MPC862PZQ66B - 66MHz PowerQUICC MPU, 357-PBGA | NXP Semiconductors
MPN： MPC862PZQ66B ✗ 停產MPC862PZQ66B 概覽
A PowerQUICC (a portmanteau of PowerPC plus QUICC, where QUICC stands for Quad Integrated Communications Controller) is a category of embedded PowerPC microprocessors that pair a general-purpose CPU with a dedicated RISC-based communications processor. This dual-processor architecture offloads serial protocol handling (Ethernet, HDLC, ATM, UART, I2C, SPI) from the main CPU, enabling wire-speed data plane performance without over-provisioning the host core. Within the power management hierarchy, the MPU sits above voltage regulators and below the system-level integration logic.
Key specifications include a 66 MHz maximum core frequency, 3.3 V typical I/O supply voltage, a 32-bit data path, and packaging compatible with industrial-grade operating ranges. The device is supplied in tray form, ships in a 357-ball PBGA (25 x 25 mm) footprint, and is qualified to NXP's standard product specifications for embedded networking applications.
Architecturally, the MPC862PZQ66B couples a PowerPC core with the CPM, a separate RISC engine for serial channel management. This split allows the host CPU to run control-plane stacks while the CPM executes bit-level protocol work, achieving wire-rate multi-channel performance that single-core MPUs cannot match at the same clock. Memory interfaces support DRAM, SRAM, and Flash via a 32-bit system bus.
Typical applications include ISDN terminal adapters, DSL access multiplexers, router control planes, industrial protocol bridges, and legacy telecom line cards. The integrated CPM makes it especially well-suited to multi-protocol serial aggregation where a smaller MCU plus discrete PHY would otherwise require additional glue logic.
When designing with this device, allocate adequate PCB area for the 357-ball PBGA - the 1.27 mm (or finer) pitch requires 4-layer or higher stack-ups with microvia capability. Decouple the 3.3 V core/IO rails with bulk plus high-frequency ceramics within 5 mm of the ball array, and follow NXP's routing rules for the system bus to avoid signal-integrity violations on parallel memory interfaces.
This page synthesizes distributor pricing, drop-in alternatives from the same MPC8xx family, and practical design notes not consolidated in the manufacturer datasheet.
直接替換替代品，適用於 MPC862PZQ66B — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC862PZQ66B （相同外形與佔位） — 差異在於 Package / Case, Core Architecture, RoHS Status, Operating Temperature, Processor Type.
MPC860DPZQ66D4
✅ 直接替換聯絡詢價
查看資料表 →MPC860TZQ66D4
✅ 直接替換聯絡詢價
查看資料表 →MPC860TCZQ66D4
✅ 直接替換📋 參考替代品（不在目錄中）
MPC860TVR50D4
✅ 直接替換聯絡詢價
查看資料表 →MPC866PCVR100A
✅ 直接替換📋 參考替代品（不在目錄中）
MPC862PZQ66B 最大額定值與電氣特性
| Manufacturer | NXP Semiconductors |
| Processor Type | MPC8xx PowerQUICC 32-Bit MPU |
| Number of Cores | 1 |
| Core Architecture | PowerPC + CPM (QUICC) |
| 資料匯流排寬度 | 32-bit |
| Maximum Clock Speed | 66 MHz |
| 工作電源電壓 | 3.3 V |
| 封裝 / 外殼 | 357-BBGA (PBGA, 25 x 25 mm) |
| 安裝類型 | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| RoHS 狀態 | Non-compliant per third-party listing (Contains Pb) |
| Terminal Form | Ball |
| Number of Terminals | 357 |
| Package Code | BGA (PBGA) |
| Series | MPC8xx PowerQUICC |
| Temperature Grade | Other (per data sheet) |
MPC862PZQ66B 腳位配置
| 腳位 A1 | BALL-A1 — Per datasheet ball-map; assigned function (power, GND, address, data, control, or I/O) varies by coordinate - consult manufacturer datasheet |
| 腳位 B5 | BALL-B5 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet |
| 腳位 C10 | BALL-C10 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet |
| 腳位 D14 | BALL-D14 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet |
| 腳位 G18 | BALL-G18 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet |
| 腳位 K20 | BALL-K20 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet |
| 腳位 M23 | BALL-M23 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet |
| 腳位 P25 | BALL-P25 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet |
| 腳位 AA19 | BALL-AA19 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet |
| 腳位 AD15 | BALL-AD15 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet |
| 腳位 AF10 | BALL-AF10 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet |
| 腳位 AJ4 | BALL-AJ4 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet |
典型應用
MPC862PZQ66B 適用於 6 應用s: ISDN Terminal Adapters, DSL Access Multiplexers (DSLAMs), Industrial Protocol Bridges, Legacy Router Control Plane, Telecom Line Card Aggregation, Embedded Networking Reference Platform.
ISDN Terminal Adapters
The MPC862PZQ66B's integrated CPM handles up to four HDLC channels simultaneously, which is exactly what an ISDN terminal adapter needs to terminate the BRI signaling and bridge it to Ethernet. Operating at 66 MHz with 32-bit PowerPC performance, the host CPU runs the management and configuration stack while the CPM offloads bit-level framing, freeing the main core for protocol translation. The 357-PBGA package dissipates roughly 3 to 4 W at full CPM activity, which is manageable on a 4-layer PCB with thermal vias. Compared to a discrete MCU plus external UART, the integrated CPM reduces BOM cost by 20 to 30 percent in ISDN bridge designs.
推薦
DSL Access Multiplexers (DSLAMs)
In DSLAM line cards, the MPC862PZQ66B aggregates ATM and HDLC traffic from many DSL ports and forwards it to an uplink. Its CPM can manage multiple serial channels per device, allowing a single MPC862 to terminate dozens of subscriber lines while the PowerPC core runs the bridging table and the ATM SAR. The 66 MHz host clock is sufficient for control-plane tasks; wire-speed data never touches the host CPU. Replacing MPC862 with the MPC866PCVR100A doubles throughput for next-generation VDSL deployments without a PCB change because both share the 357-PBGA (25x25) footprint.
推薦
Industrial Protocol Bridges
Industrial protocol bridges (Modbus, Profibus, serial-to-Ethernet gateways) benefit from the MPC862PZQ66B's multi-protocol CPM, which supports UART, SPI, and HDLC on the same chip. At 66 MHz the PowerPC core easily handles the bridge's TCP/IP stack while the CPM services the fieldbus side. The 3.3 V supply matches typical industrial backplane rails, and the 357-PBGA gives enough I/O for eight or more serial ports via external transceivers. For long-life industrial deployments, designers should verify lead-free status with the manufacturer because the MPC862 part numbers in this generation are typically non-RoHS.
推薦
Legacy Router Control Plane
The MPC862PZQ66B was a popular control-plane processor in enterprise routers of the early 2000s, and many of those routers are still in service today. Its 32-bit PowerPC core runs routing daemons and SNMP while the CPM handles T1/E1 and Ethernet MAC interfaces. The 357-PBGA package fits in the standard router mainboard footprint, so field replacements can use a stock part without mechanical rework. The obsolete lifecycle status is acceptable for maintaining legacy systems but indicates a migration to QorIQ-class processors is needed for new designs.
推薦
Telecom Line Card Aggregation
Legacy telecom line cards aggregate multiple T1, E1, or V.35 channels into a single backplane interface, and the MPC862PZQ66B's CPM is purpose-built for exactly that fan-in task. Each of its serial channels can run independently at different protocols, so one MPC862 replaces what would otherwise be four or five discrete UARTs or HDLC controllers. At 66 MHz the host CPU has plenty of headroom for channelized diagnostics, and the 32-bit system bus sustains backplane throughput without stalls. Power consumption stays in the 3 to 5 W range under full load with all CPM channels active.
推薦
Embedded Networking Reference Platform
Engineers building new embedded networking reference platforms historically used the MPC862PZQ66B as a stepping stone between smaller 8-bit microcontrollers and full PowerPC system-on-chips. The integrated CPM provides a complete multi-protocol serial stack with deterministic latency, while the host CPU exposes a familiar 32-bit programming model. The 357-PBGA package has well-documented layout examples in NXP application notes, simplifying the PCB bring-up. Modern reference platforms should evaluate the QorIQ P1010 as a RoHS-compliant replacement with similar CPM-like offload and better toolchain support.
推薦
推薦產品摘要
工程參考資料，適用於 MPC862PZQ66B — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC860DPZQ66D4 | MPC860TZQ66D4 | MPC860TCZQ66D4 | MPC860TVR50D4 | MPC866PCVR100A |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Maximum Clock Speed | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 50 MHz (-24%) | 100 MHz (+52%) |
| Core Family | MPC862 PowerQUICC | MPC860 PowerQUICC | MPC860 PowerQUICC | MPC860 PowerQUICC | MPC860 PowerQUICC | MPC866 PowerQUICC |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Operating Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Number of Balls | 357 | 357 | 357 | 357 | 357 | 357 |
| Lead Free Status | Contains Lead (non-RoHS) | Contains Lead (non-RoHS) | Contains Lead (non-RoHS) | Contains Lead (non-RoHS) | Contains Lead (non-RoHS) | Contains Lead (non-RoHS) |
| CPM Channel Count | Higher (MPC862 expanded) | MPC860 standard | MPC860 reduced | MPC860 standard | MPC860 standard | MPC866 expanded + Ethernet MACs |
主要差異化特點
- Higher CPM channel count than MPC860 family (對比MPC860DPZQ66D4)
- Mature 66 MHz industrial footprint (對比MPC866PCVR100A)
- Long-standing distribution stock (對比MPC860TVR50D4)
設計說明
Estimated: at 66 MHz with all CPM channels active the MPC862PZQ66B typically dissipates 3 to 5 W. For a 357-PBGA (25x25) thermal pad design, follow NXP application note AN2126 - use a 50 x 50 mm copper pad on the top layer stitched to inner ground planes with a 1.2 mm via array on a 1.5 mm pitch to keep the junction under 100 C at 25 C ambient. Without thermal vias, expect a 30 to 40 C junction temperature rise.
The 357-ball PBGA (25x25) requires a 4-layer or higher PCB stack-up with 0.8 mm pitch or finer via structures. Use a high-performance PCB house that supports laser-drilled microvias (typical 0.1 mm finished hole) and ENIG or immersion-silver pad finish for the BGA land pattern. Keep the breakout fanout on the top layer only and route differential pairs (Ethernet RMII/MII, TDM) with 100 ohm differential impedance per NXP MPC8xx hardware-design notes.
Estimated: common pitfalls include (1) leaving the CPM interrupt vector registers in default state after boot - failure to remap the CPM interrupt to the correct priority causes silent packet loss; (2) using 3.3 V tolerant SDRAM without series resistors - ringing on the system bus can exceed the 3.3 V absolute-max; (3) ignoring the JTAG boundary-scan requirement on board bring-up - the MPC862 will not enumerate internal buses unless JTAG is properly terminated. Also verify the boot-strap configuration pins before each board revision; incorrect HRESET pull-ups are the most common field failure.
合規資訊
Listed by DigChip as 'Contains Lead / RoHS non-compliant'; REACH and conflict-mineral data not provided in verified web data and marked unknown. AEC-Q100 not applicable - this is an industrial/networking MPU, not an automotive-grade part.
