P2010NXE2KHC - QorIQ P2 1-Core 1.2GHz Power Arch SoC | NXP
MPN: P2010NXE2KHC ⚠ Lần mua cuốiP2010NXE2KHC Tóm tắt
What is a QorIQ communications processor? QorIQ is NXP's portfolio of high-performance Power Architecture system-on-chip (SoC) devices designed for networking, industrial, and aerospace applications. Within that hierarchy, the QorIQ P2 tier sits above the value-tier P1 family and below the higher-end P3/P4/P5 families. The P2 tier integrates one or two e500v2 cores with a complete I/O subsystem (DDR2/3, GbE, PCIe, SRIO, USB, SEC, QUICC Engine), so it functions as a self-contained communications processor - not a general-purpose microcontroller.
Key features of the P2010NXE2KHC include 32 KB I-cache and 32 KB D-cache per core, double-cache supporting on-chip memory subsystem, integrated security engine (SEC) for IPSec / SSL / TLS / SRTP acceleration, four GbE MACs, two PCIe controllers, two Serial RapidIO (SRIO) ports, USB 2.0 with ULPI interface, DDR2/DDR3 memory controller with ECC, and the QUICC Engine subsystem for legacy serial protocols. The 45 nm process technology provides high performance per watt, which was a differentiator versus the older 65 nm PowerQUICC III devices.
Architecturally, the P2010 implements a single e500v2 core with Book E instruction support, dual-issue superscalar pipeline, and hardware MMU, paired with NXP's CoreNet fabric and platform peripherals shared across the P1/P2/P3 families. The SEC engine accelerates bulk crypto and public-key operations; the QUICC Engine handles HDLC, UART, and BISYNC. Performance scales with frequency selection and operating-system configuration; the P2010NXE2KHC specifically targets 1000/800 MHz industrial grade workloads.
Typical applications for this part include industrial routers and protocol converters, factory automation controllers, aerospace flight-control and avionics networking, secure VPN/firewall platforms using the integrated SEC engine, substation communications equipment, and base-station control-plane processors. It is also used in long-life-cycle industrial gateways where the -40C to +125C extended temperature range is mandatory.
When designing with this part, plan for the full TEPBGA II substrate footprint, which requires microvia PCB technology for routing inner balls, plus a multi-rail power tree (Vcore, VDD, SerDes supplies, DDR I/O). Decoupling follows the manufacturer's reference design; the device is not a hobbyist-friendly part. Use NXP's CodeWarrior or the latest Linux SDK toolchain.
This page synthesizes distributor pricing, NXP lifecycle data, and pin-compatible QorIQ platform alternatives (P1010/P1011/P1013/P2020) into one decision-ready view that the manufacturer datasheet and individual distributor listings do not provide on their own.
Bộ thay thế dễ dàng lắp đặt cho P2010NXE2KHC — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với P2010NXE2KHC (cùng hình factor và footprint) — khác nhau ở Core Architecture, Ethernet, USB, Mounting Type, Package.
P2010NXN2KHC
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
P2020NXE2KHC
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
P2020NXE2HHC
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →P1011NXN2HFB
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
P1013NXN2HFB
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
P1014NXN2HFB
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
P2010NXE2KHC Tỷ lệ tối đa & tính chất điện
| Product Family | QorIQ P2 |
| Core Architecture | Power Architecture e500v2 (Book E) |
| Number of Cores | 1 |
| Maximum Core Frequency | 1.2 GHz (1000/800 MHz core grades) |
| Core Voltage | 1.05 V |
| Process Technology | 45 nm |
| Instruction Set | Power Architecture Book E, FPU, MMU |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | Quad GbE MAC |
| PCI Express | 2 x PCIe controllers |
| Serial RapidIO (SRIO) | 2 ports |
| USB | USB 2.0 (ULPI interface) |
| Security Engine (SEC) | Yes - IPSec/SSL/TLS/SRTP acceleration |
| Hộp | 689-TEPBGA II (31x31 mm) |
| Nhiệt độ hoạt động | -40C to +125C (Extended) |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Trạng thái vòng đời | Last Time Buy (per NXP discontinuance notice) |
Hướng dẫn cấu hình chân P2010NXE2KHC 689-tepbga ii (31x31 mm)
Cấu hình chân cho P2010NXE2KHC (689-tepbga ii (31x31 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho P2010NXE2KHC.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
P2010NXE2KHC phù hợp cho 6 Áp dụngs: Industrial Secure VPN Router, Substation Communications Gateway, Aerospace Avionics Networking, Base Station Control-Plane Processor, Industrial Protocol Converter, Defense Ruggedized Firewall.
Industrial Secure VPN Router
The P2010NXE2KHC's integrated Security Engine (SEC) accelerates IPSec, SSL, and TLS at line rates, while four integrated GbE MACs handle multiple WAN/LAN segments. Its -40C to +125C extended temperature range suits DIN-rail cabinet and outdoor installations. With 1.0/0.8 GHz e500v2 performance, the part can run a hardened Linux router stack with crypto offload - better fit than the P1011 (no SEC engine) and lower power than the dual-core P2020.
Được đề xuất
Substation Communications Gateway
The P2010NXE2KHC's QUICC Engine subsystem handles legacy serial protocols like HDLC and BISYNC found in IEC 61850 substations, while GbE and PCIe support modern SCADA uplinks. The 45 nm process keeps power low for sealed, fanless enclosures, and the extended -40C to +125C temperature range survives substation ambient. Combined with the SEC engine, the chip supports secure remote-management firmware signing on the same die - ideal for IEC 62443 compliance.
Được đề xuất
Aerospace Avionics Networking
In avionics networks, the P2010NXE2KHC's two Serial RapidIO (SRIO) ports, two PCIe lanes, and four GbE MACs enable redundant 10/100/1000 fabric connectivity required by ARINC 664 / AFDX. The extended -40C to +125C temperature range is required for DO-160G environments, and the SEC engine ensures data-plane integrity. The 689-TEPBGA II package is suitable for ruggedized board layouts with underfilled ball attach.
Được đề xuất
Base Station Control-Plane Processor
The P2010NXE2KHC is well-suited as a control-plane co-processor in LTE/5G small-cell base stations, where its 1.0/0.8 GHz e500v2 core runs real-time OAM and network-management stacks. The PCIe controller interfaces to a separate baseband DSP or SoC, while the GbE and SRIO ports backhaul the management plane. The SEC engine accelerates IPsec on the OAM plane - a cleaner fit than a general-purpose ARM microcontroller lacking SRIO.
Được đề xuất
Industrial Protocol Converter
Protocol converters (Modbus to IEC 61850, Profibus to EtherCAT, etc.) need deterministic serial handling plus Ethernet/IP routing - exactly what the P2010NXE2KHC's QUICC Engine plus GbE deliver. The single-core 1.0/0.8 GHz e500v2 handles real-time protocol translation, while the SEC engine authenticates field devices. The extended temperature range eliminates fans in cabinets, and the DDR2/DDR3 controller with ECC protects configuration data.
Được đề xuất
Defense Ruggedized Firewall
The P2010NXE2KHC's integrated SEC engine performs hardware-accelerated IPSec and SSL inspection at multi-Gbps, while the four GbE ports segregate trusted and untrusted zones. Its extended temperature range meets MIL-STD-810 ambient requirements, and the 689-TEPBGA II package is well-suited to ruggedized PCB stack-ups with underfilled BGA attachment. Single-core 1.0/0.8 GHz performance is adequate for firewall throughput at edge-class link speeds.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho P2010NXE2KHC — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | P2010NXN2KHC | P2020NXE2KHC | P2020NXE2HHC | P1011NXN2HFB | P1013NXN2HFB | P1014NXN2HFB |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same |
| Number of Cores | 1 | 1 | 2 | 2 | 1 | 1 | 1 |
| Maximum Core Frequency | 1.2 GHz (1000/800 MHz grades) | 1.2 GHz | 1.2 GHz dual-core | 1.33 GHz dual-core | 800 MHz | 1.0 GHz | 1.0 GHz |
| Core Voltage | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.0 V | 1.0 V | 1.0 V |
| Security Engine (SEC) | Yes | Yes | Yes | Yes | No | No | Yes |
| Operating Temperature | -40C to +125C (Extended) | 0C to +105C (Commercial) | -40C to +125C (Extended) | -40C to +125C (Extended) | 0C to +105C (Commercial) | 0C to +105C (Commercial) | -40C to +105C (Industrial) |
| Pin Compatibility | QorIQ P1/P2 689-TEPBGA II | Drop-in (same ball map) | Drop-in (same ball map) | Drop-in (same ball map) | Drop-in (same ball map) | Drop-in (same ball map) | Drop-in (same ball map) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Bảo phân biệt quan trọng
- Single-core 1.0/0.8 GHz e500v2 with SEC engine and extended temperature range (vsP1011NXN2HFB)
- Pin-compatible path to dual-core performance upgrade (vsP2020NXE2KHC)
- 45 nm power-efficient QorIQ platform (vsP1011NXN2HFB)
Ghi chú thiết kế
The 689-TEPBGA II package requires thermal management at 1.2 GHz. Recommended: a 4-6 layer PCB with a copper ground/power plane beneath the die, plus 4-8 thermal vias in the central ball-grid region. For sealed industrial enclosures, derate Tj below 110C to maintain long-term reliability over the -40C to +125C ambient range. Use NXP's reference thermal model to estimate theta_JA for your stack-up.
The 689-ball TEPBGA II uses a 1.0 mm pitch ball array requiring microvia (laser-drilled) PCB technology for inner rows. Stack-up: minimum 6 layers with dedicated GND/PWR planes between the BGA and DDR routing. Match trace lengths for DDR2/DDR3 within +/- 25 mil and SerDes within +/- 2 mil to meet the 5 Gbps SRIO and 2.5 Gbps SerDes jitter budgets per the manufacturer datasheet.
The P2010NXE2KHC requires multiple supply rails: 1.05 V Vcore (up to 4-5 A peak), 1.0/1.5/1.8 V for DDR, 2.5 V for SerDes analog, 3.3 V for I/O, and PLL supplies. Use NXP's recommended PMIC (e.g., MMPF0100) for power sequencing - do NOT power-up Vcore before SerDes. Decoupling requires 0.1 uF + 1 uF + 10 uF ceramic caps within 5 mm of each supply ball per the manufacturer design checklist.
Do not assume any 689-TEPBGA II QorIQ part is pin-compatible without checking the part-number suffix. The P1 family and P2 family share the footprint, but P3/P4/P5 families do not. Also verify boot-mode configuration pins (cfg_rcw_src) against the part's reference manual - some P1 vs P2 variants differ in reset configuration word pin assignments. Consult the manufacturer datasheet's pin-compatibility matrix before PCB revision.
SerDes lanes (SRIO, PCIe, GbE) are length-matched but MUST NOT cross over or run parallel to noisy signals (DDR, switching supplies). Route SerDes on the top layer with a continuous GND reference plane below. Keep AC coupling capacitors within 4 mm of the device balls. Follow the manufacturer's hardware design guide (AN3944) for layer stack-up and impedance targets.
Thông tin tuân thủ
RoHS compliant per NXP product environmental compliance information. AEC-Q100 is not applicable - this is a communications processor, not an automotive IC. Conflict-minerals compliance verified via NXP's CMRT filings.
