PIC32MX150F256LT-I/GJX - 32-bit 50MHz 256KB Flash MCU 100-TFBGA
MPN: PIC32MX150F256LT-I/GJX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.18 | $6.18 |
| 10 | $5.56 | $55.60 |
| 100 | $4.74 | $474.00 |
| 500 | $4.27 | $2,135.00 |
| 1,000 | $3.79 | $3,790.00 |
PIC32MX150F256LT-I/GJX Overview
A PIC32MX-series microcontroller is a 32-bit MIPS-based MCU designed for embedded control applications requiring higher performance than 8-bit or 16-bit alternatives while retaining Microchip's MPLAB ecosystem compatibility. The PIC32MX family sits within the broader PIC32 product line, which itself extends Microchip's classic PIC architecture into 32-bit territory for applications ranging from industrial HMI to consumer audio. The M4K core is a Harvard-architecture, 5-stage pipeline MIPS32 core with hardware multiply/divide and a single-cycle MAC for DSP workloads.
The PIC32MX150F256LT-I/GJX includes the standard PIC32MX1xx/2xx peripheral set: up to 85 I/O pins, multiple UART, SPI and I2C interfaces, a 10-bit ADC with up to 1 Msps conversion rate, a Parallel Master Port (PMP) for graphics or external memory, an I2S interface for digital audio, a Charge Time Measurement Unit (CTMU) for capacitive touch, and a 16-bit Parallel Port. The 256 KB Flash is single-cycle accessible from the prefetch module, enabling zero-wait-state execution at 50 MHz from Flash, and the 32 KB SRAM supports DMA transfers between peripherals and memory without CPU intervention.
Operating voltage is 2.3 V to 3.6 V, and the part supports a wide range of clock sources including an 8 MHz internal RC oscillator, an external crystal up to 50 MHz, and the on-chip PLL for flexible frequency scaling. Debug is supported via Microchip's standard 2-wire ICSP interface using MPLAB Snap, PICkit 4, MPLAB ICD 4, or MPLAB REAL ICE in-circuit emulators. The 100-TFBGA package offers the smallest footprint in the PIC32MX150 family but requires X-ray inspection or rework-grade soldering for prototypes.
Typical applications include industrial HMI panels, USB and CAN bridges, low-power audio peripherals, capacitive touch keypads, and motor control supplementary processors. For new designs requiring this pin count and memory density, the 100-TQFP (PT) or 100-QFN (MR) packages of the same PIC32MX150F256L die are usually preferred because they are easier to assemble and rework.
Drop-in alternatives for PIC32MX150F256LT-I/GJX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX150F256LT-I/GJX (same form factor and footprint) — differing in ADC, Package, Core Architecture, UART Modules, DMA Channels.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX150F256LT-50I/GJX
✅ Drop-In✓ In Stock
$4.21 / Unit
View Datasheet →PIC32MX250F256LT-50I/GJX
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC32MX130F256LT-I/GJX
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC32MX150F256HT-I/MR
✅ Drop-In✓ In Stock
$5.45 / Unit
View Datasheet →PIC32MX150F256LT-I/GJX Maximum Ratings & Electrical Characteristics
| Core | MIPS32 M4K (32-bit) |
| Maximum CPU Clock | 50 MHz |
| Flash Memory | 256 KB (256K x 8) |
| SRAM | 32 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| I/O Pins | 85 |
| Package | 100-TFBGA (7x7 mm) |
| Operating Temperature | -40C to +85C (Industrial) |
| ADC | 10-bit, up to 1 Msps |
| Communication Interfaces | UART, SPI, I2C, I2S, PMP |
| DMA Channels | Yes |
| Special Features | CTMU (Capacitive Touch), PMP, I2S |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020, reflow at 260C) |
PIC32MX150F256LT-I/GJX 100-tfbga (7x7 mm) Pin Configuration Guide
Pin configuration for PIC32MX150F256LT-I/GJX (100-tfbga (7x7 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX150F256LT-I/GJX.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX150F256LT-I/GJX is suitable for 6 applications: Industrial Human-Machine Interface (HMI), Capacitive Touch Keypads, Digital Audio Peripherals (I2S), USB-to-UART / USB-to-SPI Bridge, Low-Power Sensor Hubs, Motor Control Supplementary Processor.
Industrial Human-Machine Interface (HMI)
The PIC32MX150F256LT-I/GJX is well matched to small industrial HMI panels because of its 85 GPIO count, Parallel Master Port (PMP), and 256 KB Flash. The PMP block can drive character LCDs, TFT modules or external SRAM without glue logic, while 85 GPIO lets a designer route keypad scanning, LED drivers and rotary encoders without I/O expanders. Compared with 8-bit MCUs, the 50 MHz MIPS32 core handles anti-aliased menu rendering with overhead left for serial protocol stacks. The 32 KB SRAM is enough for double-buffered displays up to 320x240 with 16-bit color depth.
Recommended
Capacitive Touch Keypads
The PIC32MX150F256LT-I/GJX integrates Microchip's Charge Time Measurement Unit (CTMU), which measures capacitance to sub-picofarad resolution using a constant current source and timer capture. Together with the 32 KB SRAM, this lets the firmware run a 32-key touch matrix plus gesture recognition at 50 Hz refresh without DMA. The 100-TFBGA package is appropriate when the keypad PCB is constrained to a thin strip behind a glass overlay. Industrial -40C to +85C support is required for white goods, automotive interiors, and outdoor access control panels.
Recommended
Digital Audio Peripherals (I2S)
The PIC32MX150F256LT-I/GJX integrates an I2S interface that streams 16/32-bit PCM audio to external DACs and codecs at standard 44.1/48 kHz rates. With 32 KB SRAM, the MCU can buffer approximately 170 ms of stereo 16-bit 48 kHz audio while leaving headroom for control-plane tasks. Designers using the part for headphone amplifiers or USB-to-I2S bridges benefit from 50 MHz MIPS performance for software volume, EQ and dynamics processing. DMA moves samples between the I2S peripheral and RAM without CPU intervention, which keeps the audio path glitch-free.
Recommended
USB-to-UART / USB-to-SPI Bridge
For designers who need a non-USB PIC32 to act as a peripheral-side bridge to a host USB port, the PIC32MX150F256LT-I/GJX provides the UART/SPI/I2C interfaces plus DMA to keep the host-side traffic flowing. Although this specific variant lacks the on-chip USB peripheral, the abundant Flash and SRAM let it run a software USB stack on a slower UART-attached transceiver, or pair with an external USB-to-serial chip such as the MCP2200. The 100-TFBGA package suits compact dongle designs where a TQFP would be too tall.
Recommended
Low-Power Sensor Hubs
The PIC32MX150F256LT-I/GJX supports multiple low-power modes including Sleep, Idle and Deep Sleep with retention, allowing sensor-hub designs to draw single-digit mA average current while periodically reading I2C sensors. The 32 KB SRAM is enough to buffer sensor frames between wakes, while 256 KB Flash accommodates protocol stacks such as Modbus or BLE host code. The 10-bit ADC and CTMU enable ratiometric measurements of resistive bridges and capacitive humidity sensors without external signal conditioning.
Recommended
Motor Control Supplementary Processor
In dual-MCU motor drives the PIC32MX150F256LT-I/GJX typically handles HMI, fault logging and communication while a dedicated dsPIC33 handles the real-time control loop. The 50 MHz MIPS core and 32 KB SRAM are sufficient for UART/CAN-style command parsing, encoder pulse counting and EEPROM emulation using internal Flash. Designers using the BGA package integrate this supervisory MCU directly under the keypad PCB next to the power-stage MCU, saving vertical space in compact inverter modules.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX150F256LT-I/GJX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX150F256LT-50I/GJX | PIC32MX250F256LT-50I/GJX | PIC32MX130F256LT-I/GJX | PIC32MX150F256HT-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-QFN (12x12 mm) - alternative |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Max CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB 2.0 FS | No | No | Yes (+1 peripheral) | No | No |
| I2S / CTMU | Yes | Yes | Yes | No (MX130 omits CTMU/I2S) | Yes |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Native I2S and CTMU peripherals in a 100-ball BGA (vs PIC32MX130F256LT-I/GJX)
- Compact 7x7 mm BGA footprint for space-constrained designs (vs PIC32MX150F256HT-I/MR)
- Drop-in upgrade path to USB without PCB redesign (vs PIC32MX250F256LT-50I/GJX)
Design Notes
The 100-TFBGA package uses 0.65 mm ball pitch on a 7x7 mm body; escape routing on a 4-layer PCB requires 0.10 mm (4 mil) trace width and 0.10 mm (4 mil) trace spacing. Escape the outer two rows with via-in-pad or staggered micro-vias, and provide at least 4 ground balls redistributed into a solid reference plane to reduce inductance on VDDCORE decoupling. A 0.1 uF X7R ceramic plus 4.7 uF X5R bulk capacitor should sit within 3 mm of every VDDCORE/AVDD pair.
Estimated: at maximum sustained 50 MHz activity and 3.3 V supply, internal core current is roughly 30 mA, so power dissipation is about 100 mW. With a typical 100-TFBGA theta_JA in the 40-50 C/W range (Microchip family datasheet typical values), junction temperature rise is approximately 5C above ambient. For applications in enclosed enclosures with limited airflow, derate clock speed above 70C ambient to stay inside the 85C industrial limit.
Do not confuse the 'L' device suffix (100-pin low-pin-count) with the 'H' device suffix (64-pin). The PIC32MX150F256L family is the 100-pin variant and includes PMP, while the PIC32MX150F128H is the 64-pin variant and lacks PMP. Programming via ICSP requires dedicated PGEDx/PGECx pairs that overlap with general-purpose I/O on most packages - reserve these pins in your schematic or disable them as outputs.
Compliance Information
RoHS and lead-free confirmed by Microchip product page. AEC-Q100 not applicable for industrial-grade MCU; AEC-Q100 variants are available in the PIC32MX1xx family as separate order codes.