P2010NXE2KHC - QorIQ P2 1-Core 1.2GHz Power Arch SoC | NXP
MPN： P2010NXE2KHC ⚠ 最後購買機會P2010NXE2KHC 概覽
What is a QorIQ communications processor? QorIQ is NXP's portfolio of high-performance Power Architecture system-on-chip (SoC) devices designed for networking, industrial, and aerospace applications. Within that hierarchy, the QorIQ P2 tier sits above the value-tier P1 family and below the higher-end P3/P4/P5 families. The P2 tier integrates one or two e500v2 cores with a complete I/O subsystem (DDR2/3, GbE, PCIe, SRIO, USB, SEC, QUICC Engine), so it functions as a self-contained communications processor - not a general-purpose microcontroller.
Key features of the P2010NXE2KHC include 32 KB I-cache and 32 KB D-cache per core, double-cache supporting on-chip memory subsystem, integrated security engine (SEC) for IPSec / SSL / TLS / SRTP acceleration, four GbE MACs, two PCIe controllers, two Serial RapidIO (SRIO) ports, USB 2.0 with ULPI interface, DDR2/DDR3 memory controller with ECC, and the QUICC Engine subsystem for legacy serial protocols. The 45 nm process technology provides high performance per watt, which was a differentiator versus the older 65 nm PowerQUICC III devices.
Architecturally, the P2010 implements a single e500v2 core with Book E instruction support, dual-issue superscalar pipeline, and hardware MMU, paired with NXP's CoreNet fabric and platform peripherals shared across the P1/P2/P3 families. The SEC engine accelerates bulk crypto and public-key operations; the QUICC Engine handles HDLC, UART, and BISYNC. Performance scales with frequency selection and operating-system configuration; the P2010NXE2KHC specifically targets 1000/800 MHz industrial grade workloads.
Typical applications for this part include industrial routers and protocol converters, factory automation controllers, aerospace flight-control and avionics networking, secure VPN/firewall platforms using the integrated SEC engine, substation communications equipment, and base-station control-plane processors. It is also used in long-life-cycle industrial gateways where the -40C to +125C extended temperature range is mandatory.
When designing with this part, plan for the full TEPBGA II substrate footprint, which requires microvia PCB technology for routing inner balls, plus a multi-rail power tree (Vcore, VDD, SerDes supplies, DDR I/O). Decoupling follows the manufacturer's reference design; the device is not a hobbyist-friendly part. Use NXP's CodeWarrior or the latest Linux SDK toolchain.
This page synthesizes distributor pricing, NXP lifecycle data, and pin-compatible QorIQ platform alternatives (P1010/P1011/P1013/P2020) into one decision-ready view that the manufacturer datasheet and individual distributor listings do not provide on their own.
直接替換替代品，適用於 P2010NXE2KHC — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： P2010NXE2KHC （相同外形與佔位） — 差異在於 Core Architecture, Ethernet, USB, Mounting Type, Package.
P2010NXN2KHC
✅ 直接替換📋 參考替代品（不在目錄中）
P2020NXE2KHC
✅ 直接替換📋 參考替代品（不在目錄中）
P2020NXE2HHC
✅ 直接替換聯絡詢價
查看資料表 →P1011NXN2HFB
✅ 直接替換📋 參考替代品（不在目錄中）
P1013NXN2HFB
✅ 直接替換📋 參考替代品（不在目錄中）
P1014NXN2HFB
✅ 直接替換📋 參考替代品（不在目錄中）
P2010NXE2KHC 最大額定值與電氣特性
| Product Family | QorIQ P2 |
| Core Architecture | Power Architecture e500v2 (Book E) |
| Number of Cores | 1 |
| Maximum Core Frequency | 1.2 GHz (1000/800 MHz core grades) |
| Core Voltage | 1.05 V |
| Process Technology | 45 nm |
| Instruction Set | Power Architecture Book E, FPU, MMU |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | Quad GbE MAC |
| PCI Express | 2 x PCIe controllers |
| Serial RapidIO (SRIO) | 2 ports |
| USB | USB 2.0 (ULPI interface) |
| Security Engine (SEC) | Yes - IPSec/SSL/TLS/SRTP acceleration |
| 封裝 | 689-TEPBGA II (31x31 mm) |
| 工作溫度 | -40C to +125C (Extended) |
| 安裝類型 | Surface Mount (BGA) |
| 生命週期狀態 | Last Time Buy (per NXP discontinuance notice) |
P2010NXE2KHC 689-tepbga ii (31x31 mm) 腳位配置指南
P2010NXE2KHC（689-tepbga ii (31x31 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： P2010NXE2KHC.
請參閱 資料表 以查看完整腳位配置。
典型應用
P2010NXE2KHC 適用於 6 應用s: Industrial Secure VPN Router, Substation Communications Gateway, Aerospace Avionics Networking, Base Station Control-Plane Processor, Industrial Protocol Converter, Defense Ruggedized Firewall.
Industrial Secure VPN Router
The P2010NXE2KHC's integrated Security Engine (SEC) accelerates IPSec, SSL, and TLS at line rates, while four integrated GbE MACs handle multiple WAN/LAN segments. Its -40C to +125C extended temperature range suits DIN-rail cabinet and outdoor installations. With 1.0/0.8 GHz e500v2 performance, the part can run a hardened Linux router stack with crypto offload - better fit than the P1011 (no SEC engine) and lower power than the dual-core P2020.
推薦
Substation Communications Gateway
The P2010NXE2KHC's QUICC Engine subsystem handles legacy serial protocols like HDLC and BISYNC found in IEC 61850 substations, while GbE and PCIe support modern SCADA uplinks. The 45 nm process keeps power low for sealed, fanless enclosures, and the extended -40C to +125C temperature range survives substation ambient. Combined with the SEC engine, the chip supports secure remote-management firmware signing on the same die - ideal for IEC 62443 compliance.
推薦
Aerospace Avionics Networking
In avionics networks, the P2010NXE2KHC's two Serial RapidIO (SRIO) ports, two PCIe lanes, and four GbE MACs enable redundant 10/100/1000 fabric connectivity required by ARINC 664 / AFDX. The extended -40C to +125C temperature range is required for DO-160G environments, and the SEC engine ensures data-plane integrity. The 689-TEPBGA II package is suitable for ruggedized board layouts with underfilled ball attach.
推薦
Base Station Control-Plane Processor
The P2010NXE2KHC is well-suited as a control-plane co-processor in LTE/5G small-cell base stations, where its 1.0/0.8 GHz e500v2 core runs real-time OAM and network-management stacks. The PCIe controller interfaces to a separate baseband DSP or SoC, while the GbE and SRIO ports backhaul the management plane. The SEC engine accelerates IPsec on the OAM plane - a cleaner fit than a general-purpose ARM microcontroller lacking SRIO.
推薦
Industrial Protocol Converter
Protocol converters (Modbus to IEC 61850, Profibus to EtherCAT, etc.) need deterministic serial handling plus Ethernet/IP routing - exactly what the P2010NXE2KHC's QUICC Engine plus GbE deliver. The single-core 1.0/0.8 GHz e500v2 handles real-time protocol translation, while the SEC engine authenticates field devices. The extended temperature range eliminates fans in cabinets, and the DDR2/DDR3 controller with ECC protects configuration data.
推薦
Defense Ruggedized Firewall
The P2010NXE2KHC's integrated SEC engine performs hardware-accelerated IPSec and SSL inspection at multi-Gbps, while the four GbE ports segregate trusted and untrusted zones. Its extended temperature range meets MIL-STD-810 ambient requirements, and the 689-TEPBGA II package is well-suited to ruggedized PCB stack-ups with underfilled BGA attachment. Single-core 1.0/0.8 GHz performance is adequate for firewall throughput at edge-class link speeds.
推薦
推薦產品摘要
工程參考資料，適用於 P2010NXE2KHC — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | P2010NXN2KHC | P2020NXE2KHC | P2020NXE2HHC | P1011NXN2HFB | P1013NXN2HFB | P1014NXN2HFB |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same |
| Number of Cores | 1 | 1 | 2 | 2 | 1 | 1 | 1 |
| Maximum Core Frequency | 1.2 GHz (1000/800 MHz grades) | 1.2 GHz | 1.2 GHz dual-core | 1.33 GHz dual-core | 800 MHz | 1.0 GHz | 1.0 GHz |
| Core Voltage | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.0 V | 1.0 V | 1.0 V |
| Security Engine (SEC) | Yes | Yes | Yes | Yes | No | No | Yes |
| Operating Temperature | -40C to +125C (Extended) | 0C to +105C (Commercial) | -40C to +125C (Extended) | -40C to +125C (Extended) | 0C to +105C (Commercial) | 0C to +105C (Commercial) | -40C to +105C (Industrial) |
| Pin Compatibility | QorIQ P1/P2 689-TEPBGA II | Drop-in (same ball map) | Drop-in (same ball map) | Drop-in (same ball map) | Drop-in (same ball map) | Drop-in (same ball map) | Drop-in (same ball map) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
主要差異化特點
- Single-core 1.0/0.8 GHz e500v2 with SEC engine and extended temperature range (對比P1011NXN2HFB)
- Pin-compatible path to dual-core performance upgrade (對比P2020NXE2KHC)
- 45 nm power-efficient QorIQ platform (對比P1011NXN2HFB)
設計說明
The 689-TEPBGA II package requires thermal management at 1.2 GHz. Recommended: a 4-6 layer PCB with a copper ground/power plane beneath the die, plus 4-8 thermal vias in the central ball-grid region. For sealed industrial enclosures, derate Tj below 110C to maintain long-term reliability over the -40C to +125C ambient range. Use NXP's reference thermal model to estimate theta_JA for your stack-up.
The 689-ball TEPBGA II uses a 1.0 mm pitch ball array requiring microvia (laser-drilled) PCB technology for inner rows. Stack-up: minimum 6 layers with dedicated GND/PWR planes between the BGA and DDR routing. Match trace lengths for DDR2/DDR3 within +/- 25 mil and SerDes within +/- 2 mil to meet the 5 Gbps SRIO and 2.5 Gbps SerDes jitter budgets per the manufacturer datasheet.
The P2010NXE2KHC requires multiple supply rails: 1.05 V Vcore (up to 4-5 A peak), 1.0/1.5/1.8 V for DDR, 2.5 V for SerDes analog, 3.3 V for I/O, and PLL supplies. Use NXP's recommended PMIC (e.g., MMPF0100) for power sequencing - do NOT power-up Vcore before SerDes. Decoupling requires 0.1 uF + 1 uF + 10 uF ceramic caps within 5 mm of each supply ball per the manufacturer design checklist.
Do not assume any 689-TEPBGA II QorIQ part is pin-compatible without checking the part-number suffix. The P1 family and P2 family share the footprint, but P3/P4/P5 families do not. Also verify boot-mode configuration pins (cfg_rcw_src) against the part's reference manual - some P1 vs P2 variants differ in reset configuration word pin assignments. Consult the manufacturer datasheet's pin-compatibility matrix before PCB revision.
SerDes lanes (SRIO, PCIe, GbE) are length-matched but MUST NOT cross over or run parallel to noisy signals (DDR, switching supplies). Route SerDes on the top layer with a continuous GND reference plane below. Keep AC coupling capacitors within 4 mm of the device balls. Follow the manufacturer's hardware design guide (AN3944) for layer stack-up and impedance targets.
合規資訊
RoHS compliant per NXP product environmental compliance information. AEC-Q100 is not applicable - this is a communications processor, not an automotive IC. Conflict-minerals compliance verified via NXP's CMRT filings.
