PIC32MX570F512HT-I/MR - 32-bit MCU 512KB Flash 64KB RAM 50MHz 64-QFN | Microchip
MPN： PIC32MX570F512HT-I/MR ✓ 啟用中PIC32MX570F512HT-I/MR 概覽
What is a PIC32MX MCU? The PIC32MX family from Microchip is a series of 32-bit microcontrollers based on the MIPS32 M4K architecture, sitting within the broader PIC microcontroller family. These MCUs bridge 8/16-bit PIC legacy to 32-bit performance, used in applications needing USB, CAN, and richer peripherals while staying within the MPLAB X / Harmony toolchain. They are widely adopted in industrial control, consumer audio, IoT edge nodes, and human-machine interface designs.
Key features of the PIC32MX570F512HT-I/MR include two I2S interfaces for digital audio, four SPI modules, Peripheral Pin Select (PPS) for flexible signal routing, a Parallel Master Port (PMP) with dual read/write buffers for graphics interfaces, and a 10-bit ADC with up to 1 Msps conversion rate. The on-chip CTMU supports capacitive touch sensing and time measurement, while RTCC provides real-time clocking for low-power always-on domains.
Architecturally, the device uses a 5-stage pipeline MIPS32 M4K core with hardware multiply/divide, single-cycle 32-bit ALU, and pre-fetch cache, executing most instructions in one clock cycle. The 512 KB Flash is organized as 256K x 16 with prefetch, and the 64 KB SRAM supports DMA access via four channels, offloading CPU bandwidth for high-throughput peripherals such as USB and PMP graphics.
Typical applications include industrial HMI panels with TFT-LCD graphics via PMP, USB audio interfaces using I2S, automotive infotainment peripherals (CAN + USB), home automation gateways with capacitive touch keypads, and low-cost medical monitoring devices requiring RTCC timestamping. The wide peripheral mix makes it a strong fit for designs that need a single-chip controller with connectivity and a basic graphics engine.
Designers should plan oscillator and decoupling layout carefully: the 50 MHz operation requires a stable crystal or external clock, and the QFN-64 ground pad must be soldered to a continuous ground pour for thermal dissipation and EMI suppression. Use MPLAB X IDE with XC32 compiler and configure PPS before assigning peripheral functions to physical pins.
This page synthesizes distributor stock, pricing, drop-in replacement options, and engineering design notes not consolidated on the manufacturer datasheet - giving procurement and design engineers a single source for evaluation and BOM validation.
直接替換替代品，適用於 PIC32MX570F512HT-I/MR — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC32MX570F512HT-I/MR （相同外形與佔位） — 差異在於 Package, ADC, MSL Level, Operating Temperature, Parallel Master Port (PMP).
PIC32MX570F512H-I/MR
✅ 直接替換聯絡詢價
查看資料表 →PIC32MX570F512HT-V/MR
✅ 直接替換聯絡詢價
查看資料表 →PIC32MX570F512HT-50I/MR
✅ 直接替換📋 參考替代品（不在目錄中）
PIC32MX564F128HT-I/MR
✅ 直接替換聯絡詢價
查看資料表 →PIC32MX470F512H-I/MR
✅ 直接替換聯絡詢價
查看資料表 →PIC32MX570F512HT-I/MR 最大額定值與電氣特性
| Core Architecture | MIPS32 M4K |
| Core Bit Width | 32-bit |
| Maximum CPU Frequency | 50 MHz |
| DMIPS Performance | 83 DMIPS |
| Flash Program Memory | 512 KB (512K x 8) |
| SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| I/O Pins | 53 |
| 封裝 | 64-pin QFN (9x9 mm) |
| 安裝類型 | Surface Mount |
| USB Interface | USB 2.0 Full-Speed (Device/Host/OTG) |
| CAN Interface | 1x CAN 2.0B |
| SPI Modules | 4 |
| I2C Modules | 2 |
| UART Modules | 2 |
| I2S Modules | 2 |
| ADC | 10-bit, up to 1 Msps |
| Analog Comparators | 3 |
| CTMU | Yes (Charge Time Measurement Unit) |
| RTCC | Yes (Real-Time Clock/Calendar) |
| PMP | Yes (Parallel Master Port with dual buffers) |
| PPS | Yes (Peripheral Pin Select) |
| DMA Channels | 4 |
| 工作溫度 | -40C to +85C (Industrial) |
| RoHS 狀態 | Compliant |
PIC32MX570F512HT-I/MR 64-pin qfn (9x9 mm) 腳位配置指南
PIC32MX570F512HT-I/MR（64-pin qfn (9x9 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： PIC32MX570F512HT-I/MR.
請參閱 資料表 以查看完整腳位配置。
典型應用
PIC32MX570F512HT-I/MR 適用於 7 應用s: Industrial HMI with TFT Graphics, USB Audio Interface with I2S Codec, Automotive CAN Gateway Node, Capacitive Touch Keypad Controller, IoT Edge Sensor Hub with USB Tethering, Medical Monitoring and RTCC Timestamping, Consumer Audio Mixer / Effects Unit.
Industrial HMI with TFT Graphics
The PIC32MX570F512HT-I/MR drives small TFT-LCD panels through its Parallel Master Port (PMP) with dual read/write buffers, supporting 8-bit or 16-bit interface to displays up to QVGA resolution. With 64 KB SRAM and DMA offload, framebuffer updates run without blocking the CPU. The 50 MHz MIPS32 M4K core handles anti-aliased fonts and basic GUI widgets at 30+ FPS. Compared with PIC32MX534 or PIC32MX150, the larger 512 KB Flash accommodates full GUI stacks without external memory, simplifying PCB layout in factory operator panels and appliance front-panel designs.
推薦
USB Audio Interface with I2S Codec
The two on-chip I2S interfaces and USB 2.0 Full-Speed OTG make the PIC32MX570F512HT-I/MR a strong fit for USB-to-I2S audio bridges, headset dongles, and recording interfaces. The 83 DMIPS performance handles 48 kHz/24-bit stereo audio streams with low CPU overhead, while the CTMU supports push-button or capacitive-touch volume controls. The 64 KB SRAM accommodates stereo audio buffering without external memory. This outperforms 8-bit PIC16 designs that cannot process full-rate stereo USB audio in real time.
推薦
Automotive CAN Gateway Node
The integrated CAN 2.0B controller and 50 MHz processing capability suit the PIC32MX570F512HT-I/MR for non-safety CAN gateway nodes such as body control modules, climate interfaces, and infotainment peripherals. The 512 KB Flash fits CANopen or J1939 protocol stacks, while 64 KB SRAM buffers message queues. Engineers pairing this with LIN or CAN-FD bridges can build gateway nodes at modest BOM cost. The -40C to +85C industrial temperature range covers cabin and under-hood accessory domains.
推薦
Capacitive Touch Keypad Controller
The on-chip CTMU and PPS flexibility let the PIC32MX570F512HT-I/MR scan 20+ capacitive touch keys without external charge-timing circuitry. The 512 KB Flash supports user-defined gesture recognition libraries, and USB HID output makes it a plug-and-play touch controller for industrial keypads and appliance controls. With 64 KB SRAM, designers can buffer multi-touch sequences locally before reporting to the host MCU. The QFN-64 small footprint suits slim industrial front-panel designs.
推薦
IoT Edge Sensor Hub with USB Tethering
The PIC32MX570F512HT-I/MR serves as a USB-tethered edge hub for industrial sensors, leveraging USB 2.0 Full-Speed for both power and data, plus four SPI and two I2C ports to interface SPI sensors, I2C ADCs, and external flash. The 512 KB Flash accommodates sensor-fusion logic and local calibration tables. RTCC provides timestamping for logged sensor data without external RTC. Designers upgrading from PIC24 designs benefit from the 32-bit performance jump without changing USB host software.
推薦
Medical Monitoring and RTCC Timestamping
The PIC32MX570F512HT-I/MR fits compact patient monitors and home-health peripherals that require a real-time clock, USB device connectivity, and 10-bit ADC channels for analog biosensors. The RTCC retains time across power cycles via VBAT, while 64 KB SRAM buffers short-term waveform samples before upload. The 50 MHz core executes simple digital filtering on ECG or pulse-oximeter streams. Medical designs should still validate IEC 60601 compliance at the system level, as the MCU itself is not a medical-grade component.
推薦
Consumer Audio Mixer / Effects Unit
With two I2S inputs/outputs, four SPI control ports, and 50 MHz MIPS performance, the PIC32MX570F512HT-I/MR runs audio mixers and effects processors for consumer DJ controllers, karaoke machines, and headphone amplifiers. The 64 KB SRAM hosts short audio delay lines and convolution buffers, while USB connects to host PCs for firmware updates. The PMP graphics port can drive a small status LCD alongside audio routing. The QFN-64 footprint suits compact handheld audio product form factors.
推薦
推薦產品摘要
工程參考資料，適用於 PIC32MX570F512HT-I/MR — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC32MX570F512H-I/MR | PIC32MX570F512HT-V/MR | PIC32MX570F512HT-50I/MR | PIC32MX564F128HT-I/MR | PIC32MX470F512H-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (9x9 mm) | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same |
| Max CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 120 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 128 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB | 128 KB |
| USB Controller | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| CAN Controller | 1x CAN 2.0B | 1x CAN 2.0B | 1x CAN 2.0B | 1x CAN 2.0B | 1x CAN 2.0B | 1x CAN 2.0B |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +105C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| I/O Pins | 53 | 53 | 53 | 53 | 53 | 53 |
主要差異化特點
- Largest Flash/RAM combo in the PIC32MX5xx 64-pin QFN family (對比PIC32MX564F128HT-I/MR)
- Extended -40C to +105C variant available in same package (對比PIC32MX570F512HT-V/MR)
- Higher CPU performance available at same pinout (對比PIC32MX470F512H-I/MR)
設計說明
The QFN-64 (9x9 mm) package relies on the exposed thermal pad for heat dissipation. At full 50 MHz CPU load with all peripherals active, internal die dissipation can reach 200-300 mW. Solder the thermal pad to a continuous ground pour of at least 1 square inch of copper; vias stitching the pad to internal ground planes further reduce theta-JA. Without proper PCB thermal design, junction temperature can exceed the 85C industrial limit in enclosed housings.
Place decoupling capacitors as close as possible to each VDD pin: 100 nF ceramic for each digital supply pin and a single 4.7 uF bulk capacitor near the MCU. The USB D+/D- lines require 90 ohm differential routing with matched length; place the 27 ohm series termination resistors near the MCU side. Keep high-speed PMP traces short and length-matched to avoid graphics glitches on the LCD bus.
Crystal or external clock traces must be kept short and routed over a continuous ground plane to minimize EMI. If using the internal PLL, the loop filter capacitor on VCAP must be rated low-ESR (X7R or better) and placed within 5 mm of the pin. Peripheral Pin Select (PPS) reassignment should be finalized early in firmware to avoid floating inputs; unused I/O pins should be configured as outputs low or inputs with internal pull-ups to reduce quiescent current.
Do not exceed the absolute maximum VDD of 3.6 V - even brief over-voltage events during USB hot-plug can latch-up the MCU. Configure the RTCC backup battery correctly so VBAT does not backfeed VDD when system power is removed. When using USB Host mode, the VBUS pin must not be back-driven; an external power switch IC is required. Always use Microchip MPLAB XC32 compiler v2.40+ for correct C99 peripheral library support.
合規資訊
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - use PIC32MX570F512HT-V/MR for extended temperature or design-in AEC-Q100 qualified parts for safety-critical automotive.
