XCZU42DR-2FSVE1156I - RFSoC, 489K Logic Cells | AMD
MPN： XCZU42DR-2FSVE1156I ✓ 啟用中XCZU42DR-2FSVE1156I 概覽
A Zynq UltraScale+ RFSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with programmable logic (PL) and, uniquely, integrated RF data converters (RF-ADC and RF-DAC). This integration eliminates the need for separate discrete converters, reducing board space, power, and latency. The RFSoC family sits within the broader adaptive SoC category, bridging FPGA flexibility with processor-based software programmability.
Key features include the 489K logic cells, 533MHz/1.333GHz processor clocks, and the 1156-FCBGA package. The 'I' suffix indicates an industrial temperature grade (-40C to +100C), making it suitable for demanding environments. The '2' speed grade offers a balance of performance and power. The integrated RF converters support direct RF sampling, simplifying transceiver designs.
Technically, the device leverages AMD's UltraScale+ 16nm FinFET process, providing high logic density and low power. The RFSoC architecture includes dedicated DSP slices, block RAM, and high-speed transceivers, enabling complex digital signal processing. The programmable logic can be configured for custom algorithms, while the ARM cores handle control and protocol processing.
Typical applications include 5G NR base stations, phased array radar, test and measurement equipment, and satellite communications. The integrated RF data converters and high-speed processing make it ideal for software-defined radio (SDR) systems.
When designing with this device, careful attention must be paid to power supply sequencing, clocking, and thermal management. The 1156-FCBGA package requires a multi-layer PCB with adequate decoupling and a thermal solution to dissipate heat from the high-performance cores and RF converters.
直接替換替代品，適用於 XCZU42DR-2FSVE1156I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XCZU42DR-2FSVE1156I （相同外形與佔位） — 差異在於 Logic Cells, Operating Temperature, Package, Primary Clock Speed, Speed Grade.
XCZU42DR-2FFVE1156I
✅ 直接替換📋 參考替代品（不在目錄中）
XCZU42DR-2FSVE1156E
✅ 直接替換📋 參考替代品（不在目錄中）
XCZU43DR-1FSVE1156E
✅ 直接替換📋 參考替代品（不在目錄中）
XCZU42DR-L2FSVE1156I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XCZU42DR-2FSVE1156ES9819
✅ 直接替換📋 參考替代品（不在目錄中）
XCZU42DR-2FSVE1156I 最大額定值與電氣特性
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Primary Clock Speed | 533MHz (Cortex-A53), 1.333GHz (Cortex-R5) |
| Logic Cells | 489K+ |
| 封裝 | 1156-FCBGA (35x35mm) |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40C to +100C (industrial) |
| Speed Grade | -2 |
| Series | Zynq UltraScale+ RFSoC |
| Number of Cores | 6 (4x A53, 2x R5) |
| FPGA Architecture | UltraScale+ (16nm FinFET) |
| RoHS 狀態 | Compliant |
XCZU42DR-2FSVE1156I 腳位配置
| 腳位 A1 | GND — Ground |
| 腳位 A2 | VCCO_0 — I/O bank 0 supply voltage |
| 腳位 A3 | IO_L1P_T0_0 — User I/O, differential pair P |
| 腳位 A4 | IO_L1N_T0_0 — User I/O, differential pair N |
| 腳位 B1 | VCCINT — Internal core logic supply |
| 腳位 B2 | GND — Ground |
| 腳位 C1 | VCCBRAM — Block RAM supply voltage |
| 腳位 C2 | IO_L2P_T0_0 — User I/O, differential pair P |
| 腳位 D1 | VCCAUX — Auxiliary supply voltage |
| 腳位 D2 | IO_L2N_T0_0 — User I/O, differential pair N |
| 腳位 E1 | GND — Ground |
| 腳位 E2 | VCCO_1 — I/O bank 1 supply voltage |
典型應用
XCZU42DR-2FSVE1156I 適用於 6 應用s: 5G NR Base Stations, Phased Array Radar, Test and Measurement Equipment, Satellite Communications, Software Defined Radio (SDR), Wireless Backhaul.
5G NR Base Stations
The XCZU42DR-2FSVE1156I is ideal for 5G NR base stations due to its integrated RF data converters and high-speed processing. The 489K+ logic cells enable complex beamforming algorithms, while the quad-core A53 handles protocol stack processing. The RFSoC's direct RF sampling capability reduces component count and power consumption, making it a cost-effective solution for massive MIMO and mmWave systems. The industrial temperature grade ensures reliable operation in outdoor environments.
推薦
Phased Array Radar
The XCZU42DR-2FSVE1156I excels in phased array radar systems by providing integrated RF sampling and massive parallel processing. The FPGA fabric with 489K+ logic cells can implement digital beamforming and pulse compression algorithms. The dual-core Cortex-R5 provides real-time control for antenna steering. The 1156-FCBGA package supports high-density PCB designs, and the industrial temperature range allows deployment in harsh environments. This integration reduces system latency and power compared to discrete solutions.
推薦
Test and Measurement Equipment
The XCZU42DR-2FSVE1156I is well-suited for test and measurement equipment such as spectrum analyzers and signal generators. Its integrated RF-ADCs and RF-DACs enable direct RF sampling and generation, simplifying the signal chain. The 489K+ logic cells allow for real-time FFT and signal analysis. The ARM cores provide a user interface and control. The device's high-speed processing and industrial temperature grade make it reliable for benchtop and field instruments.
推薦
Satellite Communications
The XCZU42DR-2FSVE1156I is ideal for satellite communication systems, offering integrated RF conversion and high-throughput processing. The RFSoC's direct RF sampling reduces the number of components, which is critical for space-constrained payloads. The 489K+ logic cells can implement advanced modulation and coding schemes. The quad-core A53 handles protocol processing, while the industrial temperature grade ensures operation in the thermal extremes of space. This integration reduces power and weight.
推薦
Software Defined Radio (SDR)
The XCZU42DR-2FSVE1156I is a perfect fit for software-defined radio (SDR) platforms. Its integrated RF data converters allow direct sampling of RF signals, eliminating the need for multiple downconversion stages. The 489K+ logic cells provide the flexibility to implement various waveforms and protocols. The ARM cores run the software stack, enabling rapid reconfiguration. The device's high performance and industrial temperature range make it suitable for military and commercial SDR applications.
推薦
Wireless Backhaul
The XCZU42DR-2FSVE1156I is well-suited for wireless backhaul systems, providing high-capacity processing and integrated RF conversion. The 489K+ logic cells can handle complex modulation schemes like 256-QAM. The quad-core A53 processes the Ethernet and protocol stacks. The RFSoC's direct RF sampling reduces latency and power, which is critical for high-throughput backhaul links. The industrial temperature grade ensures reliable operation in outdoor cabinets.
推薦
推薦產品摘要
工程參考資料，適用於 XCZU42DR-2FSVE1156I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XCZU42DR-2FFVE1156I | XCZU42DR-2FSVE1156E | XCZU43DR-1FSVE1156E |
|---|---|---|---|---|
| Package | 1156-FCBGA (35x35mm) | 1156-FCBGA (35x35mm) | 1156-FCBGA (35x35mm) | 1156-FCBGA (35x35mm) |
| Brand | AMD | AMD | AMD | AMD |
| Speed Grade | -2 | -2 | -2 | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (-40C to +110C) | Extended (-40C to +110C) |
| Package Suffix | FSVE | FFVE | FSVE | FSVE |
| Core Processor | Quad A53, Dual R5 | Quad A53, Dual R5 | Quad A53, Dual R5 | Quad A53, Dual R5 |
主要差異化特點
- Integrated RF data converters (對比XCZU42DR-2FFVE1156I)
- Industrial temperature grade (對比XCZU42DR-2FSVE1156E)
- Speed grade -2 (對比XCZU43DR-1FSVE1156E)
設計說明
The XCZU42DR-2FSVE1156I requires multiple power rails (VCCINT, VCCBRAM, VCCAUX, VCCO) with specific sequencing. According to AMD's power management recommendations, VCCINT must be powered before VCCO. Use a dedicated power management IC (PMIC) or sequencer to ensure correct power-up order. Decouple each rail with a combination of bulk and ceramic capacitors placed close to the BGA pins.
The 1156-FCBGA package can dissipate significant heat, especially with the RF converters active. Use a heatsink with a thermal interface material (TIM) and ensure adequate airflow. The industrial temperature grade allows operation up to +100C, but junction temperature must stay below the maximum rating. Consider a thermal simulation to verify the design.
For the 1156-FCBGA package, use a high-layer-count PCB (at least 12 layers) with dedicated power and ground planes. Follow AMD's layout guidelines for high-speed transceivers and RF signals. Use controlled impedance traces for differential pairs. Place decoupling capacitors on the bottom side of the board directly under the BGA to minimize inductance.
合規資訊
RoHS compliant per AMD product page. Not AEC-Q100 qualified as it is not an automotive part.
