 256 KB | 256 KB | 256 KB |
| Security Engine | No (MPC8545) | No | Yes (SEC 2.0) | Yes (SEC 2.0) |
| Ethernet MACs | 4 x Gigabit | 4 x Gigabit | 4 x Gigabit | 4 x Gigabit |
| Lifecycle Status | NRND | NRND | NRND | NRND |
主要差異化特點
- Integrated 4-port Gigabit Ethernet with on-chip SerDes (對比MPC8545PXANGD557 (1.0 GHz variant))
- Higher performance vs MPC8545E cousin (對比MPC8545EVTATGD557)
- PCI-X bus support vs lower-tier alternatives (對比MPC8555PXATGD557)
設計說明
The 783-FCPBGA package uses a 1.06 mm ball pitch, which requires a multi-layer PCB with laser-drilled microvias or stacked-via technology for the breakout layer. Recommended stack-up: 8+ layers with dedicated ground/power planes under the BGA. Use HDI design rules (line/space 4 mil/4 mil minimum) and ensure the BGA breakout fan-out is symmetrical on all four sides. Refer to NXP AN-2800 for FCPBGA layout guidelines.
The MPC8545PXATGD557 can dissipate 8-12 W at 1.2 GHz under typical networking workloads. A thermal pad or heat spreader must be attached to the top of the package using a thermal interface material (TIM). For conduction-cooled applications (VME/CompactPCI), a thermal pad on the lid with a minimum 2 C/W interface is required. Air-cooled designs should provide 200 LFM airflow across the heatsink.
Do not assume the security engine is present in all MPC8545 variants - the standard MPC8545 lacks SEC 2.0. If your firmware uses crypto acceleration, verify the silicon revision (MPC8545E = with SEC; MPC8545 = without). Also confirm the DDR memory topology: the MPC8545 supports only DDR/DDR2, not DDR3. Mixing DIMM types will damage the controller.
Design the core voltage rail (Vdd) at 1.1 V typical with +/-5% tolerance and a peak current capability of 4-5 A during core bursts. Use a multi-phase PWM controller with output inductors rated for at least 6 A saturation. Place decoupling capacitors within 2 mm of every Vdd/Vss pair, with a mix of 0.1 uF, 1 uF, and 10 uF bulk caps.
The DDR2 controller supports up to 533 MHz with 64-bit data plus ECC. Match trace lengths to within +/-25 mils for the data/strobe groups and use matched-impedance routing (50 ohm single-ended, 100 ohm differential for strobes). Place the DDR termination resistors as close as possible to the DRAM to prevent signal reflections.
合規資訊
RoHS and lead-free compliant per NXP product page. Not AEC-Q100 qualified (industrial/commercial part). Halogen-free status not explicitly stated in the verified data; consult NXP for confirmation.