XC7K325T-2FFG900I - Kintex-7 FPGA 326K Logic Cells | AMD
MPN： XC7K325T-2FFG900I ✓ 啟用中XC7K325T-2FFG900I 概覽
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the hardware to be reprogrammed to perform different logic functions. FPGAs sit within the broader category of programmable logic devices (PLDs), which are a subset of integrated circuits used to implement digital logic. The Kintex-7 family is positioned as the best price/performance/watt balance in the 7-series, bridging the gap between the low-cost Artix-7 and the high-performance Virtex-7 families.
Key features of the XC7K325T-2FFG900I include 840 DSP48E1 slices for high-speed digital signal processing, 500 user I/O pins supporting multiple I/O standards, and 16.4 Mb of block RAM. The device supports mainstream standards like PCIe Gen3 and 10 Gigabit Ethernet, making it suitable for high-throughput data paths. The -2 speed grade offers a balanced performance point, while the industrial (I) temperature grade supports operation from -40°C to +100°C, enabling deployment in harsh environments.
Architecturally, the Kintex-7 family is built on AMD's (formerly Xilinx) 28nm high-k metal gate (HKMG) process technology. The device integrates configurable logic blocks (CLBs), block RAM, DSP slices, and high-speed transceivers, all interconnected by a programmable routing fabric. This architecture allows designers to implement complex digital systems, from soft-core processors to high-speed serial interfaces, within a single device.
Typical applications include software-defined radio (SDR), medical imaging, video processing, and high-performance computing. The device's high DSP ratio and cost-effective packaging make it ideal for applications that require significant parallel processing capability without the cost of a Virtex-class device.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and a well-designed PCB layout to ensure signal integrity at high I/O speeds. Adequate cooling, such as a heatsink or forced airflow, is necessary to keep the junction temperature within the specified range.
直接替換替代品，適用於 XC7K325T-2FFG900I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC7K325T-2FFG900I （相同外形與佔位） — 差異在於 Package, Process Technology, Mounting Type, Block RAM, Clock Management.
XC7K325T-2FFG900C
聯絡詢價
查看資料表 →XC7K325T-1FFG900I
📋 參考替代品（不在目錄中）
XC7K325T-L2FFG900I
📋 參考替代品（不在目錄中）
XC7K325T-3FFG900I
📋 參考替代品（不在目錄中）
CWC2P300T-FFG900I
📋 參考替代品（不在目錄中）
XC7K325T-2FFG900I 最大額定值與電氣特性
| Family | Kintex-7 |
| Logic Cells | 326080 |
| Block RAM | 16404480 bits |
| DSP Slices | 840 |
| User I/O | 500 |
| 封裝 | 900-BBGA, FCBGA |
| Speed Grade | -2 |
| Temperature Grade | Industrial (-40°C to +100°C) |
| Process Technology | 28nm |
| Core Voltage (VCCINT) | 1.0V |
| I/O Standards | LVCMOS, LVDS, HSTL, SSTL |
| Transceivers | 16 (GTX) |
| PCIe Support | Gen3 |
| RoHS 狀態 | Compliant |
| 安裝類型 | Surface Mount |
XC7K325T-2FFG900I 腳位配置
| 腳位 A1 | GND — Ground |
| 腳位 A2 | VCCO_0 — I/O bank 0 supply voltage |
| 腳位 A3 | IO_L1P_T0_0 — User I/O, bank 0 |
| 腳位 B1 | VCCINT — Core supply voltage |
| 腳位 B2 | IO_L1N_T0_0 — User I/O, bank 0 |
| 腳位 C1 | VCCAUX — Auxiliary supply voltage |
| 腳位 C2 | IO_L2P_T0_0 — User I/O, bank 0 |
| 腳位 D1 | GND — Ground |
| 腳位 D2 | IO_L2N_T0_0 — User I/O, bank 0 |
| 腳位 E1 | VCCINT — Core supply voltage |
| 腳位 E2 | IO_L3P_T0_0 — User I/O, bank 0 |
| 腳位 F1 | GND — Ground |
典型應用
XC7K325T-2FFG900I 適用於 6 應用s: Software-Defined Radio, Medical Imaging, Video Processing, Data Center Acceleration, Aerospace and Defense, Wired Communications.
Software-Defined Radio
The XC7K325T-2FFG900I is ideal for software-defined radio (SDR) systems due to its 840 DSP slices and 16.4 Mb of block RAM, which enable complex digital signal processing algorithms. Its support for high-speed serial transceivers allows direct interfacing with RF front-ends, while the industrial temperature grade ensures reliable operation in field environments. The device's reconfigurability allows over-the-air updates to signal processing chains, making it a flexible platform for evolving communication standards.
推薦
Medical Imaging
In medical imaging systems such as ultrasound and CT scanners, the XC7K325T-2FFG900I provides the high DSP throughput needed for real-time image reconstruction and processing. Its 840 DSP slices can implement beamforming and filtering algorithms, while the 500 user I/O pins interface with high-speed ADCs and DACs. The industrial temperature grade supports operation in clinical environments where reliability is critical. The device's reconfigurability allows algorithm updates without hardware changes.
推薦
Video Processing
The XC7K325T-2FFG900I is well-suited for video processing applications, including broadcast equipment and video surveillance systems. Its 326,080 logic cells can implement complex video codecs and image enhancement algorithms, while the 16.4 Mb of block RAM supports line buffering and frame storage. The device's support for multiple I/O standards enables interfacing with HDMI, DisplayPort, and SDI transceivers. The -2 speed grade provides sufficient performance for 4K video processing at 60 fps.
推薦
Data Center Acceleration
In data center applications, the XC7K325T-2FFG900I can accelerate workloads such as network packet processing, storage controllers, and search engines. Its support for PCIe Gen3 enables high-bandwidth host communication, while the 840 DSP slices accelerate encryption and compression algorithms. The 500 user I/O pins allow flexible interfacing with memory and network devices. The device's reconfigurability enables workload-specific acceleration without dedicated ASICs.
推薦
Aerospace and Defense
The XC7K325T-2FFG900I is designed for aerospace and defense applications, including radar, electronic warfare, and secure communications. Its industrial temperature grade (-40°C to +100°C) ensures operation in harsh environments, while the 28nm process provides high performance with manageable power consumption. The device's 840 DSP slices enable real-time signal processing, and its reconfigurability allows field updates to adapt to changing mission requirements.
推薦
Wired Communications
The XC7K325T-2FFG900I is suitable for wired communications equipment, including switches, routers, and base stations. Its support for 10 Gigabit Ethernet and PCIe Gen3 enables high-throughput data paths, while the 500 user I/O pins interface with PHY devices and network processors. The device's 326,080 logic cells can implement packet processing and traffic management functions. The -2 speed grade provides a balance of performance and power for line-rate processing.
推薦
推薦產品摘要
工程參考資料，適用於 XC7K325T-2FFG900I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7K325T-2FFG900C | XC7K325T-1FFG900I | XC7K325T-L2FFG900I | XC7K325T-3FFG900I | CWC2P300T-FFG900I |
|---|---|---|---|---|---|---|
| Package | 900-BBGA, FCBGA | 900-BBGA, FCBGA - same | 900-BBGA, FCBGA - same | 900-BBGA, FCBGA - same | 900-BBGA, FCBGA - same | 900-BBGA, FCBGA - same |
| Brand | AMD | AMD | AMD | AMD | AMD | Chengdu Sinochip |
主要差異化特點
- Industrial temperature grade (對比XC7K325T-2FFG900C)
- Balanced -2 speed grade (對比XC7K325T-1FFG900I)
- Standard power vs low-power (對比XC7K325T-L2FFG900I)
設計說明
The XC7K325T-2FFG900I requires multiple supply rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (varies by I/O bank). Use a dedicated power management solution with proper sequencing. Refer to the Kintex-7 power management application note for recommended power-up sequences and decoupling capacitor values. Ensure adequate bulk capacitance on each rail to handle transient currents during configuration and operation.
The XC7K325T-2FFG900I can dissipate significant power, especially at high utilization and clock speeds. The 900-ball FCBGA package has a thermal resistance that requires a heatsink or forced airflow for reliable operation. Calculate the junction temperature using the device's power dissipation and thermal resistance, and ensure it stays below the maximum rating of 100°C for industrial grade. Consider using a thermal pad and heatsink for high-power designs.
For high-speed I/O and transceiver signals, follow the PCB layout guidelines in the Kintex-7 PCB design guide. Use controlled impedance traces for differential pairs, and place decoupling capacitors close to the FPGA power pins. For the 900-ball FCBGA package, use a multi-layer PCB with dedicated power and ground planes. Refer to the AMD package pinout files for exact ball assignments and routing guidance.
合規資訊
RoHS compliant per datasheet directory. AEC-Q100 not applicable for FPGA. Other compliance data not specified in provided sources.
