XCZU28DR-2FSVE1156I - Zynq UltraScale+ RFSoC Gen 3 | AMD
MPN： XCZU28DR-2FSVE1156I ✓ 啟用中XCZU28DR-2FSVE1156I 概覽
A Zynq UltraScale+ RFSoC is a System-on-Chip (SoC) that merges an FPGA fabric with a multi-core processor subsystem and integrated RF analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). This integration eliminates the need for separate discrete converters, reducing board space, power consumption, and design complexity. The RFSoC family is part of the broader adaptive SoC category, which includes FPGAs and other programmable devices, and is designed for applications requiring high-speed data conversion and flexible digital processing.
Key features of the XCZU28DR-2FSVE1156I include the Zynq UltraScale+ RFSoC Gen 3 architecture, which provides enhanced RF performance and higher bandwidth compared to previous generations. The device supports a maximum logic cell count of 930K+ and operates at a maximum clock frequency of 1.333 GHz for the PS and 533 MHz for the PL. The integrated RF data converters support direct RF sampling, enabling software-defined radio and radar systems. The device also includes a rich set of I/O options, including high-speed transceivers and general-purpose I/O.
From a technical perspective, the XCZU28DR-2FSVE1156I leverages AMD's UltraScale+ architecture, which offers advanced power management, security features, and high-speed connectivity. The device supports a wide range of interfaces, including PCIe, Ethernet, and USB, making it suitable for diverse applications. The RFSoC Gen 3 devices are designed to meet the demands of 5G wireless infrastructure, aerospace and defense, and test and measurement equipment.
Typical applications for the XCZU28DR-2FSVE1156I include 5G massive MIMO base stations, radar and electronic warfare systems, and high-speed data acquisition systems. The device's integrated RF converters and powerful processing capabilities make it ideal for these applications, where high bandwidth and low latency are critical.
When designing with this device, it is important to consider the power supply requirements and thermal management. The device requires multiple power rails with specific sequencing, and adequate cooling is necessary to maintain reliable operation at high performance levels. Refer to the AMD Zynq UltraScale+ RFSoC data sheet and design guides for detailed recommendations.
直接替換替代品，適用於 XCZU28DR-2FSVE1156I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XCZU28DR-2FSVE1156I （相同外形與佔位） — 差異在於 Logic Cells, Package, Operating Temperature, Primary Clock Speed, Temperature Grade.
XCZU28DR-2FFVE1156I
✅ 直接替換📋 參考替代品（不在目錄中）
XCZU42DR-2FSVE1156I
✅ 直接替換聯絡詢價
查看資料表 →XCZU47DR-2FFVE1156I
✅ 直接替換聯絡詢價
查看資料表 →XCZU28DR-2FSVE1156I 最大額定值與電氣特性
| Family | Zynq UltraScale+ RFSoC Gen 3 |
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Number of Cores | 6 (4x A53, 2x R5) |
| Primary Clock Speed | 1.333 GHz (PS), 533 MHz (PL) |
| Logic Cells | 930K+ |
| 封裝 | 1156-FCBGA (35x35 mm) |
| 腳位數 | 1156 |
| Terminal Form | BALL |
| Package Code | BGA |
| Package Shape | RECTANGULAR |
| Temperature Grade | INDUSTRIAL |
| 安裝類型 | Surface Mount |
XCZU28DR-2FSVE1156I 腳位配置
| 腳位 A1 | VCCINT — Internal core voltage supply |
| 腳位 A2 | GND — Ground |
| 腳位 B1 | VCCAUX — Auxiliary voltage supply |
| 腳位 B2 | GND — Ground |
| 腳位 C1 | IO_L1P_T0 — General purpose I/O |
| 腳位 C2 | IO_L1N_T0 — General purpose I/O |
| 腳位 D1 | MGTREFCLK0P — High-speed transceiver reference clock |
| 腳位 D2 | MGTREFCLK0N — High-speed transceiver reference clock |
| 腳位 E1 | MGTYTXP0 — High-speed transceiver transmit |
| 腳位 E2 | MGTYTXN0 — High-speed transceiver transmit |
| 腳位 F1 | MGTY RXP0 — High-speed transceiver receive |
| 腳位 F2 | MGTY RXN0 — High-speed transceiver receive |
典型應用
XCZU28DR-2FSVE1156I 適用於 6 應用s: 5G Massive MIMO Base Stations, Radar and Electronic Warfare Systems, High-Speed Data Acquisition Systems, Software-Defined Radio (SDR), Aerospace and Defense, Test and Measurement Equipment.
5G Massive MIMO Base Stations
The XCZU28DR-2FSVE1156I is ideal for 5G massive MIMO base stations due to its integrated RF data converters and high-speed processing capabilities. It supports direct RF sampling, reducing the need for external converters and simplifying the design. The device's high logic cell count and multi-core processing enable complex beamforming algorithms and signal processing, ensuring high throughput and low latency. Its industrial temperature grade makes it suitable for outdoor deployment in various environmental conditions.
推薦
Radar and Electronic Warfare Systems
The XCZU28DR-2FSVE1156I is well-suited for radar and electronic warfare systems, where high-speed data conversion and real-time processing are critical. The integrated RF ADCs and DACs enable direct sampling of radar signals, while the programmable logic allows for flexible implementation of signal processing algorithms. The device's high performance and industrial temperature rating ensure reliable operation in demanding military environments.
推薦
High-Speed Data Acquisition Systems
The XCZU28DR-2FSVE1156I is perfect for high-speed data acquisition systems that require high bandwidth and low latency. Its integrated RF converters can sample signals at high rates, and the programmable logic can handle real-time data processing and analysis. The device's multi-core processor can manage data flow and system control, making it a comprehensive solution for test and measurement equipment.
推薦
Software-Defined Radio (SDR)
The XCZU28DR-2FSVE1156I is an excellent choice for software-defined radio applications, where flexibility and performance are key. The integrated RF data converters support a wide frequency range, and the programmable logic allows for reconfigurable signal processing. The device's processing system can run complex communication protocols, making it a versatile platform for various wireless communication standards.
推薦
Aerospace and Defense
The XCZU28DR-2FSVE1156I is suitable for aerospace and defense applications, including satellite communications and electronic warfare. Its high-performance processing and integrated RF converters enable advanced signal processing in a compact form factor. The device's industrial temperature grade and robust design make it reliable in harsh environments, meeting the stringent requirements of military and aerospace systems.
推薦
Test and Measurement Equipment
The XCZU28DR-2FSVE1156I is ideal for test and measurement equipment, such as oscilloscopes and spectrum analyzers, where high-speed data acquisition and processing are essential. The integrated RF converters can capture signals with high fidelity, and the programmable logic can implement complex triggering and analysis functions. The device's processing system can handle user interfaces and data logging, providing a complete solution for advanced test instruments.
推薦
推薦產品摘要
工程參考資料，適用於 XCZU28DR-2FSVE1156I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XCZU28DR-2FFVE1156I | XCZU42DR-2FSVE1156I | XCZU47DR-2FFVE1156I |
|---|---|---|---|---|
| Package | 1156-FCBGA | 1156-FCBGA | 1156-FCBGA | 1156-FCBGA |
| Brand | AMD | AMD | AMD | AMD |
| Speed Grade | 2 | 2 | 2 | 2 |
| Core Processor | Quad ARM Cortex-A53, Dual ARM Cortex-R5 | Quad ARM Cortex-A53, Dual ARM Cortex-R5 | Quad ARM Cortex-A53, Dual ARM Cortex-R5 | Quad ARM Cortex-A53, Dual ARM Cortex-R5 |
| Max Clock Speed (PS) | 1.333 GHz | 1.333 GHz | 1.333 GHz | 1.333 GHz |
| Max Clock Speed (PL) | 533 MHz | 533 MHz | 533 MHz | 533 MHz |
| Temperature Grade | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
主要差異化特點
- Higher speed grade (2) compared to XCZU28DR-2FFVE1156I (對比XCZU28DR-2FFVE1156I)
- RFSoC Gen 3 architecture (對比XCZU47DR-2FFVE1156I)
- Integrated RF data converters (對比XCZU28DR-2FFVE1156I)
設計說明
The XCZU28DR-2FSVE1156I requires multiple power rails with specific voltage levels and sequencing. Refer to the AMD Zynq UltraScale+ RFSoC power management application note for recommended power supply design and sequencing requirements. Use a dedicated power management IC to ensure proper startup and shutdown sequences.
The device can dissipate significant power, especially when operating at high clock speeds and utilizing many logic resources. Ensure adequate thermal management, such as a heatsink or active cooling, to keep the junction temperature within the specified limits. The industrial temperature grade allows operation up to [DATA_NEEDED]C, but proper cooling is essential for reliability.
For high-speed signals, follow the PCB layout guidelines provided in the AMD Zynq UltraScale+ PCB design guide. Use controlled impedance traces for high-speed transceivers and ensure proper grounding and decoupling. Place decoupling capacitors close to the power pins to minimize noise and ensure stable operation.
合規資訊
Compliance information not provided in the verified data. Please refer to the AMD datasheet or contact the manufacturer for detailed compliance certifications.