MPC875ZT80 - PowerQUICC 80MHz 32-Bit MPU, 256-PBGA | NXP
MPN： MPC875ZT80 ⚠ 最後購買機會MPC875ZT80 概覽
The PowerQUICC MPC8xx family represents a class of integrated communications processors that combine a Power Architecture CPU core with system integration units (SIU), communications processor module (CPM), and memory controllers on one die. These processors sit within the broader hierarchy of microprocessors -> embedded processors -> communications processors -> networking ASICs, and they historically powered routers, DSLAMs, and telecom infrastructure.
Key features of the MPC875ZT80 include the 32-bit Power Architecture core at 80 MHz, integrated CPM supporting common serial protocols, dual UART, HDLC, and PCI interface options. The device also integrates timers, a memory controller for SDRAM/ROM/SRAM, and a flexible system bus. Compared with discrete CPU-plus-comm-controller solutions, the MPC875ZT80 reduces board area and BOM cost by integrating the communications engine and the CPU on the same silicon.
The architecture uses a unified internal bus to couple the CPU core, CPM, and memory controller. The CPM offloads protocol processing from the CPU, allowing the Power Architecture core to focus on control-plane and management tasks. This dual-engine approach was pioneering for its era and influenced later PowerQUICC II/III designs. The integrated SIU manages pin multiplexing, interrupts, and reset configuration.
Typical applications include SOHO routers, ADSL/VDSL modems, Ethernet switches, industrial gateways, and legacy telecom equipment where deterministic communications performance and Power Architecture toolchain support matter more than raw MHz. The wide operating temperature range and integrated peripherals make the part suitable for embedded networking and factory automation gateways.
When designing with the MPC875ZT80, designers must plan for a 3.3V core/IO supply and external SDRAM. Boot configuration straps are read on reset and must be set via pull-up/pull-down resistors on the configuration pins. Thermal management relies primarily on the PBGA thermal pad - use sufficient ground vias and copper pours to keep junction temperature within limits.
This page consolidates distributor availability, drop-in pin-compatible alternatives (within the same MPC8xx family), and practical design notes beyond what the manufacturer datasheet provides, making it useful for engineers sustaining older designs or sourcing replacement inventory.
直接替換替代品，適用於 MPC875ZT80 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC875ZT80 （相同外形與佔位） — 差異在於 Core Architecture, Operating Temperature, Process Technology, Mounting Type, Package.
MPC875VR80
✅ 直接替換聯絡詢價
查看資料表 →MPC870VR80
✅ 直接替換聯絡詢價
查看資料表 →MPC875ZT80 最大額定值與電氣特性
| Architecture | Power Architecture (MPC8xx / PowerQUICC) |
| Core Count | 1 |
| 資料匯流排寬度 | 32-bit |
| 最大時脈頻率 | 80 MHz |
| 封裝 | 256-PBGA (23x23 mm) |
| 工作溫度範圍 | 0 C to 95 C |
| Series | MPC8xx / PowerQUICC |
| 供應電壓 | 3.3 V (core/IO) |
| 安裝類型 | Surface Mount |
| Integrated Peripherals | CPM (communications processor module), SIU, timers, UARTs, HDLC, PCI |
| Family Position | MPC8xx / PowerQUICC I |
MPC875ZT80 256-pbga (23x23 mm) 腳位配置指南
MPC875ZT80（256-pbga (23x23 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC875ZT80.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC875ZT80 適用於 6 應用s: SOHO Routers and Gateways, ADSL / VDSL Modem Termination, Industrial Ethernet Switches, Legacy Telecom Equipment (T1/E1), Printers and Imaging Controllers, Embedded Data Concentrators.
SOHO Routers and Gateways
The MPC875ZT80's integrated CPM (communications processor module) handles Ethernet MAC, HDLC, and serial channels directly, offloading the Power Architecture core from packet processing. At 80 MHz with on-chip peripherals, it can manage routing tables, NAT, and basic QoS for SOHO broadband gateways without an external communication controller. Designers typically pair the MPC875ZT80 with an SDRAM bank and a small Flash for firmware, building a compact SOHO router on a 4-layer PCB.
推薦
ADSL / VDSL Modem Termination
DSLAM line cards and customer-premises DSL modems historically relied on the MPC875's HDLC channels, UARTs, and PCI interface for interfacing to the PHY and ATM segmentation/reassembly blocks. The MPC875ZT80's 80 MHz CPU throughput is sufficient for PPPoE encapsulation, ATM AAL5, and basic traffic shaping at DSL data rates. The 256-PBGA package's thermal pad allows sustained operation under continuous data flow typical of always-on DSL links.
推薦
Industrial Ethernet Switches
The MPC875ZT80 integrates PCI, dual UART, and HDLC channels useful for managed industrial Ethernet switches handling PROFINET, EtherNet/IP, or Modbus TCP traffic. Its CPM offloads time-critical protocol handling from the CPU, leaving the Power Architecture core to run the management stack, web interface, and diagnostics. The 0-95 C commercial temperature range covers most factory-floor environments inside control cabinets.
推薦
Legacy Telecom Equipment (T1/E1)
The MPC875ZT80's HDLC controllers and TDM support make it well-suited for legacy T1/E1 channel banks, PBX line cards, and frame-relay access devices still in service today. The integrated CPM handles per-channel HDLC framing at T1 (1.544 Mbps) and E1 (2.048 Mbps) line rates without external glue logic. Telecom OEMs who designed with PowerQUICC I in the late 1990s and early 2000s continue to source MPC875ZT80 for sustaining spare-part production.
推薦
Printers and Imaging Controllers
Networked multifunction printers in the early 2000s used the MPC875ZT80 as a print-server and scanner controller, leveraging its PCI bus to connect to image-processing ASICs and its Ethernet MAC for network connectivity. The Power Architecture core runs the embedded OS and page-description-language interpreters, while the CPM manages the network side. This role has largely been replaced by integrated SoCs, but legacy MFPs and industrial label printers continue to use the MPC875ZT80.
推薦
Embedded Data Concentrators
In remote-terminal units (RTUs) and SCADA data concentrators, the MPC875ZT80 aggregates serial sensor data from RS-485/RS-232 links via its integrated UARTs and forwards them upstream over Ethernet. The CPM's DMA channels efficiently move serial data into memory, while the CPU handles protocol conversion (Modbus, DNP3). With 32-bit processing and on-chip peripherals, the MPC875ZT80 replaces multiple discrete microcontrollers and protocol converters in compact data-concentrator designs.
推薦
推薦產品摘要
工程參考資料，適用於 MPC875ZT80 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC875VR80 | MPC870VR80 |
|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23 mm) | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same |
| Architecture | Power Architecture (MPC8xx / PowerQUICC I) | Power Architecture (MPC8xx / PowerQUICC I) | Power Architecture (MPC8xx / PowerQUICC I) |
| Maximum Clock Frequency | 80 MHz | 80 MHz | 80 MHz |
| Core Count | 1 | 1 | 1 |
| Data Bus Width | 32-bit | 32-bit | 32-bit |
| Operating Temperature Range | 0 C to +95 C (commercial) | -40 C to +105 C (industrial) | -40 C to +105 C (industrial) |
| Integrated Peripherals (CPM/SIU) | Full CPM: HDLC, UART, PCI, timers | Full CPM (matches MPC875ZT80) | Reduced CPM (fewer serial channels than MPC875) |
| Lifecycle Status | Last-time-buy / EOL | Last-time-buy / EOL | Last-time-buy / EOL |
主要差異化特點
- Integrated CPM offloads serial-protocol processing (對比MPC870VR80)
- Commercial temperature grade screened at 80 MHz (對比MPC875VR80)
- Direct NXP/Freescale drop-in within same 256-PBGA footprint (對比PowerQUICC II (MPC82xx))
設計說明
The MPC875ZT80 requires a stable 3.3V supply for both core and I/O rails. Place 10 uF tantalum plus 0.1 uF ceramic decoupling capacitors close to each PBGA power pin pair, and use a wide power plane to limit voltage drop during CPM DMA bursts. The PLL supply (VCCSYN) should be filtered with a ferrite bead and decoupled with 10 uF + 0.1 uF to minimise jitter on the 80 MHz system clock.
Estimated: at 80 MHz with continuous CPM activity, the MPC875ZT80 dissipates approximately 1.0-1.5 W into the 256-PBGA thermal pad. Use a 6x6 via array (0.3 mm drill, 0.6 mm pitch) under the thermal pad stitched to an internal ground plane to keep junction temperature within the 95 C commercial limit. Avoid placing the part near board edges where thermal relief is poor.
Route SDRAM address and data traces with matched lengths (within +/- 1 cm) to preserve timing margins at 80 MHz. Keep CPM serial clocks away from analog or reset traces to avoid coupling. Place the boot-configuration pull-up/pull-down resistors within 5 mm of the configuration pins so reset behaviour is unambiguous.
Do not confuse MPC875 (PowerQUICC I) with MPC827x (PowerQUICC II): they share the Power Architecture heritage but have different bus architectures, peripheral sets, and pinouts. Migration between the two families requires PCB redesign. Also note that the 'Z' suffix on MPC875ZT80 indicates 80 MHz commercial-temperature grade - selecting the wrong temperature grade invalidates timing specs.
合規資訊
Detailed compliance data not present in the verified web snippets; refer to the NXP product-change-notice page and the manufacturer datasheet for definitive RoHS/lead-free/reach status of the specific date/lot code on hand.