XC6SLX100-2FG484I - Spartan-6 FPGA, 101261 Cells, 484-BBGA | AMD
MPN： XC6SLX100-2FG484I ✗ 停產XC6SLX100-2FG484I 概覽
A field-programmable gate array is a semiconductor whose digital logic is configured after fabrication. FPGAs occupy the programmable-logic hierarchy alongside complex programmable logic devices and programmable system-on-chip devices. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel processing, control, interface, and signal-processing functions that are revised through programmable configuration rather than redesigning the integrated circuit. This makes the Spartan-6 LX family useful where architecture flexibility, deterministic parallel execution, or long product customization is important.
The XC6SLX100-2FG484I provides 101,261 logic cells, 667 MHz internal frequency, and 484 package pins. Its 45 nm Spartan-6 LX implementation supports high-density designs using configurable logic and dedicated fixed-function blocks. The large I/O count accommodates interfaces to external memory, communications transceivers, converters, displays, sensors, and test equipment. The industrial temperature rating supports equipment intended for controlled industrial environments, although system designers must still manage junction temperature and board-level heat dissipation.
The -2 speed grade is distinct from the -3 and -3N grades in the Spartan-6 LX family. The -3 grade offers the highest family performance, while the -2 grade provides a different balance of timing performance and system implementation considerations. The 484-pin CSBGA package requires careful PCB escape routing, power-plane design, via-in-pad or via-adjacent decoupling, and assembly-process control. AMD Spartan-6 package pinout resources should be used directly when assigning every power, ground, configuration, and user I/O connection.
Typical applications include industrial control and automation, industrial Ethernet and serial networking, video and image processing, instrumentation, communications infrastructure, and embedded control systems. In each case, parallel programmable logic can implement parallel data paths, state machines, protocol handling, or custom accelerators. Configuration storage, clocking, power sequencing, and downloadable logic also make the device suitable for equipment requiring field updates after deployment.
The primary design trade-off is package complexity. A 484-pin 19 mm CSBGA provides substantial connectivity but demands fine-pitch assembly, controlled impedance routing, and careful power and thermal planning. Before layout release, verify pin assignments against the AMD package pinout file, validate every power rail against the device requirements, and complete timing and thermal analysis for the intended clock and I/O conditions.
This page combines exact device specifications, pin-compatible family alternatives, parameter comparisons, and practical PCB and design guidance. It is intended to accelerate component selection while preserving the engineering checks required for a complex programmable-logic device.
直接替換替代品，適用於 XC6SLX100-2FG484I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC6SLX100-2FG484I （相同外形與佔位） — 差異在於 Device Type, Operating Temperature, Speed Grade, Package Dimensions, Package.
XC6SLX100-2FG484C
✅ 直接替換聯絡詢價
查看資料表 →XC6SLX100-3FG484I
✅ 直接替換聯絡詢價
查看資料表 →XC6SLX100-3FG484C
✅ 直接替換聯絡詢價
查看資料表 →XC6SLX100-N3FG484I
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX100-2FGG484I
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX100-2FG484I 最大額定值與電氣特性
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Cells | 101,261 cells |
| Internal Frequency | 667 MHz |
| FPGA Technology | 45 nm |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -2 |
| 工作溫度 | 0 °C to 85 °C |
| Package Type | CSBGA-484 |
| Total Pins | 484 pins |
| Package Dimensions | 19 mm x 19 mm |
| Package Pitch | 0.80 mm |
| Lead-Free Status | Lead free |
| 安裝類型 | Surface mount |
| Programmable Logic | Spartan-6 LX FPGA |
XC6SLX100-2FG484I 0.80 mm 腳位配置指南
XC6SLX100-2FG484I（0.80 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC6SLX100-2FG484I.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC6SLX100-2FG484I 適用於 6 應用s: Industrial Control and Automation, Industrial Networking and Protocol Conversion, Video and Image Processing, Test and Measurement Instrumentation, Communications Infrastructure, Machine Vision and Inspection.
Industrial Control and Automation
The XC6SLX100-2FG484I fits industrial controllers that combine deterministic state-machine execution with parallel I/O and custom signal conditioning. Its 101,261 logic cells provide substantial programmable capacity, while the 667 MHz internal frequency supports tightly timed control logic. The industrial 0 to 85 °C rating makes it appropriate for controlled factory equipment, provided the completed assembly satisfies its EMC, power-integrity, and thermal requirements. Place configuration storage, clock sources, and external memory according to the AMD design guidance.
推薦
Industrial Networking and Protocol Conversion
The XC6SLX100-2FG484I is suitable for protocol bridges, serial gateways, and industrial Ethernet interfaces that need several datapaths operating concurrently. Its large programmable logic capacity can support frame processing, buffering, packet classification, and custom MAC functions, while 484 package pins provide broad I/O flexibility. Clock-domain crossing, pin assignments, and I/O standards must be validated against the selected configuration, and power delivery must accommodate simultaneous high-performance switching activity.
推薦
Video and Image Processing
The XC6SLX100-2FG484I can implement parallel pixel pipelines, frame timing controllers, color-processing functions, and test-pattern generators. Its 101,261 logic cells allow multiple independent pipelines to run concurrently, which is valuable in cameras, inspection equipment, and display-processing modules. The 484-pin package simplifies access to multiple data buses and synchronization signals, but designers should constrain high-speed interfaces, keep sensitive clock paths isolated, and verify timing under the actual video pixel rate rather than relying only on the device’s internal frequency.
推薦
Test and Measurement Instrumentation
The XC6SLX100-2FG484I supports programmable logic-based data acquisition, waveform generation, digital pattern control, and multi-channel synchronization in instrumentation equipment. Parallel resources can be combined into dedicated acquisition channels, while the 484-pin package provides ample connections to converters, memory, and clock circuitry. High-accuracy measurement designs should isolate analog sections from digital switching activity, use controlled-impedance routing for high-speed interfaces, and validate configuration determinism before calibration sequences begin.
推薦
Communications Infrastructure
The XC6SLX100-2FG484I is appropriate for line-card control, interface aggregation, and protocol-aware traffic processing in communications equipment. Its programmable architecture allows fixed functions to be adapted without changing board layout, and the large logic-cell count supports parallel routing, header processing, and buffering control. For line-card deployment, pay particular attention to clock quality, I/O voltage compatibility, thermal behavior, and the separation of high-speed data paths from sensitive management and configuration signals.
推薦
Machine Vision and Inspection
The XC6SLX100-2FG484I fits machine-vision controllers requiring simultaneous camera-interface logic, image preprocessing, exposure sequencing, and inspection decisions. Its parallel programmable resources can implement line and pixel pipelines efficiently, while the 484-pin package provides connectivity for sensors, memory, and machine-control interfaces. The system should use separate clock domains with controlled return paths, isolate sensitive sensor circuitry from digital switching noise, and confirm that the selected configuration satisfies the camera’s line-rate and latency requirements.
推薦
推薦產品摘要
工程參考資料，適用於 XC6SLX100-2FG484I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC6SLX100-2FG484C | XC6SLX100-3FG484I | XC6SLX100-3FG484C | XC6SLX100-N3FG484I | XC6SLX100-2FGG484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-pin CSBGA, 19 mm x 19 mm, 0.80 mm pitch | 484-pin CSBGA, 19 mm x 19 mm, 0.80 mm pitch | 484-pin CSBGA, 19 mm x 19 mm, 0.80 mm pitch | 484-pin CSBGA, 19 mm x 19 mm, 0.80 mm pitch | 484-pin CSBGA, 19 mm x 19 mm, 0.80 mm pitch | 484-pin CSBGA, 19 mm x 19 mm, 0.80 mm pitch |
| Device Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 101,261 cells | 101,261 cells | 101,261 cells | 101,261 cells | 101,261 cells | 101,261 cells |
| Internal Frequency | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz |
| Speed Grade | -2 | -2 | -3 | -3 | N3 | -2 |
| FPGA Technology | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
主要差異化特點
- Industrial-temperature capability (對比XC6SLX100-2FG484C)
- Lower -2 performance designation (對比XC6SLX100-3FG484I)
- Retained 101,261-cell logic density (對比XC6SLX100-N3FG484I)
設計說明
Treat the 0.80 mm-pitch CSBGA as a high-density routing problem. Use the AMD Spartan-6 package device pinout file for the exact FG484 ball assignments, escape each selected ball according to the PCB fabrication and assembly capability, and provide uninterrupted return paths beneath high-speed interfaces. Do not infer ball locations from a generic BGA symbol because power islands, configuration pins, and user I/O positions are device-specific.
Plan a dedicated 1.2 V core rail with low-impedance distribution, local bulk capacitance, and high-frequency decoupling placed directly at the device supply pins. Separate core and I/O supplies where the device configuration requires distinct rails, and validate voltage sequencing against the manufacturer requirements. Estimated: without the full power-budget and transient-response information, no reliable capacitor value or dissipation figure can be calculated; use simulation and board measurements instead.
Calculate heat dissipation from the selected design rather than from the 667 MHz internal frequency alone, because actual switching activity and I/O load determine FPGA power. Spread heat through the PCB under the device, avoid placing heat-sensitive analog sections directly beneath the BGA, and model airflow for the installed enclosure. The industrial 0 to 85 °C rating describes ambient capability, not unlimited die dissipation or unrestricted board temperature.
Assign external clocks through the intended clock-capable pins, preserve clock symmetry where source-synchronous interfaces are used, and keep configuration or programming pins away from aggressive switching nets. Use controlled-impedance routing for high-speed buses, add matched-length adjustment where required, and verify I/O standards, drive strength, slew rate, and termination against the selected pin and timing constraints.
Do not substitute MPNs by package similarity alone. The speed grade changes timing characteristics, the temperature suffix changes the environmental range, and package-code differences can alter ordering or footprint details. When replacing XC6SLX100-2FG484I, verify the exact AMD package file, rerun static timing, check configuration compatibility, and reassess power and operating-temperature requirements before releasing the substitution.
合規資訊
The indexed package specification identifies the device as lead free. No explicit RoHS, REACH, halogen-free, conflict-minerals, or automotive qualification statement was present for the exact MPN.
