NXP Semiconductors

MPC862PZQ66B - 66MHz PowerQUICC MPU, 357-PBGA | NXP Semiconductors

부품 번호: MPC862PZQ66B ✗ 단종
재고 있음 영업일 기준 1~3일 내 발송
3.3 V Vdss 357-BBGA (PBGA, 25 x 25 mm) Package 66 MHz Speed
시작가 $62.1 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-16
볼륨 가격
수량 단가 합계
1 $108.23 $108.23
10 $96.5 $965.00
100 $84.2 $8,420.00
500 $72.4 $36,200.00
1,000 $62.1 $62,100.00
ℹ️ 모든 가격은 USD 기준입니다

MPC862PZQ66B 개요

The NXP Semiconductors MPC862PZQ66B is a 32-bit PowerQUICC microprocessor IC from the MPC8xx family, operating at a 66 MHz core clock speed and housed in a 357-ball Plastic Ball Grid Array (PBGA) measuring 25 x 25 mm. It integrates a single MPC8xx core with on-chip peripherals including a communications processor module (CPM), system integration functions, and memory controllers, all targeted at networking and telecom equipment that require deterministic multi-protocol serial handling on a single chip.

A PowerQUICC (a portmanteau of PowerPC plus QUICC, where QUICC stands for Quad Integrated Communications Controller) is a category of embedded PowerPC microprocessors that pair a general-purpose CPU with a dedicated RISC-based communications processor. This dual-processor architecture offloads serial protocol handling (Ethernet, HDLC, ATM, UART, I2C, SPI) from the main CPU, enabling wire-speed data plane performance without over-provisioning the host core. Within the power management hierarchy, the MPU sits above voltage regulators and below the system-level integration logic.

Key specifications include a 66 MHz maximum core frequency, 3.3 V typical I/O supply voltage, a 32-bit data path, and packaging compatible with industrial-grade operating ranges. The device is supplied in tray form, ships in a 357-ball PBGA (25 x 25 mm) footprint, and is qualified to NXP's standard product specifications for embedded networking applications.

Architecturally, the MPC862PZQ66B couples a PowerPC core with the CPM, a separate RISC engine for serial channel management. This split allows the host CPU to run control-plane stacks while the CPM executes bit-level protocol work, achieving wire-rate multi-channel performance that single-core MPUs cannot match at the same clock. Memory interfaces support DRAM, SRAM, and Flash via a 32-bit system bus.

Typical applications include ISDN terminal adapters, DSL access multiplexers, router control planes, industrial protocol bridges, and legacy telecom line cards. The integrated CPM makes it especially well-suited to multi-protocol serial aggregation where a smaller MCU plus discrete PHY would otherwise require additional glue logic.

When designing with this device, allocate adequate PCB area for the 357-ball PBGA - the 1.27 mm (or finer) pitch requires 4-layer or higher stack-ups with microvia capability. Decouple the 3.3 V core/IO rails with bulk plus high-frequency ceramics within 5 mm of the ball array, and follow NXP's routing rules for the system bus to avoid signal-integrity violations on parallel memory interfaces.

This page synthesizes distributor pricing, drop-in alternatives from the same MPC8xx family, and practical design notes not consolidated in the manufacturer datasheet.

드롭인 대체품: MPC862PZQ66B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: MPC862PZQ66B (동일 폼 팩터 및 풋프린트) — 차이점: Package / Case, Core Architecture, RoHS Status, Operating Temperature, Processor Type.

NXP Semiconductors
Package / Case: 357-Ball PBGA, 25 x 25 mm
RoHS Status: Non-RoHS (legacy BGA, contains lead)
Operating Temperature: 0C to +70C (commercial grade)
비교 대상: MPC862PZQ66B →
NXP Semiconductors
Package / Case: 357-PBGA (25x25 mm)
Core Architecture: PowerPC 32-bit
비교 대상: MPC862PZQ66B →
NXP Semiconductors
Package / Case: 357-PBGA (25x25 mm)
Core Architecture: PowerPC, 32-bit
RoHS Status: RoHS non-compliant (Contains Lead)
비교 대상: MPC862PZQ66B →
NXP Semiconductors
Package / Case: 357-BBGA (PBGA 25x25 mm)
Core Architecture: Power Architecture (MPC8xx family)
RoHS Status: Non-RoHS (legacy PowerQUICC)
비교 대상: MPC862PZQ66B →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MPC860DPZQ66D4

✅ 드롭인
NXP Semiconductors
📦 357-PBGA (25x25)
MPC8xx PowerQUICC 32-Bit RISC MPU · 1 Core, 32-Bit PowerPC · 66 MHz · 3.3 V · 4 Kbyte · 4 Kbyte · Communications Processor Module (CPM)

✓ 재고 있음

$25.28 / 개

데이터시트 보기 →

MPC860TZQ66D4

✅ 드롭인
NXP Semiconductors
📦 357-PBGA (25x25)
NXP Semiconductors · MPC8xx PowerQUICC · PowerPC, 32-bit · 1 · 66 MHz · 3.3 V · 357-PBGA (25x25 mm) · Tray

✓ 재고 있음

$81.28 / 개

데이터시트 보기 →

MPC860TCZQ66D4

✅ 드롭인
📦 357-PBGA (25x25)
MPC860 family, same 357-PBGA (25x25) and 66 MHz; commercial temperature grade variant

📋 참조 대체품 (카탈로그에 없음)

MPC860TVR50D4

✅ 드롭인
NXP Semiconductors
📦 357-PBGA (25x25)
PowerPC 32-bit · 1 · 50 MHz · 3.3 V · 3.3 V · 357-PBGA (25x25 mm) · 0.32 µm CMOS · 4 Kbyte

✓ 재고 있음

$58 / 개

데이터시트 보기 →

MPC866PCVR100A

✅ 드롭인
📦 357-PBGA (25x25)
MPC866 family, same 357-PBGA (25x25); 100 MHz (+52%) for higher throughput; CPM register revisions differ

📋 참조 대체품 (카탈로그에 없음)

MPC862PZQ66B 최대 정격 & 전기적 특성

Manufacturer NXP Semiconductors
Processor Type MPC8xx PowerQUICC 32-Bit MPU
Number of Cores 1
Core Architecture PowerPC + CPM (QUICC)
데이터 버스 폭 32-bit
Maximum Clock Speed 66 MHz
동작 공급 전압 3.3 V
패키지 / 케이스 357-BBGA (PBGA, 25 x 25 mm)
실장 유형 Surface Mount
Packaging Tray
Lead Free Status Contains Lead
RoHS 상태 Non-compliant per third-party listing (Contains Pb)
Terminal Form Ball
Number of Terminals 357
Package Code BGA (PBGA)
Series MPC8xx PowerQUICC
Temperature Grade Other (per data sheet)

MPC862PZQ66B 핀 구성

BGA-400 Package Pinout Diagram BGA-400 21x21mm, 20x20, P0.8mm, JEDEC MO-192. A1 BGA-400 20x20 grid
핀 A1 BALL-A1 — Per datasheet ball-map; assigned function (power, GND, address, data, control, or I/O) varies by coordinate - consult manufacturer datasheet
핀 B5 BALL-B5 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet
핀 C10 BALL-C10 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet
핀 D14 BALL-D14 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet
핀 G18 BALL-G18 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet
핀 K20 BALL-K20 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet
핀 M23 BALL-M23 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet
핀 P25 BALL-P25 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet
핀 AA19 BALL-AA19 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet
핀 AD15 BALL-AD15 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet
핀 AF10 BALL-AF10 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet
핀 AJ4 BALL-AJ4 — Per datasheet ball-map; assigned function varies - consult manufacturer datasheet

일반적인 애플리케이션

MPC862PZQ66B 적합 용도: 6 애플리케이션s: ISDN Terminal Adapters, DSL Access Multiplexers (DSLAMs), Industrial Protocol Bridges, Legacy Router Control Plane, Telecom Line Card Aggregation, Embedded Networking Reference Platform.

🌐

ISDN Terminal Adapters

The MPC862PZQ66B's integrated CPM handles up to four HDLC channels simultaneously, which is exactly what an ISDN terminal adapter needs to terminate the BRI signaling and bridge it to Ethernet. Operating at 66 MHz with 32-bit PowerPC performance, the host CPU runs the management and configuration stack while the CPM offloads bit-level framing, freeing the main core for protocol translation. The 357-PBGA package dissipates roughly 3 to 4 W at full CPM activity, which is manageable on a 4-layer PCB with thermal vias. Compared to a discrete MCU plus external UART, the integrated CPM reduces BOM cost by 20 to 30 percent in ISDN bridge designs.

🌐

DSL Access Multiplexers (DSLAMs)

In DSLAM line cards, the MPC862PZQ66B aggregates ATM and HDLC traffic from many DSL ports and forwards it to an uplink. Its CPM can manage multiple serial channels per device, allowing a single MPC862 to terminate dozens of subscriber lines while the PowerPC core runs the bridging table and the ATM SAR. The 66 MHz host clock is sufficient for control-plane tasks; wire-speed data never touches the host CPU. Replacing MPC862 with the MPC866PCVR100A doubles throughput for next-generation VDSL deployments without a PCB change because both share the 357-PBGA (25x25) footprint.

🏭

Industrial Protocol Bridges

Industrial protocol bridges (Modbus, Profibus, serial-to-Ethernet gateways) benefit from the MPC862PZQ66B's multi-protocol CPM, which supports UART, SPI, and HDLC on the same chip. At 66 MHz the PowerPC core easily handles the bridge's TCP/IP stack while the CPM services the fieldbus side. The 3.3 V supply matches typical industrial backplane rails, and the 357-PBGA gives enough I/O for eight or more serial ports via external transceivers. For long-life industrial deployments, designers should verify lead-free status with the manufacturer because the MPC862 part numbers in this generation are typically non-RoHS.

🖥️

Legacy Router Control Plane

The MPC862PZQ66B was a popular control-plane processor in enterprise routers of the early 2000s, and many of those routers are still in service today. Its 32-bit PowerPC core runs routing daemons and SNMP while the CPM handles T1/E1 and Ethernet MAC interfaces. The 357-PBGA package fits in the standard router mainboard footprint, so field replacements can use a stock part without mechanical rework. The obsolete lifecycle status is acceptable for maintaining legacy systems but indicates a migration to QorIQ-class processors is needed for new designs.

📡

Telecom Line Card Aggregation

Legacy telecom line cards aggregate multiple T1, E1, or V.35 channels into a single backplane interface, and the MPC862PZQ66B's CPM is purpose-built for exactly that fan-in task. Each of its serial channels can run independently at different protocols, so one MPC862 replaces what would otherwise be four or five discrete UARTs or HDLC controllers. At 66 MHz the host CPU has plenty of headroom for channelized diagnostics, and the 32-bit system bus sustains backplane throughput without stalls. Power consumption stays in the 3 to 5 W range under full load with all CPM channels active.

🔧

Embedded Networking Reference Platform

Engineers building new embedded networking reference platforms historically used the MPC862PZQ66B as a stepping stone between smaller 8-bit microcontrollers and full PowerPC system-on-chips. The integrated CPM provides a complete multi-protocol serial stack with deterministic latency, while the host CPU exposes a familiar 32-bit programming model. The 357-PBGA package has well-documented layout examples in NXP application notes, simplifying the PCB bring-up. Modern reference platforms should evaluate the QorIQ P1010 as a RoHS-compliant replacement with similar CPM-like offload and better toolchain support.

추천 제품 요약

MPC860DPZQ66D4 NXP Semiconductors 사용처: ISDN Terminal Adapters, DSL Access Multiplexers (DSLAMs), Legacy Router Control Plane, Telecom Line Card Aggregation, Embedded Networking Reference Platform MPC860TZQ66D4 NXP Semiconductors 사용처: ISDN Terminal Adapters, Telecom Line Card Aggregation MPC866PCVR100A 100 MHz upgrade MPC866 in same 357-PBGA footprint 사용처: DSL Access Multiplexers (DSLAMs), Legacy Router Control Plane, Embedded Networking Reference Platform MPC860TCZQ66D4 Commercial-grade MPC860 for industrial temp range 사용처: Industrial Protocol Bridges MPC860TVR50D4 NXP Semiconductors 사용처: Industrial Protocol Bridges
What processor family does MPC862PZQ66B belong to?
The MPC862PZQ66B is a member of the MPC8xx PowerQUICC family of 32-bit PowerPC microprocessors from NXP Semiconductors. It pairs a PowerPC host CPU with a dedicated RISC-based CPM (Communications Processor Module) for offloading serial protocol processing, and is offered in this part at a 66 MHz maximum core clock in a 357-ball PBGA package.
What is the maximum operating frequency of MPC862PZQ66B?
The MPC862PZQ66B operates at a maximum core clock frequency of 66 MHz, as listed in the NXP datasheet summary and confirmed by independent distributor listings for the 357-PBGA (25x25) variant. The "66B" suffix in the part number encodes this 66 MHz speed grade, distinguishing it from slower 50 MHz and faster 80 MHz members of the MPC862 family.
What package does MPC862PZQ66B use?
The MPC862PZQ66B uses a 357-ball Plastic Ball Grid Array (PBGA) package measuring 25 mm by 25 mm. This surface-mount BGA has 357 ball terminals on the bottom of the package in a land-grid array pattern suitable for high-density networking and telecom PCBs.
Is MPC862PZQ66B still in production?
No, the MPC862PZQ66B is in the obsolete lifecycle stage and is no longer in active production by NXP. Distributors such as Rochester Electronics hold remaining factory-stock or refurbished inventory. Lead time for existing inventory is typically immediate; new factory orders are no longer accepted.
Is MPC862PZQ66B RoHS compliant?
The MPC862PZQ66B is listed as Contains Lead (Pb) per the DigChip datasheet extract and is therefore not RoHS compliant. Theatasheet summarizes its lead-free status as "Contains Lead." For RoHS-compliant designs, look at later MPC8xx variants or migrate to a current-generation QorIQ part such as the P1010 or P2020.
What is the recommended replacement for MPC862PZQ66B?
The recommended drop-in replacement for the MPC862PZQ66B is the MPC860DPZQ66D4, which shares the same 357-PBGA (25x25) footprint and 66 MHz speed grade but offers updated peripheral integration. For higher-throughput designs, the MPC866PCVR100A is also pin-compatible on the same PBGA with a 100 MHz upgrade, though the exact CPM feature mix differs slightly between revisions.
Where can I buy MPC862PZQ66B today?
The MPC862PZQ66B is available today through authorized NXP distributors carrying obsolete inventory, including Rochester Electronics (which holds original-factory stock) and Heisener, which lists 5,440 pieces in stock as of 2026-10-16. Pricing at qty-1 is around $108.23 per piece per Heisener; lead time on remaining distributor inventory is generally immediate.
What is the lead time for MPC862PZQ66B orders?
The lead time for MPC862PZQ66B orders from currently-stocking distributors is approximately 3 to 5 days for domestic shipment and 5 to 7 business days for expedited international shipping. Because the part is obsolete and held in limited distributor inventory, larger quantities (above 1,000 pieces) may require quotation and verification of remaining stock before order acceptance.
How does MPC862PZQ66B compare to MPC860TZQ66D4?
The MPC862PZQ66B and MPC860TZQ66D4 both belong to the NXP MPC8xx PowerQUICC family and are offered in related BGA packages at 66 MHz. The MPC862 variant adds enhanced ATM and HDLC channel counts compared to the MPC860, while the MPC860TZ part focuses on a slightly reduced CPM channel count. Both parts are obsolete today; the MPC862 typically commands a higher price due to its wider protocol support.
What is the difference between MPC862PZQ66B and MPC866PCVR100A?
The MPC862PZQ66B operates at 66 MHz in a 357-PBGA package, while the MPC866PCVR100A is the higher-clocked 100 MHz family member. The MPC866 adds expanded Ethernet MAC support and more on-chip protocol channels, providing roughly 50 percent more compute headroom at the cost of slightly higher power dissipation. Neither is a true drop-in for the other at the firmware level because CPM revision registers differ.
Where can I download the MPC862PZQ66B datasheet PDF?
The MPC862PZQ66B datasheet can be downloaded from NXP's official product documentation page at the link referenced in the data sources section. The datasheet covers the MPC862/857T/857DSL family and includes power considerations, DC and AC electrical characteristics, AC timing specifications, and the full 357-ball PBGA pinout.
Where do I find the MPC862PZQ66B pinout diagram?
The full 357-ball PBGA pinout for the MPC862PZQ66B is published in the manufacturer datasheet's pinout chapter, which assigns each ball to a power rail, ground, CPM signal, system bus, or general-purpose I/O function. The 25 x 25 mm BGA maps each ball to coordinates referenced in the package mechanical drawing section.
What is the PowerQUICC architecture used in MPC862PZQ66B?
The PowerQUICC architecture used in the MPC862PZQ66B pairs a PowerPC 32-bit core with a CPM (Communications Processor Module, originally branded QUICC for Quad Integrated Communications Controller). The CPM is a separate RISC engine that executes serial protocol tasks - HDLC, Ethernet, ATM, UART, I2C, and SPI - independently of the host CPU, delivering wire-rate multi-channel throughput while the PowerPC core runs the control-plane stack.
Can I use MPC862PZQ66B in a new design today?
No, the MPC862PZQ66B is not recommended for new designs because it is obsolete and not RoHS compliant. For new industrial or telecom designs, use a current QorIQ or PowerQUICC III part such as the P1020, P2020, or T1024, which provide multi-gigabit Ethernet, hardware packet acceleration, and full RoHS compliance. The MPC862 is still useful for maintaining legacy equipment and matching exact 357-PBGA footprints.
Is MPC862PZQ66B pin-compatible with MPC860 parts?
Yes, the MPC862PZQ66B is generally pin-compatible with the MPC860 family in the same 357-PBGA (25 x 25 mm) package, including the MPC860DPZQ66D4 and other 66 MHz grade variants. However, some CPM register revisions differ between the MPC860 and MPC862 firmware driver paths, so a board-level swap may require driver re-validation even when the ball map is identical.

엔지니어링 참조 데이터: MPC862PZQ66B — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the MPC862PZQ66B when you need a production-proven PowerQUICC MPU in the 357-PBGA (25x25) footprint with 66 MHz performance and the full MPC862 CPM channel set. This part is specifically targeted at multi-protocol serial aggregation and ISDN, DSLAM, and legacy router line cards. Choose the MPC860DPZQ66D4 instead when you do not need the MPC862's expanded channel count and want a slighly lower-cost drop-in option. Choose the MPC866PCVR100A when you need higher throughput and can tolerate the +52 percent clock bump and CPM register revision differences; both share the same PBGA footprint. Avoid the MPC860TVR50D4 unless you are intentionally downgrading throughput to ease thermal or power budgets. For entirely new designs that must meet RoHS, skip the MPC862 family and evaluate the QorIQ P1010 or T1024 as a software-and-footprint-compatible migration path.

대체품과의 비교

파라미터 이 제품 MPC860DPZQ66D4 MPC860TZQ66D4 MPC860TCZQ66D4 MPC860TVR50D4 MPC866PCVR100A
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 357-PBGA (25x25) 357-PBGA (25x25) - same 357-PBGA (25x25) - same 357-PBGA (25x25) - same 357-PBGA (25x25) - same 357-PBGA (25x25) - same
Maximum Clock Speed 66 MHz 66 MHz 66 MHz 66 MHz 50 MHz (-24%) 100 MHz (+52%)
Core Family MPC862 PowerQUICC MPC860 PowerQUICC MPC860 PowerQUICC MPC860 PowerQUICC MPC860 PowerQUICC MPC866 PowerQUICC
Data Bus Width 32-bit 32-bit 32-bit 32-bit 32-bit 32-bit
Operating Supply Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Number of Balls 357 357 357 357 357 357
Lead Free Status Contains Lead (non-RoHS) Contains Lead (non-RoHS) Contains Lead (non-RoHS) Contains Lead (non-RoHS) Contains Lead (non-RoHS) Contains Lead (non-RoHS)
CPM Channel Count Higher (MPC862 expanded) MPC860 standard MPC860 reduced MPC860 standard MPC860 standard MPC866 expanded + Ethernet MACs

주요 차별점

  • Higher CPM channel count than MPC860 family (vs MPC860DPZQ66D4)
  • Mature 66 MHz industrial footprint (vs MPC866PCVR100A)
  • Long-standing distribution stock (vs MPC860TVR50D4)

설계 노트

Estimated: at 66 MHz with all CPM channels active the MPC862PZQ66B typically dissipates 3 to 5 W. For a 357-PBGA (25x25) thermal pad design, follow NXP application note AN2126 - use a 50 x 50 mm copper pad on the top layer stitched to inner ground planes with a 1.2 mm via array on a 1.5 mm pitch to keep the junction under 100 C at 25 C ambient. Without thermal vias, expect a 30 to 40 C junction temperature rise.

The 357-ball PBGA (25x25) requires a 4-layer or higher PCB stack-up with 0.8 mm pitch or finer via structures. Use a high-performance PCB house that supports laser-drilled microvias (typical 0.1 mm finished hole) and ENIG or immersion-silver pad finish for the BGA land pattern. Keep the breakout fanout on the top layer only and route differential pairs (Ethernet RMII/MII, TDM) with 100 ohm differential impedance per NXP MPC8xx hardware-design notes.

Estimated: common pitfalls include (1) leaving the CPM interrupt vector registers in default state after boot - failure to remap the CPM interrupt to the correct priority causes silent packet loss; (2) using 3.3 V tolerant SDRAM without series resistors - ringing on the system bus can exceed the 3.3 V absolute-max; (3) ignoring the JTAG boundary-scan requirement on board bring-up - the MPC862 will not enumerate internal buses unless JTAG is properly terminated. Also verify the boot-strap configuration pins before each board revision; incorrect HRESET pull-ups are the most common field failure.

규정 준수 정보

RoHS
Non Compliant
REACH
Unknown
AEC-Q100
Not Applicable
무연
No
무할로겐
Unknown
분쟁 광물
Unknown

Listed by DigChip as 'Contains Lead / RoHS non-compliant'; REACH and conflict-mineral data not provided in verified web data and marked unknown. AEC-Q100 not applicable - this is an industrial/networking MPU, not an automotive-grade part.

데이터 검증일: 2026-10-16 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

MPC862PZQ66B MPC862PZQ66B datasheet NXP MPC862 PowerQUICC 66 MHz 357-PBGA MPC8xx microprocessor MPC862 vs MPC860 MPC862PZQ66B drop-in replacement MPC862PZQ66B buy price lead time where to buy obsolete MPC862 PowerQUICC 357 BGA pinout MPC862 CPM HDLC channels legacy ISDN terminal adapter MPU DSLAM line card processor NXP

관련 부품 & 용어

NXP Semiconductors MPC862PZQ66B MPC862 MPC860DPZQ66D4 MPC860TZQ66D4 MPC860TCZQ66D4 MPC860TVR50D4 MPC866PCVR100A PowerQUICC MPC8xx PowerPC QUICC CPM (Communications Processor Module) PBGA 357-BBGA HDLC ATM ISDN DSLAM 3.3 V supply 66 MHz clock RoHS non-compliant embedded microprocessor BGA surface-mount package industrial telecom networking
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