XC5VLX50-1FF676I - 46,080-Cell Virtex-5 LX FPGA | AMD
MPN： XC5VLX50-1FF676I ✓ 啟用中XC5VLX50-1FF676I 概覽
A field-programmable gate array is a programmable logic device that can be configured after manufacture to implement digital functions ranging from interface bridging and protocol conversion to embedded control, signal processing, and high-performance parallel processing. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices and combines configurable logic blocks, programmable I/O, embedded memory resources, and dedicated configuration resources into a single integrated circuit.
The Virtex-5 LX architecture is suitable for designs requiring substantial parallel logic and high I/O density. Its 46,080 logic cells are organized into 3,600 configurable logic blocks, while 440 I/O positions provide extensive external connectivity. The 65 nm CMOS process supports integration of large programmable systems on one package, reducing the need for multiple logic devices when the design contains multiple buses, protocol engines, or data-processing pipelines.
Three principal characteristics distinguish this device. First, the large logic-cell count supports parallel architectures that may be impractical with smaller FPGAs. Second, the 440 I/O sites allow high-density connections to external memory, serializers, clocks, data converters, and parallel peripherals. Third, the -40°C to +100°C operating range supports industrial environments where commercial-temperature components are insufficient. The 676-pin FCBGA also requires careful PCB escape routing and thermal management because of its high pin count.
Typical applications include industrial control systems, communications infrastructure, test and measurement equipment, high-speed data acquisition, embedded video processing, and aerospace or defense platforms designed around the Virtex-5 family. The architecture is particularly useful when deterministic parallel throughput, flexible configuration, and a high pin count are more important than minimizing unit cost or power consumption.
The principal design consideration is package complexity. A 676-pin FCBGA requires a fine-pitch multilayer PCB, careful power and ground-plane distribution, via-in-pad or via-beneath-pad structures where appropriate, and assembly-process control for solder joints beneath the device. Designers should also use the AMD Virtex-5 package pinout files and device documentation to assign every power, ground, configuration, clock, and user I/O connection before layout release.
This page combines the verified device specifications, package and search-query information, candidate same-package alternatives, and application-focused engineering guidance. The alternatives are intended to support preliminary migration planning, while final substitution requires verification of speed grade, temperature grade, pin mapping, power characteristics, configuration compatibility, and timing closure.
直接替換替代品，適用於 XC5VLX50-1FF676I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC5VLX50-1FF676I （相同外形與佔位） — 差異在於 Device Type, Logic Cells, Package.
XC5VLX50-3FF676C
✅ 直接替換聯絡詢價
查看資料表 →XC5VLX50-1FFG676C
✅ 直接替換📋 參考替代品（不在目錄中）
XC5VLX50-1FFV676C
✅ 直接替換📋 參考替代品（不在目錄中）
XC5VLX50-3FFG676C
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC5VLX50-3FFV676C
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC5VLX50-1FF676I 最大額定值與電氣特性
| Device Type | Virtex-5 LX field-programmable gate array (FPGA) |
| Logic Cells | 46,080 cells |
| Configurable Logic Blocks | 3,600 CLBs |
| User I/O | 440 I/O |
| Process Technology | 65 nm CMOS |
| Maximum Supply Voltage | 1.05 V |
| 工作溫度 | -40°C to +100°C |
| 封裝 | 676-pin BBGA/FCBGA |
| 安裝類型 | Surface mount |
| FPGA Family | Virtex-5 LX |
| Programmable Logic Type | SRAM-configured FPGA |
| Logic Cell Count | 46,080 cells |
| Configurable Logic Block Count | 3,600 blocks |
| I/O Count | 440 I/O |
| Nominal Supply Voltage | 1 V |
| Temperature Class | -40°C to +100°C |
XC5VLX50-1FF676I 676-pin bbga/fcbga 腳位配置指南
XC5VLX50-1FF676I（676-pin bbga/fcbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC5VLX50-1FF676I.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC5VLX50-1FF676I 適用於 6 應用s: High-Speed Data Acquisition, Industrial Control and Automation, Communications and Protocol Conversion, Test and Measurement Equipment, Aerospace and Defense Processing, Embedded Video and Image Processing.
High-Speed Data Acquisition
The XC5VLX50-1FF676I fits parallel data-acquisition systems that must capture multiple channels, perform real-time filtering, and transfer results with low latency. Its 46,080 logic cells and 3,600 configurable logic blocks can support sampling, correlation, digital filtering, and packetizing pipelines, while 440 I/O sites provide connections to converters, memory, and synchronization logic. The 676-pin FCBGA favors multilayer PCB construction and careful escape routing. Timing performance must be verified against the grade-1 speed designation and the intended voltage and temperature corners.
推薦
Industrial Control and Automation
The XC5VLX50-1FF676I is suitable for industrial controllers requiring deterministic parallel logic, extensive I/O, and operation across -40°C to +100°C. A single Virtex-5 LX device can combine machine-control sequencing, communication protocols, data conditioning, and safety-adjacent monitoring logic instead of relying on several discrete controllers. Its 440 I/O sites support field-bus interfaces, sensors, actuators, and operator panels. The industrial temperature rating and 676-pin FCBGA require a robust multilayer PCB with careful grounding, thermal spreading, and surge-protection design.
推薦
Communications and Protocol Conversion
The XC5VLX50-1FF676I can consolidate multiple communications functions because 46,080 logic cells provide substantial parallel processing capacity and 440 I/O sites support high-width interfaces. Designers can implement framing, buffering, clock-domain crossing, packet inspection, and protocol conversion in programmable logic. The 676-pin FCBGA allows extensive connectivity but demands precise pin assignment and controlled escape routing. This device is especially appropriate where evolving standards require field updates or where several interface engines must operate concurrently with deterministic latency.
推薦
Test and Measurement Equipment
The XC5VLX50-1FF676I is appropriate for automated test and measurement equipment that combines pattern generation, response capture, timing control, and analysis in programmable logic. Its large logic-cell and I/O resources allow parallel channels and high-throughput data paths to be implemented in one device. A 65 nm CMOS Virtex-5 LX FPGA can support deterministic pipelines and reusable instrument architectures. The engineering trade-off is package complexity: the 676-pin FCBGA requires precise ball assignment, multilayer routing, clean clock distribution, and thermal verification under sustained acquisition workloads.
推薦
Aerospace and Defense Processing
The XC5VLX50-1FF676I can support programmable acquisition, navigation assistance, signal processing, and embedded-control functions in aerospace and defense systems where deterministic operation and broad logic capacity are important. Its 46,080 logic cells can host parallel algorithms, while 440 I/O sites connect sensors, memory, and communication equipment. The documented -40°C to +100°C range covers many environmental categories, but program-specific qualification must still be confirmed. Migration across the legacy Virtex-5 family requires controlled timing, radiation, software, and configuration reviews.
推薦
Embedded Video and Image Processing
The XC5VLX50-1FF676I is suited to embedded image-processing systems requiring parallel pixel pipelines, frame buffering interfaces, and multiple high-speed I/O channels. The 46,080 logic cells can implement color conversion, filtering, enhancement, compression pre-processing, or object-detection pre-processing in hardware. Its 440 I/O sites provide substantial connectivity to image sensors, memory, and display or network interfaces. The 676-pin FCBGA demands careful high-speed routing, return-path continuity, and power integrity, while the grade-1 speed designation must be checked against the target pixel-clock rate.
推薦
推薦產品摘要
工程參考資料，適用於 XC5VLX50-1FF676I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC5VLX50-3FF676C | XC5VLX50-1FFG676C | XC5VLX50-1FFV676C | XC5VLX50-3FFG676C |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 676-pin BBGA/FCBGA | 676-pin BBGA/FCBGA | 676-pin BBGA/FCBGA | 676-pin BBGA/FCBGA | 676-pin BBGA/FCBGA |
| FPGA Family | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX |
| Logic Cells | 46,080 cells | 46,080 cells | 46,080 cells | 46,080 cells | 46,080 cells |
| Configurable Logic Blocks | 3,600 CLBs | 3,600 CLBs | 3,600 CLBs | 3,600 CLBs | 3,600 CLBs |
| User I/O | 440 I/O | 440 I/O | 440 I/O | 440 I/O | 440 I/O |
| Process Technology | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS |
| Maximum Supply Voltage | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V |
| Speed Designation | Grade 1 | Grade 3 | Grade 1 | Grade 1 | Grade 3 |
主要差異化特點
- Broader documented operating-temperature range (對比XC5VLX50-1FFG676C)
- Established grade-1 timing option with substantial logic capacity (對比XC5VLX50-3FF676C)
- Exact 676-pin package alignment within the same device family (對比XC5VLX50-1FFV676C)
- High-density integration for parallel systems (對比XC5VLX50-3FFG676C)
設計說明
Treat the 676-pin FCBGA as a high-density multilayer-routing problem. Use the AMD package pinout and mechanical drawing to create a one-to-one ball and land-pattern mapping, place supply and ground escapes directly beneath the package where the design rules allow, and provide uninterrupted return paths beneath high-speed interfaces. Check every escape segment against the fabricator's minimum width, spacing, and via rules before releasing the PCB.
Thermal design must include the FPGA's local power dissipation, copper spreading through the package substrate, the PCB power map, and the enclosure heat path. Use the manufacturer power data for the selected speed, temperature grade, output activity, and voltage. Spread heat across multiple PCB layers where practical, avoid blocking airflow beneath the board, and verify the assembled junction-temperature margin under the worst sustained operating condition.
Separate clocks, high-speed serial or parallel data links, and slower configuration signals during floorplanning. Keep clock distribution symmetric, provide matched-length routing when the interface requires it, and use solid reference planes beneath high-speed nets. Configuration pins, mode pins, and dedicated pins require exact assignments from the AMD pin-description table; leaving their treatment to general I/O assumptions can prevent configuration or create startup problems.
Do not assume that a similar ordering code is automatically interchangeable. Differences in speed grade, temperature grade, package suffix, and lifecycle status can affect timing, qualification, and supply planning. For every proposed alternative, compare the full ordering information, pinout, configuration compatibility, supported tools and bitstreams, power characteristics, and timing results across voltage and temperature corners. Perform a formal engineering review before changing the released BOM.
合規資訊
The manufacturer package-pinout resource is listed, but no specific RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations were identified for this exact ordering code.
