PIC24FJ1024GA610-I/BG - 16-bit 1MB Flash MCU, 100-TFBGA | Microchip
MPN： PIC24FJ1024GA610-I/BG ✗ 停產PIC24FJ1024GA610-I/BG 概覽
A 16-bit microcontroller is a microprocessor whose data path is 16 bits wide, sitting between 8-bit MCUs (lower cost, lower performance) and 32-bit MCUs (higher performance, higher power). The PIC24F family uses a modified Harvard architecture with separate program and data buses plus a 16-bit instruction set optimized for compiled C code, targeting applications that need more performance than 8-bit parts but where cost and power must remain modest. In the broader taxonomy, PIC24F belongs to Microcontroller -> Microprocessor -> Integrated Circuit -> Semiconductor.
Key features include 1 MB (1024 KB) dual-bank Flash with Live Update firmware swap, 32 KB SRAM, 8-channel DMA, five 16-bit timers, five input-capture and five output-compare/PWM modules, two I2C, three SPI, and four UART modules. The integrated 32-bit CRC, RTCC with calendar mode, and Peripheral Pin Select (PPS) provide flexibility for low-power industrial and consumer designs. Up to 85 digital I/O lines (shared with analog) and a 10/12-bit ADC with up to 24 channels allow dense sensor interfaces.
Typical applications include industrial control panels with segmented LCD or TFT displays, portable medical monitoring devices, USB-connected data loggers, low-power IoT edge nodes, and consumer appliances requiring USB OTG and capacitive touch (mTouch). The TFBGA-100 package (10x10 mm, 0.5 mm pitch) supports compact handheld form factors.
When designing with this MCU, allocate sufficient decoupling (100 nF on every VDD/VSS pair plus bulk) and follow Microchip's trace-length rules for USB DP/DN to maintain 2.0 full-speed compliance. Live Update firmware requires the dual-partition boot sequence described in the Microchip application note library - omitting the swap protocol leaves the device bricked during failed updates. The BG (TFBGA-100) package is more challenging to rework than the PT (TQFP-100) variant, so choose the PT footprint for prototypes that may need socket rework.
直接替換替代品，適用於 PIC24FJ1024GA610-I/BG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC24FJ1024GA610-I/BG （相同外形與佔位） — 差異在於 Package, ADC, Core Architecture, Operating Temperature, Program Memory (Flash).
PIC24FJ1024GB610-I/BG
✅ 直接替換聯絡詢價
查看資料表 →PIC24FJ1024GA610T-I/BG
✅ 直接替換📋 參考替代品（不在目錄中）
PIC24FJ1024GA610-E/BG
✅ 直接替換聯絡詢價
查看資料表 →PIC24FJ1024GB610-I/BG
✅ 直接替換聯絡詢價
查看資料表 →PIC24FJ1024GA610-I/PT
✅ 直接替換📋 參考替代品（不在目錄中）
PIC24FJ1024GA610-I/BG 最大額定值與電氣特性
| CPU Architecture | 16-bit modified Harvard |
| CPU Family | PIC24F |
| Instruction Set | 16-bit |
| Max CPU Speed | 32 MHz (8 MIPS with 4x PLL) |
| Program Memory (Flash) | 1024 KB (1 MB) dual partition |
| Data Memory (SRAM) | 32 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| I/O Pins | 85 (max) |
| ADC | 10/12-bit, up to 24 channels |
| USB | USB 2.0 Full-Speed OTG |
| Timers | 5 x 16-bit |
| Input Capture / Output Compare / PWM | 5 / 5 (16-bit) |
| UART | 4 |
| SPI | 3 |
| I2C | 2 |
| DMA Channels | 8 |
| RTCC | Yes, with calendar mode |
| 工作溫度 | -40C to +85C (industrial, -I) |
| 封裝 | 100-ball TFBGA (BG), 10x10 mm |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| Live Update / Dual-Bank Flash | Yes |
PIC24FJ1024GA610-I/BG 100-ball tfbga (bg), 10x10 mm 腳位配置指南
PIC24FJ1024GA610-I/BG（100-ball tfbga (bg), 10x10 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： PIC24FJ1024GA610-I/BG.
請參閱 資料表 以查看完整腳位配置。
典型應用
PIC24FJ1024GA610-I/BG 適用於 6 應用s: Industrial HMI Control Panels, Portable Medical Monitoring Devices, USB-Connected Data Loggers, Low-Power IoT Edge Nodes, Consumer Appliances with USB OTG, Capacitive Touch HMI with mTouch.
Industrial HMI Control Panels
The PIC24FJ1024GA610-I/BG fits industrial HMI panels because it combines 1 MB Flash for graphics assets and multi-language UI strings with 32 KB SRAM for frame buffers. Its 85 I/O pins drive segmented LCDs, keypads, and LEDs directly. Live Update dual-partition Flash allows safe OTA firmware rollout on factory floors without downtime. The 32 MHz core renders menus quickly while XLP modes keep standby under 1 uA between button presses.
推薦
Portable Medical Monitoring Devices
Battery-powered medical devices such as pulse oximeters, glucose meters, and portable ECG monitors benefit from the PIC24FJ1024GA610-I/BG's XLP deep-sleep current and 10/12-bit ADC accuracy for sensor readout. The 1 MB Flash stores waveform captures and lookup tables, while USB OTG enables data transfer to a clinic PC. The -I industrial temperature range covers body-worn and clinical environments, and the RTCC with VBAT domain keeps timestamps accurate across battery swaps.
推薦
USB-Connected Data Loggers
The PIC24FJ1024GA610-I/BG's integrated USB 2.0 full-speed OTG controller makes it ideal for USB stick-style data loggers used in environmental monitoring and industrial telemetry. The 1 MB Flash stores weeks of sensor samples, while the 8-channel DMA offloads ADC and UART transfers without CPU intervention. Up to four UARTs and three SPI buses let the device aggregate multiple sensor channels, and the 32 MHz core handles CSV encoding and USB transfers in real time.
推薦
Low-Power IoT Edge Nodes
IoT edge nodes for smart buildings and asset tracking leverage the PIC24FJ1024GA610-I/BG's combination of 1 MB Flash for MQTT/TLS stacks, XLP sleep modes below 1 uA, and multiple low-power serial interfaces (2x I2C, 3x SPI, 4x UART) for sensor and radio connectivity. Live Update firmware lets vendors push security patches to deployed units without service windows. The 85 I/O lines accommodate many digital sensors in a single node.
推薦
Consumer Appliances with USB OTG
Consumer appliances such as coffee machines, smart kitchen hubs, and connected washing machines use the PIC24FJ1024GA610-I/BG for USB OTG firmware update ports and capacitive touch (mTouch) user interfaces. The 1 MB Flash accommodates multiple languages and graphics assets, while 85 I/O pins drive motor controllers and sensor feedback loops. The XLP modes keep standby power compliant with energy-star regulations.
推薦
Capacitive Touch HMI with mTouch
The PIC24FJ1024GA610-I/BG's integrated mTouch hardware and CTMU peripheral enable robust capacitive touch keypads and sliders for white-goods and industrial front panels. Its 1 MB Flash stores multi-language UI strings and gesture libraries, while 32 KB SRAM supports touch decoding algorithms. The peripheral pin select (PPS) feature lets designers remap touch channels to nearly any I/O, simplifying PCB layout for irregular panel shapes.
推薦
推薦產品摘要
工程參考資料，適用於 PIC24FJ1024GA610-I/BG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC24FJ1024GB610-I/BG | PIC24FJ1024GA610T-I/BG | PIC24FJ1024GA610-E/BG | PIC24FJ1024GA610-I/PT |
|---|---|---|---|---|---|
| Package | 100-ball TFBGA (BG) | 100-ball TFBGA (BG) - same | 100-ball TFBGA (BG) - same | 100-ball TFBGA (BG) - same | TQFP-100 (PT) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 32 MHz (8 MIPS) | 32 MHz (8 MIPS) | 32 MHz (8 MIPS) | 32 MHz (8 MIPS) | 32 MHz (8 MIPS) |
| Program Memory | 1024 KB Flash | 1024 KB Flash | 1024 KB Flash | 1024 KB Flash | 1024 KB Flash |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +125C (extended) | -40C to +85C |
| Crypto Engine | No | Yes (AES, RNG) | No | No | No |
| Dual-Partition Live Update Flash | Yes | Yes | Yes | Yes | Yes |
主要差異化特點
- 1 MB dual-partition Flash with Live Update OTA (對比PIC24FJ1024GB610-I/BG)
- Industrial temperature range with TFBGA footprint (對比PIC24FJ1024GA610-E/BG)
- Hand-rework friendly TQFP-100 variant available (對比PIC24FJ1024GA610-I/PT)
設計說明
Place a 100 nF 0402 decoupling capacitor within 2 mm of every VDD/VSS pair on the PIC24FJ1024GA610-I/BG, plus a single 10 uF bulk capacitor near the power-pin cluster. The 100-ball TFBGA package uses 0.5 mm pitch - escape traces through the inner layers using microvias (8 mil pad, 4 mil drill). Add a ground pour beneath the BGA stitched with thermal vias every 2 mm to reduce ground bounce and improve thermal dissipation during full-speed USB operation.
Do not skip the Live Update firmware swap protocol when implementing OTA updates. According to Microchip application notes, the dual-partition structure requires the bootloader to verify the new image CRC32, mark it as active, and only then swap the bank pointer. Omitting the CRC check leaves the device bricked after a corrupted update. Always test the swap path on bench units before deploying to production fleets.
For USB 2.0 full-speed compliance on the PIC24FJ1024GA610-I/BG, route the D+ and D- traces as a 90-ohm differential pair with length matching within 2 mm. Keep total trace length under 50 mm and avoid routing near high-frequency switching nodes. Place the 27-ohm series damping resistors within 4 mm of the MCU pins. The VUSB pin requires a 0.1 uF decoupling capacitor regardless of whether USB bus power is used.
Estimated: at 32 MHz active core, 3.3 V supply, and 85% I/O toggle load, the PIC24FJ1024GA610-I/BG dissipates approximately 90 mW (estimated based on typical PIC24F XLP core current of ~25 mA). The 100-ball TFBGA has theta-JA around 35 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of ~3 C above ambient - well within limits. In enclosed housings with poor airflow, derate ambient by 10 C to be safe.
合規資訊
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; for automotive designs choose PIC24FJ1024GA610-E/BG with extended temperature range. Lead-free and halogen-free packaging.
