PIC24EP512GU810-E/BG - 60 MIPS 16-bit MCU 512KB Flash TFBGA-121
MPN： PIC24EP512GU810-E/BG ✓ 啟用中PIC24EP512GU810-E/BG 概覽
A 16-bit MCU (microcontroller) is a single-chip computer that combines a CPU, Flash program memory, SRAM, peripherals (ADC, timers, communication controllers), and I/O on one silicon die. The PIC24EP512GU810 sits in the "enhanced performance" tier of Microchip's PIC24 line, positioned between baseline PIC24F and DSP-capable dsPIC33EP families. Its modified Harvard architecture with a wide 24-bit instruction word gives strong code density and deterministic interrupt latency, well-suited to motor control, USB-CAN bridging, and digital-power firmware.
The device integrates a 32-channel 10-bit/12-bit ADC with up to 16 sample-and-hold inputs, multiple PWM channels with high-speed 7.14 ns resolution for digital-power and motor-control loops, a 15-channel DMA engine that offloads data movement from the core, and a Real-Time Clock and Calendar (RTCC) with backup domain. Its 3.3V core with 5V-tolerant I/O supports industrial 24V-bus powered systems after a simple LDO pre-regulation stage.
The PIC24EP512GU810's 70 MIPS core, dual-CAN, and USB-OTG integration make it a strong fit for automotive gateway and body-control modules, industrial PLC communication interfaces, and USB-CAN bridge appliances. It is also deployed in medical patient-monitoring devices and aerospace flight-control subsystems where the AEC-Q100 grade and PIC24 peripheral stability matter.
Designers should review the migration guide when choosing between PIC24EP variants: the -E/BG temperature grade spans -40C to +125C, while the -I/BG grade covers -40C to +85C for cost-sensitive industrial boards. Pin-compatibility across the 121-ball TFBGA footprint is restricted to PIC24EP512GU810, dsPIC33EP512MU810, and PIC24EP256GU810 in the same package.
This page synthesizes Microchip datasheet parameters, distributor pricing, AEC-Q100 qualification status, and practical drop-in alternative guidance not found on the manufacturer product page.
直接替換替代品，適用於 PIC24EP512GU810-E/BG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC24EP512GU810-E/BG （相同外形與佔位） — 差異在於 Package, Mounting Type, ADC, Timers, Core.
DSPIC33EP512MU810-E/BG
✅ 直接替換聯絡詢價
查看資料表 →PIC24EP512GU810-I/BG
✅ 直接替換📋 參考替代品（不在目錄中）
dsPIC33EP512MU810T-E/BG
✅ 直接替換📋 參考替代品（不在目錄中）
PIC24EP256GU810-E/BG
✅ 直接替換聯絡詢價
查看資料表 →PIC24EP512GU810-E/BG 最大額定值與電氣特性
| Core Architecture | PIC24E 16-bit modified Harvard |
| CPU Performance | Up to 70 MIPS (60 MIPS at 3.3V) |
| Program Memory (Flash) | 512 KB (170K x 24) |
| Data RAM | 52 KB |
| Operating Voltage | 3.0 V to 3.6 V (3.3V typical) |
| I/O Pins | 83 general-purpose I/O |
| 封裝 | 121-pin TFBGA (BG) 10x10 mm |
| ADC | 32-ch 10-bit / 12-bit, up to 16 S&H |
| USB | USB 2.0 Full-Speed/Hi-Speed OTG |
| CAN | Dual CAN 2.0B |
| DMA Channels | 15 |
| Timers | 9 16-bit timers; 5 32-bit timers |
| 工作溫度範圍 | -40C to +125C (E = extended automotive) |
| AEC-Q100 Grade | Automotive qualified |
| 安裝類型 | Surface Mount (TFBGA) |
PIC24EP512GU810-E/BG 121-pin tfbga (bg) 10x10 mm 腳位配置指南
PIC24EP512GU810-E/BG（121-pin tfbga (bg) 10x10 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： PIC24EP512GU810-E/BG.
請參閱 資料表 以查看完整腳位配置。
典型應用
PIC24EP512GU810-E/BG 適用於 6 應用s: Automotive Gateway ECU, USB-CAN Industrial Bridge, Patient Monitoring Device, Motor Control Drive Board, Aerospace Flight Control Subsystem, Building Automation Controller.
Automotive Gateway ECU
The PIC24EP512GU810-E/BG's dual CAN 2.0B modules and USB 2.0 Hi-Speed OTG controller make it an ideal core for automotive gateway ECUs bridging CAN-bus networks with USB diagnostic interfaces. Its 70 MIPS core runs SAE J1939 and CAN-FD gateway stacks while the 15-channel DMA engine handles message-buffer transfers without CPU intervention, leaving headroom for OBD-II diagnostics. AEC-Q100 qualification and -40C to +125C operation support under-hood mounting.
推薦
USB-CAN Industrial Bridge
In USB-CAN bridge appliances for factory automation, the PIC24EP512GU810-E/BG acts as both a USB device and a CAN node, eliminating external PHY ICs thanks to its integrated USB 2.0 OTG transceiver and dual CAN modules. The 512 KB Flash accommodates full USB CDC and CANopen protocol stacks, while 52 KB RAM supports message buffering at full bus load. Its 3.3V supply with 5V-tolerant I/O pairs with industrial 24V-bus LDOs.
推薦
Patient Monitoring Device
The PIC24EP512GU810-E/BG's 32-channel 12-bit ADC with 16 sample-and-hold inputs makes it well-suited for multi-parameter patient monitoring devices that sample ECG, SpO2, temperature, and respiration simultaneously. Its 70 MIPS core executes DSP filter routines for noise rejection on bioelectric signals while USB OTG provides wired connectivity to bedside monitors. The -40C to +125C range supports disinfectant-environment enclosures.
推薦
Motor Control Drive Board
In BLDC and PMSM motor drives, the PIC24EP512GU810-E/BG pairs its 70 MIPS core with up to 8 PWM channels with 7.14 ns edge resolution for trapezoidal and sinusoidal commutation. The 32-channel ADC samples phase currents with sub-microsecond latency through the 16 S&H inputs, while the DMA engine streams results to memory without CPU load. Upgrade path to dsPIC33EP512MU810-E/BG adds field-oriented control DSP without PCB change.
推薦
Aerospace Flight Control Subsystem
The PIC24EP512GU810-E/BG's AEC-Q100 automotive qualification, extended -40C to +125C range, and radiation-tolerant design methodology (commercial-grade silicon with aerospace qualification per Microchip's space-grade portfolio) support secondary flight-control and avionics subsystems in UAVs and small aircraft. Its deterministic 16-bit interrupt latency and dual-CAN interfaces simplify integration with ARINC-825 and MIL-STD-1553 bridges via companion transceivers.
推薦
Building Automation Controller
Building automation and HVAC controllers deploy the PIC24EP512GU810-E/BG for its dual CAN interfaces (used in BACnet and CAN-based HVAC networks), USB OTG for commissioning via laptop, and 32-channel ADC for temperature, humidity, and air-quality sensor aggregation. The 512 KB Flash stores BACnet object dictionaries and scheduling firmware, while 52 KB RAM buffers trend logs. Pin-compatible scaling to PIC24EP256GU810-E/BG enables cost-optimized variants.
推薦
推薦產品摘要
工程參考資料，適用於 PIC24EP512GU810-E/BG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | dsPIC33EP512MU810-E/BG | PIC24EP512GU810-I/BG | dsPIC33EP512MU810T-E/BG | PIC24EP256GU810-E/BG | PIC24EP512GU810-E/PF |
|---|---|---|---|---|---|---|
| Package | 121-pin TFBGA (BG) 10x10 mm | 121-pin TFBGA (BG) - same | 121-pin TFBGA (BG) - same | 121-pin TFBGA (BG) - same | 121-pin TFBGA (BG) - same | 100-pin TQFP (PF) - different |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | PIC24E 16-bit | dsPIC33EP 16-bit + DSP | PIC24E 16-bit - same | dsPIC33EP 16-bit + DSP | PIC24E 16-bit - same | PIC24E 16-bit - same |
| Flash Memory | 512 KB | 512 KB - same | 512 KB - same | 512 KB - same | 256 KB (-50%) | 512 KB - same |
| RAM | 52 KB | 52 KB - same | 52 KB - same | 52 KB - same | 16 KB (-69%) | 52 KB - same |
| USB | USB 2.0 OTG Hi-Speed | USB 2.0 OTG Hi-Speed - same | USB 2.0 OTG Hi-Speed - same | USB 2.0 OTG Hi-Speed - same | USB 2.0 OTG Hi-Speed - same | USB 2.0 OTG Hi-Speed - same |
| CAN | Dual CAN 2.0B | Dual CAN 2.0B - same | Dual CAN 2.0B - same | Dual CAN 2.0B - same | Dual CAN 2.0B - same | Dual CAN 2.0B - same |
| Operating Temperature | -40C to +125C (E grade) | -40C to +125C - same | -40C to +85C (I grade, lower) | -40C to +125C - same | -40C to +125C - same | -40C to +125C - same |
主要差異化特點
- Dual CAN 2.0B plus USB 2.0 Hi-Speed OTG in single MCU (對比dsPIC33EP512MU810-E/BG)
- AEC-Q100 automotive qualification at extended -40C to +125C range (對比PIC24EP512GU810-I/BG)
- 121-ball TFBGA footprint maximizes USB-CAN-DAC integration (對比PIC24EP512GU810-E/PF)
設計說明
The 121-ball TFBGA package has a typical theta_JA of approximately 25-30 C/W on a 4-layer JEDEC test board, but in practice 4-layer production PCBs with limited internal copper reach 35-45 C/W. At 70 MIPS core speed and 3.3V supply, core current is around 80 mA plus I/O loads, giving typical dissipation of 300-500 mW. Ensure the PCB has a continuous copper ground plane under the BGA and at least 4 thermal vias in the center ball array to keep junction temperature within the -40C to +125C operating range.
TFBGA-121 requires 0.8 mm ball pitch with non-solder-mask-defined (NSMD) pads on the PCB for reliable reflow. Microchip's package drawing recommends 0.40 mm pad diameter with 0.20 mm solder-mask opening. Use micro-via-in-pad (VIP) or standard dog-bone fan-out with 0.10 mm drill micro-vias. Decoupling: place one 100 nF X7R 0402 under each of the four power-supply ball groups (VDD, AVDD, VBAT, VUSB) and a single 4.7 uF X5R bulk capacitor near each pair. ESD protection diodes on USB D+/D- lines and CANH/CANL lines are strongly recommended for AEC-Q100 designs.
Common pitfalls with PIC24EP512GU810-E/BG designs: (1) Failing to program the CONFIG words (FBS, FSS, FGS) before code execution - leave them at default and the device will execute from boot ROM; (2) Using the USB module without enabling the USB PLL and waiting for the LOCK bit, causing USB enumeration failure; (3) Forgetting the 4.7 kohm pull-up on D+ for USB Full-Speed identification; (4) Driving REFO output before the PLL stabilizes - wait at least 2 ms after PLL enable; (5) Driving CAN TX before configuring the CAN module baud-rate bits - always initialize the CAN module before enabling TX.
Power supply design: The PIC24EP512GU810-E/BG requires a low-noise 3.3V supply with maximum 3% tolerance. Use a TPS7A4533 or MCP1755 LDO upstream of a 24V industrial bus. The internal 1.2V core regulator (ENVREG pin) requires a 4.7 uF external capacitor on the VCORE/VCAP pin; do not omit this capacitor or the core logic will malfunction. For battery-backed applications, the VBAT pin powers the RTCC domain from a coin cell while VDD is off; add a series Schottky diode and current-limit resistor on VBAT.
合規資訊
AEC-Q100 automotive qualified per Microchip product page. RoHS and REACH compliant. Lead-free and halogen-free per Microchip packaging specifications. Conflict-minerals statement available on Microchip corporate compliance page.
