MPC862PZQ66B vs MPC860TZQ66D4 比較
詳細並排比較 MPC862PZQ66B 由 NXP Semiconductors 與 MPC860TZQ66D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPC862PZQ66B - 66MHz PowerQUICC MPU, 357-PBGA | NXP Semiconductors
MPC862PZQ66B Obsolete
規格比較
| 參數 | MPC862PZQ66B | MPC860TZQ66D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | Obsolete | 停產終止 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors |
| Processor Type | MPC8xx PowerQUICC 32-Bit MPU | — |
| Number of Cores | 1 | — |
| Core Architecture | PowerPC + CPM (QUICC) | PowerPC, 32-bit |
| 資料匯流排寬度 | 32-bit | — |
| Maximum Clock Speed | 66 MHz | — |
| 工作電源電壓 | 3.3 V | — |
| 封裝 / 外殼 | 357-BBGA (PBGA, 25 x 25 mm) | 357-PBGA (25x25 mm) |
| 安裝類型 | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Lead Free Status | Contains Lead | Contains Lead |
| RoHS 狀態 | Non-compliant per third-party listing (Contains Pb) | RoHS non-compliant (Contains Lead) |
| Terminal Form | Ball | — |
| Number of Terminals | 357 | — |
| Package Code | BGA (PBGA) | — |
| Series | MPC8xx PowerQUICC | — |
| Temperature Grade | Other (per data sheet) | — |
| Part Family | — | MPC8xx PowerQUICC |
| Core Count | — | 1 |
| Core Frequency | — | 66 MHz |
| 供應電壓 | — | 3.3 V |
| 工作溫度 | — | 0 °C to +70 °C |
| Communications Module | — | CPM (QUICC Engine) |
| 生命週期狀態 | — | End of Life (per NXP) |
| 類別 | — | Microprocessors - MPU |