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10CX150YU484I5G

10CX150YU484I5G - Cyclone 10 GX 150K LE FPGA | Intel | 484-BGA

The Intel 10CX150YU484I5G is a Cyclone 10 GX field-programmable gate array (FPGA) integrating 150,000 logic elements, 10,907,648 bits of embedded memory, and 188 (18x18) multipliers in a 484-ball fine-pitch BGA package. It is built on Intel's 20 nm process and supports transceivers, hardened memory controllers, and an industrial operating temperature range of -40C to +100C. The 'I5G' speed grade balances timing margin and Fmax against dynamic power, making it suitable for cost-sensitive mid-volume designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and embedded memory that designers can re-program after manufacture to implement custom digital logic, signal processing, and interface functions. FPGAs sit between fixed-function ASICs (lower unit cost, high NRE) and microcontrollers (slower, sequential) in the programmable-logic hierarchy, and modern FPGAs such as Cyclone 10 GX add hard IP blocks (PCIe Gen2, 3.125 Gbps transceivers, DDR3 controllers) that deliver ASIC-class throughput while preserving full design re-programmability. Key features include 12 transceiver channels up to 3.125 Gbps, hard PCIe Gen2 x4 IP, two hard memory controllers supporting DDR3/DDR3L up to 800 MHz, 1 Gb Ethernet MAC support, and a security feature set including configuration bitstream AES-256 encryption and JTAG-based configuration. The Cyclone 10 GX family delivers up to 30% lower power than Cyclone V GX at the same performance, achieved through a low-power core fabric and selectable on-die termination. The 484-pin UBGA package is a 0.8 mm pitch fine-pitch BGA with 19x19 ball array (peripheral rows plus a depopulated center), supported by Intel's comprehensive Quartus Prime design toolchain for synthesis, place-and-route, and timing closure. Hard PCIe and transceiver blocks free the FPGA fabric for application logic, allowing BOM cost reduction through elimination of external PHY ICs. Typical applications include industrial machine vision, video broadcast processing, PCIe Gen2 endpoint cards, low-density 4K video aggregation, motor control and industrial Ethernet, smart-camera and surveillance pipelines, and portable medical imaging peripherals where low power and small BGA footprint matter. When designing with this device, observe Intel's PCB layout guidelines for 0.8 mm-pitch BGAs (microvia stack-ups, breakout routing, decoupling strategy) and use the Quartus Prime power analyzer early to model thermal dissipation. The industrial temperature grade (I) supports -40C to +100C operation, but junction-to-ambient thermal resistance must be calculated using the package's theta_JA values for the actual airflow and copper-pour conditions in the end system. This page synthesizes distributor pricing, drop-in Intel Cyclone 10 GX and 10AX (Arria 10) alternatives, and PCB/design notes that are not aggregated in the manufacturer datasheet, helping engineers shorten sourcing decisions and compare pin-compatible FPGA options across Intel's mid-range programmable-logic portfolio.

USD $176.20 有现货

10CX150YU484I6G

10CX150YU484I6G - Cyclone 10 GX FPGA, 150K LE, 484-BGA | Intel

The Intel 10CX150YU484I6G is a Cyclone 10 GX field-programmable gate array (FPGA) with 150,000 logic elements, 10,907,648 bits of embedded memory, and 188 DSP blocks, housed in a 484-ball UBGA (FCBGA) package. Built on Intel's 20 nm process, it integrates up to 12.5 Gbps transceivers and a hard floating-point arithmetic architecture, targeting mid-range FPGA applications where cost, power, and bandwidth must be balanced. A Cyclone 10 GX FPGA is a programmable logic device from the broader category of field-programmable gate arrays (FPGAs) within the integrated circuits hierarchy (FPGA -> programmable logic device -> digital IC -> semiconductor). Cyclone 10 GX sits within Intel's low-power, transceiver-equipped FPGA family that complements the higher-end Stratix 10 line. Its role in the system hierarchy is to provide reconfigurable digital logic fabric, embedded memory, DSP, and high-speed serial I/O for video, industrial, and communications designs. Key features include 12.5 Gbps transceivers supporting PCIe Gen2 x4 and external memory interfaces up to DDR3/4, hard IEEE 754 single-precision floating-point multipliers, and the hardened Floating-Point Adaptive Logic Module (FAM) block. The 20 nm process delivers static power roughly 40% lower than the prior Cyclone V generation while preserving full transceiver bandwidth. The 484-ball BGA provides high I/O density for parallel memory buses and LVDS channels. Typical applications span industrial machine vision, broadcast video processing, multi-axis motor control, smart surveillance, and small-cell wireless backhaul. The combination of 12.5 Gbps transceivers, embedded transceivers for PCIe, and hard floating-point arithmetic makes the device well-suited for cost-sensitive signal-processing and protocol-bridging tasks. When designing with the 10CX150YU484I6G, careful PCB layout of the BGA power rails is critical - decouple every VCC/VCCA rail close to the balls and provide a continuous ground plane beneath the package. Use Intel's Quartus Prime Lite or Pro toolchain for synthesis, place-and-route, and timing closure.

USD $151.90 有现货

10CX220YF672E5G

10CX220YF672E5G - Cyclone 10 GX 220K LE FPGA | Intel | 672-FBGA

The Intel 10CX220YF672E5G is a Cyclone 10 GX field-programmable gate array (FPGA) with 220,000 logic elements, 11.46 Mbit embedded memory, and 236 user I/Os, housed in a 672-ball fine-pitch BGA (FBGA-672) package. It features 80,330 adaptive logic modules (ALMs), 5.7 Mbit MLAB memory, 48 18x19 multipliers, and four hard memory controllers. The 'E5G' speed grade and industrial-grade 'I' extended temperature profile target cost-sensitive high-volume applications requiring transceivers up to 12.5 Gbps and PCI Express Gen2 hard IP blocks. A field-programmable gate array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect, allowing hardware designers to implement custom digital logic functions after manufacturing. FPGAs occupy a unique position in the digital design hierarchy: more flexible than application-specific integrated circuits (ASICs) and far higher-performance than microcontrollers for parallel data-path workloads. Cyclone 10 GX specifically targets FPGA-accelerated industrial, video, and connectivity designs requiring transceivers and DSP blocks at low power. Key features include integrated PCI Express Gen2 x4 hard IP, up to 12.5 Gbps transceivers, hard memory controllers supporting DDR3/DDR4/LPDDR3, and 8-input fracturable ALMs delivering up to 7.0 Gbps LVDS performance. The device supports configuration via active serial x4, fast passive parallel x8, and JTAG modes. Hardened floating-point DSP blocks accelerate IEEE 754 single-precision arithmetic at block-level, reducing soft-logic utilization for signal-processing pipelines. The Cyclone 10 GX architecture combines a 20 nm process node with hardened protocol IP, achieving lower static power than the previous Cyclone V generation while supporting 12.5 Gbps multi-gigabit transceivers. The 672-ball FBGA package enables high I/O density on a 27 mm x 27 mm footprint with 1.0 mm ball pitch, suitable for mid-complexity PCIe cards, industrial machine vision, and broadcast video bridging. Typical applications include industrial machine vision frame grabbers, broadcast video interfaces (SDI/DisplayPort/HDMI bridging), PCIe Gen2 endpoint cards, motor control and industrial Ethernet, and low-power wireless backhaul. The integrated transceivers and PCIe hard IP make 10CX220YF672E5G particularly suited for video capture cards and protocol-bridging designs. When designing with this device, ensure the PCB stackup supports 1.0 mm BGA pitch with appropriate via-in-pad or dog-bone fanout. Power estimation should be performed using Intel's Early Power Estimator (EPE) before logic design begins, as 12.5 Gbps transceiver channels significantly affect thermal budget. Decoupling requires a minimum of 24 low-ESL ceramic capacitors distributed across the FPGA's core supply rails. This page synthesizes distributor pricing, pin-compatible Cyclone 10 GX family alternatives with shared 672-FBGA footprint, and practical PCB layout considerations not found in the standalone manufacturer datasheet, enabling faster engineering decisions for new designs and BOM risk mitigation for legacy boards.

USD $342.00 有现货

10CX220YF672E6G

10CX220YF672E6G - Cyclone 10 GX 220K LE FPGA | Intel

The Intel 10CX220YF672E6G is a Cyclone 10 GX field-programmable gate array (FPGA) with 220,000 logic elements, 13,752,320 embedded memory bits, and 236 (18x18) multipliers, housed in a 672-ball flip-chip BGA (FCBGA) package. It is a member of the Cyclone 10 GX family that delivers up to 12.5 Gbps transceiver performance and supports up to 72-bit wide DDR3 SDRAM interfaces at 1,866 Mbps, positioning it for high-bandwidth, cost-optimized applications. An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit that combines programmable logic blocks, programmable interconnect, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP blocks. Within the broader semiconductor taxonomy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as programmable logic devices, occupying the role of hardware-accelerated parallel processing in modern electronic systems. Cyclone 10 GX specifically targets mid-range applications requiring transceivers and DSP at low power. Key features include 220,000 logic elements, 13,752,320 bits of embedded memory, 236 hardware multipliers (18x18), and integrated 12.5 Gbps transceivers. The device is fabricated on TSMC's 20nm process, delivering a favorable performance-per-watt ratio. It supports high-speed external memory interfaces including DDR3, DDR4, LPDDR3, and QDR II+/QDR IV, plus 1.4 Gbps LVDS I/O for legacy parallel connectivity. Architecturally, the Cyclone 10 GX combines a fabric of adaptive logic modules (ALMs), embedded SRAM blocks, DSP slices, and hardened PCI Express Gen2 controllers. Hardened IP reduces soft-logic overhead and lowers power consumption compared to soft implementations, while the 20nm process enables higher integration and tighter timing margins than prior 28nm Cyclone generations. Typical applications include industrial machine vision and video processing, broadcast and professional video equipment, wireless backhaul infrastructure, PCIe-based accelerator cards, and high-speed prototyping platforms. The integrated 12.5 Gbps transceivers make it particularly well-suited for protocols such as CPRI, 10GbE (via XAUI), and JESD204B/C. When designing with this FPGA, consider power estimation using the Intel Early Power Estimator (EPE) before PCB layout, and ensure the 672-ball FCBGA footprint includes proper microvia stack-up and ball-pitch escape routing. Thermal management is essential at sustained high transceiver utilization; a heatsink or airflow is typically required. This page consolidates distributor pricing, drop-in alternatives, and design notes not assembled in the manufacturer datasheet, giving engineers a single reference for sourcing, replacement, and integration decisions.

USD $925.00 有现货

10CX220YF672I5G

10CX220YF672I5G - 220K LE Cyclone 10 GX FPGA, 672-FCBGA

The Intel (Altera) 10CX220YF672I5G is a Cyclone 10 GX field-programmable gate array (FPGA) integrating 220,000 logic elements, 13,752,320 bits of embedded memory, and 236 user I/Os in a 672-ball FCBGA package. Built on TSMC's 20nm process, the device is positioned for high-volume, cost-sensitive applications that still require hardened transceivers and DSP blocks. The part carries the industrial temperature grade (-40C to +100C), a 0.9V core supply, and belongs to the 220K-LE density tier of the Cyclone 10 GX family. An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture consists of configurable logic blocks (CLBs / ALMs), programmable interconnect, block RAM (BRAM), DSP slices, and hardened I/O serdes, all fabricated on a CMOS process. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and semiconductor ICs, distinguished from ASICs by their post-fabrication reconfigurability and from CPLDs by their finer-grained architecture and much higher logic capacity. Key features include 80330 adaptive logic modules (ALMs), 13.43 Mbit embedded memory, support for up to 12.5 Gbps transceivers on selected pins, hardware DSP blocks for fixed- and floating-point arithmetic, and a hard memory controller subsystem for DDR3/DDR4/LPDDR3 external memory interfaces. The F672 package provides 236 general-purpose I/Os and uses Intel's standard Cyclone 10 GX pin-out so existing board designs can drop the part in without remapping. The 20nm process node yields an attractive performance-per-watt ratio, with the -5 speed grade indicating a mid-tier Fmax placement. The Cyclone 10 GX architecture merges low-power logic fabric with embedded transceivers and PCIe Gen2 hard IP, allowing single-chip implementation of protocol bridging, motor control, video processing, and software-defined radio front-ends. Typical applications include industrial machine vision, factory automation backplanes, video surveillance and broadcast equipment, low-cost 10G Ethernet aggregation, PCIe-over-cable bridges, and embedded computing platforms for IoT gateways. Designers also use the device in test and measurement front-ends and as a programmable logic companion to ASSPs in automotive driver-assistance subsystems (industrial temperature grade required). A key design consideration for FPGAs of this density is power budgeting. Use the Intel FPGA Power and Thermal Calculator (PTC) early in the design cycle to estimate junction temperature and supply-rail currents; the 672-FCBGA's exposed-die thermal pad must be soldered to a multi-layer PCB land pattern with at least a 6x6 via array to the internal ground plane. This page synthesizes current distributor pricing, drop-in Cyclone 10 GX density and speed-grade alternatives, and practical PCB/thermal design guidance not found in the manufacturer datasheet alone.

USD $600.00 有现货

10CX220YF672I6G

10CX220YF672I6G - Cyclone 10 GX 220K LE FPGA, 672-FCBGA | Intel

The Intel 10CX220YF672I6G is a Cyclone 10 GX field-programmable gate array (FPGA) integrating 220,000 logic elements, 13,752,320 total memory bits, and 236 18x19 multipliers in a 672-ball FineLine BGA (FCBGA) package. Built on TSMC's 20nm process, it delivers mid-range programmable logic density with embedded transceivers for cost-sensitive video, industrial imaging, and machine vision pipelines. The device is offered in the industrial temperature grade (-40C to +100C), suitable for factory-floor and outdoor edge deployments. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic fabric, routing, and I/O can be reconfigured by the end user after manufacture. Within the broader semiconductor taxonomy, an FPGA is a programmable logic device (PLD) that sits alongside ASICs and CPLDs, occupying the niche between fixed-function ASICs and software-driven processors. The Cyclone 10 GX family is Intel's (formerly Altera's) low-power, transceiver-equipped line that targets high-throughput serial interfaces without the power envelope of the high-end Stratix series. Key features of the 10CX220YF672I6G include up to 12.5 Gbps transceiver capability, hard PCIe Gen2 IP blocks, hard memory controllers for DDR3/DDR4/LPDDR3, variable-precision DSP blocks, and 1.4 Gbps LVDS support. The FCBGA-672 package provides a compact 27x27 mm footprint suitable for space-constrained PCIe cards, vision processing boards, and broadcast video bridges. Power is supplied through dedicated VCC, VCCP, VCCERAM, VCCBAT, and transceiver rails requiring careful sequencing per the Intel pin connection guidelines. The 10CX220YF672I6G uses a logic-structure architecture based on adaptive logic modules (ALMs) feeding into a segmented routing fabric, with dedicated hardware for transceivers, memory interfaces, and DSP multiplication. This heterogeneous mix allows the same die to simultaneously drive multi-gigabit serial links, perform block-RAM-backed image buffering, and run fixed-point DSP filtering, all under hard real-time latency guarantees that no general-purpose processor can match. Typical applications include industrial machine vision and frame-grabber boards, broadcast video processing, low-cost PCIe acceleration cards, factory automation controllers, and protocol bridging for medical imaging or test equipment. The 672-ball BGA footprint supports designs requiring up to 12 high-speed transceiver channels alongside moderate logic capacity. When designing with this device, observe Intel's recommended decoupling scheme of 100 nF and 10 uF capacitors near every power pin, maintain a continuous ground plane beneath the BGA, and route all high-speed transceiver channels with reference-controlled differential impedance per Intel's PCB guidelines. Configuration via JTAG, AS, or PS modes must use the appropriate Intel Quartus Prime programmer. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving procurement and design engineers a single reference for the 10CX220YF672I6G.

USD $365.00 有现货

10CX220YF780E5G

10CX220YF780E5G - Cyclone 10 GX 220K LE FPGA | Intel | F780

The Intel / Altera 10CX220YF780E5G is a Cyclone 10 GX field-programmable gate array (FPGA) with 220,000 logic elements, 13,752,320 bits of embedded memory, and 284 user I/O pins, fabricated on a 20 nm process and housed in a 780-ball flip-chip BGA (FCBGA / F780) package. It targets cost- and power-sensitive applications that still require high-throughput transceivers and DSP resources. As a member of the Cyclone 10 GX family, it is the lowest-density entry in the family but retains the same transceiver-rich architecture used in mid-range Cyclone 10 GX devices. An FPGA is a reconfigurable digital integrated circuit that allows designers to implement arbitrary logic, DSP, memory, and high-speed serial interfaces by programming look-up tables, routing, and hardened IP blocks. The Cyclone 10 GX family sits in the Intel FPGA hierarchy below Arria 10 and Stratix 10, optimized for mid-range transceiver-rich designs such as industrial vision, broadcast, machine vision, and motor control. The 10CX220YF780E5G integrates transceivers that operate up to 12.5 Gbps, hardened PCI Express Gen2/Gen3 controllers, hardened memory controllers, and variable-precision DSP blocks. Key features of the 10CX220YF780E5G include up to 12.5 Gbps transceiver data rates, integrated PCI Express Gen3 x4 hard IP, 156 18x19 multipliers for DSP, partial reconfiguration support, and a hardened memory controller subsystem supporting DDR3/DDR4/LPDDR3 external memory. Security features include bitstream encryption using AES-256, JTAG, and configuration via serial flash. The device supports both commercial (0C to 85C) and industrial (-40C to 100C) temperature grades; the E5G suffix denotes the commercial speed grade 5. The 10CX220YF780E5G is typically deployed in industrial machine vision frame grabbers, broadcast video processing (SDI/HDMI bridges), motor control and drives, low-cost 10G Ethernet aggregation, and PCI Express add-in cards. Its combination of transceivers, DSP, and low power makes it well suited for cost-constrained designs that previously required mid-range FPGAs. Compared with the older Cyclone V and Cyclone IV families, the 10CX220YF780E5G offers up to 2x higher transceiver bandwidth and significantly higher logic density at comparable power. When designing with this device, ensure Quartus Prime software support matches the device speed grade, plan power sequencing for the multiple supply rails (core, transceiver, I/O, auxiliary), and provide matched-impedance routing for high-speed serial links. The F780 package has a 29 mm x 29 mm body and requires a multilayer PCB with microvia or via-in-pad technology for reliable assembly.

USD $615.00 有现货

10CX220YF780E6G

10CX220YF780E6G - Cyclone 10 GX 220K LE FPGA | Intel | 780-FCBGA

The Intel (formerly Altera) 10CX220YF780E6G is a Cyclone 10 GX field-programmable gate array (FPGA) from the 20 nm process family, providing 220,000 logic elements (LEs), approximately 13.75 Mbits of embedded M20K memory, and 284 (18x18) multipliers in a 780-ball FineLine BGA (FCBGA) package. The device integrates up to 12.5 Gbps transceivers, a hard PCIe Gen2 controller, and a 1.5 GHz ARM Cortex-A9 dual-core Hard Processor Subsystem-free fabric, targeting mid-range cost-sensitive applications that still require transceiver bandwidth. The "E6G" suffix indicates the industrial temperature grade and a lead-free/RoHS-compliant lead finish. An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) belonging to the broader category of programmable logic and semiconductor ICs. In the system hierarchy, FPGAs sit between fixed-function ASICs (lower NRE, higher unit cost) and microcontrollers/MCUs (software-driven, lower throughput). Cyclone 10 GX specifically targets applications that need transceiver speed and DSP blocks without the power and cost of high-end Stratix 10 devices. This positions the family in the power management and signal-chain ecosystem as a parallel-processing engine that interfaces directly to high-speed serial links, DDR3 memory, and analog front ends. Key features include 220K logic elements, 13,752,320 bits (~1.6 MBytes) of embedded memory, 284 DSP blocks for fixed- and floating-point math, and 12 transceiver channels supporting data rates up to 12.5 Gbps. The fabric runs with core voltages of 0.9 V (VCC) and 1.1 V (VCCPT) using a hardened PLL and clock network. Designers use Intel Quartus Prime software for synthesis, place-and-route, and timing closure. The 780-FCBGA package has a body size of 29 mm x 29 mm with a 1.0 mm ball pitch, providing ample signal and power pins for transceiver and DDR3 routing. Typical applications include industrial machine vision over CoaXPress or GigE Vision, video broadcast processing up to 4K60 with protocol bridging, wireline telecom line cards using CPRI/OBSAI backhaul, motor control and drive systems, and PCIe Gen2 endpoint cards in test and measurement. The combination of 12.5 Gbps transceivers, DSP blocks, and moderate logic density also makes the device well suited to low-cost radar preprocessing, software-defined radio (SDR) front ends, and medical imaging acquisition boards. Designers should plan PCB layout with matched-length transceiver pairs, a 12-layer stack-up for the 780-BGA escape, and a thermal solution sized for the worst-case 9-12 W dissipation at full transceiver utilization. Quartus Prime recommends the per-pin power-integrity decoupling schedule in the device pin connection guidelines; following it closely is the difference between a clean BER (Bit Error Rate) margin and intermittent link-up failures.

USD $1,720.00 有现货

10CX220YF780I5G

10CX220YF780I5G - Cyclone 10 GX 220K LE FPGA | Intel | F780

The Intel (formerly Altera) 10CX220YF780I5G is a Cyclone 10 GX field-programmable gate array (FPGA) with 220,000 logic elements, 13,752,320 bits of embedded memory, and a 780-ball fine-pitch BGA (FCBGA) package. It belongs to Intel's low-power, high-bandwidth Cyclone 10 GX family optimized for video, industrial imaging, and high-speed serial interface applications. The device integrates up to 12.5 Gbps transceivers and a hard PCIe Gen2 hard IP block for cost-sensitive connectivity designs. What is a Cyclone 10 GX FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device containing programmable logic blocks, interconnect, and I/O that can be customized after manufacturing using HDL bitstreams. Cyclone 10 GX sits in Intel's low-end FPGA portfolio below Stratix 10, targeting power- and cost-sensitive applications that still need high-speed transceivers and embedded hard IP. Within the broader taxonomy: FPGA -> programmable logic device (PLD) -> digital IC -> integrated circuit (IC). Key features of the 10CX220YF780I5G include 284 (18x19) variable-precision DSP blocks, 12 transceiver channels up to 12.5 Gbps supporting protocols such as PCIe Gen2 x4, 10GbE, CPRI, and JESD204B, hard memory controllers, and a maximum of 284 user I/O pins. The device supports the -40C to +100C industrial temperature range (the 'I' speed/temperature grade), making it suitable for harsh-environment industrial and military/aerospace adjacent applications. Architecturally, the 10CX220 uses a 20 nm process technology, an adaptive logic module (ALM) based core fabric, and embedded SRAM blocks distributed across the die. The hard IP blocks (PCIe, memory controllers, transceivers) reduce soft logic overhead and power consumption. The 780-pin FCBGA package provides ample signal breakout for the high-speed serial links and parallel I/O. Typical applications include industrial machine vision and video processing, motor control and factory automation, broadcast and professional video (SDI/DisplayPort bridges), 4K UHD video capture cards, software-defined radio (SDR) platforms, and PCIe-based accelerator cards in edge computing. The combination of low static power, transceiver bandwidth, and small footprint suits space-constrained embedded designs. When designing with the Cyclone 10 GX, engineers should plan power sequencing, JTAG access, and configuration scheme (AS, PS, JTAG, or FPP) up front. Use Intel Quartus Prime Lite/Standard edition for synthesis, place-and-route, and timing closure. The 780-ball BGA requires PCB design rules for microvia stacks and controlled-impedance routing on high-speed TX/RX pairs. This page synthesizes distributor pricing, drop-in same-family alternatives (10CX220YF780I6G, 10CX220YF780E5G, etc.), a 780-FCBGA pinout reference, and practical Quartus Prime design notes not found in the bare datasheet PDF.

USD $1,995.00 有现货

10CX220YF780I6G

10CX220YF780I6G - Cyclone 10 GX 220K LE FPGA, 780-FCBGA | Intel

The Intel (formerly Altera) 10CX220YF780I6G is a Cyclone® 10 GX field-programmable gate array (FPGA) with 220,000 logic elements, 13,752,320 bits of embedded memory (1,678 Kb of M20K), and 284 user I/O pins, housed in a 780-ball FineLine BGA (FBGA/FCBGA) package. Built on Intel's low-power 20 nm process, the device targets cost- and power-sensitive applications that still require high-speed serial transceivers and a hardened floating-point digital signal processing (DSP) fabric. A field-programmable gate array (FPGA) is a programmable logic device whose logic, routing and I/O are defined by configuration bitstream rather than hard-wired silicon. The Cyclone 10 GX family sits inside Intel's broader FPGA hierarchy: programmable logic device -> FPGA -> SRAM-based FPGA -> Cyclone series -> Cyclone 10 GX. Compared with ASICs, FPGAs give instant prototyping and field-upgrade flexibility; compared with low-cost CPLDs, they offer far higher logic density, embedded transceivers and DSP blocks for parallel arithmetic workloads. Key features include up to 12 transceivers at 12.5 Gbps supporting PCIe Gen2 x4 hard IP, 6x 6.144 Gbps CPRI for wireless fronthaul, and 4 memory controllers with ECC. Logic resources scale to 220K logic elements and 156 DSP blocks for fixed- and floating-point compute. Industrial-grade temperature range (-40C to +100C) and lead-free/RoHS-compliant packaging suit embedded, broadcast and industrial imaging designs. The Cyclone 10 GX architecture pairs a sea-of-LABs fabric with adaptive logic modules (ALMs), column-M20K memory blocks and 18x19 variable-precision DSP blocks with hardened IEEE-754 single-precision floating-point support. This combination lets one device implement both control-plane glue logic and high-throughput DSP pipelines without an external companion chip. Typical applications include broadcast video processing, machine-vision frame grabbers, industrial motor control and encoder interfaces, low-cost PCIe accelerator cards, wireless baseband pre-processing (CPRI / OBSAI) and IoT edge analytics gateways. The high I/O count supports multiple camera sensors or Ethernet ports in a single device. Designers should plan power-rail sequencing for the core, PLL and transceiver supplies separately and follow Intel's recommended decoupling per the Pin Connection Guidelines to meet transceiver jitter budgets. The I6G ordering code indicates industrial temperature grade, lead-free RoHS-compliant FCBGA. This page synthesizes distributor pricing, drop-in Altera/Intel alternatives, application recommendations and design notes not found on any single distributor page.

USD $121.83 有现货

10CX220YU484E5G

10CX220YU484E5G - 220K LE Cyclone 10 GX FPGA 484-BGA | Intel

The Intel 10CX220YU484E5G is a Cyclone® 10 GX Field-Programmable Gate Array (FPGA) featuring 220,000 logic elements, 13,752,320 bits of embedded memory, and 188 user I/O, housed in a 484-pin UBGA (BFBGA) package. Built on TSMC's 20nm process technology, this device operates from a 0.9V nominal core supply and supports transceiver speeds up to 12.5 Gbps, making it well suited for cost-sensitive high-volume applications requiring moderate logic density with embedded serial connectivity. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks (CLBs), programmable interconnect, and hardened IP blocks such as transceivers, memory controllers, and DSP slices. Within the broader taxonomy, an FPGA sits under programmable logic -> logic IC -> integrated circuit -> semiconductor. Cyclone 10 GX specifically targets industrial, automotive, video broadcast, and IoT edge applications where designers need a balance of logic capacity, low power consumption, and integrated multi-gigabit transceivers without paying for the higher-end Stratix family price tier. Key specifications include up to 12.5 Gbps multi-gigabit transceivers with hard PCIe Gen2 x4 IP blocks, hardware floating-point DSP blocks for high-throughput signal processing, and a hardened memory controller subsystem supporting DDR3/DDR4/LPDDR3 external memory interfaces. The 188 user I/O pins support LVDS, LVCMOS, SSTL, and HSTL I/O standards with individually-controllable slew rate and drive strength. The device supports up to 6.144 Mb of distributed RAM (MLAB) and 13.75 Mb of embedded M20K block RAM. Cyclone 10 GX uses a low-power architecture optimized for thermal envelope-constrained designs. Static power reduction features include optional clock gating per LAB, power gating of unused transceivers, and Intel's Quartus Prime software-driven power optimization. The 20nm process delivers a typical core VCC of 0.9V, which reduces dynamic power by approximately 30% compared to the prior 28nm Cyclone V generation while preserving pin-to-pin package compatibility for many design footprints. Typical applications include industrial machine vision over CoaXPress or GigE Vision, video broadcast and pro-AV signal processing with DisplayPort or HDMI aggregation, automotive driver assistance (ADAS) sensor fusion, PCIe Gen2 x4 endpoint cards, and IoT edge inference accelerators. The integrated transceivers eliminate the need for external PHY chips, reducing BOM cost and board area for protocols like 10GbE, CPRI, and JESD204B. Design consideration: when targeting 10CX220YU484E5G, designers should use Intel Quartus Prime software (Lite or Standard edition depending on license) and verify pinout assignments against the device-specific pin table in the Cyclone 10 GX Device Handbook, as 484-pin UBGA variants differ from F780 and F672 package pinouts even at the same logic density. Power estimation should be run early using the PowerPlay Early Power Estimator to validate thermal budgets. This page synthesizes Intel distributor pricing, drop-in same-family alternatives, and practical design notes that are not aggregated in the manufacturer datasheet PDF alone. Engineers searching for a 220K LE Cyclone 10 GX in a 484-pin UBGA can use the comparison_table and alternatives list below to evaluate drop-in same-package siblings and cross-brand candidates.

USD $189.95 有现货

10CX220YU484E6G

10CX220YU484E6G - Cyclone 10 GX 220K LE FPGA | Intel | 484-BGA

The Intel 10CX220YU484E6G is a Cyclone® 10 GX field-programmable gate array (FPGA) built on 20nm process technology, integrating 220,000 logic elements and 13,752,320 bits of embedded memory in a 484-pin UBGA package with 188 user I/O. It is part of Intel's (formerly Altera's) low-power, transceiver-equipped Cyclone 10 GX family targeting cost-optimized bandwidth-intensive applications. An FPGA (Field Programmable Gate Array) is a semiconductor device with an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be reconfigured by the designer after manufacturing. FPGAs occupy a unique tier in the programmable logic hierarchy: above fixed-function ASICs in flexibility, below microcontrollers in per-unit cost for high-volume products, but unmatched for parallel processing, low-latency I/O, and hardware-reconfigurable logic. Cyclone 10 GX sits at the intersection of low power and high serial bandwidth in Intel's portfolio. Key features of the 10CX220YU484E6G include integrated transceivers up to 12.5 Gbps, hard memory controllers, a hard PCIe Gen2 hard IP block, and a 1.4 Gbps LVDS performance. The device supports up to 220K logic elements, 13.75 Mbits embedded RAM, and 154 18x18 multipliers for DSP workloads. The 484-BGA package provides 188 general-purpose I/O pins, with transceivers and configuration pins sharing additional balls in the same array. The 10CX220YU484E6G is fabricated on TSMC's 20nm low-power process, delivering lower static and dynamic power versus prior-generation 28nm Cyclone V devices. Integrated PLLs, hard PCIe Gen2 x4 IP, and 12.5 Gbps transceivers enable designers to consolidate what previously required external bridge chips into a single FPGA. The architecture supports configuration via active serial (AS), passive serial (PS), JTAG, and fast passive parallel (FPP) modes. Typical applications include industrial machine vision with GigE Vision or CoaXPress aggregation, low-cost broadcast video processing, software-defined radio front-ends, IoT edge acceleration, motor control, and PCIe-based acceleration cards. The combination of integrated transceivers and low power makes it a popular choice for cost-sensitive designs requiring high-speed serial I/O without the power budget of a Stratix 10. When designing with the 10CX220YU484E6G, pay close attention to transceiver reference clock routing and power distribution. The integrated transceivers require clean, low-jitter reference clocks for proper link operation, and a minimum of 4 PCB layers is recommended for the transceiver power planes. Quartus Prime Lite edition provides free synthesis and place-and-route support for this device. This page synthesizes distributor pricing, drop-in Cyclone 10 GX alternatives, and practical design notes not aggregated in a single location on the manufacturer datasheet, providing engineers a one-stop reference for sourcing and designing in this part.

USD $160.00 有现货

10CX220YU484I5G

10CX220YU484I5G - Cyclone 10 GX FPGA 220K LE | Intel

The Intel 10CX220YU484I5G is a Cyclone 10 GX field-programmable gate array (FPGA) from the 10CX220 logic-element (LE) density tier, packaged in a 484-ball Ultra FineLine BGA (UBGA) with 188 user I/O pins and offering up to 12.5 Gbps transceiver capability. Built on a low-power 20 nm process, this device integrates 220,000 logic elements, 13,752,320 bits of embedded memory (approximately 1.6 MByte of M20K block RAM), and dedicated DSP blocks, targeting cost-sensitive applications that still require 10+ Gbps serial links and high memory bandwidth. A field-programmable gate array (FPGA) is a reprogrammable semiconductor device that combines configurable logic blocks (CLBs), programmable routing, embedded memory, DSP slices, and hardened IP such as transceivers and memory controllers. Cyclone 10 GX sits within Intel's broader FPGA hierarchy: Cyclone 10 (low-power, cost-optimized) → Cyclone 10 GX (adds 12.5 Gbps transceivers and 1.4 Gbps LVDS) → Cyclone family → FPGA → programmable logic device (PLD) → semiconductor. The 'I5G' suffix denotes the industrial temperature grade (-40 °C to +100 °C junction) and 0.85 mm ball-pitch BGA. Key features include up to 12.5 Gbps multi-protocol transceivers supporting PCIe Gen2 x4 and external memory interfaces up to 72-bit wide DDR3 SDRAM at 1866 Mbps. The device supports 1.4 Gbps LVDS I/O, hard PCIe Gen2 IP blocks, and an integrated Hard Memory Controller, removing soft-logic overhead and freeing fabric for application differentiation. On-chip PLLs and per-channel transceiver settings are configured through Intel Quartus Prime software. Architecturally, the 10CX220 uses a transceiver-rich tile layout, with hardened PCIe and memory controllers co-located with transceivers to minimize latency. The 20 nm process combined with Intel's low-power fabric delivers measurable static and dynamic power reductions versus prior-generation Cyclone V devices at equivalent logic densities. Typical applications include industrial machine vision and image processing pipelines, broadcast video I/O, low-density 4K video processing, IoT and edge gateways requiring hardware-accelerated interfaces, motor control and robotics with deterministic low-latency comms, and PCIe-based add-in cards and test equipment that need 10 Gbps class serial links at moderate cost. When designing with this device, plan power-rail sequencing for the core (VCC, VCCP), transceiver (VCCRT), and auxiliary (VCCAUX/VCCAUX_PLL) supplies and provide adequate thermal relief via PCB copper pour. Verify the transceiver channel count and reference-clock routing against your block diagram before PCB layout commit. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical board-level design notes not assembled in a single place in the manufacturer datasheet.

USD $42.38 有现货

10CX220YU484I6G

10CX220YU484I6G - Cyclone 10 GX FPGA 220K LE, 12.5G Transceiver | Intel

The Intel 10CX220YU484I6G is a Cyclone 10 GX field-programmable gate array (FPGA) delivering 220,000 logic elements, 13,752,320 bits of embedded memory, and 188 maximum user I/Os in a 484-ball Ultra FineLine BGA (UBGA) package. It integrates 12.5 Gbps transceiver channels, hardened memory controllers, and a variable-precision DSP block set, serving as Intel's mid-density low-power FPGA family optimized for high-bandwidth, cost-sensitive applications. A Cyclone 10 GX FPGA is a programmable logic device from Intel's low-density Cyclone family that combines hard IP blocks (transceivers, PCIe Gen2, memory controllers) with general-purpose FPGA fabric. It sits in the broader taxonomy of FPGA -> programmable logic device -> logic IC -> semiconductor, and is the direct successor to Cyclone V GX/GT families, offering higher transceiver bandwidth and lower core voltage than its predecessors. Key features of this 10CX220 variant include up to 12.5 Gbps multi-protocol transceivers that support PCIe Gen2 x4, 10GbE (10GBASE-R), CPRI, and JESD204B. The device integrates a hardened PCIe Gen2 controller with up to x4 lane support, eliminating soft IP overhead for PCIe endpoint designs. It also embeds variable-precision DSP blocks supporting 18x19 and 27x27 multiplier modes for high-efficiency signal processing, and dual-configuration memory interfaces for fail-safe remote updates. Memory interface support extends to DDR3 SDRAM up to 1,866 Mbps with a 72-bit wide interface. Architecturally, this device uses Intel's 20 nm low-power process and a logic-structure voltage of 0.9 V core. The transceiver tiles are powered from a separate 1.1 V supply to maintain signal integrity at 12.5 Gbps. The 484-pin UBGA package offers a compact footprint suitable for space-constrained designs such as industrial cameras and small-form-factor embedded systems. The 'I6G' speed grade indicates industrial temperature range (-40C to +100C) and a specific transceiver performance bin. Typical applications include 10GbE network interface cards, industrial machine vision, broadcast video processing, 5G fronthaul, and PCIe Gen2 endpoint cards. When designing with this FPGA, plan for adequate PCB layers to route 12.5 Gbps SERDES signals - typically six or more layers with controlled impedance and a continuous ground plane below the SERDES region.

USD $277.00 有现货

10M02DCU324A7G

10M02DCU324A7G - MAX 10 FPGA, 2K LE, 160 I/O, 324-UBGA | Intel

The Intel (formerly Altera) 10M02DCU324A7G is a MAX 10 non-volatile FPGA with 2,000 logic elements (LE), 110,592 bits of embedded SRAM, and 160 user I/O, housed in a 324-ball Ultra FineLine BGA (UBGA) package measuring 15x15 mm. It is a member of the MAX 10 family, Intel's lowest-power non-volatile FPGA line, integrating a flash configuration memory on-chip so no external boot PROM is required. The device supports core voltages of 1.15 V to 1.25 V and operates across the -40 C to +125 C extended industrial junction temperature range. An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (LBs), programmable interconnect, and I/O cells that can be rewired after manufacture to implement arbitrary digital circuits. FPGAs occupy a unique position between general-purpose microcontrollers (software-defined behavior, fixed hardware) and ASICs (fixed function, no post-silicon changes). The MAX 10 family extends this concept with on-die flash, integrated ADCs, and DSP blocks, making it suitable for glue logic, I/O expansion, motor control, and industrial interface bridging where deterministic hardware parallelism is required but ASIC NRE is unjustified. Key features of the 10M02DCU324A7G include 2,000 logic elements (approximately 1.6K ALMs / 3,200 LUT4-equivalents), 110 Kbits of embedded SRAM, 16 embedded 18x18 multipliers, and a 1.5 Msps 12-bit successive-approximation ADC with up to 17 analog inputs. The device integrates a user flash memory block, internal oscillator, and PLL blocks. It is built on TSMC's 55 nm embedded flash process, allowing instant-on functionality from a single 3.3 V supply with no external configuration device. Typical applications include industrial motor control, multi-protocol sensor interfacing, low-cost video processing for machine vision, LED display controllers, and bridge/glue logic in factory automation. The integrated 12-bit ADC and DSP blocks make it particularly suitable for closed-loop control loops in power conversion and motor drive stages. When designing with the 10M02DCU324A7G, use Intel Quartus Prime Lite Edition for synthesis, place-and-route, and timing closure; the free toolchain supports this device fully. Note that pinout and package thermal performance depend heavily on PCB stack-up - the 15x15 mm UBGA package requires microvia or laser-drilled via technology for reliable assembly on standard 4-layer FR-4 boards. This page synthesizes distributor pricing, drop-in MAX 10 family alternatives, and practical Quartus Prime design notes not found in the bare datasheet.

USD $6.30 有现货

10M02DCU324I7G

10M02DCU324I7G - MAX 10 FPGA 2K LE, 160 I/O, U324 BGA | Intel

The Intel (formerly Altera) 10M02DCU324I7G is a MAX 10 family Field Programmable Gate Array (FPGA) integrating 2,000 logic elements, 110 Kbit embedded block RAM, and 160 user I/O in a 324-ball UBGA package, manufactured on a 55 nm non-volatile process. Operating from a 1.2 V core supply with on-chip voltage regulators, the device delivers up to [DATA_NEEDED: DSP performance] and supports instant-on dual-configuration flash for non-volatile configuration storage. A MAX 10 FPGA is a non-volatile programmable logic device that combines look-up-table (LUT)-based fabric with analog mixed-signal (AMS) hard IP blocks, on-chip flash configuration memory, and a hardened Nios II soft-core-friendly interface. Positioned within the broader FPGA > programmable logic hierarchy, MAX 10 serves low-power, low-density glue-logic, bridging, and control-plane applications, complementing higher-density Cyclone, Arria, and Stratix families in the Intel/Altera portfolio. Key features include 2,000 logic elements (LEs), 110,592 bits of embedded M9K block RAM, 24 embedded 18x18 multipliers (DSP blocks), a 12-bit successive-approximation ADC with up to [DATA_NEEDED: ADC channel count], internal temperature-sensing diode, and dual-boot configuration flash. The 324-ball UBGA package exposes 160 user I/O supporting LVCMOS, LVDS, LVTTL, SSTL, and HSTL I/O standards with programmable drive strength and slew rate. Per-bank I/O voltages simplify mixed-voltage interfacing on the same die. Architecturally, MAX 10 fuses a LUT4-based logic array with embedded RAM, DSP, PLL, and a 12-bit ADC IP block on a single monolithic die, eliminating external boot memory and reducing bill-of-materials cost. The integrated configuration flash supports instant-on operation and dual-image remote update, while the AMS block provides analog-to-digital conversion and on-die temperature monitoring without external components. Typical applications include industrial motor control and human-machine interface (HMI) boards, low-cost video bridging, I/O expansion and protocol translation in factory automation, sensor fusion front-ends, and portable test/measurement instruments where instant-on, low power, and embedded analog simplify board design. Choose MAX 10 when Cyclone V is over-spec and a CPLD cannot deliver the logic capacity or ADC integration required. When designing with this device, route I/O bank supplies (VCCIO) per bank so mixed-voltage interfaces (e.g., 1.8 V LVCMOS plus 3.3 V LVCMOS) coexist. Place the dedicated VCCINT core and VCCA analog supplies with a low-noise LDO and adequate decoupling (10 uF bulk plus 0.1 uF per supply pin); reference the Intel MAX 10 device datasheet pin connection guidelines for board layout. Verify the junction-temperature envelope using theta-JA for the U324 package when fanless. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

USD $1.55 有现货

10M02DCV36C7G

10M02DCV36C7G - 2K Logic Elements FPGA | Intel | Embedded Control

Intel 10M02DCV36C7G is a non-volatile MAX 10 field-programmable gate array with 2,000 logic elements, 27 I/O pins, and a 36-ball WLCSP package. Verified distributor listings identify 110,592 bits of embedded memory, a 1.2 V operating voltage, and 55 nm process technology. The device belongs to the programmable-logic hierarchy of FPGA, programmable logic device, semiconductor, and configurable digital integrated circuit. A field-programmable gate array combines programmable logic blocks, routing resources, embedded memory, and user-defined I/O so engineers can implement control, interface, timing, and state-machine functions without a custom application-specific integrated circuit. The MAX 10 family is intended to support compact embedded systems where hardware flexibility, rapid design iteration, and non-volatile configuration are useful. The target's 27 available I/O pins can connect digital sensors, control signals, communications interfaces, and application processors. Its embedded memory capacity of 110,592 bits supports moderate buffering, lookup-table storage, and small data or control stores. The 36-WLCSP footprint makes it suitable for space-constrained boards, although assembly and PCB routing require careful consideration of the fine-pitch ball grid. The verified data identifies 2,000 logic elements, 27 I/O, 110,592 embedded memory bits, 55 nm technology, and 1.2 V operation. These parameters define a small FPGA suitable for glue logic, interface translation, configurable timing, and distributed control. Compared with a fixed-function controller, the FPGA can change logic behavior after PCB fabrication. Compared with a larger FPGA, the 2,000-element device is constrained by limited logic and memory capacity, so designers should estimate resource utilization before committing to the part. The device's non-volatile FPGA configuration is particularly relevant in systems that must retain behavior after power is removed. Typical designs can use the FPGA for sensor aggregation, motor or actuator control sequencing, legacy bus adaptation, or custom peripheral bridging. The 1.2 V supply requirement must be satisfied by the board power architecture, while the WLCSP package requires controlled thermal, assembly, and signal-integrity design. The verified sources do not provide a complete pinout, operating-temperature range, configuration details, or absolute electrical limits, so those values require datasheet confirmation before production design. Practical applications include industrial control, embedded vision interfaces, robotics, test equipment, and portable electronics. A production design should validate the selected package against the PCB land pattern, confirm configuration and clocking requirements, and verify all supply, I/O, and timing limits in the manufacturer documentation. This page combines verified distributor specifications, pricing references, package-aware alternatives, and engineering considerations to help procurement and design teams assess 10M02DCV36C7G.

USD $2.34 有现货

10M02DCV36C8G

10M02DCV36C8G - MAX 10 FPGA, 2K LE, 36-UFBGA WLCSP | Intel

The Intel 10M02DCV36C8G is a non-volatile Field Programmable Gate Array (FPGA) from the MAX 10 family, delivering 2,000 logic elements and 110,592 bits of embedded RAM (approximately 108 Kbits) in a compact 36-ball WLCSP (Wafer-Level Chip-Scale Package). The device integrates 27 general-purpose user I/O pins and supports a single configuration memory solution thanks to its on-chip flash, eliminating the need for an external boot PROM in most designs. According to Intel MAX 10 datasheet documentation, this device operates over the industrial -40C to +100C (C8G speed/temperature grade) range. A field programmable gate array is a semiconductor device built around an array of configurable logic blocks (LBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs sit in the digital-logic hierarchy above fixed-function ASICs and below software-driven microcontrollers for applications requiring parallel processing, custom high-speed interfaces, or hardware acceleration. The MAX 10 family specifically targets low-power, non-volatile, low-cost applications by integrating flash configuration memory directly on-die, occupying the entry-tier position in Intel's FPGA portfolio (MAX 10 -> MAX -> FPGA -> programmable logic -> semiconductor). Key features include 2,000 logic elements (LEs), 110,592 bits of total RAM, an integrated PLL, and on-chip user flash memory. The 36-UFBGA WLCSP package provides the smallest possible footprint in the MAX 10 family, making it ideal for space-constrained designs such as handheld test equipment, sensor fusion modules, and wearable devices. The C8G speed grade and industrial temperature rating make this part suitable for moderate-speed industrial control applications. The MAX 10 architecture combines a look-up-table (LUT)-based logic fabric with embedded flash, embedded SRAM blocks, and dedicated DSP/ multiplier blocks (smaller MAX 10 devices have a reduced DSP count). This integrated flash approach differentiates MAX 10 from SRAM-based competitors such as Lattice iCE40 and Xilinx Spartan-6/7, allowing instant-on behavior and reducing BOM cost for low-density designs. Typical applications include industrial control I/O expansion, sensor data pre-processing, low-speed video bridging (e.g., MIPI CSI-2 to parallel RGB), FPGA-based glue logic, motor control co-processors, and portable instrumentation. The wide operating temperature range and integrated flash make it especially suitable for factory automation and automotive aftermarket products. When designing with this device, note that the 36-UFBGA WLCSP is hand-soldering friendly but typically requires reflow with precise land-pattern control. Ensure the PCB has a 4-layer stackup with continuous ground plane beneath the device to provide thermal spreading and signal-return paths. The MAX 10 toolchain is the Intel Quartus Prime software suite (Lite edition supports MAX 10 free of charge). This page synthesizes distributor pricing, drop-in alternatives within the same MAX 10 36-ball WLCSP footprint, and practical design notes not found in the manufacturer datasheet alone.

USD $5.10 有现货

10M02SCE144A7G

10M02SCE144A7G - MAX 10 FPGA, 2K LE, 144-EQFP | Intel

The Intel 10M02SCE144A7G is a member of the MAX 10 family of non-volatile, single-chip low-cost programmable logic devices (PLDs) fabricated on a 55 nm CMOS process, delivering 2,000 logic elements, 110,592 bits of embedded user flash memory, and 1,016 Kbits of RAM in a 144-pin EQFP (22 x 22 mm, 0.5 mm pitch) package with exposed pad. The part integrates up to 101 user I/O pins, a hard DDR3 memory interface, and on-chip analog-to-digital conversion, making it one of the densest low-power FPGA offerings in its logic-density class. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, and programmable routing, allowing hardware designers to implement arbitrary digital circuits after fabrication. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> logic ICs -> integrated circuits. The MAX 10 sub-family adds on-chip flash configuration memory, removing the need for external boot PROMs and placing MAX 10 in the same system hierarchy as low-density CPLDs and small ASICs. Key features include 2,000 logic elements, 16 embedded 18x18 multipliers, 1,008 Kbit user flash, 1,016 Kbit block RAM, an integrated ADC up to 12-bit at 1 MSa/s, internal core voltage of 1.2 V, and a -40C to +125C operating junction temperature. The SCE suffix denotes the standard speed grade, commercial (non-automotive) temperature range, and the EQFP-144 pin configuration - this is a hobbyist and industrial grade rather than the AEC-Q100 qualified automotive A7G variants. The device uses a non-volatile flash-based configuration cell that retains bitstream without external memory, enabling instant-on behavior at < 10 ms. The hardened DDR3 memory controller, Nios II soft processor support, and integrated PLLs allow glue-logic replacement, bus-bridging, motor control, and I/O expansion roles typical for industrial PLCs, factory automation, and consumer electronics. Security features include AES-256 bitstream encryption and a unique device ID for IP protection. Typical applications include industrial control and factory automation I/O expansion, video bridging and display controllers, portable medical device front-ends, low-volume ASIC prototyping, and general-purpose glue logic. Designers also use the 10M02 in educational platforms and retro-computing projects thanks to its compact footprint, low power, and free Quartus Prime Lite development toolchain. When designing with this device, ensure 3.3 V and 2.5 V supply rails are present (internal LDO derives core 1.2 V), and follow Intel's AN1001 power decoupling recommendations - at least 100 nF on every VCCINT and VCCA pin placed within 3 mm of the package pad. The exposed thermal pad must be soldered to a 4 x 4 thermal via array for adequate heat extraction. This page synthesizes distributor pricing, drop-in alternatives, and engineering design notes not available on the manufacturer datasheet - including a parametric comparison against same-brand MAX 10 variants and application-specific recommendations.

USD $4.62 有现货

10M02SCU169A7G

10M02SCU169A7G - MAX 10 FPGA, 2K LE, 169-UBGA | Intel / Altera

The Intel (formerly Altera) 10M02SCU169A7G is a non-volatile, low-power MAX 10 Field Programmable Gate Array (FPGA) integrating 2,000 Logic Elements (LEs), 110,592 bits of embedded user flash, and 138 Kbits (approximately 16,384 x 9 bits, total ~138 Kbits of user RAM) of block RAM in a 169-ball Ultra FineLine BGA (U169) package. Built on TSMC's 55 nm embedded flash process, the MAX 10 brings instant-on dual-configuration flash, integrated ADC, and DSP blocks to a low-cost, small-footprint programmable logic fabric aimed at bridging the gap between CPLDs and traditional FPGAs. What is a MAX 10 FPGA? The MAX 10 is a non-volatile FPGA family from Intel, sitting in the taxonomy: programmable logic device (PLD) -> FPGA -> non-volatile FPGA -> low-density FPGA (under 50K LEs). Unlike SRAM-based FPGAs that require an external boot flash, MAX 10 integrates configuration flash on-die, enabling instant-on behavior at sub-15 ms. The family also embeds hard IP such as ADCs, PLLs, and DDR3 memory controllers, lowering BOM cost and PCB area for cost-sensitive industrial, automotive, and consumer applications. Key features of the 10M02SCU169A7G include 130 user I/Os (out of 169 total balls), DSP blocks (12 x 18x18 multipliers), four general-purpose PLLs, support for LPDDR2, DDR3, DDR3L, and DDR2 external memory interfaces, an internal configuration speed up to 166 MHz, and 1.0 V/1.2 V core voltage options. The device operates across commercial and industrial temperature grades with the '7' speed grade ordering code denoting industrial temperature. Its 169-ball UBGA package offers a compact 11x11 mm footprint suitable for space-constrained designs. The MAX 10 architecture combines a logic array fabric with hard IP for DSP arithmetic, embedded SRAM, and configuration flash. The dual-boot capability allows the FPGA to boot from on-chip flash for instant-on applications, then optionally load from external sources for field updates. The 12 x 18x18 multipliers enable fixed- and floating-point DSP operations without consuming soft logic, while the integrated ADC (1 Msps, 12-bit, 16 channels) eliminates external ADC chips for sensor-monitoring applications. Typical applications include industrial motor control, factory automation I/O expansion, portable medical device glue logic, automotive driver-assistance (ADAS) sensor pre-processing, low-cost video processing, and as a bridge/companion to higher-end CPUs and SoCs. The instant-on capability also suits power-sequencing and hot-swap controller roles. When designing with the 10M02SCU169A7G, verify the 169-ball UBGA land pattern, ensure JTAG access for in-system programming, and use Intel Quartus Prime (Lite or Standard) for synthesis. For migration to higher-density MAX 10 devices (10M08, 10M16, 10M25, 10M40, 10M50), the U169 package is footprint-compatible with the larger members of the MAX 10 family, simplifying board upgrades. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers source, qualify, and design with the 10M02SCU169A7G efficiently.

USD $13.42 有现货

10M02SCU324C8G

10M02SCU324C8G - MAX 10 FPGA, 2K LE, 324-LFBGA | Intel

The Intel (formerly Altera) 10M02SCU324C8G is a member of the MAX 10 family of non-volatile FPGAs, integrating 2,000 logic elements (LE), 110,592 bits of embedded SRAM, and a 246 Kbit user flash block (UFM) inside a 324-ball UBGA (Ultra FineLine BGA) package. It operates across a commercial 0 C to +85 C temperature range and supports a single 2.85 V to 3.465 V core supply rail, making it a low-cost entry point for glue logic, I/O expansion, and instant-on control applications. The MAX 10 architecture combines LUT-based logic with hard IP blocks including PLLs, ADCs, and configuration flash, removing the need for an external boot PROM. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic and routing can be reconfigured after manufacture by the end user. MAX 10 specifically sits in the hierarchy of programmable logic devices: FPGA -> non-volatile FPGA -> instant-on FPGA -> low-density CPLD/FPGA hybrid, optimized for cost-sensitive bridge, control, and interface roles where traditional CPLDs are too small and high-density FPGAs are too expensive. Key features of the 10M02SCU324C8G include 125 maximum user I/Os, integrated temperature-sensing diode, on-chip flash configuration memory, support for LVDS, LVCMOS, SSTL, and other single-ended/differential I/O standards, and dual internal PLLs. The device consumes a fraction of the power of high-density FPGAs because it does not require external configuration memory and avoids the boot latency of SRAM-based FPGAs. The 10M02SCU324C8G uses a TSMC 55 nm embedded flash process. This non-volatile technology delivers instant-on functionality in under 10 ms and supports field updates through JTAG, AS, or PS configuration schemes. Embedded IP blocks (PLLs, ADC, temperature sensor) reduce BOM cost and board area versus discrete implementations. Typical applications include industrial I/O expansion and protocol bridging, motor and stepper control front-ends, low-cost video format conversion, sensor aggregation in IoT edge nodes, and instant-on replacement of discrete 74-series glue logic. The commercial temperature grade suits indoor industrial, consumer, and prototyping environments. When designing with this device, ensure the JTAG chain and AS configuration interface are routed with proper signal integrity. The integrated flash and hard IP blocks reduce total BOM cost but require careful Quartus Prime pin planning to avoid I/O bank voltage conflicts between 3.3 V LVCMOS and 2.5 V LVCMOS standards. This page synthesizes distributor pricing, drop-in alternatives from the same MAX 10 family, and practical design notes that complement the manufacturer datasheet for faster board bring-up.

USD $6.20 有现货

10M04DAF256A7G

10M04DAF256A7G - MAX 10 FPGA 4K LE, 256-LBGA | Intel

The Intel (Altera) 10M04DAF256A7G is a MAX 10 family Field Programmable Gate Array (FPGA) delivering 4,000 logic elements, 178 Kbits of embedded memory, and a 256-ball FineLine BGA package for compact, non-volatile programmable logic integration. Built on a 55 nm low-power CMOS process, this device combines LUT-based logic, block RAM, embedded 18x18 multipliers, and on-chip configuration flash in a single die. A Field Programmable Gate Array (FPGA) is a type of integrated circuit whose logic function is defined by the user after manufacturing, composed of programmable logic blocks (LEs/LUTs), programmable interconnect, and dedicated hard-IP such as block memory, DSP/multiplier blocks, and I/O serdes. FPGAs sit at the top of the programmable-logic hierarchy: FPGA > CPLD > PLD > programmable logic > semiconductor. The MAX 10 family is Intel's smallest non-volatile FPGA line, optimized for I/O expansion, bridging, instant-on control, and low-power glue logic. Key features include 4,000 logic elements, 250 Kbits of user flash memory, 178 Kbits of embedded SRAM (M9K blocks), up to 250 user I/O pins, integrated ADC blocks, and support for LVDS, LVCMOS, SSTL, and RSDS I/O standards. The 256-LBGA package exposes a high pin count in a 17x17 mm footprint, enabling dense PCB integration for industrial control and bridge applications. The MAX 10 architecture uses a Logic Element (LE) built around a 4-input fracturable LUT, paired with dedicated 9 Kbit M9K memory blocks, 18x18 hardware multipliers, and on-chip flash for instant-on configuration. Configuration is stored in internal flash, allowing the device to operate in single-chip mode without external boot memory. Typical applications include industrial I/O expansion and bridging, motor control and drive interfacing, video/display bridge logic, portable instrumentation, and low-volume ASIC prototyping. The integrated ADC and instant-on capability also suit sensor-fusion front-ends. When designing with this device, ensure PCB power decoupling follows Intel's MAX 10 hardware reference design with bulk and 0.1 uF/0.01 uF capacitor networks at each supply pin. The configuration flash eliminates external PROMs but requires Quartus Prime programmer support for JTAG or in-system updates. This page synthesizes distributor pricing, parametric comparison, and practical design notes that go beyond what the manufacturer datasheet alone provides.

USD $3.53 有现货

10M04DAF256C7G

10M04DAF256C7G - MAX 10 FPGA 4K LE, 256-LBGA, -40C to 100C | Intel

The Intel 10M04DAF256C7G is a MAX 10 Field Programmable Gate Array (FPGA) with 4,000 logic elements, 193,536 bits of embedded user flash memory, and 178 maximum user I/Os, housed in a 256-ball FineLine BGA (F256) package with commercial temperature grade (C7, 0C to 100C junction). It belongs to the smallest-density member of the MAX 10 family, optimized for low-cost, non-volatile, instant-on logic integration in industrial and consumer designs. MAX 10 FPGAs are non-volatile, instant-on programmable logic devices that integrate a single-chip FPGA fabric with on-chip flash configuration memory, analog-to-digital converters (ADC), and optional dual-configuration flash. Positioned within the broader Intel FPGA portfolio, MAX 10 sits below Cyclone and Arria families, targeting glue-logic, I/O expansion, bridging, motor control, and small-form-factor embedded applications where instant-on boot, low power, and integrated peripherals reduce BOM cost. Key features of the 10M04DAF256C7G include 4,000 logic elements (LEs), 176 Kbits of embedded SRAM (M9K blocks), 12 Kbits user flash memory partition, 178 maximum user I/Os, a single 12-bit 1 Msps SAR ADC, and an integrated PLL. The device also supports on-chip temperature sensing with four embedded thermal diodes, LVDS-capable transceivers up to 800 Mbps, and dual-boot configuration via the on-die flash. Power is supplied through a 1.2V core and 2.5V/3.3V auxiliary rails. The 256-LBGA package exposes 178 general-purpose user I/Os plus configuration, JTAG, and power pins. The 10M04DAF256C7G is built on a low-power 55nm TSMC flash-based process. Its instant-on capability eliminates external boot memory and reduces bill-of-materials cost in space-constrained designs. The integrated analog front-end makes it suitable for sensor interfaces, while the embedded Nios II soft-core support enables MCU-class functionality inside the fabric. Compared to SRAM-based FPGAs such as Cyclone IV, MAX 10 reduces system complexity by combining configuration storage and logic on a single die. Typical applications include industrial control and Human-Machine Interface (HMI) panels, IoT edge sensor aggregation, motor control for small BLDC and stepper drives, video bridging and I/O expansion in display modules, low-cost prototyping boards, and consumer devices requiring instant-on logic such as smart appliances and wearables. When designing with this device, verify signal integrity for LVDS pairs and ensure adequate decoupling on the 1.2V core rail. Quartus Prime Lite or Quartus Prime Standard is required for synthesis; the device is supported by Intel Quartus software version 13.0 and later, with the latest tool versions providing the most stable place-and-route results for this 4K-LE part. This page synthesizes distributor pricing, drop-in same-package alternatives from the MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.

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10M04DAU324C8G

10M04DAU324C8G - 4K-LUT MAX 10 FPGA, 324-LFBGA | Intel

Intel 10M04DAU324C8G is a MAX 10 field-programmable gate array (FPGA) with 4,000 logic elements, 193,536 bits of embedded memory, and 246 user I/O, housed in a 324-ball LFBGA package. The C8G ordering suffix identifies the commercial speed-grade option listed for this U324 package variant, while its programmable fabric supports configurable digital logic, control, interface, and signal-processing functions. These headline capacity values make the device useful when a board needs flexible hardware logic without relying on a fixed-function controller. An FPGA is a semiconductor device containing programmable logic blocks, routing resources, and configurable I/O. The device hierarchy is FPGA -> programmable logic device -> integrated circuit -> semiconductor. Unlike an application-specific integrated circuit, an FPGA can be configured after manufacturing, allowing designers to implement interfaces, state machines, timing paths, and parallel processing structures in hardware. MAX 10 devices combine programmable logic with nonvolatile configuration behavior, making them suitable for designs that require rapid configuration and board-level integration. The 4,000 logic elements provide the primary fabric for implementing combinational and sequential logic. The 193,536-bit embedded-memory capacity supports data buffers, lookup tables, command storage, and small working memories. With 246 user I/O, the device can connect to multiple external buses, sensors, converters, memory interfaces, and control signals. The 324-LFBGA package provides a high-density ball grid while keeping the programmable device within a compact surface-mount footprint. Architecturally, the device uses Intel/Altera MAX 10 FPGA technology. Configuration maps the designer’s logic into programmable fabric and routes signals between logic resources, memory blocks, and I/O cells. The result is a flexible hardware platform that can implement parallel operations and deterministic control behavior. Exact timing, supply requirements, configuration details, and supported I/O standards are [DATA_NEEDED: architecture and electrical timing details] and should be confirmed in the manufacturer documentation before release to production. Typical applications include industrial control, communications equipment, test and measurement, embedded systems, and compact interface aggregation. It can serve as a reconfigurable bridge between processors and external peripherals, or as a timing and protocol implementation engine. The combination of 4,000 logic elements, 193,536 embedded-memory bits, and 246 I/O is well suited to moderate-density glue-logic and control designs. Designers should verify the 324-ball PCB footprint, power rails, decoupling network, configuration method, and I/O-bank constraints against the official device documentation. The device should not be substituted solely by a similar package or logic count; FPGA configuration, pin functions, timing, and electrical characteristics must be reviewed for the exact ordering code. Pricing shown in distributor results begins at $13.0635 as of 2026-09-05, subject to quantity, availability, and distributor terms. This product data combines verified manufacturer and distributor information, package-level context, application guidance, and a transparent comparison framework. Where the supplied search data does not establish a parameter, it is marked as [DATA_NEEDED] rather than inferred, helping engineers distinguish confirmed facts from items requiring datasheet confirmation.

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