SN65MLVD200ADR - Half-Duplex M-LVDS Transceiver, 8-SOIC | TI
MPN： SN65MLVD200ADR ✓ 啟用中SN65MLVD200ADR 概覽
Background: An LVDS (Low-Voltage Differential Signaling) transceiver is a type of high-speed differential interface IC that transmits data across a balanced pair of wires using low-swing, current-mode signaling, achieving high noise immunity at low power. M-LVDS is an extension of LVDS (TIA/EIA-899) that adds a stronger driver and controlled bus-edge transition so multiple drivers and receivers can coexist on a single twisted pair - typical of multipoint backplane buses. Within the broader taxonomy: LVDS transceiver -> differential interface IC -> interface IC -> integrated circuit.
Key features include ±9 kV HBM ESD protection on the bus pins (enhancing ruggedness for cable and connector exposure), driver output rise/fall times around 1 ns, and a wide common-mode range on the receiver. The 8-SOIC footprint is industry-standard, allowing easy board integration and pin-compatible second sourcing. The device is characterized for operation from -40 °C to +85 °C and is targeted at clock distribution, telecom backplanes, and base-station equipment.
Typical applications include cellular base stations, central-office switches, network routers and switches, multipoint clock distribution, and industrial backplane data links. In clock-distribution trees the SN65MLVD200ADR fans out a low-jitter reference to multiple cards. Compared to a single-ended bus (such as TTL/CMOS parallel), M-LVDS offers superior EMI and ground-noise immunity at lower power per bit.
Design consideration: Because multiple transceivers share one bus, only one driver may be enabled at a time. The driver-enable / receiver-enable logic (DE, RE) supports wired-OR bus arbitration; unused output nodes should not float. Always confirm bus termination and stub length against the TIA/EIA-899 standard for the chosen data rate.
This page synthesizes distributor stock data, same-family TI M-LVDS drop-in alternatives, and cross-brand pin-compatible substitutes from TIA/EIA-899 compliant parts - information not consolidated on the manufacturer datasheet alone.
直接替換替代品，適用於 SN65MLVD200ADR — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： SN65MLVD200ADR （相同外形與佔位） — 差異在於 Package.
SN65MLVD200AD
✅ 直接替換📋 參考替代品（不在目錄中）
SN65MLVD200ADRG4
✅ 直接替換📋 參考替代品（不在目錄中）
SN65MLVD200A-Q1
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
SN65MLVD200ADG4
✅ 直接替換📋 參考替代品（不在目錄中）
ADN4690EBRZ
✅ 直接替換📋 參考替代品（不在目錄中）
ADN4690EBRZ-RL7
✅ 直接替換📋 參考替代品（不在目錄中）
SN65MLVD200ADR 規格
| 功能 | Half-duplex M-LVDS transceiver (1 driver + 1 receiver) |
| 資料速率 | Up to 100 Mbps (typical) |
| Driver Skew | 700 ps (typical) |
| 供應電壓 | 3.3 V (typical) |
| Output Drive Current | 24 mA (typical) |
| ESD Protection (Bus Pins) | ±9 kV HBM |
| Common-Mode Range (Receiver) | -1 V to +3.4 V (M-LVDS spec) |
| Standards Compliance | TIA/EIA-899 (M-LVDS); TIA/EIA-644 (LVDS reference) |
| 工作溫度 | -40 °C to +85 °C |
| 封裝 | 8-pin SOIC |
| 安裝類型 | Surface Mount |
| 腳位數 | 8 |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
SN65MLVD200ADR 腳位配置
| 腳位 1 | VCC — 3.3 V supply |
| 腳位 2 | GND — Ground |
| 腳位 3 | A/Y — Driver output (positive)/Receiver input (positive) |
| 腳位 4 | R — Receiver logic output |
| 腳位 5 | RE — Receiver enable (active low) |
| 腳位 6 | DE — Driver enable (active high) |
| 腳位 7 | D — Driver logic input |
| 腳位 8 | B/Z — Driver output (negative)/Receiver input (negative) |
典型應用
SN65MLVD200ADR 適用於 6 應用s: Cellular Base Station Backplane, Central-Office Switches, Network Switches and Routers, Multipoint Clock Distribution, Industrial Backplane Communication, ATE and Test Equipment.
Cellular Base Station Backplane
The SN65MLVD200ADR's TIA/EIA-899 M-LVDS compliance and 100 Mbps data rate make it ideal for cellular base-station backplane links where multiple cards share a single bus. Driver output skew of 700 ps maintains low jitter on the shared bus, while ±9 kV HBM ESD protects against cable-charging events during field installation. Used between the baseband card and the RF/trx cards over multipoint stubs. Power dissipation is roughly 25 mW per link, lower than parallel CMOS buses at the same speed.
推薦
Central-Office Switches
In central-office switching equipment the SN65MLVD200ADR distributes control and timing signals across multiple line cards on a multipoint backplane. Its half-duplex topology fits command-and-response protocols common in line-card control. The driver's 24 mA drive and the bus's ability to support multiple nodes reduce wiring compared to point-to-point LVDS. Common-mode range to -1 V tolerates ground-shift across cards.
推薦
Network Switches and Routers
Network switches and routers use the SN65MLVD200ADR for intra-chassis high-speed signaling between line cards and switch-fabric boards. The 8-SOIC small footprint suits dense line-card designs, while the M-LVDS multipoint capability lets multiple ports share a managed backplane. Compared to TTL parallel buses the M-LVDS link reduces pin count and EMI by an order of magnitude.
推薦
Multipoint Clock Distribution
The SN65MLVD200ADR is widely deployed as a clock-distribution element where one master and many slave cards share one timing reference. With 700 ps driver skew and M-LVDS multipoint bus capability, jitter across the fan-out tree stays low. A typical design wires the master as a driver and slave cards as receivers, each enabled by the RE pin. This minimizes the number of clock buffers while preserving signal integrity.
推薦
Industrial Backplane Communication
Industrial control cabinets and instrumentation racks use the SN65MLVD200ADR for deterministic backplane communication in harsh electrical environments. M-LVDS provides ±1 V common-mode tolerance and ±9 kV ESD robustness, both suited to factory-floor noise. Industrial designers appreciate the 8-SOIC footprint for easy hand-debugging and rework. Operating temperature range -40 °C to +85 °C covers most industrial enclosures.
推薦
ATE and Test Equipment
Automated test equipment (ATE) leverages the SN65MLVD200ADR for distributing stimulus and capture signals across a backplane. The M-LVDS standard supports cable lengths to several meters, useful when separating the tester pin-electronics from the DUT interface. Half-duplex saves board space compared to separate transmitter and receiver ICs. ESD protection simplifies compliance with tester handling transients.
推薦
推薦產品摘要
工程參考資料，適用於 SN65MLVD200ADR — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | SN65MLVD200AD | SN65MLVD200ADRG4 | SN65MLVD200A-Q1 | SN65MLVD200ADG4 | ADN4690EBRZ | ADN4690EBRZ-RL7 |
|---|---|---|---|---|---|---|---|
| Package | 8-SOIC | 8-SOIC - same | 8-SOIC - same | 8-SOIC - same | 8-SOIC - same | 8-SOIC - same | 8-SOIC - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Analog Devices | Analog Devices |
| Function | Half-duplex M-LVDS transceiver | Half-duplex M-LVDS transceiver | Half-duplex M-LVDS transceiver | Half-duplex M-LVDS transceiver | Half-duplex M-LVDS transceiver | Half-duplex M-LVDS transceiver | Half-duplex M-LVDS transceiver |
| Data Rate | 100 Mbps | 100 Mbps | 100 Mbps | 100 Mbps | 100 Mbps | 100 Mbps | 100 Mbps |
| Automotive Grade (AEC-Q100) | No | No | No | Yes (AEC-Q100) | No | No | No |
| Packaging Format | Tape & Reel (R suffix) | Tube | Tape & Reel (G4) | Tape & Reel | Tape & Reel | Tube | 7-inch Reel |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +125 °C (AEC-Q100) | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
主要差異化特點
- Drop-in same-family alternatives within TI catalog (對比SN65MLVD200AD)
- AEC-Q100 variant available in same package (對比SN65MLVD200A-Q1)
- Cross-brand cross-reference available (對比ADN4690EBRZ)
設計說明
Place the SN65MLVD200ADR near the bus connector and route the differential pair (A/Y and B/Z) as a 100-ohm differential microstrip with matched length ±0.13 mm. Keep the pair away from switching power and TTL signals. Add a 100 nF decoupling cap on VCC within 3 mm of pin 1 and a 10 µF bulk cap at the supply entry. The single 3.3 V rail can be shared across multiple transceivers without sequencing constraints.
Estimated: with VCC=3.3 V and idle bus, each SN65MLVD200ADR draws about 8-12 mA, rising to ~25 mA when actively driving a 100 Mbps load. Across an 8-card backplane this is ~200 mA worst-case; ensure the 3.3 V rail has at least 250 mA of margin. Decouple each IC with a 100 nF X7R local cap to avoid bus-edge noise coupling back into the supply.
Because the device supports multipoint operation with multiple drivers, the design must enforce exclusive driver-enable arbitration: only one DE may be high at a time. Floating DE or RE pins may trigger unintended driver or receiver state. Use a processor GPIO with explicit initialization at startup, never rely on default latches. The TIA/EIA-899 standard requires only one driver to be active at a time to avoid bus contention.
合規資訊
RoHS compliant per TI product page; choose SN65MLVD200A-Q1 for AEC-Q100 automotive applications.