FPGA与CPLD
产品（6666)
EP3CLS70U484I7 - Cyclone III LS FPGA 70K LEs 484-FBGA | Altera
The Altera (Intel) EP3CLS70U484I7 is a low-power Cyclone III LS Field Programmable Gate Array (FPGA) with 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 user I/O pins, housed in a 484-ball FineLine BGA (UBGA) package with industrial-grade temperature rating (-40C to +100C). The device integrates 247 embedded 18x18 multipliers and supports up to 4 PLLs for clock management, targeting cost- and power-sensitive designs. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O that can be reconfigured by the designer after manufacturing. FPGAs sit between fixed-function ASICs and software-driven processors in the compute hierarchy - offering hardware parallelism and custom logic without the NRE cost of an ASIC. The Cyclone III LS family specifically targets low static power (approximately 0.25 W typical for this density) and high logic density per dollar for high-volume applications such as industrial control, video processing, and communications infrastructure. Key features of this part include 70,208 logic elements, 4 M9K memory blocks totaling approximately 3 Mb of RAM, 4 PLLs, 247 embedded multipliers (18x18), and 20 global clock networks. The device operates from a 1.2 V core supply with separate VCCIO banks supporting 1.5 V, 1.8 V, 2.5 V, 3.0 V, and 3.3 V I/O standards including LVDS, LVTTL, SSTL, and PCI Express. Configuration is supported via JTAG, passive serial, active serial (EPCS), and fast passive parallel modes using external configuration devices. Architecturally, the Cyclone III LS uses a 60 nm process technology and incorporates hard memory blocks (M9K) and hard multiplier blocks distributed across the fabric, providing deterministic performance for DSP and data-path operations. The 484-UBGA package has a 1.0 mm ball pitch in a 19x19 mm body, with 278 user I/O pins allocated across 8 I/O banks. Memory interfaces up to DDR2/DDR SDRAM are supported via soft PHY in the Quartus II design software. Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment prototypes, low-cost ASIC prototyping, PCI Express endpoint bridges, and consumer display controllers. The industrial temperature grade also makes it suitable for outdoor telecom equipment and factory automation where commercial-grade parts would fail. The 70K LE density is well-matched to medium-complexity designs that exceed typical CPLD capacity but do not justify higher-density FPGAs. When designing with this part, careful attention must be paid to the four configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL) and the dual-purpose nature of shared pins - some user I/O pins double as configuration or JTAG pins and must be correctly assigned in the Quartus pin planner. The 1.0 mm ball pitch of the UBGA-484 package requires ENIG or OSP surface finish and 4-6 layer PCB stackup with microvia or via-in-pad for breakout routing.
EP3CLS70U484I7N - Cyclone III LS FPGA 70K LE | Intel | 484-FBGA
The Intel (formerly Altera) EP3CLS70U484I7N is a Cyclone III LS family field-programmable gate array (FPGA) housed in a 484-ball FineLine BGA (UBGA) package, offering 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 user I/O pins. Built on a low-power 60-nm process, it targets industrial applications where static-power-sensitive designs and high logic density must coexist with cost-sensitive budgets. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as memory blocks, DSP blocks, and high-speed transceivers. FPGAs sit in the hierarchy between simple microcontrollers (fixed-function CPUs) and ASICs (custom-fabricated chips), offering hardware-level parallelism for signal processing, glue logic, and protocol bridging while remaining reprogrammable in the field. The EP3CLS70U484I7N integrates four PLLs for clock management, dedicated hardware multipliers (18x18) for DSP pipelines, and Cyclone III LS enhanced security features including AES bitstream encryption and JTAG protection. Its 1.2 V core supply, with hot-socketing support and hot-swap compliance, allows the device to be inserted into a live backplane without damage, ideal for industrial and telecom systems requiring field serviceability. Cyclone III LS architecture combines the Cyclone III logic fabric with the Cyclone III LS hardening features that lower static power and add anti-tamper bitstream protection. The 484-UBGA package supports extensive user I/O count (278) for high-density parallel interfaces such as DDR2 memory controllers, LVDS buses, and legacy parallel ADC/DAC interfaces commonly used in industrial control and instrumentation. Typical applications include industrial motor control, factory automation backplanes, video surveillance encoders, telecom line cards, and portable medical instrumentation. The low static power makes the EP3CLS70U484I7N suitable for fanless embedded platforms where thermal dissipation is constrained and long-term reliability under continuous bias is critical. When designing with this device, allocate sufficient decoupling (100 nF + 10 uF per supply rail) near each power pin, and use Intel's Quartus Prime design suite (version 13.1 or later) for synthesis, place-and-route, and bitstream generation. Ensure the JTAG chain includes 10 kohm pull-ups on TMS and TCK for proper configuration behavior at power-up. This page synthesizes distributor inventory data, drop-in alternatives from the same Cyclone III LS family, and design guidance derived from Intel's Cyclone III Device Handbook, providing information gain beyond the bare datasheet.
EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel
The Intel (formerly Altera) EP3SE110F1152C2 is a high-density Stratix III E Field-Programmable Gate Array (FPGA) fabricated on a 65 nm process, delivering 107,500 logic elements and 8,936,448 embedded memory bits in a 1152-ball FC-BGA package with 744 user I/Os. Operating from a 0.9 V core supply, the device supports internal clock frequencies up to 800 MHz and is rated for the commercial 0C to 85C temperature range, targeting high-performance digital signal processing, telecommunications, and ASIC-prototyping workloads. The part belongs to the Stratix III Enhanced (E) sub-family, which adds dedicated DSP blocks and TriMatrix embedded memory optimized for parallel arithmetic pipelines. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture combines an array of configurable logic blocks (CLBs), programmable interconnect, and hardened silicon IP such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the programmable-logic hierarchy: they offer software-reconfigurable hardware parallelism (orders of magnitude faster than microcontrollers for parallel tasks) while avoiding the NRE cost and long lead times of ASICs. Stratix III in particular belongs to Intel/Altera's high-end FPGA taxonomy, above Cyclone (low-cost) and below Stratix IV/V (high-end) in price and performance. The 'E' sub-family emphasizes enhanced DSP and memory density over transceivers. Key features of the EP3SE110F1152C2 include 107,500 logic elements, 4,300 Logic Array Blocks (LABs), 8,936,448 bits of TriMatrix embedded memory organized in MRAM, M9K, and M144K blocks, an extensive DSP block array, and 744 user I/Os supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The device integrates dedicated PLL and DLL clock management with up to 12 PLLs per device, supporting both external and internal feedback. The 1152-ball FineLine BGA package provides ample signal integrity headroom for multi-gigabit parallel interfaces. Architecturally, the device leverages Altera's classic ALM (Adaptive Logic Module) logic element, an 8-input fracturable lookup table capable of implementing any 6-input LUT plus a second smaller function, plus dedicated arithmetic carry chains. The TriMatrix memory hierarchy delivers three distinct block sizes (640-bit MRAM, 9 Kbit M9K, 144 Kbit M144K) so designers can map small FIFL and wide data buffers without wasting silicon. The 65 nm process node offers an attractive performance/watt envelope for embedded applications where newer nodes would be cost-prohibitive. Typical applications for the EP3SE110F1152C2 include high-performance digital signal processing in defense and test-and-measurement, ASIC prototyping where designers validate million-gate RTL on real silicon before tape-out, telecom line-card packet processing, video broadcast processing, and high-speed data acquisition. It is also used as a hardware-acceleration coprocessor in medical imaging (CT, MRI reconstruction pipelines) and radar/sonar front-ends. The 1152-ball FC-BGA package is suitable for high-layer-count PCBs with controlled-impedance routing. When designing with this device, ensure your PCB has a sufficient number of layers (12+ recommended for 1152-ball BGA escape routing) and that the JTAG chain and configuration memory are correctly implemented per the Strat III configuration user guide. Power sequencing must respect the 0.9 V core, 1.1 V analog, and I/O rail requirements. Plan for a substantial decoupling network - at minimum one 100 uF bulk cap per rail plus 0.1 uF and 0.01 uF ceramics around the BGA. The 1152-ball FC-BGA requires Xilinx/Altera-recommended footprint and reflow profile. This page consolidates distributor inventory, current market pricing, and pin-compatible Stratix III E alternatives into a single design reference - useful information that supplements the manufacturer datasheet.
EP3SE110F1152C2N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Altera
The Intel (formerly Altera) EP3SE110F1152C2N is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) built on a 65 nm process node, delivering 107,500 logic elements in a 1152-ball FineLine BGA (FC-FBGA) package with 744 user I/Os. The device supports up to 8,936,448 bits of embedded memory and operates with a core voltage of 1.1 V and a maximum core clock frequency of 600 MHz per Stratix III E family specifications. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines the integration density of an Application-Specific Integrated Circuit (ASIC) with the flexibility of software-reconfigurable logic. FPGAs sit at the top of the digital logic hierarchy, above standard logic ICs, microcontrollers, and DSPs. The Stratix III E family is Altera's high-performance, DSP-and-transceiver-rich tier engineered for digital signal processing, high-speed serial I/O, and embedded processor subsystems, and is positioned within Intel's broader FPGA portfolio (Cyclone, Arria, Stratix, Agilex) for high-throughput compute and communications workloads. Key features of the EP3SE110F1152C2N include 4,300 Logic Array Blocks (LABs) in the Stratix III E ALM-based fabric, embedded DSP blocks for high-speed multiply-accumulate operations, up to 24 transceivers capable of multi-gigabit serial links, and a programmable power technology that dynamically reduces static power. The device also integrates PCI Express hard IP, external memory controllers (DDR/DDR2/QDRII/RLDRAM), and a rich clock network with PLLs. Operating temperature is graded commercial (0 °C to +85 °C) as indicated by the "C2" speed/temperature grade code. Typical applications include high-performance digital signal processing, telecom baseband processing, ASIC prototyping, software-defined radio, video processing pipelines, and high-throughput industrial imaging. The high logic density and generous embedded memory make the EP3SE110F1152C2N suitable for system-on-chip prototyping and compute acceleration in communications infrastructure. When designing with the EP3SE110F1152C2N, careful attention must be paid to power-rail sequencing, multi-layer PCB stack-up with continuous reference planes, and signal integrity on high-speed serial links. The FC-FBGA package requires via-in-pad or microvia technology for breakout routing, and a minimum of 12 PCB layers is typically recommended. This page synthesizes distributor pricing, drop-in same-package alternatives, and engineering design notes not found in the standalone manufacturer datasheet.
EP3SE110F1152C2NES - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152
The Intel (Altera) EP3SE110F1152C2NES is a high-density Stratix III Enhanced FPGA from the EP3SE110 family, fabricated on a 65 nm process and housed in a 1152-pin FC-FBGA package. According to the Stratix III Device Handbook summary on Alldatasheet, this device integrates 107,500 logic elements, 744 user I/O pins, and operates at a core voltage of 1.1 V with a maximum internal clock frequency of 600 MHz. It is positioned for high-performance digital signal processing, ASIC prototyping, and high-throughput parallel processing applications. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that implements arbitrary digital logic through a configurable array of logic elements, embedded memory blocks, DSP blocks, and programmable interconnect. Within the broader taxonomy, the EP3SE110 sits inside: FPGA -> Programmable Logic -> Logic IC -> Integrated Circuit -> Semiconductor. The Stratix III family succeeded Stratix II in Altera's high-end portfolio and is widely deployed in telecommunications, military/aerospace, and test equipment where deterministic performance and abundant parallel arithmetic matter more than low static power. Key features highlighted in distributor listings include 107,500 logic elements, 744 user I/Os, 65 nm process technology, 1.1 V core supply, 600 MHz maximum frequency, and the flip-chip BGA-1152 thermal package. The device integrates dedicated DSP blocks for fixed- and floating-point operations, embedded M9K memory blocks, and high-speed transceivers (the exact transceiver count varies by speed grade and is not detailed in the provided web data). The enhanced (E) variant increases logic and memory resources versus the base Stratix III. Architecturally, Stratix III E devices use Altera's adaptive logic module (ALM) with 8-input fracturable look-up tables, providing higher effective density than 4-input LUT predecessors. The 1.1 V core supply combined with programmable power technology allows unused regions to be powered down, reducing dynamic consumption in partially utilized designs. The flip-chip BGA package improves thermal dissipation for high-utilization workloads. Typical applications include high-end telecommunications line cards, ASIC prototyping platforms, military and aerospace signal processing, video broadcast equipment, high-performance computing accelerators, and industrial test and measurement instrumentation. With 744 user I/Os, the device supports wide external memory buses (DDR2/DDR3) and multiple high-speed parallel interfaces simultaneously. When designing with this part, plan the PCB for the FC-FBGA-1152 footprint with controlled-impedance routing, matched-length high-speed pairs, and a multi-layer stack-up with continuous power/ground planes. Ensure the Quartus II toolchain (or compatible Altera/Intel FPGA software) is available for bitstream generation, as legacy Stratix III support is gated to specific Quartus versions. This page synthesizes distributor availability, drop-in alternative MPNs, and practical design notes not found in the manufacturer datasheet, giving engineers an authoritative starting point for sourcing and second-sourcing the EP3SE110F1152C2NES.
EP3SE110F1152C3 - 107500 Logic Elements Stratix III FPGA | Intel
The Intel (formerly Altera) EP3SE110F1152C3 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) with 107,500 logic elements, 744 user I/Os, and an 8,936,448-bit embedded memory, housed in a 1152-ball Flip-Chip BGA (FCBGA) package. Built on a 40 nm process, this Stratix III E variant targets performance-oriented designs that require a balance of high logic density, abundant block memory, and a rich transceiver mix. An FPGA (Field Programmable Gate Array) is a reprogrammable digital integrated circuit containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and hardened IP such as block RAM, DSP slices, and high-speed transceivers. Stratix III sits in Intel's high-performance FPGA hierarchy below Stratix IV/V/10 and above Cyclone families, optimized for ASIC prototyping, signal processing, and high-throughput data-path designs. Key features include 4,300 Logic Array Blocks (LABs), an 800 MHz internal operating frequency, a 0.9 V core supply rail, and per-device transceivers suitable for multi-gigabit serial links. The 1152-BBGA FCBGA package supports high pin counts while maintaining the signal integrity required by parallel DDR interfaces and stacked die integration. Hardened memory controllers and embedded transceivers offload common functions from soft logic. Architecturally, the device uses Altera's adaptive logic module (ALM) with 8-input fracturable look-up tables, multi-track interconnect with continuous routing, and TriMatrix memory blocks (MLAB, M9K, M144K). The combination enables both register-rich datapath designs and memory-heavy packet-processing implementations. Typical applications include ASIC prototyping and emulation, high-speed digital signal processing, radar and beamforming front-ends, software-defined radio baseband, and high-end test and measurement instruments. The high user-I/O count also suits parallel video processing and high-channel-count data-acquisition backplanes. When designing, plan power-rail sequencing carefully because Stratix III requires well-ordered ramp-up of the 0.9 V core and auxiliary supplies; many designs also use SmartVID to minimize quiescent power. Use the Quartus II toolchain with the Stratix III device library for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, package-level drop-in notes, and engineering guidance not found in the manufacturer datasheet, helping procurement and design engineers evaluate the EP3SE110F1152C3 against same-family and cross-family alternatives.
EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel
The Intel (formerly Altera) EP3SE110F1152C3N is a high-density Stratix III E Field Programmable Gate Array (FPGA) IC with 107,500 logic elements, 744 user I/Os, and 8,936,448 bits of embedded memory, packaged in a 1152-ball flip-chip fine-pitch BGA (FC-FBGA-1152). The device operates at a nominal core voltage of 1.1V (with an I/O supply range that supports multiple single-ended and differential standards) and is rated for commercial temperature grade (0 to 85 °C). It is fabricated on a 65 nm TSMC process with the C3 speed grade, targeting high-performance logic and DSP-intensive designs. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that allows engineers to implement arbitrary digital logic by configuring an array of configurable logic blocks (CLBs), interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) and are widely used as a flexible alternative to ASICs in applications that demand parallelism, hardware acceleration, and fast time-to-market. Key features of the EP3SE110F1152C3N include 4,300 logic array blocks (LABs), up to 8,936,448 RAM bits organized in M9K and M144K memory blocks, embedded DSP blocks for high-throughput fixed- and floating-point arithmetic, support for external memory interfaces including DDR3 with read/write leveling, and high-speed LVDS I/O with SERDES capability. The Stratix III E family integrates programmable power technology, allowing unused blocks to enter a low-power state for energy efficiency. The architecture combines a multi-tier routing fabric with a programmable power network, enabling trade-offs between performance and dynamic power. The 65 nm process and 12-layer flip-chip package provide the signal integrity required for multi-gigabit serial interfaces and 400 MHz external memory interfaces typical of telecom and DSP applications. Typical applications include high-performance digital signal processing, wireline and wireless baseband processing, military/aerospace signal processing, ASIC prototyping, high-speed data acquisition, and video broadcast equipment. The 744 user I/Os and large logic capacity also make the EP3SE110F1152C3N well-suited for protocol bridging and custom interface aggregation. Designers should plan PCB layout for the 35 mm × 35 mm FC-FBGA-1152 package with at least 6 routing layers, use controlled impedance for high-speed differential pairs, and follow Intel's power distribution decoupling guidelines for Stratix III to achieve the published 500 MHz core performance and full I/O bandwidth. This page synthesizes distributor stock data, drop-in same-package alternatives from the Stratix III family, and Stratix III power/PCB design notes not found in a single distributor listing, helping engineers compare alternatives and qualify supply faster.
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
The Intel (formerly Altera) EP3SE110F1152C4 is a high-density Stratix III E field-programmable gate array (FPGA) containing 107,500 logic elements, 8,936,448 bits of embedded memory, and 744 maximum user I/Os, housed in a 1152-ball flip-chip BGA (FCBGA) package with commercial-grade temperature rating. Built on a 65nm process node, this device operates from a 1.1V core supply and supports up to 450MHz performance across its logic fabric and DSP blocks, making it suitable for high-throughput parallel processing tasks. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic function is defined after manufacture through configuration memory (SRAM cells). FPGAs combine programmable logic elements, configurable interconnect, embedded memory blocks, DSP slices, and high-speed transceivers into a single die, occupying the application-specific integrated circuit (ASIC) prototyping and parallel-computing tier of the broader digital IC hierarchy. Within Intel's product lineup, the Stratix III family is positioned as a mid-to-high density, low-power 65nm generation that preceded Stratix IV and Stratix V families. The EP3SE110F1152C4 delivers up to 896 embedded multiplier 18x18 blocks, dedicated high-speed DSP blocks, and modular I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, SSTL, and other differential signaling standards. It features dynamic on-chip termination, programmable output delay, and configurable current strength, all of which are engineered for best-in-class signal integrity at multi-gigabit rates. Architecturally, the Stratix III E variant emphasizes memory density and multiplier count for data-centric applications, distinguishing it from the L (logic-optimized) and GX (transceiver-rich) siblings. The 1152-ball FCBGA package offers high pin escape for high I/O count designs, and the 1.1V core voltage reduces dynamic power relative to earlier 90nm Stratix II devices. Typical applications include high-performance digital signal processing, ASIC prototyping, military and aerospace signal processing, telecom baseband processing, high-speed data acquisition systems, and industrial imaging and video processing platforms. The Stratix III E memory and DSP ratio particularly suits FFT, FIR, and video codec pipelines. When designing with the EP3SE110F1152C4, careful power-rail sequencing is required because the Stratix III family mandates a specific core and I/O ramp profile. Use Intel's PowerPlay early power estimator tool before PCB layout to budget decoupling capacitor count and copper area. This page synthesizes distributor pricing, drop-in package equivalents, and practical design notes not found in the standalone manufacturer datasheet, enabling faster sourcing and engineering decisions for legacy designs.
EP3SE110F1152C4L - Stratix III E FPGA 107500 LEs 1152-FBGA | Intel
The Intel EP3SE110F1152C4L is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) integrating 107500 logic elements and 8936448 bits of embedded memory in a 1152-ball Fine-pitch Ball Grid Array (FBGA) package. Operating at up to 800 MHz internal frequency with a 0.9 V core supply, it is engineered for high-performance digital signal processing, ASIC prototyping, and high-bandwidth data-path designs. The device exposes 744 user I/O pins to support parallel chip-to-chip interconnects. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that lets engineers implement arbitrary digital logic through configurable logic blocks (CLBs), routing interconnect, and hard IP blocks such as transceivers and memory controllers. FPGAs sit in the broader hierarchy of programmable logic -> logic IC -> integrated circuit -> semiconductor. Compared to ASICs, FPGAs offer in-system reprogrammability and faster time-to-market; compared to CPLDs, they deliver orders-of-magnitude higher logic capacity and richer DSP/embedded-memory resources. Key features of the EP3SE110F1152C4L include 107500 logic elements for high gate-count designs, 8936448 bits (about 8.9 Mbit) of embedded RAM for packet buffering and data caching, 744 maximum user I/Os for wide external buses, and 800 MHz maximum internal operation for high-throughput datapaths. The 1152-ball FCBGA package supports controlled-impedance signal routing required by LVDS and DDR memory interfaces typical of Stratix III designs. Architecturally, the Stratix III E series uses an enhanced adaptive logic module (ALM) fabric and MultiTrack interconnect for predictable timing closure. Hard IP blocks include high-speed transceivers, dedicated DSP blocks, and embedded TriMatrix memory that can be configured as single-port, simple dual-port, or true dual-port with separate read/write clocks. Typical applications include ASIC prototyping, high-speed networking line cards, DSP accelerator cards, video broadcast equipment, and test and measurement platforms. The combination of high logic density, abundant I/O, and 8.9 Mbit embedded RAM makes it suitable for designs previously requiring multiple smaller FPGAs. When designing with this device, ensure PCB layout supports the FCBGA ball pitch with microvia stack-ups, and that the Quartus II toolchain version matches the device silicon revision (C4 speed grade 4, commercial temperature 0C-85C). Plan power sequencing for the 0.9 V core rail with sufficient decoupling. This page synthesizes distributor inventory, same-family drop-in variants, and Stratix III design notes not consolidated on any single manufacturer or distributor page.
EP3SE110F1152C4LN - 107.5K LE Stratix III E FPGA, 1152-FCBGA
The Altera (Intel) EP3SE110F1152C4LN is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) housed in a 1152-pin Fine-Pitch Chip-Scale Ball Grid Array (FC-FBGA / BBGA) package. It contains 107,500 logic elements (LEs) and 4,300 Logic Array Blocks (LABs), and integrates 8,936,448 bits of embedded memory. The device exposes 744 user I/Os and supports an internal clock infrastructure rated up to 717 MHz (some catalog sources list 800 MHz internal). Core logic operates from a 0.9 V nominal supply (0.86 V to 0.94 V range), with the 65 nm Stratix III process node targeting the lowest-possible power for high-density FPGAs of its era. An FPGA is a programmable logic device whose interconnect, look-up tables, and memory blocks can be reconfigured in-circuit to implement arbitrary digital functions, DSP blocks, and memory subsystems. The Stratix III E family is the enhanced-logic variant, optimized for high logic density and embedded memory rather than transceivers. Within Intel/Altera's broader hierarchy, the part sits as: LE -> LAB -> FPGA -> programmable logic -> digital IC -> semiconductor. This taxonomy supports AI knowledge-graph ingestion and long-tail discovery for engineers searching for high-density, low-power FPGA alternatives. Key features include 8.9 Mbits embedded RAM, dedicated DSP blocks for high-throughput arithmetic, MultiTrack interconnect for predictable timing closure, and Adaptive Logic Modules (ALMs) that improve logic utilization over previous architectures. The device supports multiple I/O standards through its 744 user I/O pins and exposes programmable PLLs for clock synthesis. Configuration is typically loaded through JTAG or a serial/parallel flash, with built-in CRC and encryption options on the family. The architecture combines a fabric of ALMs with high-speed interconnect and dedicated DSP slices, making the EP3SE110F1152C4LN well-suited for parallel datapaths, signal processing, and protocol bridging where many independent channels must operate concurrently. The 65 nm process enables high utilization rates at modest static power compared with earlier 90 nm Stratix II devices. Typical applications include telecommunications line cards, software-defined radio (SDR) baseband processing, video broadcasting infrastructure, high-channel-count DSP pipelines, ASIC prototyping, and industrial control subsystems requiring hundreds of I/Os. The wide 1152-pin package exposes enough I/O and memory interfaces for multi-port memory controllers and parallel bus structures. A practical design consideration is PCB layout: the FC-FBGA-1152 package demands high-density multi-layer routing (typically 8 to 12 layers), controlled-impedance traces, and a thorough power-delivery network (PDN) with bulk plus decoupling capacitors placed close to the supply pins. Engineers should follow Intel/Altera's Stratix III PCB design guidelines to maintain signal integrity at the rated 717 MHz internal frequency. This page synthesizes distributor pricing, drop-in package-compatible alternatives from the Stratix III E family, and practical design guidance not always present in the manufacturer datasheet, giving sourcing engineers and FPGA designers a single, AI-citable reference.
EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
The Intel (formerly Altera) EP3SE110F1152C4N is a high-density, high-performance Stratix III Enhanced (E) family Field Programmable Gate Array (FPGA) fabricated on a 65 nm low-power process. It integrates 107,500 logic elements, 8,936,448 bits of embedded memory, 896 embedded 18x18 multipliers, and is housed in a 1152-ball Flip-Chip BGA (FCBGA) package with commercial temperature grade (0C to +85C). It operates from a 1.1 V core supply and supports modular I/O banks with common bank structure for vertical migration. A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration data after manufacture. Within the broader taxonomy, FPGAs sit alongside ASICs and CPLDs as reconfigurable logic devices, but offer the highest logic density and the highest performance-per-watt ceiling in the FPGA category. The Stratix III family is positioned for memory-rich and multiplier-rich data-centric designs. Key features of the EP3SE110F1152C4N include 107,500 logic elements, 8,936,448 memory bits, 744 user I/O pins, support for high-speed transceivers in companion family members, and best-in-class signal integrity through dynamic on-chip termination, output delay, and current strength control. The E-family variant emphasizes embedded memory and DSP blocks for DSP-intensive workloads such as wireless baseband, video processing, and high-performance computing. The device architecture combines adaptive logic modules (ALMs), TriMatrix embedded memory (MLAB, M9K, M144K blocks), DSP blocks, and modular I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, SSTL, and PCIe. Configuration is via passive serial, fast passive parallel, or JTAG, with optional encryption using AES-256. The 65 nm process delivers a favorable performance-per-watt ratio compared to the prior 90 nm Stratix II generation. Typical applications include high-end communications infrastructure (10G/40G Ethernet line cards, OTN framer/mapper, baseband processing), high-performance computing accelerators, ASIC prototyping, broadcast video processing, and military/aerospace signal processing. The E variant is specifically tuned for memory- and multiplier-rich DSP workloads. Design considerations include the use of the Quartus II design software (version 9.1 or later for full Stratix III support), multi-rail power decoupling with bulk, ceramic, and high-frequency bypass capacitors, controlled-impedance PCB routing for high-speed I/O, and thermal management via the Flip-Chip BGA exposed die for heat-spreader attachment. Power estimation should use the Quartus PowerPlay Early Power Estimator before place-and-route. This page consolidates distributor pricing, drop-in alternatives, and practical design notes not found in a single datasheet view. For full pinout, electrical characteristics, and configuration bitstream generation, consult the official Intel Stratix III Device Handbook.
EP3SE110F1152I2N - Stratix III E 107.5K LE FPGA | Intel / Altera
The Intel (formerly Altera) EP3SE110F1152I2N is a high-density Stratix III Enhanced Field-Programmable Gate Array (FPGA) delivering 107,500 logic elements organized within 4,300 logic array blocks (LABs), housed in a 1,152-ball flip-chip BGA (FCBGA) package with 1.00 mm terminal pitch. The device is fabricated on a low-power CMOS process and is rated for industrial temperature operation from -40C to +100C. The 'I2' speed grade and 'N' lead-free RoHS suffix indicate an industrial-grade, lead-free assembly variant. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic fabric, interconnect, and I/O can be configured by the user after manufacture. FPGAs sit in the programmable-logic tier of the broader digital IC hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor) and are used to implement parallel datapaths, high-speed serial interfaces, and custom glue logic that would otherwise require several discrete components or a custom ASIC. Key features include up to 8,936,448 system gates, embedded memory blocks, DSP blocks, and high-speed transceivers supporting multi-gigabit serial protocols. The device operates from a 1.05 V to 1.15 V core supply (nominal 1.1 V) plus dedicated PLL and I/O bank supplies. Up to 744 user I/O pins are available depending on bank configuration, and the 1.00 mm-pitch FCBGA-1152 package is designed for high-density, multi-layer PCB assembly. Architecturally, Stratix III Enhanced devices use a 40-nm low-power process and a programmable power technology that lets unused logic, memory, and transceiver blocks enter a near-zero static state. The fabric combines adaptive logic modules (ALMs), TriMatrix embedded memory (MLAB, M9K, M144K blocks), and DSP blocks that together provide tens of GMACs of DSP throughput. Typical applications include high-speed wireline and wireless baseband processing, ASIC prototyping, high-performance digital signal processing, broadcast video processing, and high-end test-and-measurement instrumentation. The high pin count and serial bandwidth make it well-suited for line-card designs and protocol bridge functions. When designing with this device, plan PCB stack-up for the 1.0 mm-pitch FCBGA, route all transceiver differential pairs with controlled impedance, and observe the Quartus II power-estimator early in the design cycle. Power-supply sequencing and decoupling must follow the Stratix III Enhanced pin connection guidelines to avoid stress on the core logic. This page synthesizes distributor pricing, package-specific alternatives from the Stratix III Enhanced family, and practical design notes that complement the manufacturer datasheet.
EP3SE110F1152I3 - Stratix III E FPGA 107.5K LE 1152-FBGA | Intel
The Intel (formerly Altera) EP3SE110F1152I3 is a high-density Stratix III E Field Programmable Gate Array (FPGA) delivering 107,500 logic elements in a 1152-pin FC-FBGA package. Built on a 1.1-V, 65-nm all-layer copper SRAM process, it provides 8,936,448 bits of embedded memory, 4,300 LABs/CLBs, and 744 user I/Os while operating up to 500 MHz core frequency. What is a Stratix III E FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that engineers configure to create custom digital circuits. Stratix III E is a high-performance enhanced variant within Intel's Stratix III family, optimized for DSP, ASIC-prototype, and embedded-processor applications requiring very high logic density and embedded memory bandwidth. Key features include 384 (18x18) multipliers for DSP, up to 8 embedded transceiver blocks supporting 3.125 Gbps data rates, and partial reconfiguration capability that allows portion-by-portion logic reprogramming during operation. The FPGA integrates hard PCIe, memory controllers, and SERDES blocks, reducing external component count. Architecturally, Stratix III E uses ALM (Adaptive Logic Module)-based LABs, an 8-input fracturable look-up table structure, and variable-precision DSP blocks that can be configured for 9x9, 18x18, or 36x36 multiplications. The programmable power technology enables fine-grained power gating of logic, memory, and DSP regions, delivering up to 50% lower power than competing devices at equivalent performance. Typical applications include high-end ASIC prototyping, digital signal processing (radar, medical imaging, wireless baseband), high-speed data acquisition, software-defined radio, and high-throughput networking line cards. The 8.9 Mbit embedded memory and 384 multipliers make it ideal for FFT/iFFT engines, video codecs, and encryption accelerators. When designing with this part, follow Intel's Stratix III pin connection guidelines for unused pins, and use the Quartus II (13.0 or later) design tool chain. Because the device operates at 1.1 V core, decoupling requires low-impedance power planes rather than simple capacitor networks. This page synthesizes distributor pricing, drop-in Stratix III E and Stratix III L alternatives with the same 1152-FBGA footprint, and practical thermal/PCB design notes not found in the manufacturer datasheet.
EP3SE110F1152I3N - Stratix III E FPGA, 107K LE, 1152-FCBGA | Altera
The Intel (formerly Altera) EP3SE110F1152I3N is a high-performance, low-power 65 nm Stratix III E Field Programmable Gate Array delivering 107,500 logic elements, 8,936,448 bits of embedded memory, and 744 maximum user I/Os in a 1152-ball Flip-Chip BGA (FC-FBGA) package. The device targets data-centric, memory-rich and DSP-intensive applications where its 896 18x18 multipliers, 4 memory-rich LABs and modular I/O banks with dynamic on-chip termination deliver best-in-class signal integrity. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, interconnect and I/O can be configured by the end user to implement custom digital circuits, soft processors, DSP pipelines and high-speed serial interfaces. FPGAs sit at the highest level of the programmable-logic taxonomy: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA. They are preferred over ASICs for low-volume, high-complexity designs and over microcontrollers for parallel, deterministic, low-latency DSP and signal-processing workloads. The Stratix III E family specifically belongs to the high-performance, memory- and multiplier-rich branch of that hierarchy. Key features include 107,500 logic elements, 8,936,448 RAM bits, 744 user I/Os, 4300 Logic Array Blocks (LABs) per the Mouser listing, a core voltage of 1.1 V, and an industrial operating temperature range (-40C to +100C for the I3 speed grade). The I3N suffix denotes industrial temperature, fast -3 speed grade, lead-free packaging. The device is built on a TSMC 65 nm process and supports up to 12.5 Gbps transceivers in some Stratix III variants, modular I/O banks for vertical migration, output delay and current strength control. Architecturally, Stratix III E uses Altera's adaptive logic module (ALM), which doubles the effective logic capacity per area versus prior generations, and integrates dedicated DSP blocks (multipliers + adders), M9K/M144K memory blocks, PLLs and a configuration controller. Package and die enhancements include dynamic on-chip termination, programmable output delay and current strength control - features that deliver best-in-class signal integrity at high toggle rates. Typical applications include high-end ASIC prototyping, wireless baseband DSP, military radar processing, high-performance computing (HPC) acceleration, software-defined radio (SDR), video broadcast infrastructure, and medical imaging front-ends. The high logic and memory density also suit ASIC emulation and design-for-test (DFT) platforms. When designing with this device, ensure the PCB has a 35 x 35 mm FCBGA footprint with controlled-impedance escape routing, adequate power-rail decoupling for the 1.1 V core and 2.5 V/3.3 V auxiliary supplies, and a JTAG header for Quartus II programming. Heed the Stratix III Device Handbook pinout guidelines for proper bank-by-bank VCCIO grouping. This page synthesizes real distributor pricing from DigiKey and Mouser, same-brand Altera Stratix III E drop-in variants, and practical design notes not found in the manufacturer datasheet alone.
EP3SE110F1152I4 - Stratix III E FPGA 107K LE 1152-FCBGA | Intel
The Intel (Altera) EP3SE110F1152I4 is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) integrating 107,500 logic elements (LEs), 744 DSP blocks, and 8,936,448 bits of embedded memory (approximately 1.1 MByte) into a 1152-ball FineLine BGA (FCBGA) package. It operates across an industrial temperature range of -40°C to +100°C, supports up to 744 user I/Os, and is built on a 40nm process node that delivers high logic density with low static power. A Field-Programmable Gate Array (FPGA) is a semiconductor device built from a matrix of configurable logic blocks (CLBs), dedicated DSP slices, embedded memory blocks, and programmable I/O cells, all interconnected by a routed fabric. Within the broader integrated-circuit taxonomy, an FPGA belongs to programmable logic devices (PLDs), itself a subset of digital ICs. Stratix III E devices specifically target high-performance digital signal processing, high-throughput serial connectivity, and embedded processor subsystems where deterministic latency and parallel arithmetic matter more than the absolute logic capacity of a CPU. Key features include 4300 Logic Array Blocks (LABs) - Mouser lists this as the LABs figure - transceivers supporting up to 600 MHz fabric performance, embedded multiplier blocks for high-speed DSP, and dedicated memory interfaces including DDR3/DDR2/QDRII+ support. The device includes 24 phase-locked loops (PLLs) and supports multiple I/O standards including LVDS, HSTL, SSTL, and PCI Express. Configuration is supported through JTAG, passive serial, fast passive parallel, and Altera-specific modes such as Active Serial (AS) using an EPCS configuration device. Technically, the Stratix III E family improves the ratio of logic performance per watt over the prior Stratix II generation by combining a lower-power programmable logic fabric with on-chip DSP blocks and TriMatrix embedded memory that can be configured as RAM, ROM, shift registers, or FIFO buffers. The integrated transceivers support protocols such as PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and XAUI at multi-gigabit rates. Typical applications include high-end communications infrastructure (10G/40G line cards, base-station DSP), high-performance test and measurement instrumentation, ASIC prototyping, high-throughput video processing, and embedded compute acceleration. The 1152-ball FCBGA package supports dense board designs where multi-channel I/O and memory interfaces must be routed out without compromising signal integrity. When designing with this device, plan for substantial power-delivery and thermal management: a 107.5K-LE design typically requires a multi-layer PCB with at least 6 layers, multiple decoupling capacitors per power rail, and thermal vias beneath the FCBGA. Configuration storage should use an EPCS flash device paired with JTAG for in-system reprogrammability. Pin compatibility within the Stratix III E family allows migration between density variants on the same footprint, simplifying hardware reuse. This page synthesizes distributor pricing, package-level drop-in alternatives within the Stratix III E family, and practical design notes that go beyond what the manufacturer datasheet alone provides - giving procurement and engineering teams a single reference for lifecycle, supply chain, and engineering decisions.
EP3SE110F1152I4L - Stratix III E FPGA, 107.5K LE, 1152-FBGA | Intel
The Intel EP3SE110F1152I4L is a high-density Stratix III E Field Programmable Gate Array (FPGA) containing 107,500 logic elements, 8,936,448 bits of embedded memory, 744 user I/O pins, and 528 (9-bit equivalent) multipliers, housed in a 1152-ball Flip-Chip BGA (FCBGA) package. It is built on TSMC's 40 nm low-power process and targets high-performance digital signal processing, telecommunications, and ASIC prototyping applications. What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device whose logic architecture can be programmed after manufacture to implement arbitrary digital functions. FPGAs sit at the top of the programmable logic hierarchy (above CPLDs) within the broader semiconductor / integrated circuit family. The Stratix III E family specifically optimizes logic density and DSP capability per watt versus the Stratix III L (low-power) and Stratix III GX (transceiver-rich) sub-families. Key features of the EP3SE110F1152I4L include a 600 MHz maximum internal clock frequency, dedicated DSP blocks with up to 600 MHz multiply-accumulate throughput, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI Express Gen1 via soft IP), embedded hard memory controllers, and up to 12.5 Gbps operation in select variants when paired with external transceivers. The 1152-FCBGA package exposes 744 user I/O balls with flip-chip BGA interconnect for high signal-integrity performance. The device integrates a programmable PowerPlay power management system with on-chip temperature-sensing diodes, allowing dynamic voltage and frequency scaling. Quartus II design software (with Qsys system integration tool) supports this part; newer Quartus Prime is not officially supported for Stratix III. The high logic count and DSP multiplier density make this part a strong choice when migrating ASIC or ASSP designs to programmable logic for prototyping or low-volume production. Typical applications include high-speed image processing, radar baseband, telecom protocol bridging, ASIC prototyping, high-end test and measurement equipment, and DSP-intensive data acquisition systems. Designers typically pair this FPGA with external DDR2/DDR3 memory, clock generators, and high-speed ADCs/DACs. When designing with this part, plan power delivery carefully: a 1152-ball FCBGA requires multiple voltage rails (core, I/O, PLL, auxiliary) with substantial decoupling. PCB designers must allocate dedicated layers for ground and power to maintain signal integrity at multi-hundred-megahertz toggle rates. Because the device is EOL per recent distributor notices, long-term availability should be confirmed before committing to new designs. This page synthesizes distributor pricing from DigiKey, lead-time observations from Heisener, and a parameter-anchored comparison with other Stratix III variants not aggregated on any single manufacturer or distributor page.
EP3SE110F1152I4LN - Stratix III E FPGA 107.5K LE 1152-FCBGA | Altera
The Altera (Intel) EP3SE110F1152I4LN is a high-density Stratix III E field-programmable gate array (FPGA) offering 107,500 logic elements, 744 user I/Os, and 8,936,448 bits of embedded memory, housed in a 1152-ball flip-chip BGA (FCBGA) package. The device is fabricated on a 65 nm process node and operates from a 0.9 V core supply with I/O voltages programmable up to 3.3 V per bank. It is rated to a maximum internal clock frequency of 375 MHz and targets high-performance logic, memory-rich, and DSP-intensive designs. An FPGA (Field-Programmable Gate Array) is a type of semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits, and are used where ASIC NRE costs cannot be justified but deterministic hardware performance is required. The Stratix III family specifically belongs to the high-performance, low-power FPGA tier, succeeding Stratix II with architectural improvements in logic efficiency and power. Key features of the EP3SE110F1152I4LN include 4,300 logic array blocks (LABs), a peak internal memory bandwidth sufficient for buffering 8.9 Mbits of user data, support for external memory interfaces including DDR/DDR2/DDR3/QDR, and hardened DSP blocks for fixed- and floating-point arithmetic. It supports up to 744 general-purpose I/Os arranged in configurable banks. The device ships in the industrial temperature grade (-40 °C to +100 °C) per the I4 speed-grade designation. The package is lead-free (Pb-free) with NiPdAu terminations. Typical applications include high-throughput signal processing, software-defined radio baseband, military and aerospace signal intelligence, medical imaging pipelines, high-speed data acquisition, ASIC prototyping, and high-end broadcast video processing. The combination of large logic capacity, embedded memory, and high I/O count makes it well suited to designs previously requiring multiple FPGAs or migrating from ASIC. When designing with this part, allocate dedicated core and I/O power rails using a multi-rail PMIC (e.g., LM2023) and follow the Stratix III PCB layout guide for FCBGA ball escape and decoupling. JTAG and AS configuration modes are both supported. Plan for JTAG chain integrity at the board level. This page synthesizes XAIPART distributor pricing, drop-in same-package alternatives from the Stratix III E family, and practical design notes not found in the manufacturer datasheet.
EP3SE110F1152I4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
The Intel (formerly Altera) EP3SE110F1152I4N is a high-density, high-performance Stratix III E Field Programmable Gate Array (FPGA) housed in a 1152-ball FC-FBGA package. Built on a 65 nm process technology, it integrates 107,500 logic elements, 4,300 LABs/CLBs, 744 user I/Os, and approximately 8.94 Mbits of embedded memory, with maximum operating frequency up to 600 MHz (per verified distributor data). An FPGA (Field Programmable Gate Array) is a programmable logic device whose architecture consists of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks. In the broader taxonomy, FPGAs are a sub-family of programmable logic devices (PLDs), which themselves sit within the integrated circuit (IC) hierarchy alongside ASICs and microcontrollers. FPGAs are chosen when designers need hardware-level parallelism, custom high-speed I/O timing, or rapid prototyping of complex digital systems. The Stratix III E family is engineered for transceivers and DSP-heavy workloads, with the EP3SE110 positioned in the mid-to-high density tier of the family. According to the manufacturer datasheet family, the device supports multiple high-speed transceiver channels and dedicated DSP blocks, making it suitable for signal processing pipelines. The 'I4' speed grade and industrial temperature rating make the I4N variant suitable for harsh-environment designs. Typical applications include telecommunications baseband processing, high-speed data acquisition, broadcast video processing, and high-performance digital signal processing cards. The 1152-ball FC-FBGA package exposes a large pin count, allowing simultaneous access to many high-speed serial lanes and parallel LVDS/TTL I/Os. When designing with this FPGA, verify that PCB layout accommodates the 1.0 mm (or 0.8 mm) ball pitch of the FC-FBGA and that thermal vias are placed under the central thermal balls to dissipate the configurable power budget. This page synthesizes verified distributor pricing, drop-in same-package alternatives, and practical design guidance not found in the manufacturer datasheet alone.
EP3SE110F780C2 - Stratix III E FPGA 107.5K LEs 780-FCBGA | Intel
The Intel EP3SE110F780C2 is a high-density Stratix III E FPGA delivering 107,500 logic elements, 8,936,448 bits of embedded memory, and 488 user I/O pins in a 780-ball FineLine BGA (FCBGA) package. Built on a 65 nm TSMC process and operating at a core voltage of 1.1 V, it belongs to the Stratix III Enhanced family engineered for high-performance digital signal processing, ASIC prototyping, and high-throughput serial connectivity designs. An FPGA (Field Programmable Gate Array) is a programmable logic device whose architecture consists of configurable logic blocks (CLBs), programmable interconnect, embedded memory blocks (M9K/M144K), DSP blocks, and high-speed transceivers. In the broader system hierarchy, an FPGA sits between a microcontroller (limited performance, fixed peripherals) and a custom ASIC (fixed function, highest performance, highest NRE cost). The Stratix III E family targets designs that demand far more parallel processing capability and memory bandwidth than an MCU can deliver, while retaining the time-to-market advantage and field-reprogrammability of programmable logic. Key features of the EP3SE110F780C2 include 107,500 logic elements, 8,936,448 embedded memory bits, 768 18x18 multipliers, four PLLs, 488 maximum user I/Os, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device integrates transceivers suitable for external memory interfacing (DDR/DDR2/DDR3/QDRII) and rich logic density for parallel pipelines, which differentiates it from lower-cost Cyclone III parts in the same family tree. Architecturally, the Stratix III E uses Altera's adaptive logic module (ALM) and multi-track interconnect for predictable timing closure at 600 MHz internal performance. Hard IP blocks for memory controllers, PCI Express Gen1/Gen2, and 8B/10B serial interfaces reduce soft-logic consumption and allow designers to focus die area on application logic. Typical applications include high-speed DSP (radar, software defined radio), ASIC prototyping, video processing, high-end test and measurement, military/aerospace signal processing, and wireline backplane bridging. The 488 user I/O count enables connection to multiple parallel data buses and external memory ranks simultaneously. When designing with this device, ensure the PCB supports the FCBGA-780 ball grid with appropriate via-in-pad, microvia, or HDI stackup. Thermal management is essential: at full logic utilization the device may dissipate several watts and requires a heatsink or high-performance thermal interface material. Use Altera (now Intel) Quartus II software with the Stratix III device support installed for synthesis, place-and-route, and timing analysis. This page synthesizes distributor inventory, parametric context, and practical design considerations not bundled in the manufacturer datasheet.
EP3SE110F780C2N - Stratix III E FPGA, 107.5K LE, 780-FBGA | Altera
The Altera (Intel) EP3SE110F780C2N is a high-density Stratix III E family Field Programmable Gate Array (FPGA) with 107,500 logic elements, 488 user I/Os, 8,936,448 bits of embedded memory, and a 600 MHz core operating frequency, housed in a 780-ball FC-FBGA package with 1.1 V core supply on a 65 nm process node. This -C2 speed grade device is engineered for high-performance digital signal processing, multi-gigabit serial connectivity, and high-throughput parallel processing. What is an FPGA? A Field Programmable Gate Array is a semiconductor device based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect, allowing designers to implement custom digital logic, DSP pipelines, and interface protocols after fabrication. Within the taxonomy of programmable logic devices, an FPGA sits between a CPLD (smaller, non-volatile) and an ASIC (fixed-function, high-NRE), offering hardware-level parallelism, reprogrammability, and high I/O counts for prototyping, low-volume production, and accelerating compute-bound workloads such as signal processing, image processing, and network packet inspection. Key features of the EP3SE110F780C2N include 4,300 Logic Array Blocks (LABs), embedded 18x18 multipliers for DSP-intensive designs, integrated transceivers in Stratix III variants, dedicated PLL and clock-tree resources, and Stratix III's programmable power technology that reduces dynamic power by intelligently gating unused logic blocks. The 780-ball FC-FBGA package supports high-speed differential I/O including LVDS at rates suitable for DDR2/DDR3 memory interfaces and high-speed serial protocols. Architecturally, the Stratix III E family uses Altera's adaptive logic module (ALM) and the MultiTrack interconnect, providing higher logic utilization than traditional LUT-4 architectures. The 65 nm process and 1.1 V core voltage balance performance against leakage, while the C2 speed grade targets mid-tier timing closure for commercial temperature designs. Typical applications include high-end telecom line cards, ASIC prototyping, military radar and signal intelligence, broadcast video processing, medical imaging accelerators, and high-performance computing test platforms. The combination of logic density, embedded memory, and DSP blocks makes it suitable for algorithms that demand parallel arithmetic units such as FFT, FEC, and digital down-conversion. Designers should note that Stratix III is a legacy generation (introduced circa 2007); the part is still serviced but new designs typically migrate to Stratix IV/V or Cyclone families for active roadmap support. Quartus II software is required for synthesis, place-and-route, and bitstream generation. This page consolidates distributor pricing, drop-in alternative cross-references, and practical design notes not found in the manufacturer datasheet alone.
EP3SE110F780C3 - Stratix III E FPGA 107.5K LE 780-FCBGA | Intel
The Intel (formerly Altera) EP3SE110F780C3 is a high-density Stratix III E Field Programmable Gate Array (FPGA) IC delivering 107,500 logic elements, 488 user I/Os, 8,936,448 bits of embedded memory, and 4,300 Logic Array Blocks (LABs) in a 780-ball Flip-Chip BGA (FCBGA) package. The device targets high-performance digital signal processing, high-speed serial connectivity, and memory-rich system designs requiring wide parallel data paths and high logic density on a single programmable fabric. An FPGA is a programmable logic device that lets designers implement custom digital circuits using configurable logic blocks, programmable interconnect, embedded memory blocks, DSP blocks, and high-speed transceivers. The Stratix III E family specifically optimizes the logic-to-memory-to-DSP ratio for memory-intensive and parallel-processing designs, making it well suited for ASIC prototyping, custom compute engines, and high-throughput image or video processing. Key features include 107,500 logic elements, 4,300 LABs, 488 user I/Os, 8,936,448 embedded memory bits, and an integrated high-speed transceiver layer supporting multi-gigabit serial interfaces. The 780-ball FCBGA package exposes wide parallel banks and dedicated high-speed serial channels, enabling designs that require both broadband I/O and bulk storage on-chip. The commercial speed grade designation "C3" identifies a specific timing bin within the Stratix III E family, balancing cost against Fmax across the supported temperature range. Stratix III E devices use a 65 nm TSMC process node with an architecture that combines adaptive logic modules (ALMs), TriMatrix embedded memory blocks, and DSP blocks. This combination enables efficient implementation of pipelined datapaths, large FIFOs, and high-throughput DSP filtering, with the transceiver and I/O circuitry supporting industry-standard serial protocols commonly used in communications, broadcast video, and test equipment. Typical applications include high-end ASIC prototyping, high-speed image and video processing, telecommunications line cards, radar and signal-intelligence front ends, and test and measurement instrumentation. The combination of high logic density and substantial embedded memory makes it suitable for systems that require real-time buffering and parallel compute such as multi-channel baseband processing and software-defined radio front ends. When designing with this device, ensure Quartus II software support for the C3 speed grade is used during synthesis and place-and-route to achieve published timing closure. Verify power budget and thermal solution against application note AN 471 by Intel, and provide a sufficient decoupling network across the FCBGA supply balls to meet simultaneous switching noise requirements. This page synthesizes distributor pricing, drop-in alternatives, application guidance and design considerations not consolidated in the manufacturer datasheet, supporting faster part selection and supply-chain evaluation for engineering teams.
EP3SE110F780C3N - Stratix III E FPGA 107K LE FCBGA-780 | Intel
The Intel (formerly Altera) EP3SE110F780C3N is a high-density Stratix III E family field-programmable gate array (FPGA) with 107,500 logic elements, 8,936,448 memory bits, and 488 user I/Os, housed in a 780-ball flip-chip BGA (FCBGA) package. It operates from a 1.1 V core supply, is fabricated on a 65 nm process, and is specified for a commercial junction-temperature grade (the trailing "C" suffix). The device integrates up to 4,300 logic array blocks (LABs), 8 transceiver blocks, and dedicated DSP and memory blocks for high-throughput signal-processing designs. What is an FPGA? A field-programmable gate array is a reconfigurable semiconductor device built from an array of programmable logic blocks, embedded memory, DSP slices, and high-speed serial transceivers all interconnected by a programmable routing fabric. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), then to logic ICs, then to integrated circuits and finally to semiconductors. The Stratix III E family in particular is positioned by Intel as a high-performance, logic-rich tier intended for ASIC prototyping, telecom/datacom infrastructure, and digital signal processing where high logic density and embedded transceiver bandwidth must coexist. Key features include 107,500 logic elements (LEs), 8,936,448 embedded RAM bits, 488 user I/O pins, 8 full-duplex transceiver channels supporting multi-gigabit serial interfaces, and integrated DSP blocks. The 780-ball FCBGA package provides a high pin-count platform suitable for memory-rich and transceiver-heavy designs, while the 65 nm low-k process enables high core frequencies with reduced dynamic power versus the prior Stratix II generation. The EP3SE110F780C3N uses a logic-rich architecture built around 4- and 6-input adaptive look-up tables (ALUTs), TriMatrix embedded memory blocks (MLABs, M9K, and M144K), and DSP blocks that can be configured as multipliers, multiply-accumulate units, or finite-impulse-response filters. The device also includes a dedicated PCML transceiver block supporting backplane and chip-to-chip serial links, a configuration controller, and clock-management tiles with PLL and dynamically reconfigable phase shift. These features combine to deliver ASIC-class compute density while retaining the in-system reprogrammability of an FPGA. Typical applications include ASIC prototyping and emulation, high-end wired communication systems (10G/40G Ethernet, SONET/SDH, PCIe Gen2), wireless baseband processing, military and aerospace signal processing, broadcast video processing, and high-performance DSP firmware acceleration. The 780-ball FCBGA package is intended for multilayer PCB designs with controlled-impedance routing for the transceiver channels. When designing with this device, plan PCB stackup and power-delivery network (PDN) for the 1.1 V core and the transceiver PLL supplies in parallel - the FCBGA requires a high-layer-count board to escape the 780 balls cleanly. Use the Intel Quartus II design suite (or later) to evaluate logic utilization, transceiver channel placement, and timing closure before committing to layout. This page synthesizes distributor pricing, FPGA-stratix drop-in alternatives from the same package family, and practical design notes that go beyond the manufacturer datasheet to support an engineer's evaluation of the EP3SE110F780C3N.
EP3SE110F780C4 - Stratix III E FPGA, 107500 LEs, 780-FCBGA | Intel
The Intel (Altera) EP3SE110F780C4 is a high-density Stratix III E FPGA delivering 107,500 logic elements, 8,936,448 bits of embedded memory, and 896 18x18 multipliers, packaged in a 780-ball FineLine BGA (FCBGA) with 488 user I/O pins. Built on TSMC's 40 nm process, the device integrates 8.9 Mbits of RAM and supports data rates up to 1.6 Gbps on its multi-gigabit transceivers, making it a workhorse for high-throughput DSP, ASIC prototyping, and high-speed serial link applications. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect, allowing engineers to implement arbitrary digital logic after fabrication. Within the broader taxonomy, an FPGA belongs to programmable logic devices -> logic ICs -> integrated circuits. The Stratix III E family sits in Intel's high-performance tier, positioned between cost-optimized Cyclone families and the higher-end Stratix V series, and is widely deployed for ASIC prototyping, high-speed packet processing, and wireless baseband signal chains. Key features of the EP3SE110F780C4 include 4,300 Logic Array Blocks (LABs), 8.9 Mbits of M9K block RAM, 896 DSP blocks (18x18 multipliers), up to 1.6 Gbps transceiver performance, and support for DDR3 memory interfaces up to 800 MHz. The C4 speed grade places it in the lower-power corner of the speed-grade spectrum, while the 780-FCBGA package offers 488 user I/O for connectivity-dense designs. The 40 nm process node balances static power and performance, and the device supports Partial Reconfiguration for systems that require runtime logic swaps. Architecturally, the EP3SE110F780C4 implements a hierarchical routing fabric with adaptive logic modules (ALMs), each containing two 4-input fracturable look-up tables. The transceiver tiles integrate hard PCIe Gen2 and Serial RapidIO IP blocks, offloading common serial-protocol state machines from the fabric and freeing logic for application-level work. Adaptive voltage scaling reduces dynamic power by lowering Vcc on inactive regions. Typical applications include high-end ASIC prototyping, high-performance DSP acceleration, telecom baseband processing, broadcast video processing, and high-speed serial interface bridging. Designers typically use the Quartus II design suite (Cyclone/Stratix family support) for HDL entry, synthesis, place-and-route, and timing closure on this device. A practical design consideration is thermal management: the 780-FCBGA package and 40 nm process require careful PCB thermal vias and a multi-layer stack-up with adequate ground pour to dissipate the ~10-15 W typical power envelope. Signal-integrity-aware pinout planning is also essential for 1.6 Gbps transceiver channels, which mandate controlled-impedance routing and length matching within tight tolerances. This page synthesizes distributor pricing, drop-in alternatives from Intel's Stratix III E family, application guidance, and design considerations not collected in one place in the manufacturer datasheet, giving procurement and design engineers a single reference for sourcing and applying EP3SE110F780C4.
EP3SE110F780C4L - Stratix III E FPGA 107.5K LE, 780-FCBGA | Intel
The Intel (Altera) EP3SE110F780C4L is a high-performance, low-power Stratix III E Field Programmable Gate Array (FPGA) housed in a 780-ball Fine-pitch Ball Grid Array (FCBGA) package. According to the verified distributor data, the device integrates 107,500 logic elements (LEs), 488 dedicated 18x18 multipliers, and 8,936,448 bits of embedded memory, providing the digital signal processing and buffering density required for high-throughput signal processing and ASIC-prototyping workloads. The part designation suffix "C4" indicates a -4 commercial speed grade, while the "L" suffix denotes a lower-leakage process variant, balancing static power against maximum performance. What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit above microcontrollers and DSP processors in the silicon hierarchy: they trade deterministic instruction execution for hardware-level parallelism, allowing engineers to implement custom datapaths, interfaces, and accelerators. The Stratix III E family specifically emphasizes high logic density combined with low static power via the programmable power technology, making it well suited to dense compute boards. Key features of the EP3SE110F780C4L include 488 hardened 18x18 multipliers for fixed-point DSP pipelines, 8.9 Mbits of distributed and block RAM, programmable power technology that reduces dynamic power by selectively gating unused regions, and a rich on-chip clock network with up to 12 PLLs per device. The FCBGA-780 footprint uses a 1.0 mm ball pitch, enabling high I/O density of 488 user I/O pins on a compact substrate for board-space-constrained designs. Architecturally, the device is fabricated on TSMC's 65 nm low-leakage process node, employing Altera's classic Adaptive Logic Module (ALM) architecture - each ALM contains an 8-input fracturable look-up table, two dedicated adders, and four registers, allowing any 7-input LUT function or two independent 4-input LUT functions to be packed efficiently. This delivers roughly 1.4x the logic capacity per area compared to the previous Stratix II generation at equivalent performance. Typical applications include high-end image and video processing pipelines, software-defined radio baseband processing, ASIC prototyping and emulation, high-speed serial protocol bridging (PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet), and test & measurement instrumentation where deterministic latency and reconfigurable logic are essential. With 8.9 Mbits of on-chip memory and 488 multipliers, the EP3SE110F780C4L can implement multi-channel FFT engines or H.264 encode/decode datapaths without external memory pressure. When designing with this device, allocate sufficient PCB layers (typically 12+ for the FCBGA-780 breakout) and use the Altera Quartus II design suite for synthesis, place-and-route, and power estimation. Note that the device is now in the Altera/Intel legacy FPGA portfolio, so consider second-source options from the Site MPN list within the same Stratix III family for risk mitigation. This page synthesizes distributor pricing, verified FPGA specifications, and same-family drop-in alternatives not found in a single manufacturer datasheet - giving engineers the full picture for sourcing and design reuse decisions.