XCKU3P-2SFVB784E - Kintex UltraScale+ 304 I/O 784-BFBGA FPGA
MPN： XCKU3P-2SFVB784E ✓ 啟用中XCKU3P-2SFVB784E 概覽
A field-programmable gate array is a programmable digital integrated circuit. An FPGA belongs to the semiconductor and programmable-logic hierarchy, combining configurable logic blocks, programmable I/O, embedded memory, dedicated arithmetic resources, and clocking and routing resources. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reprogrammed for different algorithms, interfaces, and system architectures after manufacture.
The Kintex UltraScale+ family is designed for high-performance programmable systems. In this part, the combination of 304 I/O and a large logic-resource count supports designs requiring substantial parallel processing, broad external connectivity, and high-speed data movement. The 784-BFBGA package provides a dense surface-mount implementation for complex systems rather than a simple discrete-package design.
The 784-BFBGA format is intended for high-density PCB layouts. Its ball grid requires careful escape-routing, power-plane distribution, thermal management, and BGA assembly process control. Because the package contains a large programmable device, designers should plan decoupling, regulated supplies, clocking, configuration memory, and download or boot interfaces before finalizing the PCB.
Typical uses include high-speed data acquisition, test and measurement, communications infrastructure, industrial control, video processing, and accelerator or prototyping systems. The FPGA's parallel architecture can accelerate workloads that benefit from configurable pipelines, parallel lanes, and hardware-constrained data paths. The exact performance of any such system depends on the selected clocking resources, memory interface implementation, I/O standards, and device configuration.
For PCB implementation, use the AMD package pinout and mechanical files for the exact ordering code. Check all power, ground, configuration, clock, and I/O assignments against the manufacturer package documentation before fabrication. Treat the 784-BFBGA footprint as a high-density assembly design rather than a conventional two-row leaded package.
This product page organizes the core device identity, package information, application guidance, replacement analysis, and engineering-oriented selection notes for engineers evaluating the XCKU3P-2SFVB784E.
直接替換替代品，適用於 XCKU3P-2SFVB784E — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XCKU3P-2SFVB784E （相同外形與佔位） — 差異在於 Package Type, Device Family, I/O Count, Package, Speed Grade.
XCKU3P-L2SFVB784E
✅ 直接替換📋 參考替代品（不在目錄中）
XCKU3P-2SFVB784E 最大額定值與電氣特性
| Device Type | Kintex UltraScale+ FPGA |
| Programmable Logic Type | Field-programmable gate array (FPGA) |
| I/O Count | 304 I/O |
| Logic Cell Count | 31,641,600 logic cells |
| LUT Count | 355,950 LUTs |
| 封裝 | 784-BFBGA FCBGA |
| Package Type | Fine-pitch ball-grid-array FCBGA |
| 安裝類型 | Surface mount |
| Device Family | Kintex UltraScale+ |
| Speed Grade | -2 |
XCKU3P-2SFVB784E fine-pitch ball-grid-array fcbga 腳位配置指南
XCKU3P-2SFVB784E（fine-pitch ball-grid-array fcbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XCKU3P-2SFVB784E.
請參閱 資料表 以查看完整腳位配置。
典型應用
XCKU3P-2SFVB784E 適用於 6 應用s: High-Speed Data Acquisition, Test and Measurement Systems, Communications Infrastructure, Industrial Control and Automation, Video and Image Processing, High-Performance Prototyping and Accelerators.
High-Speed Data Acquisition
The XCKU3P-2SFVB784E fits parallel data-acquisition systems that require many external channels and substantial programmable logic. Its 304 I/O can support dense sensor, ADC, digital I/O, and timing connections, while approximately 31,641,600 logic cells support filtering, correlation, buffering, and real-time data organization. The -2 speed grade is relevant to timing-critical pipelines, but achievable signal rates also depend on the selected I/O standard, clocking resources, board-level loss, and device pin constraints. Layout should preserve the package’s power and ground connectivity, use the exact ball assignments, and route high-speed interfaces with controlled impedance.
推薦
Test and Measurement Systems
The XCKU3P-2SFVB784E is suitable for modular test and measurement equipment requiring configurable channels, timing, and signal processing. The 304-I/O device can connect logic, counters, pattern resources, converters, and control interfaces without relying on a fixed application-specific architecture. Approximately 355,950 LUTs and 31,641,600 logic cells allow measurement algorithms, acquisition pipelines, and control logic to share one programmable platform. Performance should be partitioned across clock regions and resources with the Vivado design tools. Power integrity, sequential configuration, and synchronization between instruments are as important as the FPGA logic itself.
推薦
Communications Infrastructure
The XCKU3P-2SFVB784E can support communications line cards, packet-processing prototypes, and high-throughput interface bridges that benefit from parallel programmable architecture. Its 304 I/O provides a broad connection surface for network data, control, clocks, and status signals, while the large logic-cell count supports protocol state machines, packet classification, queues, and header processing. The 784-BFBGA package also enables compact high-density board designs, although that density requires careful escape routing and assembly planning. Designers should verify the exact transceiver, hard-interface, clock, and I/O resources required by the target standard rather than assuming every protocol feature is available.
推薦
Industrial Control and Automation
The XCKU3P-2SFVB784E fits industrial controllers that combine deterministic I/O, parallel control logic, diagnostics, and communications. Its 304 I/O supports a mixture of field-bus, encoder, relay-control, digital I/O, and external monitoring connections, while the large programmable fabric allows protocol conversion and real-time control functions to be consolidated. The -2 speed designation can help when control and acquisition paths require tighter timing margins, but final performance must be checked against the exact clocking and I/O specifications. Industrial products should also account for operating temperature, power-transient tolerance, functional safety evidence, and lifecycle commitments in the system qualification plan.
推薦
Video and Image Processing
The XCKU3P-2SFVB784E is appropriate for image pipelines requiring parallel pixels, multiple data streams, and configurable preprocessing. The 304 I/O can accommodate high-volume parallel input and output interfaces, while approximately 31,641,600 logic cells and 355,950 LUTs provide substantial capacity for filters, color conversion, feature extraction, and frame control. A BGA implementation also allows the device to coexist with external memory and high-speed interface components in a dense board layout. Actual frame rate and channel width depend on memory bandwidth, selected I/O standards, clock sources, and timing closure. Use the AMD device resources report to prevent unplanned over-allocation of logic, block RAM, and DSP resources.
推薦
High-Performance Prototyping and Accelerators
The XCKU3P-2SFVB784E supports FPGA-based prototyping, custom accelerators, and algorithm exploration where hardware parallelism and reconfigurability are important. The device combines approximately 31,641,600 logic cells with 304 I/O, allowing datapath logic, memory interfaces, control functions, and host-facing links to coexist in one package. Its -2 speed grade is relevant to pipelines requiring greater timing margin, but real accelerator throughput must be calculated from clock frequency, resource mapping, memory bandwidth, and data-movement overhead. The 784-BFBGA layout requires a disciplined PCB stack-up, power grid, escape-routing strategy, and thermal model before the prototype is fabricated.
推薦
推薦產品摘要
工程參考資料，適用於 XCKU3P-2SFVB784E — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XCKU3P-L2SFVB784E |
|---|---|---|
| Package | 784-BFBGA FCBGA | 784-BFBGA FCBGA |
| Brand | AMD | AMD |
| Device Family | Kintex UltraScale+ | Kintex UltraScale+ |
| I/O Count | 304 I/O | 256 I/O |
| Speed Designation | -2 | L2 |
| Programmable Device Type | FPGA | FPGA |
| Mounting Type | Surface mount | Surface mount |
| Cross-Manufacturer Alternatives | None confirmed | No cross-manufacturer candidate confirmed |
主要差異化特點
- Higher published I/O count than the related L2 ordering code (對比XCKU3P-L2SFVB784E)
- Uses the -2 speed designation (對比XCKU3P-L2SFVB784E)
- Dense 304-I/O integration in the specified package (對比XCKU3P-L2SFVB784E)
設計說明
Use the exact AMD SFVB784E package files to define the 784-BFBGA footprint, ball map, pin-1 orientation, and land pattern. Route power and ground through a dense via array and preserve low-impedance planes beneath the device. Because a BGA escape route cannot be repaired without rework, complete stack-up, impedance, via-in-pad, assembly, and solder-mask checks before fabrication.
Obtain the device-specific power rails, current limits, sequencing rules, and decoupling recommendations from the manufacturer datasheet before designing the supply network. The available product listing does not establish those numeric limits, so do not size the power supply from FPGA-family assumptions. Validate startup, shutdown, rail sequencing, transient response, and power-supply noise margin with the final configuration and board layout.
Model junction temperature from the actual activity factor, package thermal data, PCB copper, airflow, enclosure temperature, and neighboring heat sources. A high-performance 784-BFBGA design can concentrate activity in selected clock and logic regions, so a uniform ambient calculation is insufficient. Use Vivado thermal reporting and board-level measurements to identify hot areas and determine whether additional airflow, heat spreading, or a thermal design change is required.
Do not treat a same-family or same-package ordering code as an automatic replacement. XCKU3P-L2SFVB784E uses the same 784-FCBGA family designation, but a comparison record lists 256 I/O versus the target's 304 I/O. Compare every ball assignment, configuration interface, power rail, supported resource, speed grade, and required bitstream before approving a substitution.
Assign high-speed interfaces through the device pinout and AMD design guidance rather than selecting pins by proximity. Plan controlled-impedance routes, return paths, clock distribution, and I/O buffers according to the selected voltage and protocol. For wide parallel buses, constrain skew and account for package and board loss in simulation; for external memory interfaces, follow the prescribed topology and layer-transition guidance.
合規資訊
No specific RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status is stated in the available device records.
