PIC32MX150F256LT-I/GJX - 32-bit 50MHz 256KB Flash MCU 100-TFBGA
MPN： PIC32MX150F256LT-I/GJX ✓ 啟用中PIC32MX150F256LT-I/GJX 概覽
A PIC32MX-series microcontroller is a 32-bit MIPS-based MCU designed for embedded control applications requiring higher performance than 8-bit or 16-bit alternatives while retaining Microchip's MPLAB ecosystem compatibility. The PIC32MX family sits within the broader PIC32 product line, which itself extends Microchip's classic PIC architecture into 32-bit territory for applications ranging from industrial HMI to consumer audio. The M4K core is a Harvard-architecture, 5-stage pipeline MIPS32 core with hardware multiply/divide and a single-cycle MAC for DSP workloads.
The PIC32MX150F256LT-I/GJX includes the standard PIC32MX1xx/2xx peripheral set: up to 85 I/O pins, multiple UART, SPI and I2C interfaces, a 10-bit ADC with up to 1 Msps conversion rate, a Parallel Master Port (PMP) for graphics or external memory, an I2S interface for digital audio, a Charge Time Measurement Unit (CTMU) for capacitive touch, and a 16-bit Parallel Port. The 256 KB Flash is single-cycle accessible from the prefetch module, enabling zero-wait-state execution at 50 MHz from Flash, and the 32 KB SRAM supports DMA transfers between peripherals and memory without CPU intervention.
Operating voltage is 2.3 V to 3.6 V, and the part supports a wide range of clock sources including an 8 MHz internal RC oscillator, an external crystal up to 50 MHz, and the on-chip PLL for flexible frequency scaling. Debug is supported via Microchip's standard 2-wire ICSP interface using MPLAB Snap, PICkit 4, MPLAB ICD 4, or MPLAB REAL ICE in-circuit emulators. The 100-TFBGA package offers the smallest footprint in the PIC32MX150 family but requires X-ray inspection or rework-grade soldering for prototypes.
Typical applications include industrial HMI panels, USB and CAN bridges, low-power audio peripherals, capacitive touch keypads, and motor control supplementary processors. For new designs requiring this pin count and memory density, the 100-TQFP (PT) or 100-QFN (MR) packages of the same PIC32MX150F256L die are usually preferred because they are easier to assemble and rework.
直接替換替代品，適用於 PIC32MX150F256LT-I/GJX — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC32MX150F256LT-I/GJX （相同外形與佔位） — 差異在於 ADC, Package, Core Architecture, UART Modules, DMA Channels.
PIC32MX150F256LT-50I/GJX
✅ 直接替換聯絡詢價
查看資料表 →PIC32MX250F256LT-50I/GJX
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
PIC32MX130F256LT-I/GJX
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
PIC32MX150F256HT-I/MR
✅ 直接替換聯絡詢價
查看資料表 →PIC32MX150F256LT-I/GJX 最大額定值與電氣特性
| Core | MIPS32 M4K (32-bit) |
| Maximum CPU Clock | 50 MHz |
| Flash Memory | 256 KB (256K x 8) |
| SRAM | 32 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| I/O Pins | 85 |
| 封裝 | 100-TFBGA (7x7 mm) |
| 工作溫度 | -40C to +85C (Industrial) |
| ADC | 10-bit, up to 1 Msps |
| Communication Interfaces | UART, SPI, I2C, I2S, PMP |
| DMA Channels | Yes |
| Special Features | CTMU (Capacitive Touch), PMP, I2S |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| MSL 等級 | 3 (per JEDEC J-STD-020, reflow at 260C) |
PIC32MX150F256LT-I/GJX 100-tfbga (7x7 mm) 腳位配置指南
PIC32MX150F256LT-I/GJX（100-tfbga (7x7 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： PIC32MX150F256LT-I/GJX.
請參閱 資料表 以查看完整腳位配置。
典型應用
PIC32MX150F256LT-I/GJX 適用於 6 應用s: Industrial Human-Machine Interface (HMI), Capacitive Touch Keypads, Digital Audio Peripherals (I2S), USB-to-UART / USB-to-SPI Bridge, Low-Power Sensor Hubs, Motor Control Supplementary Processor.
Industrial Human-Machine Interface (HMI)
The PIC32MX150F256LT-I/GJX is well matched to small industrial HMI panels because of its 85 GPIO count, Parallel Master Port (PMP), and 256 KB Flash. The PMP block can drive character LCDs, TFT modules or external SRAM without glue logic, while 85 GPIO lets a designer route keypad scanning, LED drivers and rotary encoders without I/O expanders. Compared with 8-bit MCUs, the 50 MHz MIPS32 core handles anti-aliased menu rendering with overhead left for serial protocol stacks. The 32 KB SRAM is enough for double-buffered displays up to 320x240 with 16-bit color depth.
推薦
Capacitive Touch Keypads
The PIC32MX150F256LT-I/GJX integrates Microchip's Charge Time Measurement Unit (CTMU), which measures capacitance to sub-picofarad resolution using a constant current source and timer capture. Together with the 32 KB SRAM, this lets the firmware run a 32-key touch matrix plus gesture recognition at 50 Hz refresh without DMA. The 100-TFBGA package is appropriate when the keypad PCB is constrained to a thin strip behind a glass overlay. Industrial -40C to +85C support is required for white goods, automotive interiors, and outdoor access control panels.
推薦
Digital Audio Peripherals (I2S)
The PIC32MX150F256LT-I/GJX integrates an I2S interface that streams 16/32-bit PCM audio to external DACs and codecs at standard 44.1/48 kHz rates. With 32 KB SRAM, the MCU can buffer approximately 170 ms of stereo 16-bit 48 kHz audio while leaving headroom for control-plane tasks. Designers using the part for headphone amplifiers or USB-to-I2S bridges benefit from 50 MHz MIPS performance for software volume, EQ and dynamics processing. DMA moves samples between the I2S peripheral and RAM without CPU intervention, which keeps the audio path glitch-free.
推薦
USB-to-UART / USB-to-SPI Bridge
For designers who need a non-USB PIC32 to act as a peripheral-side bridge to a host USB port, the PIC32MX150F256LT-I/GJX provides the UART/SPI/I2C interfaces plus DMA to keep the host-side traffic flowing. Although this specific variant lacks the on-chip USB peripheral, the abundant Flash and SRAM let it run a software USB stack on a slower UART-attached transceiver, or pair with an external USB-to-serial chip such as the MCP2200. The 100-TFBGA package suits compact dongle designs where a TQFP would be too tall.
推薦
Low-Power Sensor Hubs
The PIC32MX150F256LT-I/GJX supports multiple low-power modes including Sleep, Idle and Deep Sleep with retention, allowing sensor-hub designs to draw single-digit mA average current while periodically reading I2C sensors. The 32 KB SRAM is enough to buffer sensor frames between wakes, while 256 KB Flash accommodates protocol stacks such as Modbus or BLE host code. The 10-bit ADC and CTMU enable ratiometric measurements of resistive bridges and capacitive humidity sensors without external signal conditioning.
推薦
Motor Control Supplementary Processor
In dual-MCU motor drives the PIC32MX150F256LT-I/GJX typically handles HMI, fault logging and communication while a dedicated dsPIC33 handles the real-time control loop. The 50 MHz MIPS core and 32 KB SRAM are sufficient for UART/CAN-style command parsing, encoder pulse counting and EEPROM emulation using internal Flash. Designers using the BGA package integrate this supervisory MCU directly under the keypad PCB next to the power-stage MCU, saving vertical space in compact inverter modules.
推薦
推薦產品摘要
工程參考資料，適用於 PIC32MX150F256LT-I/GJX — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC32MX150F256LT-50I/GJX | PIC32MX250F256LT-50I/GJX | PIC32MX130F256LT-I/GJX | PIC32MX150F256HT-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-QFN (12x12 mm) - alternative |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Max CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB 2.0 FS | No | No | Yes (+1 peripheral) | No | No |
| I2S / CTMU | Yes | Yes | Yes | No (MX130 omits CTMU/I2S) | Yes |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
主要差異化特點
- Native I2S and CTMU peripherals in a 100-ball BGA (對比PIC32MX130F256LT-I/GJX)
- Compact 7x7 mm BGA footprint for space-constrained designs (對比PIC32MX150F256HT-I/MR)
- Drop-in upgrade path to USB without PCB redesign (對比PIC32MX250F256LT-50I/GJX)
設計說明
The 100-TFBGA package uses 0.65 mm ball pitch on a 7x7 mm body; escape routing on a 4-layer PCB requires 0.10 mm (4 mil) trace width and 0.10 mm (4 mil) trace spacing. Escape the outer two rows with via-in-pad or staggered micro-vias, and provide at least 4 ground balls redistributed into a solid reference plane to reduce inductance on VDDCORE decoupling. A 0.1 uF X7R ceramic plus 4.7 uF X5R bulk capacitor should sit within 3 mm of every VDDCORE/AVDD pair.
Estimated: at maximum sustained 50 MHz activity and 3.3 V supply, internal core current is roughly 30 mA, so power dissipation is about 100 mW. With a typical 100-TFBGA theta_JA in the 40-50 C/W range (Microchip family datasheet typical values), junction temperature rise is approximately 5C above ambient. For applications in enclosed enclosures with limited airflow, derate clock speed above 70C ambient to stay inside the 85C industrial limit.
Do not confuse the 'L' device suffix (100-pin low-pin-count) with the 'H' device suffix (64-pin). The PIC32MX150F256L family is the 100-pin variant and includes PMP, while the PIC32MX150F128H is the 64-pin variant and lacks PMP. Programming via ICSP requires dedicated PGEDx/PGECx pairs that overlap with general-purpose I/O on most packages - reserve these pins in your schematic or disable them as outputs.
合規資訊
RoHS and lead-free confirmed by Microchip product page. AEC-Q100 not applicable for industrial-grade MCU; AEC-Q100 variants are available in the PIC32MX1xx family as separate order codes.