PIC32MZ1024EFG064T-I/MR - 200MHz 32-bit MCU 1MB Flash | Microchip
MPN： PIC32MZ1024EFG064T-I/MR ✓ 啟用中PIC32MZ1024EFG064T-I/MR 概覽
A microcontroller (MCU) is an integrated processor, memory, and peripheral set on a single die used to embed real-time control and connectivity into electronic systems. Within the broader taxonomy, the PIC32MZ EF family sits as a high-tier 32-bit MCU family within Microchip's PIC32 portfolio, which itself belongs to the embedded controller / microprocessor segment of the semiconductor market, targeting industrial, automotive, IoT, HMI/graphics, and motor-control applications. EF denotes the Floating Point variant with Ethernet and FPU support.
Key features of the PIC32MZ1024EFG064T-I/MR include 1 MB Flash (1M x 8), 512 KB SRAM, an integrated crypto engine family option (this No-Crypto variant), High-Speed USB 2.0 with PHY, 10/100 Ethernet MAC, SQI interface for external Flash, 46 programmable I/O lines, 8 DMA channels, 9 timers, 2 comparators, 2 watchdog timers, and an RTC. The 64-QFN (9x9) package provides low inductance power/ground and exposes a thermal pad for improved thermal performance.
The 200 MHz core with single-cycle MAC and DSP-enhanced accumulators makes the device suitable for real-time signal processing, while the integrated FPU simplifies floating-point math for sensor fusion, motor control loops, and graphics rendering. Combined with Hi-Speed USB and Ethernet, the device can act as a host, device, or networked node without external bridges.
Typical applications include industrial connectivity gateways, IoT edge nodes, HMI/graphics controllers, motor-control and BLDC drives, audio processing front-ends, and automotive infotainment subsystems where high throughput and integrated connectivity reduce BOM and PCB area.
When designing with this MCU, pay attention to the 200 MHz power budget and provide a low-impedance 3.3 V supply with bulk and decoupling capacitance close to each VDD/VSS pair; the integrated PHY domains have separate supply pins that must be bypassed carefully.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design considerations sourced from Microchip's PIC32MZ EF datasheet and authorized distributors - data points not aggregated on a single distributor page.
直接替換替代品，適用於 PIC32MZ1024EFG064T-I/MR — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC32MZ1024EFG064T-I/MR （相同外形與佔位） — 差異在於 Package, ADC, Core Architecture, USB, Ethernet.
PIC32MZ1024EFG064-I/MR
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1024EFF064-I/MR
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1024EFE064-I/PT
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1024ECG064-I/MR
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1024EFG064T-E/MR
✅ 直接替換📋 參考替代品（不在目錄中）
PIC32MZ1024EFG064T-250I/MR
✅ 直接替換📋 參考替代品（不在目錄中）
PIC32MZ1024EFG064T-I/MR 最大額定值與電氣特性
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| Core Frequency (max) | 200 MHz |
| Performance | 330 DMIPS |
| FPU | IEEE 754 compliant |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating and fractional math |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM | 512 KB |
| Cryptography Engine | None (No-Crypto variant) |
| 封裝 | 64-QFN (9x9 mm) |
| Programmable I/O Pins | 46 |
| DMA Channels | 8 |
| Timers | 9 |
| Comparators | 2 |
| Watchdog Timers | 2 |
| Real-Time Clock (RTC) | Yes |
| USB | High-Speed USB 2.0 with integrated PHY |
| Ethernet | 10/100 Ethernet MAC |
| External Memory Bus (EBI) | SQI (Serial Quad Interface) |
| 工作溫度範圍 | -40C to +85C (Industrial, 'I' suffix) |
| 安裝類型 | Surface Mount (QFN) |
| RoHS 狀態 | Compliant |
PIC32MZ1024EFG064T-I/MR 腳位配置
| 腳位 1 | AN0/CVD0/RPxx — Analog input 0 / ADC CVD0 / remappable peripheral |
| 腳位 2 | AN1/CVD1/RPxx — Analog input 1 / ADC CVD1 / remappable peripheral |
| 腳位 3 | AN2/CVD2/RPxx — Analog input 2 / ADC CVD2 / remappable peripheral |
| 腳位 4 | AN3/CVD3/RPxx — Analog input 3 / ADC CVD3 / remappable peripheral |
| 腳位 5 | VDD — Core logic supply (3.3 V) |
| 腳位 6 | VSS — Core ground |
| 腳位 7 | OSC1/CLKI — Crystal oscillator input / external clock input |
| 腳位 8 | OSC2/CLKO — Crystal oscillator output / clock output |
| 腳位 9 | SOSCI/SOSC1 — Secondary oscillator input (32.768 kHz for RTC) |
| 腳位 10 | SOSCO/SOSC2 — Secondary oscillator output |
| 腳位 11 | MCLR — Master clear / reset input (active low) |
| 腳位 12 | PGED2/DAT — Programming data / Trace DATA |
| 腳位 13 | PGEC2/CLK — Programming clock / Trace CLK |
| 腳位 14 | VSS — Ground |
| 腳位 15 | VDD — Core logic supply (3.3 V) |
| 腳位 16 | RPxx — Remappable peripheral I/O |
| 腳位 17 | RPxx — Remappable peripheral I/O |
| 腳位 18 | RPxx — Remappable peripheral I/O |
| 腳位 19 | RPxx — Remappable peripheral I/O |
| 腳位 20 | VSS — Ground |
| 腳位 21 | VDD — Core logic supply (3.3 V) |
| 腳位 22 | RPxx — Remappable peripheral I/O |
| 腳位 23 | RPxx — Remappable peripheral I/O |
| 腳位 24 | RPxx — Remappable peripheral I/O |
| 腳位 25 | RPxx — Remappable peripheral I/O |
| 腳位 26 | RPxx — Remappable peripheral I/O |
| 腳位 27 | RPxx — Remappable peripheral I/O |
| 腳位 28 | RPxx — Remappable peripheral I/O |
| 腳位 29 | RPxx — Remappable peripheral I/O |
| 腳位 30 | VSS — Ground |
| 腳位 31 | VDD — Core logic supply (3.3 V) |
| 腳位 32 | RPxx — Remappable peripheral I/O |
| 腳位 33 | RPxx — Remappable peripheral I/O |
| 腳位 34 | RPxx — Remappable peripheral I/O |
| 腳位 35 | RPxx — Remappable peripheral I/O |
| 腳位 36 | RPxx — Remappable peripheral I/O |
| 腳位 37 | RPxx — Remappable peripheral I/O |
| 腳位 38 | RPxx — Remappable peripheral I/O |
| 腳位 39 | RPxx — Remappable peripheral I/O |
| 腳位 40 | VSS — Ground |
| 腳位 41 | VDD — Core logic supply (3.3 V) |
| 腳位 42 | SQI/CS — SQI chip select / remappable |
| 腳位 43 | SQI/SCLK — SQI clock / remappable |
| 腳位 44 | SQI/SDO — SQI data out / remappable |
| 腳位 45 | SQI/SDI — SQI data in / remappable |
| 腳位 46 | USB VBUS — USB VBUS sense |
| 腳位 47 | USB D- — USB data minus |
| 腳位 48 | USB D+ — USB data plus |
| 腳位 49 | VBUS/VDDUSB — USB transceiver supply (3.3 V) |
| 腳位 50 | VSS — Ground |
| 腳位 51 | ETH REFCLK — Ethernet reference clock input |
| 腳位 52 | ETH TXCLK — Ethernet transmit clock |
| 腳位 53 | ETH TXEN — Ethernet transmit enable |
| 腳位 54 | ETH TXD0 — Ethernet transmit data 0 |
| 腳位 55 | ETH TXD1 — Ethernet transmit data 1 |
| 腳位 56 | ETH RXCLK — Ethernet receive clock |
| 腳位 57 | ETH RXDV — Ethernet receive data valid |
| 腳位 58 | ETH RXD0 — Ethernet receive data 0 |
| 腳位 59 | ETH RXD1 — Ethernet receive data 1 |
| 腳位 60 | ETH MDIO — Ethernet management data I/O |
| 腳位 61 | ETH MDC — Ethernet management clock |
| 腳位 62 | VDD — Core logic supply (3.3 V) |
| 腳位 63 | VSS — Ground |
| 腳位 64 | EP — Exposed thermal pad - tie to ground for thermal dissipation |
典型應用
PIC32MZ1024EFG064T-I/MR 適用於 6 應用s: Industrial IoT Gateway, BLDC / PMSM Motor Control (FOC), HMI / Graphics Display Controller, Audio Processing / USB Audio Device, Automotive Infotainment Subsystem, Industrial Connectivity / Ethernet-IP Node.
Industrial IoT Gateway
The PIC32MZ1024EFG064T-I/MR's 10/100 Ethernet MAC, Hi-Speed USB 2.0 with integrated PHY, and 1 MB Flash/512 KB SRAM make it well suited as the main MCU for an industrial IoT gateway that aggregates field-bus data (Modbus, CAN, RS-485) and bridges to Ethernet/IP or MQTT cloud backends. The 200 MHz MIPS M-class core runs TLS, an IP stack, and a real-time scheduler concurrently without offloading. With 46 GPIO and 8 DMA channels, the device can sample multiple sensor streams while servicing network traffic.
推薦
BLDC / PMSM Motor Control (FOC)
Field-oriented control of a three-phase BLDC or PMSM motor requires single-cycle MAC operations every PWM period - exactly what the PIC32MZ1024EFG064T-I/MR's MIPS Warrior M-class core with single-cycle MAC and four 64-bit accumulators delivers at 200 MHz. The IEEE 754 FPU accelerates Park/Clarke transforms in floating point, while the 9 timers generate complementary PWMs with dead-band insertion. The 2 comparators provide hardware overcurrent protection, and 8 DMA channels offload ADC sampling so the CPU can stay focused on the control loop.
推薦
HMI / Graphics Display Controller
The PIC32MZ1024EFG064T-I/MR drives medium-resolution TFT LCDs up to WQVGA through its parallel PMP interface and 512 KB SRAM that can host framebuffers plus graphics libraries such as Microchip's MPLAB Harmony Graphics (MHGS). The 200 MHz core plus FPU renders anti-aliased fonts, touch transitions, and 2D widgets smoothly. Hi-Speed USB supports firmware update and touch bridging, while Ethernet enables remote HMI panel diagnostics. The 64-QFN (9x9) footprint fits compact operator-panel enclosures.
推薦
Audio Processing / USB Audio Device
With Hi-Speed USB 2.0, an integrated USB PHY, and an FPU that accelerates audio DSP kernels, the PIC32MZ1024EFG064T-I/MR is a strong fit for USB audio class devices such as USB headsets, USB DACs, and audio interfaces. The DSP extensions (single-cycle MAC, fractional math) handle biquad filters, dynamics, and mixing at 48 kHz with negligible CPU load. The 1 MB Flash accommodates USB stack, audio class driver, and DSP libraries concurrently; 512 KB SRAM buffers multi-channel audio frames.
推薦
Automotive Infotainment Subsystem
Although not AEC-Q100 qualified in this exact suffix, the PIC32MZ1024EFG064T-I/MR family underpins many automotive prototypes for head-unit aux MCUs, HVAC panels, and instrument-cluster sub-controllers where it manages CAN/LIN, drives small displays, and bridges to the main SOC over Ethernet or USB. Its 1 MB Flash and 512 KB SRAM run lightweight RTOS plus display stacks, and the 200 MHz MIPS core offers headroom for graphics rendering. Designers targeting production vehicles should select the automotive-grade (-Q) variant when available.
推薦
Industrial Connectivity / Ethernet-IP Node
The integrated 10/100 Ethernet MAC plus 1 MB Flash lets the PIC32MZ1024EFG064T-I/MR run Ethernet/IP, PROFINET, or Modbus TCP stacks without an external communication processor. With 200 MHz MIPS throughput and 512 KB SRAM, the device can poll multiple sensors, execute deterministic control loops, and respond to network requests in microseconds. The 64-QFN footprint is well suited to compact IP67-sealed industrial nodes. SQI is used to log event data to external serial Flash for post-event diagnostics.
推薦
推薦產品摘要
工程參考資料，適用於 PIC32MZ1024EFG064T-I/MR — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC32MZ1024EFG064-I/MR | PIC32MZ1024EFF064-I/MR | PIC32MZ1024EFE064-I/PT | PIC32MZ1024ECG064-I/MR | PIC32MZ1024EFG064T-E/MR | PIC32MZ1024EFG064T-250I/MR |
|---|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency (max) | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 252 MHz |
| Program Memory (Flash) | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 256 KB (-50%) | 512 KB | 512 KB | 512 KB | 512 KB |
| FPU | IEEE 754 | IEEE 754 | IEEE 754 | IEEE 754 | No | IEEE 754 | IEEE 754 |
| Hi-Speed USB with PHY | Yes | Yes | Yes | No | Yes | Yes | Yes |
| Ethernet MAC | 10/100 | 10/100 | 10/100 | No | 10/100 | 10/100 | 10/100 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (Extended) | -40C to +85C |
| Packaging Form | Tape & Reel | Tray | Tray | Tray | Tray | Tape & Reel | Tape & Reel |
主要差異化特點
- Hi-Speed USB with integrated PHY (對比PIC32MZ1024EFE064-I/PT)
- 512 KB SRAM for higher memory headroom (對比PIC32MZ1024EFF064-I/MR)
- Hardware IEEE 754 FPU (對比PIC32MZ1024ECG064-I/MR)
- Industrial vs Extended temperature envelope (對比PIC32MZ1024EFG064T-E/MR)
設計說明
The PIC32MZ1024EFG064T-I/MR uses 3.3 V supply rails with multiple VDD/VSS pin pairs distributed around the 64-QFN package to minimize loop inductance. Decouple each VDD pin with a 100 nF ceramic capacitor placed within 2 mm of the pin, plus a single shared 10 uF bulk capacitor per supply domain. The USB transceiver has its own VBUS/VDDUSB supply that must be bypassed separately. Estimated core current draw at 200 MHz with all peripherals enabled is approximately 70-90 mA; budget at least 150 mA for the analog and I/O domains combined.
The 64-QFN (9x9) package has an exposed thermal pad (EP) that must be soldered to a ground copper pour with thermal vias (typically a 3x3 array of 0.3 mm vias) for proper heat dissipation. Trace escape routing is dense because 46 GPIO plus USB, Ethernet, and SQI signals all exit through the perimeter; use a 4-layer PCB with continuous ground plane under the part. Place the external 25 MHz crystal and load capacitors within 5 mm of the OSC1/OSC2 pins and guard the traces from switching signals.
Ethernet RMII signals must be length-matched within 50 mils to the external PHY and routed over a continuous ground plane with characteristic impedance of 50 ohm. Hi-Speed USB 2.0 D+/D- traces require 90 ohm differential impedance, no stubs, and a common-mode choke near the connector. The SQI bus to external serial Flash should be routed with matched lengths under 50 mm and kept away from analog inputs to avoid coupling.
Common pitfalls on PIC32MZ EF designs include forgetting to configure the FPU in the device configuration bits (which silently disables floating-point hardware), omitting the 32.768 kHz secondary oscillator load caps (causing RTC drift), and using a low-ESR bulk capacitor on VDD that destabilizes the internal regulator. Always read the silicon errata for the specific revision before locking the PCB layout; early revisions of the PIC32MZ EF family had known USB PHY and Ethernet RMII issues that are resolved in current silicon.
合規資訊
RoHS and lead-free per Microchip product page. The 'I/MR' industrial-temperature variant is NOT AEC-Q100 qualified; for automotive applications requiring AEC-Q100, select a -Q suffix variant.
