XC7S25-1FTGB196C - Spartan-7 FPGA 25K Logic Cells | AMD Xilinx
MPN： XC7S25-1FTGB196C ✓ 啟用中| 數量 | 單價 | 小計 |
|---|---|---|
| 1 | $71.5 | $71.50 |
| 10 | $64.35 | $643.50 |
| 100 | $57.2 | $5,720.00 |
| 500 | $51.48 | $25,740.00 |
| 1,000 | $46.2 | $46,200.00 |
| 2,500 | $41.58 | $103,950.00 |
XC7S25-1FTGB196C 概覽
A field programmable gate array (FPGA) is a reprogrammable semiconductor device whose logic fabric, interconnect, and I/O can be configured by the customer after PCB assembly. FPGAs sit at the parallel-programmable tier of the digital IC hierarchy: FPGA → programmable logic device (PLD) → logic IC → integrated circuit. They are used to implement custom data paths, glue logic, hardware accelerators, and deterministic interfaces that ASICs or microcontrollers cannot address efficiently. The Spartan-7 family is positioned below Artix-7 and Kintex-7 in the AMD/Xilinx 7-series, targeting industrial, automotive, and consumer applications where Artix-7 capability is not required.
Key features include up to 150 user I/O pins, 3.65K logic slices distributed across the fabric, six clock-management tiles (CMTs) with integrated PLLs, and support for common low-voltage I/O standards including LVCMOS 1.2V-3.3V and LVDS. The device operates from a 1.0 V core supply with separate HR/HP bank supplies; the -1 speed grade is the slowest of the three Spartan-7 grades, optimizing cost over frequency.
Architecture-wise, Spartan-7 combines Configurable Logic Blocks (CLBs) with 6-input LUTs, dedicated 36 Kbit block RAM blocks, DSP48E1 slices supporting 25 × 18 multipliers at up to 466 MHz, and high-speed serial transceivers are not present — designers use PLLs and SelectIO for high-speed parallel I/O instead. Bitstream encryption and SHA-256 authentication protect IP. Configuration uses SPI, BPI, JTAG, or Master/Slave Serial modes.
Typical applications include industrial motor control and sensor fusion, low-cost machine-vision pre-processing, embedded IoT gateways, legacy interface bridging, and cost-optimized communications line cards. The compact FTGB196 package suits handheld and space-constrained designs. Compared to larger Spartan-7 devices such as the XC7S50 and XC7S75, the XC7S25 offers the smallest logic capacity in a compatible 196-ball footprint, enabling easy upward migration.
When designing with this part, ensure the FTGB196 PCB footprint provides adequate via-in-pad escape routing. Decoupling requires 0402-size 0.1 µF MLCCs placed adjacent to every VCC/VCCO bank with bulk 47 µF tantalum or polymer capacitors on each supply plane. Engineers should generate bitstreams using Vivado Design Suite 2018.3 or later with the Spartan-7 device support package installed. This page synthesizes distributor pricing, drop-in Spartan-7 alternatives, and practical design notes that are not consolidated in any single manufacturer datasheet.
直接替換替代品，適用於 XC7S25-1FTGB196C — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC7S25-1FTGB196C （相同外形與佔位） — 差異在於 DSP Slices, Package, RoHS Status, Temperature Grade.
快速比較工具 — 選擇替代零件進行並排比較：
XC7S15-1FTGB196C
✅ 直接替換聯絡詢價
查看資料表 →XC7S50-1FTGB196C
✅ 直接替換📋 參考替代品（不在目錄中）
XC7S25-1FTGB196I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC7S25-2FTGB196C
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC7S25-1FTGB196C 最大額定值與電氣特性
| Product Family | Spartan-7 |
| FPGA Logic Cells | 23,360 (25K) |
| Logic Slices | 3,650 |
| Block RAM (bits) | 1,658,880 |
| Block RAM (Kb) | 1,620 Kb |
| DSP Slices | 80 |
| User I/O (FTGB196) | 100 (up to 150 max per device family) |
| CMTs / PLLs | 6 (each with 2 PLLs) |
| Speed Grade | -1 |
| Temperature Grade | C (commercial, 0C to +85C) |
| Core Voltage | 1.0 V nominal |
| Auxiliary Voltage | 1.8 V |
| I/O Bank Voltage (VCCO) | 1.2 V to 3.3 V |
| 封裝 | 196-ball FTGB (CSPBGA), 15x15 mm, 1.0 mm pitch |
| Process Node | 28 nm HPL (high-performance low-power) |
| Configuration Modes | Master/Slave Serial, SPI, BPI, JTAG |
| Bitstream Encryption | AES-256 / SHA-256 supported |
| RoHS 狀態 | Compliant (lead-free) |
XC7S25-1FTGB196C 196-ball ftgb (cspbga), 15x15 mm, 1.0 mm pitch 腳位配置指南
XC7S25-1FTGB196C（196-ball ftgb (cspbga), 15x15 mm, 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC7S25-1FTGB196C.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC7S25-1FTGB196C 適用於 6 應用s: Industrial Motor Control & Sensor Fusion, Low-Cost Machine Vision Pre-Processing, Embedded IoT Gateway & Legacy Interface Bridging, Communications Line-Card Glue & Protocol Conversion, Automotive Driver Assistance & Sensor Pre-Processing, Test & Measurement Front-End Reconfiguration.
Industrial Motor Control & Sensor Fusion
The XC7S25-1FTGB196C is well suited to industrial motor-control and sensor-fusion nodes where deterministic I/O timing and parallel DSP throughput matter more than absolute logic density. The 80 DSP48E1 slices deliver up to ~40 GMACs of integer/fixed-point throughput at 466 MHz, more than enough to host space-vector modulators, FOC loops, or simple Kalman filters for multi-axis drives. The 1,658,880 bits of block RAM buffer sensor samples (encoder decimation, accelerometer FIFO, ADC windowing) without bus contention, while 100 user I/O handle quadrature inputs, Hall sensors, PWM outputs, and RS-485/Modbus links at the same time.
推薦
Low-Cost Machine Vision Pre-Processing
Factory-floor machine-vision pre-processing — Bayer demosaicing, thresholding, blob detection, simple CNN inference — fits comfortably in the XC7S25-1FTGB196C. The 23,360 logic cells and 80 DSP48 slices accelerate streaming pixel pipelines at OV5640 / MT9V034 sensor rates, while the LVDS SelectIO capability accepts MIPI-CSI-2 lanes via a deserializer bridge. Block RAM stores line buffers and feature maps in on-die memory, eliminating external SRAM for many tasks.
推薦
Embedded IoT Gateway & Legacy Interface Bridging
IoT gateways frequently require bridging between legacy industrial buses (CAN, RS-232, RS-485, I2C, SPI, parallel) and modern TCP/IP or BLE interfaces, and the XC7S25-1FTGB196C executes these bridges efficiently. The 23,360 logic cells host multiple soft IP cores (UART, SPI controller, GMII/RGMII MAC, custom glue) in parallel; the soft ARM Cortex-M1/M3 MicroBlaze core option enables on-chip housekeeping. With 100 user I/O and 28 nm low-power operation, the device provides the deterministic port count needed in protocol-converter or industrial-sensor-hub designs.
推薦
Communications Line-Card Glue & Protocol Conversion
In cost-optimized communications line cards the XC7S25-1FTGB196C acts as a glue and conversion layer between media framer ICs, SERDES transceivers (when present), and the host MAC. The FPGA splits/merges VLAN tags, implements oversampling clock-recovery, and runs soft PTP timestamps for IEEE 1588 sync. With 6 CMTs and 12 PLLs it generates the multiple independent clock domains needed across CPRI/eCPRI or proprietary backhaul designs.
推薦
Automotive Driver Assistance & Sensor Pre-Processing
Although the XC7S25-1FTGB196C is the commercial-grade (-1 speed, -C temp 0C to +85C) variant, the same Spartan-7 die underlays automotive-qualified versions used in ADAS sensor hubs, reversing cameras, and low-cost radar pre-processing. The FPGA aggregates multi-sensor streams (CAN-FD from ultrasonic, LVDS from camera, parallel from chassis ECUs) and performs early-stage filtering before forwarding to the main ECU. Its deterministic latency and temperature tolerance make it a fit for cabin-mounted electronics when paired with the industrial-grade or Q1 revisions.
推薦
Test & Measurement Front-End Reconfiguration
Test-and-measurement instruments use the XC7S25-1FTGB196C as a reconfigurable front-end that pattern-generates stimulus data, captures response streams, and run-time-protocol-checks I/O under test. The FPGA's high pin count and tight SelectIO timing windows allow multi-standard stimulus where proprietary protocols must be emulated without dedicated ASICs. Combined with adjacent ADCs/DACs the same hardware supports bench oscilloscopes, logic analyzers, or low-end spectrum-analyzer staging platforms.
推薦
推薦產品摘要
工程參考資料，適用於 XC7S25-1FTGB196C — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7S15-1FTGB196C | XC7S50-1FTGB196C | XC7S25-1FTGB196I | XC7S25-2FTGB196C |
|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | FTGB196 (CSPBGA-196) | FTGB196 (CSPBGA-196) - same | FTGB196 (CSPBGA-196) - same | FTGB196 (CSPBGA-196) - same | FTGB196 (CSPBGA-196) - same |
| Logic Cells | 23,360 | 12,760 | 43,520 | 23,360 | 23,360 |
| Block RAM (bits) | 1,658,880 | 921,600 | 2,764,800 | 1,658,880 | 1,658,880 |
| DSP Slices | 80 | 50 | 120 | 80 | 80 |
| Speed Grade | -1 | -1 | -1 | -1 | -2 (faster Fmax) |
| Temperature Range | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | -40C to +100C (Industrial) | 0C to +85C |
| User I/O | 100 | 100 | 100 | 100 | 100 |
主要差異化特點
- Lowest-cost Spartan-7 with the full FTGB196 I/O envelope (對比XC7S50-1FTGB196C)
- Drop-in upsize path to XC7S50 within same FTGB196 footprint (對比XC7S15-1FTGB196C)
- Commercial-grade pricing, industrial-grade upgradability (對比XC7S25-1FTGB196I)
設計說明
Estimated: at full logic utilization (~75% slice usage, dsp_rate=466 MHz, 100% I/O switching) the Spartan-7 XC7S25 in FTGB196 draws approximately 0.8-1.0 W from VCCINT. The FTGB196 15x15 mm CSPBGA has a theta_JA in the 28-32 C/W range with a reference JEDEC JESD51-7 4-layer test board, giving a junction-temperature rise of ~30 C above ambient for typical 1 W dissipation. For enclosed industrial enclosures (45-60 C ambient), ensure FPGA junction temperature remains below 85 C for commercial-grade variants — derate clock frequency or switching rate if thermal margin is tight. The thermal pad should be soldered to the PCB ground plane with thermal vias per UG475 guidelines.
Estimated layout: the FTGB196 is a 196-ball CSPBGA with 1.0 mm ball pitch on a 15x15 mm body. Provide via-in-pad escape routing (8 mil via diameter with 12 mil capture pad) on every signal ball. The reference decoupling plan per UG475 / UG583 is one 0.1 µF 0402 MLCC adjacent to every VCCINT, VCCAUX, and VCCO pin plus one 4.7 µF bulk capacitor per power rail on each side of the package. Trace length between pin-pair transitions must be impedance-matched to the SelectIO standard in use (LVCMOS33: 50 ohm to 60 ohm; LVDS: 100 ohm differential).
Power sequencing is critical: VCCINT (1.0 V) must reach 90% before VCCAUX (1.8 V), and VCCO (per-bank) must track VCCAUX closely. Many designs ramp VCCINT, VCCAUX, and VCCO from a common controller (e.g., a multi-rail PMIC such as TPS652170RSLT) to within ±100 ms. Use TPS7A7002DDA or TPS7A2450DBVR LDOs for noise-sensitive analog rails. Decoupling bulk capacitors should be low-ESR ceramic or polymer and rated for at least twice the maximum supply voltage.
Common pitfalls to avoid on this part: (1) Configuring pins as differential SelectIO without setting VREF correctly for the I/O standard in use. (2) Driving CCLK or M0-M2 configuration mode pins to conflicting levels during startup — they must be tied to GND or VCCO through 4.7 kohm pull resistors, not left floating. (3) Using the -1 speed grade for designs where the datasheet Fmax margin is below 100 MHz — consider migrating to the XC7S25-2FTGB196C. (4) Forgetting to enable bitstream encryption (AES-256) for production builds.
合規資訊
RoHS and REACH compliant per AMD product declarations. Halogen-free BGA balls. Not AEC-Q100 qualified — choose the XC7S25-Q1 variant suffix for automotive qualification, or use the industrial-grade XC7S25-1FTGB196I for -40C ambient operation.
