XC3S4000-4FG676I - 4M Gate Spartan-3 FPGA, 676-BGA | AMD
MPN： XC3S4000-4FG676I ✗ 停產XC3S4000-4FG676I 概覽
A field-programmable gate array is a digital integrated circuit whose logic, interconnect, and configurable I/O are programmed after manufacture. Within the product hierarchy, an FPGA belongs to programmable logic devices and is broader than a fixed-function application-specific integrated circuit. The Spartan-3 architecture combines configurable logic blocks, distributed and block RAM, dedicated multipliers, and programmable I/O so engineers can implement parallel data processing, control, communications, and interface functions on one device.
The XC3S4000 part of the Spartan-3 family provides 4 million system-gate equivalents, while the -4 suffix identifies its performance grade. The device provides 62,208 logic cells, 489 I/O lines, and 1,769,472 bits of RAM. Its 676-BGA package supports a high pin count, allowing extensive parallel connectivity in compact industrial, communications, instrumentation, and embedded-control equipment.
The Spartan-3 architecture is organized around configurable logic blocks connected by programmable routing resources. Dedicated block RAM and arithmetic resources allow designers to place buffering, packet handling, filtering, and fixed-point processing close to the logic that consumes the data. This architecture is valuable when system throughput, parallel processing, or flexible post-deployment updates matter more than the absolute operating frequency of a large application-specific processor.
Typical uses include industrial control systems, network-interface controllers, video and image-processing pipelines, communications equipment, test and measurement instruments, and embedded control platforms. The large I/O count also supports buses, memory interfaces, high-speed acquisition channels, and external peripheral connectivity when board constraints allow the associated signal-integrity engineering.
Design planning must account for the BGA assembly process, power delivery across many supply balls, decoupling, thermal performance, and high-speed routing. Differential and sensitive interfaces should use controlled-length geometry and reference planes, while configuration, JTAG, decoupling, and clock circuitry should follow the manufacturer’s Spartan-3 design guidance. Verify every selected pin, voltage requirement, speed limit, and package dimension against the official device documentation before schematic release.
This product record combines the device identity, package information, sourcing fields, technical specifications, drop-in candidates, application guidance, and design notes needed for initial engineering evaluation. The 676-ball footprint requires deliberate PCB layout and assembly planning, so migration decisions should be based on confirmed pin compatibility rather than family name or gate-count similarity alone.
直接替換替代品，適用於 XC3S4000-4FG676I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC3S4000-4FG676I （相同外形與佔位） — 差異在於 Device Type, I/O Count, Package Type, System Gates.
XC3S4000-4FGG676I
✅ 直接替換📋 參考替代品（不在目錄中）
XC3S4000-4FGG676C
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC3S4000-4FG676C
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC3S4000-5FGG676I
✅ 直接替換📋 參考替代品（不在目錄中）
XC3S4000-5FG676I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC3S4000-5FG676C
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →XC3S4000-4FG676I 最大額定值與電氣特性
| Device Type | Spartan-3 field-programmable gate array (FPGA) |
| System Gates | 4 million |
| Logic Cells | 62,208 |
| I/O Count | 489 |
| Total RAM | 1,769,472 bits |
| 封裝 | 676-BGA (27 x 27 mm) |
| Terminal Count | 676 balls |
| Package Type | Fine-pitch ball grid array (FBGA) |
| 安裝類型 | Surface mount |
| Performance Grade | -4 performance grade |
| Product Family | Spartan-3 |
| Manufacturer | AMD Xilinx |
| Logic Architecture | Configurable logic blocks with programmable routing and dedicated memory resources |
XC3S4000-4FG676I fine-pitch ball grid array (fbga) 腳位配置指南
XC3S4000-4FG676I（fine-pitch ball grid array (fbga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC3S4000-4FG676I.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC3S4000-4FG676I 適用於 6 應用s: Industrial Control and Automation, Communications and Network Interface, Video and Image Processing, Test and Measurement Instrumentation, Embedded Control Platform, Aerospace and Defense Systems.
Industrial Control and Automation
The XC3S4000-4FG676I fits industrial controllers that coordinate sensors, actuators, motion logic, and safety interlocks while requiring deterministic parallel processing. Its 62,208 logic cells and 489 I/O lines provide substantial capacity for multiple state machines and peripheral interfaces without splitting a control function across several devices. The 1,769,472 RAM bits can support buffers, status histories, and protocol state, while dedicated programmable logic improves timing predictability. Engineering validation must include I/O-standard compatibility, operating-temperature limits, isolation strategy, and industrial EMC requirements.
推薦
Communications and Network Interface
The XC3S4000-4FG676I can implement parallel packet processing, protocol conversion, buffering, and interface isolation in communications equipment. Its 489 I/O lines support multiple data buses, while 1,769,472 RAM bits allow packet queues and framing state to be distributed across the Spartan-3 fabric. Dedicated multipliers can accelerate CRC, filtering, and fixed-point operations. For production designs, verify supported I/O standards, clocking resources, differential-pair constraints, and board-level signal integrity against the manufacturer documentation.
推薦
Video and Image Processing
The XC3S4000-4FG676I is suitable for parallel pixel pipelines, sensor preprocessing, and real-time image feature extraction because its Spartan-3 architecture combines programmable logic, block memory, and dedicated multipliers. The 489 I/O lines can accommodate substantial parallel sensor and display data paths, while the 1,769,472 RAM bits support line buffers and working memory. Clocking, I/O standards, memory bandwidth, and timing closure must be evaluated carefully because high-throughput video designs can be constrained by routing and external memory performance.
推薦
Test and Measurement Instrumentation
The XC3S4000-4FG676I can serve as the central programmable-logic engine in a multichannel test instrument, combining acquisition control, stimulus sequencing, data reduction, and communications. Its 489 I/O lines support multiple instruments or trigger channels, and 62,208 logic cells provide room for timing engines and digital signal processing. The large RAM resource supports sample buffers and decision trees. Laboratory applications must also account for analog isolation, calibration, input bandwidth, clock jitter, and the device’s exact electrical operating limits.
推薦
Embedded Control Platform
The XC3S4000-4FG676I supports embedded systems that combine control logic, communication protocols, data acquisition, and local decision-making in one programmable device. Its 4 million system-gate equivalents provide room for multiple concurrent tasks, while the 489 I/O lines simplify expansion of sensors, memory, and actuators. Compared with a microcontroller-only architecture, the FPGA fabric supports parallel execution and deterministic hardware pipelines. Firmware and HDL division must still be planned explicitly, including boot configuration, watchdog behavior, and fault recovery.
推薦
Aerospace and Defense Systems
The XC3S4000-4FG676I can support programmable data acquisition, command decoding, telemetry processing, and fault-monitoring logic where deterministic parallel behavior is important. Its 62,208 logic cells and 489 I/O lines allow substantial interface consolidation, while the dedicated memory resources support framed telemetry and status data. Deployment in aerospace or defense equipment requires qualification against the applicable program-specific procurement, reliability, screening, radiation, and configuration-management requirements. None of those program-level requirements should be inferred from the commercial ordering code.
推薦
推薦產品摘要
工程參考資料，適用於 XC3S4000-4FG676I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC3S4000-4FGG676I | XC3S4000-4FGG676C | XC3S4000-4FG676C | XC3S4000-5FGG676I |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 676-BGA (27 x 27 mm) | 676-BGA | 676-BGA | 676-BGA | 676-BGA |
| Logic Cells | 62,208 | 62,208 | 62,208 | 62,208 | 62,208 |
| System Gates | 4 million | 4 million | 4 million | 4 million | 4 million |
| I/O Count | 489 | 489 | 489 | 489 | 489 |
| Total RAM | 1,769,472 bits | 1,769,472 bits | 1,769,472 bits | 1,769,472 bits | 1,769,472 bits |
| Performance Grade | -4 | -4 | -4 | -4 | -5 |
| Temperature Grade | Industrial | Industrial | Commercial | Commercial | Industrial |
| Programmable Logic | FPGA | FPGA | FPGA | FPGA | FPGA |
| Product Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
主要差異化特點
- Industrial-grade -4 option preserves the exact performance target (對比XC3S4000-4FGG676C)
- Lower speed grade can reduce procurement complexity when -5 timing is unnecessary (對比XC3S4000-5FGG676I)
- Combines substantial logic and I/O capacity in one 676-BGA device (對比XC3S4000-4FGG676I)
設計說明
Treat the 676-BGA as a high-pin-count fine-pitch assembly rather than a conventional perimeter package. Follow the manufacturer land pattern, mask, and paste recommendations, and design the board for the required X-ray inspection and assembly process. Confirm the mechanical drawings, ball-pitch tolerances, coplanarity requirements, and component placement restrictions before releasing artwork. Changes to the footprint can affect solderability, inspection coverage, and long-term product reliability.
Plan power delivery and decoupling from the device's supply and ground-ball assignments. Use the official pin table to identify every power ball and place the required bypass network close to the package according to the Spartan-3 layout guidance. Validate voltage sequencing, startup behavior, and maximum operating current against the exact -4FG676I ordering code. Because static power alone may underestimate demand, include configurable logic activity and simultaneous I/O switching in the system power estimate.
Route clocks and high-speed interfaces over continuous reference planes and use the manufacturer's recommended I/O standards and topology. Preserve symmetry for differential pairs, avoid unnecessary stubs, and include series termination where the selected interface standard calls for it. The 489 available I/O lines simplify connectivity, but they also increase the chance of simultaneous switching; analyze edge rates, crosstalk, return paths, and connector or package parasitics rather than relying only on logic timing.
Evaluate junction temperature using the configured design’s actual logic activity rather than a generic FPGA power number. Include core and I/O dissipation, adjacent regulator losses, airflow, board copper, and the package thermal model. Place thermal-plane vias under exposed thermal balls when required by the package drawing, and avoid trapping heat between the BGA and a heat sink. Validate the worst-case ambient temperature and production component tolerances before declaring thermal margin.
Do not substitute a Spartan-3 MPN based only on gate count, ball count, or family name. Confirm the exact land pattern, speed grade, temperature grade, voltage configuration, supported I/O standards, and initialization behavior. For migration among XC3S4000 variants, compare the official ordering tables and complete pin descriptions. Also verify that the replacement bitstream is supported by the selected device before changing the production BOM.
合規資訊
The available product information identifies the device as an industrial Spartan-3 FPGA but does not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Obtain the current manufacturer product declaration before making a compliance claim.
