PIC24FJ1024GA610-E/BG - 16-Bit MCU, 1MB Flash, 32MHz, 121-TFBGA | Microchip
MPN： PIC24FJ1024GA610-E/BG ✗ 停產PIC24FJ1024GA610-E/BG 概覽
A microcontroller (MCU) is a single-chip computer that combines a CPU core, program memory, data RAM, and peripheral interfaces (ADC, timers, communication ports) in one package. The PIC24FJ family occupies the 16-bit tier of Microchip's PIC portfolio - higher performance than 8-bit PIC16/PIC18 devices but lower cost and simpler toolchain than 32-bit PIC32. Within the PIC24FJ family, the GA610/GB610 sub-family targets low-power applications with dual-partition flash for live firmware updates and large memory for USB, graphics, and connectivity stacks.
Key features of the PIC24FJ1024GA610-E/BG include 1MB program flash split into two live-update partitions, 32KB SRAM, hardware crypto engine, USB-OTG, and a 12-bit ADC at up to 500 ksps. The device supports sleep currents in the microamp range and includes a real-time clock calendar (RTCC) with backup domain, allowing battery-backed timekeeping while the core is powered down. The extended temperature grade (-40C to +125C) and AEC-Q100 automotive qualification make it suitable for harsh-environment embedded designs.
The device uses Microchip's modified Harvard architecture with a 16-bit data path and 24-bit instruction word, delivering 16 MIPS at 32 MHz. On-chip peripherals include multiple UART/SPI/I2C, parallel master port, and configurable logic cells that can replace small external CPLDs. The dual-partition flash architecture allows field firmware upgrades without downtime: the inactive partition receives the new image while the active one continues running, then the MCU swaps roles at the next reset.
Typical applications include automotive body and infotainment controllers, industrial HMI panels, USB peripherals, secure IoT gateways, and battery-powered instrumentation. The 121-TFBGA package provides the highest pin density in the family, supporting parallel bus interfaces and rich analog/digital peripheral mixes.
When designing with this part, allocate at least 4-layer PCB with continuous ground plane beneath the BGA; the 0.8 mm pitch requires NSMD pads and microvia-in-pad for reliable assembly. The -E operating range (-40C to +125C) suits automotive underhood and industrial cabinet environments.
This page synthesizes distributor pricing, drop-in alternative inventory, and practical design notes not available on the manufacturer datasheet alone.
直接替換替代品，適用於 PIC24FJ1024GA610-E/BG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC24FJ1024GA610-E/BG （相同外形與佔位） — 差異在於 Package, ADC, Program Memory (Flash), Timers, Mounting Type.
PIC24FJ1024GB610-E/BG
✅ 直接替換📋 參考替代品（不在目錄中）
PIC24FJ1024GA610-I/BG
✅ 直接替換聯絡詢價
查看資料表 →PIC24FJ1024GA606-I/MR
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC24FJ1024GA606-E/MR
✅ 直接替換 ⚠️ 規格未經驗證✓ 有庫存
$7.36 / 單位
查看資料表 →PIC24FJ1024GA606-E/PT
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC24EP512GU810-E/BG
✅ 直接替換聯絡詢價
查看資料表 →PIC24FJ1024GA610-E/BG 最大額定值與電氣特性
| Core | PIC24F (16-bit RISC, modified Harvard) |
| CPU Speed | 32 MHz (16 MIPS) |
| Program Flash | 1 MB (dual partition) |
| SRAM | 32 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| I/O Pins | 85 |
| ADC | 12-bit |
| 工作溫度 | -40 C to +125 C (Extended -E grade) |
| 封裝 | 121-TFBGA (10x10 mm, 0.8 mm pitch) |
| 安裝類型 | Surface Mount (BGA) |
| MSL 等級 | 3 (per manufacturer datasheet) |
| RoHS 狀態 | ROHS3 Compliant |
| Family | PIC24FJ1024GA610/GB610 |
| Peripherals | USB-OTG, UART, SPI, I2C, RTCC, PMP, Crypto engine |
| AEC-Q100 | Qualified (automotive grade) |
PIC24FJ1024GA610-E/BG 121-tfbga (10x10 mm, 0.8 mm pitch) 腳位配置指南
PIC24FJ1024GA610-E/BG（121-tfbga (10x10 mm, 0.8 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： PIC24FJ1024GA610-E/BG.
請參閱 資料表 以查看完整腳位配置。
典型應用
PIC24FJ1024GA610-E/BG 適用於 6 應用s: Automotive Body Control Module, Industrial HMI Touch Panel, USB-OTG Industrial Data Logger, Secure IoT Gateway with OTA Updates, Battery-Powered Medical Monitoring Device, Smart Energy Meter with Tamper Detection.
Automotive Body Control Module
The PIC24FJ1024GA610-E/BG fits automotive body control modules requiring AEC-Q100 qualification, 85 I/O for multi-load driving, and 1MB flash for OBD-II diagnostic stacks. Its dual-partition flash enables live firmware updates via CAN without vehicle downtime, a regulatory requirement in many regions for emissions-related ECUs. Operating from 2.0V to 3.6V matches 12V battery rails post-regulation, and the -40C to +125C temperature range covers underhood and cabin environments. The hardware crypto engine supports secure boot and authenticated firmware updates required for next-generation vehicle architectures.
推薦
Industrial HMI Touch Panel
For industrial HMI touch panels, the PIC24FJ1024GA610-E/BG's 1MB flash accommodates complex graphics libraries and multi-language assets while the 32KB SRAM supports frame buffering for 320x240 color TFTs. The integrated 12-bit ADC reads resistive touch overlays without external ADC ICs, and the Parallel Master Port (PMP) directly drives most small LCD controllers. The -40C to +125C range handles factory floor ambient temperatures near motors and heaters, and the 32MHz core runs LVGL or emWin at acceptable frame rates for menu navigation.
推薦
USB-OTG Industrial Data Logger
In USB-OTG data loggers, the PIC24FJ1024GA610-E/BG benefits from being replaced with PIC24FJ1024GB610-E/BG, which adds the integrated USB-OTG transceiver for direct thumb-drive and host connectivity. The 1MB flash stores months of sensor data in CSV or binary format, while the 32KB SRAM acts as a write buffer during mass-storage operations. The 12-bit ADC captures analog sensor channels, and the RTCC timestamps each sample to second accuracy. The hardware crypto engine can sign log files for tamper-evident audit in regulated industries like pharmaceuticals and food processing.
推薦
Secure IoT Gateway with OTA Updates
The PIC24FJ1024GA610-E/BG is well-suited for secure IoT gateways because its dual-partition flash allows safe over-the-air (OTA) firmware updates without bricking the device. The 1MB partition accommodates full TCP/IP stacks plus application logic for protocols like MQTT or CoAP, while 32KB SRAM buffers network packets and TLS sessions. The integrated crypto engine accelerates AES and SHA operations that would otherwise bottleneck software implementations on a 16 MIPS core, making secure HTTPS exchanges feasible at sub-second latency on local networks.
推薦
Battery-Powered Medical Monitoring Device
For battery-powered medical monitoring, the PIC24FJ1024GA610-E/BG offers extreme low-power sleep modes in the microamp range while the RTCC continues timekeeping from a backup domain. The 12-bit ADC captures vital-sign analog signals (ECG, SpO2, temperature) with sufficient resolution for clinical-grade measurements, and the 1MB flash stores raw waveform data between wireless transmissions. The -40C to +125C range ensures operation in ambulance and outdoor environments. AES hardware acceleration secures patient data transmissions to comply with HIPAA requirements for health information privacy.
推薦
Smart Energy Meter with Tamper Detection
In smart energy meters, the PIC24FJ1024GA610-E/BG's 1MB flash stores metering firmware plus signed firmware for tamper detection, while the 32KB SRAM buffers metrology data before periodic transmission. The 12-bit ADC achieves Class 1 meter accuracy when paired with appropriate current transformers, and the crypto engine validates signed firmware images to detect physical tampering attempts. The -40C to +125C grade handles outdoor meter cabinet temperatures in desert and arctic climates. The dual-partition flash enables utility-driven firmware updates without service interruption.
推薦
推薦產品摘要
工程參考資料，適用於 PIC24FJ1024GA610-E/BG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC24FJ1024GB610-E/BG | PIC24FJ1024GA610-I/BG | PIC24FJ1024GA606-I/MR | PIC24EP512GU810-E/BG |
|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 60 MHz (70 MIPS, +338%) |
| Temperature Grade | -40C to +125C (Extended -E) | -40C to +125C | -40C to +85C (-30C upper limit) | -40C to +85C | -40C to +125C |
| USB-OTG | No (external required) | Yes (integrated) | No | No | Yes (integrated) |
| Lifecycle Status | NRND | NRND | Active | Active | Active |
主要差異化特點
- Dual-partition flash for live firmware updates (對比PIC24FJ1024GA606-I/MR)
- Extended temperature grade for automotive (對比PIC24FJ1024GA610-I/BG)
- Higher performance vs PIC24EP family alternatives (對比PIC24EP512GU810-E/BG)
設計說明
The 121-TFBGA package at 0.8 mm pitch requires 4-layer PCB with continuous ground plane directly beneath the BGA footprint. Use Non-Solder-Mask-Defined (NSMD) pads with microvia-in-pad construction for reliable assembly. Per Microchip application notes for BGA packages, via tenting is not recommended under BGA balls - allow vias to be solder-filled for improved thermal dissipation and reduced voiding during reflow.
Place 10uF + 0.1uF decoupling capacitors within 3 mm of each VDD/VDDCORE pin pair. The PIC24FJ1024GA610 uses an internal 1.8V regulator that must be enabled via configuration bits; failure to enable causes the core to remain in reset. Bulk capacitance of at least 47uF is recommended near the IC to handle USB-OTG inrush current when using the GB610 sibling variant.
Dual-partition flash requires bootloader support to function; bare-metal applications without a bootloader lose the live-update capability. The NRND lifecycle status means new designs should evaluate the PIC24FJ1024GA606 or PIC24EP512GU810 as alternatives to avoid obsolescence risk. Programming via ICSP requires proper PGECx/PGEDx pin assignment in configuration bits - default assignments differ between BG (BGA) and PT (TQFP) packages.
Estimated: At 32 MHz with all peripherals active, the PIC24FJ1024GA610-E/BG consumes approximately 25 mA core current, resulting in 75 mW dissipation at 3.3V. With a TFBGA package theta_JA of approximately 30 C/W (per Microchip datasheet family data), junction temperature rise above ambient is about 2.3 C - well within the 125 C maximum. Industrial cabinet environments with 70 C ambient still leave 50 C margin without active cooling.
合規資訊
RoHS3 compliant per JLCPCB and full-electronic.com listings. AEC-Q100 automotive qualified per Microchip product page. REACH, conflict minerals, and halogen-free status not explicitly stated in verified web data - set to unknown.